CN116759329A - 安装装置、检查装置及半导体器件的制造方法 - Google Patents

安装装置、检查装置及半导体器件的制造方法 Download PDF

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Publication number
CN116759329A
CN116759329A CN202310047030.7A CN202310047030A CN116759329A CN 116759329 A CN116759329 A CN 116759329A CN 202310047030 A CN202310047030 A CN 202310047030A CN 116759329 A CN116759329 A CN 116759329A
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CN
China
Prior art keywords
inspection
center
reference object
substrate
image data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310047030.7A
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English (en)
Chinese (zh)
Inventor
内藤大辅
横森刚
高柳健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Publication of CN116759329A publication Critical patent/CN116759329A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
CN202310047030.7A 2022-03-14 2023-01-31 安装装置、检查装置及半导体器件的制造方法 Pending CN116759329A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-039755 2022-03-14
JP2022039755A JP7822837B2 (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN116759329A true CN116759329A (zh) 2023-09-15

Family

ID=87946574

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310047030.7A Pending CN116759329A (zh) 2022-03-14 2023-01-31 安装装置、检查装置及半导体器件的制造方法

Country Status (2)

Country Link
JP (1) JP7822837B2 (https=)
CN (1) CN116759329A (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5596141B2 (ja) 2010-05-27 2014-09-24 株式会社日立ハイテクノロジーズ 画像処理装置、荷電粒子線装置、荷電粒子線装置調整用試料、およびその製造方法
JP7300353B2 (ja) 2019-09-13 2023-06-29 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

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Publication number Publication date
JP2023134298A (ja) 2023-09-27
JP7822837B2 (ja) 2026-03-03

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