JP7822837B2 - 実装装置、検査装置および半導体装置の製造方法 - Google Patents

実装装置、検査装置および半導体装置の製造方法

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Publication number
JP7822837B2
JP7822837B2 JP2022039755A JP2022039755A JP7822837B2 JP 7822837 B2 JP7822837 B2 JP 7822837B2 JP 2022039755 A JP2022039755 A JP 2022039755A JP 2022039755 A JP2022039755 A JP 2022039755A JP 7822837 B2 JP7822837 B2 JP 7822837B2
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JP
Japan
Prior art keywords
view
center
field
inspection
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022039755A
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English (en)
Japanese (ja)
Other versions
JP2023134298A5 (https=
JP2023134298A (ja
Inventor
大輔 内藤
剛 横森
健一 高柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fasford Technology Co Ltd
Original Assignee
Fasford Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Priority to JP2022039755A priority Critical patent/JP7822837B2/ja
Priority to CN202310047030.7A priority patent/CN116759329A/zh
Publication of JP2023134298A publication Critical patent/JP2023134298A/ja
Publication of JP2023134298A5 publication Critical patent/JP2023134298A5/ja
Application granted granted Critical
Publication of JP7822837B2 publication Critical patent/JP7822837B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP2022039755A 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法 Active JP7822837B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022039755A JP7822837B2 (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法
CN202310047030.7A CN116759329A (zh) 2022-03-14 2023-01-31 安装装置、检查装置及半导体器件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022039755A JP7822837B2 (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2023134298A JP2023134298A (ja) 2023-09-27
JP2023134298A5 JP2023134298A5 (https=) 2025-01-27
JP7822837B2 true JP7822837B2 (ja) 2026-03-03

Family

ID=87946574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022039755A Active JP7822837B2 (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7822837B2 (https=)
CN (1) CN116759329A (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148975A1 (ja) 2010-05-27 2011-12-01 株式会社日立ハイテクノロジーズ 画像処理装置、荷電粒子線装置、荷電粒子線装置調整用試料、およびその製造方法
JP2021044466A (ja) 2019-09-13 2021-03-18 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148975A1 (ja) 2010-05-27 2011-12-01 株式会社日立ハイテクノロジーズ 画像処理装置、荷電粒子線装置、荷電粒子線装置調整用試料、およびその製造方法
JP2021044466A (ja) 2019-09-13 2021-03-18 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Also Published As

Publication number Publication date
CN116759329A (zh) 2023-09-15
JP2023134298A (ja) 2023-09-27

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