JPWO2022168585A1 - - Google Patents
Info
- Publication number
- JPWO2022168585A1 JPWO2022168585A1 JP2022579420A JP2022579420A JPWO2022168585A1 JP WO2022168585 A1 JPWO2022168585 A1 JP WO2022168585A1 JP 2022579420 A JP2022579420 A JP 2022579420A JP 2022579420 A JP2022579420 A JP 2022579420A JP WO2022168585 A1 JPWO2022168585 A1 JP WO2022168585A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5733—Structural details or topology
- G01C19/5755—Structural details or topology the devices having a single sensing mass
- G01C19/5762—Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0307—Anchors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/04—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021016755 | 2021-02-04 | ||
| PCT/JP2022/001418 WO2022168585A1 (ja) | 2021-02-04 | 2022-01-17 | 静電容量型センサ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022168585A1 true JPWO2022168585A1 (https=) | 2022-08-11 |
Family
ID=82740694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022579420A Pending JPWO2022168585A1 (https=) | 2021-02-04 | 2022-01-17 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240092630A1 (https=) |
| JP (1) | JPWO2022168585A1 (https=) |
| CN (1) | CN116761980A (https=) |
| WO (1) | WO2022168585A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005337874A (ja) * | 2004-05-26 | 2005-12-08 | Matsushita Electric Works Ltd | 半導体加速度センサ |
| WO2018135211A1 (ja) * | 2017-01-17 | 2018-07-26 | パナソニックIpマネジメント株式会社 | センサ |
| WO2020203011A1 (ja) * | 2019-03-29 | 2020-10-08 | パナソニックIpマネジメント株式会社 | 角速度センサ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918017A (ja) * | 1995-06-30 | 1997-01-17 | Omron Corp | 半導体加速度センサおよび半導体圧力センサ |
| JP7166238B2 (ja) * | 2019-11-06 | 2022-11-07 | 株式会社豊田中央研究所 | Mems構造体 |
-
2022
- 2022-01-17 CN CN202280010003.6A patent/CN116761980A/zh not_active Withdrawn
- 2022-01-17 US US18/263,267 patent/US20240092630A1/en not_active Abandoned
- 2022-01-17 JP JP2022579420A patent/JPWO2022168585A1/ja active Pending
- 2022-01-17 WO PCT/JP2022/001418 patent/WO2022168585A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005337874A (ja) * | 2004-05-26 | 2005-12-08 | Matsushita Electric Works Ltd | 半導体加速度センサ |
| WO2018135211A1 (ja) * | 2017-01-17 | 2018-07-26 | パナソニックIpマネジメント株式会社 | センサ |
| WO2020203011A1 (ja) * | 2019-03-29 | 2020-10-08 | パナソニックIpマネジメント株式会社 | 角速度センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116761980A (zh) | 2023-09-15 |
| WO2022168585A1 (ja) | 2022-08-11 |
| US20240092630A1 (en) | 2024-03-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240918 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250603 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20251028 |