CN116730845A - 一种高含氟联苯二胺、一种无色聚酰亚胺光学薄膜及其制备方法与应用 - Google Patents
一种高含氟联苯二胺、一种无色聚酰亚胺光学薄膜及其制备方法与应用 Download PDFInfo
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- CN116730845A CN116730845A CN202310616892.7A CN202310616892A CN116730845A CN 116730845 A CN116730845 A CN 116730845A CN 202310616892 A CN202310616892 A CN 202310616892A CN 116730845 A CN116730845 A CN 116730845A
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- fluorine
- diamine
- biphenyl
- optical film
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 45
- 239000012788 optical film Substances 0.000 title claims abstract description 42
- UDQLIWBWHVOIIF-UHFFFAOYSA-N 3-phenylbenzene-1,2-diamine Chemical compound NC1=CC=CC(C=2C=CC=CC=2)=C1N UDQLIWBWHVOIIF-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 77
- 239000011737 fluorine Substances 0.000 claims abstract description 73
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 65
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000004305 biphenyl Substances 0.000 claims abstract description 31
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 28
- 150000004985 diamines Chemical class 0.000 claims abstract description 23
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 19
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 30
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 30
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 24
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 19
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- 238000005266 casting Methods 0.000 claims description 13
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 8
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- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 6
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- 150000002221 fluorine Chemical class 0.000 claims description 6
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
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- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
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- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 4
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- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 4
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- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 3
- UMIVDQOVSJFWOH-UHFFFAOYSA-N C1(=CC=CC=C1)C1=CC=CC=C1.[F] Chemical group C1(=CC=CC=C1)C1=CC=CC=C1.[F] UMIVDQOVSJFWOH-UHFFFAOYSA-N 0.000 claims description 3
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- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 2
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 claims description 2
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- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 2
- 239000005711 Benzoic acid Substances 0.000 claims description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- 235000010233 benzoic acid Nutrition 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
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- 229910052740 iodine Inorganic materials 0.000 claims description 2
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- 239000004317 sodium nitrate Substances 0.000 claims description 2
- 235000010344 sodium nitrate Nutrition 0.000 claims description 2
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 claims description 2
- -1 biphenyl diamines Chemical class 0.000 abstract description 26
- 239000000463 material Substances 0.000 abstract description 14
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- 238000000354 decomposition reaction Methods 0.000 abstract 1
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- 101001053395 Arabidopsis thaliana Acid beta-fructofuranosidase 4, vacuolar Proteins 0.000 description 3
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- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- KOKFXNCIDZHGFG-UHFFFAOYSA-N 1-fluoro-2-[2-fluoro-5-(trifluoromethyl)phenyl]-4-(trifluoromethyl)benzene Chemical group FC1=C(C=C(C=C1)C(F)(F)F)C1=C(F)C=CC(=C1)C(F)(F)F KOKFXNCIDZHGFG-UHFFFAOYSA-N 0.000 description 2
- JPZRPCNEISCANI-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(trifluoromethyl)aniline Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F JPZRPCNEISCANI-UHFFFAOYSA-N 0.000 description 2
- TWEABKDGGZAZSS-UHFFFAOYSA-N C1(=CC=C(C=C1C1=CC(F)=CC=C1C(F)(F)F)F)C(F)(F)F Chemical group C1(=CC=C(C=C1C1=CC(F)=CC=C1C(F)(F)F)F)C(F)(F)F TWEABKDGGZAZSS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- NPHDTZNZHSUYPN-UHFFFAOYSA-N 1,4-bis(trifluoromethyl)cyclohexa-2,5-diene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(F)(F)F)(C(O)=O)C=CC1(C(O)=O)C(F)(F)F NPHDTZNZHSUYPN-UHFFFAOYSA-N 0.000 description 1
- BDLNCFCZHNKBGI-UHFFFAOYSA-N 1-nitro-4-(4-nitrophenyl)benzene Chemical group C1=CC([N+](=O)[O-])=CC=C1C1=CC=C([N+]([O-])=O)C=C1 BDLNCFCZHNKBGI-UHFFFAOYSA-N 0.000 description 1
- LRYZJEXQHWCLJY-UHFFFAOYSA-N 1-phenyl-2-(trifluoromethyl)benzene Chemical group FC(F)(F)C1=CC=CC=C1C1=CC=CC=C1 LRYZJEXQHWCLJY-UHFFFAOYSA-N 0.000 description 1
- RZJOIMPUMMQKFR-UHFFFAOYSA-N 2-bromo-1-fluoro-4-(trifluoromethyl)benzene Chemical compound FC1=CC=C(C(F)(F)F)C=C1Br RZJOIMPUMMQKFR-UHFFFAOYSA-N 0.000 description 1
- TUMXMNZWNKIGIE-UHFFFAOYSA-N 2-bromo-4-fluoro-1-(trifluoromethoxy)benzene Chemical compound FC1=CC=C(OC(F)(F)F)C(Br)=C1 TUMXMNZWNKIGIE-UHFFFAOYSA-N 0.000 description 1
- XBBGYSIEJHXPLL-UHFFFAOYSA-N 2-bromo-4-fluoro-1-(trifluoromethyl)benzene Chemical compound FC1=CC=C(C(F)(F)F)C(Br)=C1 XBBGYSIEJHXPLL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C17/00—Preparation of halogenated hydrocarbons
- C07C17/26—Preparation of halogenated hydrocarbons by reactions involving an increase in the number of carbon atoms in the skeleton
- C07C17/263—Preparation of halogenated hydrocarbons by reactions involving an increase in the number of carbon atoms in the skeleton by condensation reactions
- C07C17/269—Preparation of halogenated hydrocarbons by reactions involving an increase in the number of carbon atoms in the skeleton by condensation reactions of only halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C201/00—Preparation of esters of nitric or nitrous acid or of compounds containing nitro or nitroso groups bound to a carbon skeleton
- C07C201/06—Preparation of nitro compounds
- C07C201/08—Preparation of nitro compounds by substitution of hydrogen atoms by nitro groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C209/00—Preparation of compounds containing amino groups bound to a carbon skeleton
- C07C209/30—Preparation of compounds containing amino groups bound to a carbon skeleton by reduction of nitrogen-to-oxygen or nitrogen-to-nitrogen bonds
- C07C209/32—Preparation of compounds containing amino groups bound to a carbon skeleton by reduction of nitrogen-to-oxygen or nitrogen-to-nitrogen bonds by reduction of nitro groups
- C07C209/325—Preparation of compounds containing amino groups bound to a carbon skeleton by reduction of nitrogen-to-oxygen or nitrogen-to-nitrogen bonds by reduction of nitro groups reduction by other means than indicated in C07C209/34 or C07C209/36
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/43—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
- C07C211/44—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton having amino groups bound to only one six-membered aromatic ring
- C07C211/52—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton having amino groups bound to only one six-membered aromatic ring the carbon skeleton being further substituted by halogen atoms or by nitro or nitroso groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C213/00—Preparation of compounds containing amino and hydroxy, amino and etherified hydroxy or amino and esterified hydroxy groups bound to the same carbon skeleton
- C07C213/02—Preparation of compounds containing amino and hydroxy, amino and etherified hydroxy or amino and esterified hydroxy groups bound to the same carbon skeleton by reactions involving the formation of amino groups from compounds containing hydroxy groups or etherified or esterified hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
- C07C217/78—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
- C07C217/80—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings
- C07C217/82—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings of the same non-condensed six-membered aromatic ring
- C07C217/84—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings of the same non-condensed six-membered aromatic ring the oxygen atom of at least one of the etherified hydroxy groups being further bound to an acyclic carbon atom
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C41/00—Preparation of ethers; Preparation of compounds having groups, groups or groups
- C07C41/01—Preparation of ethers
- C07C41/18—Preparation of ethers by reactions not forming ether-oxygen bonds
- C07C41/30—Preparation of ethers by reactions not forming ether-oxygen bonds by increasing the number of carbon atoms, e.g. by oligomerisation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
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- C—CHEMISTRY; METALLURGY
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Abstract
本发明公开了一种高含氟联苯二胺、一种无色聚酰亚胺光学薄膜及其制备方法与应用。具体地说,基于Ullmann(乌尔曼)偶联、硝化、还原反应,可高效地合成一系列高含氟联苯二胺;接着,将该高含氟联苯二胺与商品化二酐、二胺进行均聚(或共聚),以制备出高性能聚酰亚胺材料。本发明高含氟联苯二胺的合成具有路线简洁、成本低廉、条件温和、反应高效的优点;由此制备的高性能聚酰亚胺展现了极佳的光学透明性、高无色性、高耐热性(高玻璃化温度、高分解温度)、高力学性能、优异的低介电性能等,可实际应用于柔性显示器、可穿戴设备、柔性电池与5G高频通讯等领域。
Description
技术领域
本发明属于光学薄膜领域,具体涉及一种高含氟联苯二胺、一种无色聚酰亚胺光学薄膜及其制备方法与应用。
背景技术
面向未来的柔性器件,其轻薄化、可穿戴化、高频信号、安全性是最为关键的功能需求,在柔性显示、柔性电池、5G+通信等方面尤其重要。其中,功能器件的实现与新一代升级关键在于柔性材料的开发,包括柔性有机发光二极管(OLED)的盖板与衬底、薄膜太阳能电池(TFSC)的基板、高频信号挠性覆铜板(FCCL)基板等。现如今,已应用于OLED或TFSC中的商品化的透明盖板、衬底等为超薄玻璃(UTG),其易脆性、密度大、加工成型复杂等,极大地限制其大尺寸、多卷曲的新一代发展。新一代的柔性显示的迭代升级,包括全透明显示、屏下摄像及人脸识别等,无色透明聚酰亚胺(CPI)薄膜成为最佳解决方案材料,其性能需求为:1)高透明;2)高无色、低黄度;3)高耐热,包括高玻璃化转变、高热分解温度等;4)高尺寸热稳定性;5)高力学性能;5)易加工成型等。基于含氟结构设计,因其极低的摩尔电子极化率,可进一步赋予CPI薄膜优异的高透明、低介电性能,大大改善传统FCCL基板用的黄色PI薄膜的困境,尤其有效降低其介电损耗(Df)。基于此,该类CPI薄膜材料的设计与实现的难点在于高透明、高耐热、低膨胀、高力学性能、低介电等多性能的同时满足,而一旦实现可在上述柔性电子领域具有极大应用潜力。
目前,已发表或公开的绝大多数CPI薄膜仅可同时满足高透明、高耐热、低膨胀、高力学性能、低介电的一种、两种,甚至三种,但都不能做到性能兼顾,大大限制了在高性能的高端柔性电子产品的长期服役应用。例如,CN 112500568B、Polymer 2020,209,122963等公开的PI薄膜有效满足PI薄膜的高耐热(Tg>400℃、Td5%>560℃)、低膨胀(CTE<10ppm/K)的性能需求,但受限于本征的深黄色(不满足高透明性),无法有效适用上述的新型柔性器件的需求。CN 115557848A、CN 110606949A、Polymer,2023,273,125883等公开的薄膜有效满足CPI薄膜的高透明(T550>86%、YI<5)与高耐热(Tg>350℃、Td5%>520℃)的性能需求,而明显存在本征的高膨胀(CTE>35ppm/K),极大缩减了器件的使用寿命与可靠性。Polym.Chem.,2021,12,5364、Polymer,2020,206,122889等极好地提出以含酰胺单元芳香CPI薄膜的高透明(T550>86%、YI<10)、高耐热(Tg>330℃、Td5%>450℃)、低膨胀(CTE<15ppm/K)的三者同时满足,即使其透明性与无色度不如前者方法,但仍存在其力学性能较差的现状(σm<200MPa、Et<4GPa)。总的来说,满足上述多性能需求的CPI光学薄膜的结构与制备依然为极大且重要的难题,对其解决方案的有效实现很有意义。
发明内容
针对背景技术中的关键光学膜,尤其无法同时满足其高透明、高耐热、低膨胀、高力学性能、低介电等多需求,本发明提供了一种高含氟联苯二胺、一种无色聚酰亚胺光学薄膜及其制备方法与应用。
具体地说,基于Ullmann(乌尔曼)偶联、硝化与还原反应,可高效地合成一系列高含氟联苯二胺(Ⅳ-1~Ⅳ-6);接着,将该高含氟联苯二胺与商品化二酐(Ⅴ-1~Ⅴ-10)、二胺(ⅤI-1~ⅤI-10)进行均聚(或共聚),经流延、热处理等工艺,以制备出高性能CPI光学膜材料。该光学膜材料可同时满足高透明、高耐热、低膨胀、高力学性能、低介电等多性能需求,应用于柔性显示、穿戴设备、薄膜电池、高频信号基板等关键领域。
本发明的第一方面在于提供一种高含氟联苯二胺的制备方法,一种高含氟联苯二胺的合成路线:首先,由卤代含氟单苯(结构式l-1~l-6)在一定溶剂、催化、温度、气氛条件下,经Ullmann偶联反应合成含氟芳香联苯(结构式Ⅱ-1~Ⅱ-6)。再者,上述含氟芳香联苯在一定酸性溶剂、硝化剂条件下,经硝化反应合成出含氟联苯二硝基(结构式Ⅲ-1~Ⅲ-6)。随后,含氟联苯二硝基(结构式III-1~Ⅲ-6)在经典的还原体系下,转变为目标单体,即含氟联苯二胺(结构式Ⅳ-1~Ⅳ-6)。
一种高含氟联苯二胺的制备方法,具体包括如下步骤:
(1)惰性气氛保护下,卤代含氟单苯在非质子极性溶剂中经金属催化剂发生Ullmann偶联反应得到含氟芳香联苯,
所述卤代含氟单苯限定为如下l-1~l-6结构式中的一种或多种,
其中,X为卤素,限定为溴或碘;
所述含氟芳香联苯限定为如下Ⅱ-1~Ⅱ-6结构式中的一种,
(2)步骤(1)所述含氟芳香联苯在硝化剂条件下,发生硝化反应得到含氟联苯二硝基,
所述含氟联苯二硝基限定为如下Ⅲ-1~Ⅲ-6结构式中的一种,
(3)惰性气氛保护下,步骤(2)所述含氟联苯二硝基经还原反应制得目标的高含氟联苯二胺,
所述高含氟联苯二胺限定为如下Ⅳ-1~Ⅳ-6结构式中的一种,
优选的,步骤(1)所述惰性气氛为氮气、氩气中的一种。
优选的,步骤(1)所述非质子极性溶剂包括N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)、1,3-二甲基-2-咪唑啉酮(DMI)的一种或多种。
更优选的,步骤(1)所述非质子极性溶剂为DMF、NMP中的一种或多种。
优选的,步骤(1)所述金属催化剂包括Cu、CuI、CuCl、CuBr、Cu2O、Cu(OTf)2中的一种或多种;更优选的,步骤(1)所述金属催化剂为Cu、CuI、CuCl中的一种或多种。
优选的,步骤(1)所述Ullmann偶联反应的温度为50~250℃;更优选的,步骤(1)所述Ullmann偶联反应的温度为120~180℃。
优选的,步骤(2)所述硝化剂为发烟硝酸、浓硝酸、五氧化二氮、硝酸钠中的一种或多种。
优选的,步骤(2)所述硝化反应的溶剂为浓硫酸、冰醋酸、草酸、乙酐、P2O5、甲醇、乙醇、二氯甲烷、氯仿、去离子水中的一种或多种。
优选的,步骤(2)所述硝化反应的温度为-80~150℃;更优选的,步骤(2)所述硝化反应的温度为-10~80℃。
优选的,步骤(3)所述惰性气氛为氮气、氩气中的一种。
优选的,步骤(3)所述还原反应的溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、乙醇、异丙醇、四氢呋喃、乙酸乙酯、二氧六环、甲苯、苯和水中的一种或多种。
优选的,步骤(3)所述还原反应的温度为50~150℃。
优选的,步骤(3)所述还原反应选择Pd/C及N2H4·H2O体系或SnCl2及HCl体系。
更优选的,所述Pd/C及N2H4·H2O体系中Pd/C投料量为含氟联苯二硝基1~15wt%,N2H4·H2O投料量为含氟联苯二硝基的物质的量的2~8倍。
更优选的,所述SnCl2及HCl体系中HCl溶液量为SnCl2用量的1~100wt%,SnCl2投料量为含氟联苯二硝基的物质的量的2~16倍。
本发明的第二方面在于提供一种无色聚酰亚胺光学薄膜,所述一种无色聚酰亚胺光学薄膜由聚酰亚胺构成,所述聚酰亚胺的结构通式如下:
其中,X Part为高含氟联苯二胺的残基;Ar1独立地为商品化二酐的残基;Ar2为商品化二胺的残基,n和m为对应结构单元的重复数,n:m的比值范围为1:0-5:95。
所述高含氟联苯二胺限定为如下Ⅳ-1~Ⅳ-6结构式中的一种或多种,
所述商品化二酐限定为如下Ⅴ-1~Ⅴ-10结构式中的一种或多种:
其中,R1、R2各独立地选自F、CF3的一种或两种;p及q为R1与R2基的个数,p取值为1~2,q取值为1~4;R3独立地选自
所述商品化二胺为如下Ⅵ-1~Ⅵ-10结构式中的一种或多种:
其中R1、R2各独立地选自F、CF3的一种或两种;p及q为R1与R2基的个数,p取值为1~2,q取值为1~4;R3独立地选自
优选的,所述一种无色聚酰亚胺光学薄膜的玻璃化转变温度Tg为371~453℃,5wt%对应的热失重温度Td5%值为568~592℃,热膨胀系数CTE为1.3~8.8ppm/K。
优选的,所述一种无色聚酰亚胺光学薄膜550nm处的光学透过率T550值为88.1%~89.7%,黄色指数YI值为2.2~4.9。
优选的,所述一种无色聚酰亚胺光学薄膜拉伸强度σm值为268~367MPa,拉伸模量Et值为5.7~7.2GPa。
优选的,所述一种无色聚酰亚胺光学薄膜在10GHz高频的介电常数Dk值2.70~2.98,介电损耗Df值0.0013~0.0042。
本发明第三方面旨在提供本发明第二方面任一项所述的一种无色聚酰亚胺光学薄膜的制备方法。首先,由卤代含氟单苯(结构式l-1~l-6)经关键Ullmann偶联反应出含氟芳香联苯(结构式Ⅱ-1~Ⅱ-6)、经硝化反应为含氟联苯二硝基(结构式Ⅲ-1~Ⅲ-6),后经还原转变为高含氟联苯二胺(结构式Ⅳ-1~Ⅳ-6)。接着,由该含氟二胺与商品化(或已知的)二酐(结构式Ⅴ-1~Ⅴ-10)、二胺(结构式Ⅵ-1~Ⅵ-10)等进行均聚/共聚反应,经流延、热处理等工艺,制备出高性能CPI光学薄膜材料。
一种无色聚酰亚胺光学薄膜的制备方法,包括如下步骤:
(a)本发明第一方面任一项所述的一种高含氟联苯二胺的制备方法制备得到的高含氟联苯二胺(结构式Ⅳ-1~Ⅳ-6)与商品化二酐(结构式Ⅴ-1~Ⅴ-10)、商品化二胺(结构式Ⅵ-1~Ⅵ-10)进行均聚/共聚反应得到聚酰亚胺(或者聚酰胺酸前体)溶液;
(b)步骤(a)所述聚酰亚胺(或者聚酰胺酸前体),经制膜工艺,得到一种无色聚酰亚胺光学薄膜。
优选的,步骤(a)所述高含氟联苯二胺为Ⅳ-1~Ⅳ-6结构式中的一种或多种。
优选的,步骤(a)所述商品化二酐为Ⅴ-1~Ⅴ-10结构式中的一种或多种。
优选的,步骤(a)所述商品化二胺为Ⅵ-1~Ⅵ-10结构式中的一种或多种。
优选的,步骤(a)所述高含氟联苯二胺与商品化二胺的物质的量之和同商品化二酐的物质的量比值为1:(0.9~1.1)。
优选的,步骤(a)所述均聚/共聚反应采用一步法或两步法。
更优选的,所述一步法为在惰性气氛保护下,高含氟联苯二胺与商品化二酐、商品化二胺,加入催化剂/不添加催化剂,在高沸点溶剂中高温缩聚,制得均一且粘性的聚酰亚胺溶液,所述催化剂为苯甲酸、异喹啉一种或两种,高沸点溶剂为间甲酚、对氯酚、间氯酚中的一种或多种,反应温度为150~200℃,反应时间为5~36h,惰性气氛为氮气气氛、氩气中的一种。
更优选的,两步法为在惰性气氛保护下,高含氟联苯二胺与商品化二酐、商品化二胺,在非质子极性溶剂中低温缩聚,制得均一且粘性的聚酰胺酸溶液,所述非质子极性溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)中的一种或多种,反应温度为-10~50℃,反应时间优选为10~120h,惰性气氛为氮气、氩气中的一种。
优选的,步骤(b)所述制膜工艺包括流延和热处理。
更优选的,所述流延工艺包括直接流延成膜、精密狭缝涂布成膜、流延及拉伸连续成膜中的一种或多种。
更优选的,所述热处理工艺包括去溶剂过程、亚胺化过程,升温方式为连续升温、梯度升温,温度范围为20~450℃,高温气氛为氮气、氩气、真空中的一种。
更进一步优选的,所述亚胺化包括热亚胺化或化学亚胺化方法。
本发明的第四方面在于提供一种柔性显示器,所述柔性显示器包括本发明第二方面所述的一种无色聚酰亚胺光学薄膜。
本发明的第五方面在于提供一种可穿戴设备,所述可穿戴设备包括本发明第二方面所述的一种无色聚酰亚胺光学薄膜。
本发明的第六方面在于提供一种柔性电池,所述柔性电池包括本发明第二方面所述的一种无色聚酰亚胺光学薄膜。
本发明的第七方面在于提供一种5G高频通信设备,所述5G高频通信设备包括本发明第二方面所述的一种无色聚酰亚胺光学薄膜。
与现有技术相比,本发明具有如下优点和有益效果:
本发明提供的一种无色聚酰亚胺光学薄膜的制备方法制备得到的CPI薄膜,同时满足了高透明(T550≥88.1%、最高为89.7%、YI≤4.9)、高耐热(Tg≥371℃,Td5%≥568℃)、低膨胀(CTE≤8.8ppm/K,最小为1.3ppm/K)、高力学性能(σm≥268MPa,Et≥5.7GPa)、低介电性(Dk低至2.70、Df低至0.0013)等多方面需求,整体方案优于现有公开的专利及文献性能。表明该类CPI薄膜在柔性显示、穿戴设备、薄膜电池、高频信号基板等关键领域。具有极大的应用潜力。
本发明制备得到的一种无色聚酰亚胺光学薄膜的玻璃化转变温度Tg为371~453℃,5wt%对应的热失重温度Td5%值为568~592℃,热膨胀系数CTE为1.3~8.8ppm/K;同时,550nm处的光学透过率T550值为88.1%~89.7%,黄色指数YI值为2.2~4.9;并且力学性能中,拉伸强度σm值为268~367MPa,拉伸模量Et值为5.7~7.2GPa;此外,在10GHz高频的介电性能Dk值2.70~2.98,Df值0.0013~0.0042。
本发明提供的一种高含氟联苯二胺的制备方法合成路线清晰简洁,后处理操作简单,收率高(反应收率维持在80%-90%),关键步骤(如Ullmann偶联反应)并没有使用昂贵的含铂、钯、铑等元素的催化剂,反应条件温和,无需在高温高压的条件下即可反应完全,适用于大规模合成。
本发明制备的CPI薄膜采用高含氟二胺单体进行制备,大量含氟基团的引入具有以下优势:一方面可以抑制链内或链间CTC电荷转移效应,有效提升光学膜的透明性,显著降低薄膜黄度;另一方面,大量低极性的氟原子可以显著降低分子极性,降低分子链段对于电场的响应能力,从而降低高分子的介电常数和介电损耗,使得薄膜了优异的介电性能。
附图说明
图1为一种高含氟联苯二胺及一种无色聚酰亚胺光学薄膜的制备方法的流程图。
图2为实施例1和实施例4制备得到的CPI薄膜的UV-Vis(光学透明性)曲线。
图3为实施例2、3制备得到的CPI薄膜的DMA(玻璃化温度)曲线。
图4为实施例1、3制备得到的CPI薄膜的TMA(热膨胀性)曲线。
图5为实施例1-6制备得到的CPI薄膜的高频介电性能图。
具体实施方式
以下结合附图和实例对本发明的具体实施作进一步说明,但本发明的实施和保护不限于此。需指出的是,以下若有未特别详细说明之过程,均是本领域技术人员可参照现有技术实现或理解的。所用试剂或仪器未注明生产厂商者,视为可以通过市售购买得到的常规产品。
一种高含氟联苯二胺及一种无色聚酰亚胺光学薄膜的制备方法如图1所示。
实施例1
1.高含氟联苯二胺合成
在氮气保护下,将2-溴-4-氟三氟甲苯(19.44g,80mmol,式Ⅰ-1)、Cu粉(0.50g,7.87mmol)、N,N-二甲基甲酰胺(DMF)(80mL)投入200mL Schlenk瓶中,加热至150℃,保持搅拌至反应结束。随后经乙酸乙酯(EA)萃取、柱分离,获得对应的含氟联苯,3,5'-二氟-6,2'-二(三氟甲基)联苯(结构式Ⅱ-1),产物为无色透明液。产率:83%。核磁结果:1H NMR(500MHz,DMSO-d6)δ7.97-7.94(m,2H),7.58-7.54(m,2H),7.42-7.40(m,2H).。
将上述3,5'-二氟-6,2'-二(三氟甲基)联苯(10.00g,30.66mmol,式Ⅱ-1)、浓HNO3(7.72g,122.63mmol)、浓硫酸(40mL)加入100ml烧杯中,随后搅拌加热至70℃,直至反应结束。接着,将反应物到入冰水,并使用二氯甲烷(DCM)萃取、重结晶,获得对应目标的3,5'-二氟-6,2'-二(三氟甲基)-4,4'-二硝基联苯(浅黄色晶体,结构式Ⅲ-1)。产率:95%。1H NMR(500MHz,DMSO-d6)δ8.66-8.65(m,2H),8.04-8.02(m,2H).。
在氩气保护下,将3,5'-二氟-6,2'-二(三氟甲基)-4,4'-二硝基联苯(10.00g,24.03mmol,式Ⅲ-1)、SnCl2·2H2O(54.20g,240.35mmol)、浓HCl溶液(40mL)溶解于100ml的乙酸乙酯中,随后搅拌加热至78℃,直至反应结束。接着,经NaOH溶液中和为弱碱性(pH=8),二氯甲烷(DCM)萃取、重结晶,获得目标的含氟二胺,3,5'-二氟-6,2'-二(三氟甲基)-4,4'-二氨基联苯(白色晶体,结构式Ⅳ-1)。产率:83%。核磁结果:1H NMR(500MHz,DMSO-d6)δ7.16-7.14(m,2H),6.95-6.92(m,2H),5.71(s,4H)。所述含氟二胺结构如下所示。
2.CPI的合成与薄膜制备
在氮气保护下,将上述3,5'-二氟-6,2'-二(三氟甲基)-4,4'-二氨基联苯(2.49g,7mmol,式Ⅳ-1)、2,2'-二(三氟甲基)二氨基联苯(0.96g,3.0mmol,式Ⅵ-4)、联苯二酐(2.94g,10mmol,式Ⅴ-3)、N,N-二甲基乙酰胺(DMAc)(25mL)投入至100mL的三口烧瓶中,待充分溶解后常温转子搅拌反应24h,得到粘稠的聚酰胺酸溶液(特性粘度为1.751dL/g)。将该溶液经精密狭缝涂布,真空条件下以20-150-300℃的梯度升温酰亚胺化,后经剥离获得CPI薄膜材料。
实施例2
在氩气保护下,将3,5'-二氟-6,2'-二(三氟甲基)-4,4'-二氨基联苯(35.6g,100mmol,式Ⅳ-1)、均苯四甲酸二酐(12.0g,55mmol,式Ⅴ-1)、六氟二酐(20.0g,45mmol,式Ⅴ-5)、N,N-二甲基甲酰胺(DMF)(250mL)投入至500mL的三口烧瓶中,待充分溶解后常温机械搅拌反应24h,得到粘稠的聚酰胺酸溶液(特性粘度为2.287dL/g)。将该溶液经流延成膜,由20℃加热至290℃的连续升温,以20℃/min的升温速率,氩气条件下完成酰亚胺化,后经剥离获得CPI薄膜材料。
实施例3
在氩气保护下,将3,5'-二氟-6,2'-二(三氟甲基)-4,4'-二氨基联苯(1.42g,4mmol,式Ⅳ-1)、2,2′,2″,5′-四(三氟甲基)二胺(3.19g,6mmol,式Ⅵ-10)、均苯四甲酸二酐(0.87g,4mmol,式Ⅴ-1)、1,4-二(三氟甲基)苯四甲酸二酐(2.12g,6mmol,式Ⅴ-2)、二甲基亚砜(DMSO)(25mL)投入至100mL的三口烧瓶中,待充分溶解后常温转子搅拌反应24h,得到粘稠的聚酰胺酸溶液。向该溶液中缓慢加入三乙胺(0.01mol,1.01g)、乙酸酐(0.02mol,2.04g),并搅拌36h完成化学亚胺化过程。接着,通过甲醇沉淀、干燥、NMP溶解获得对应结构的CPI溶液(固含量15wt%,特性粘度为2.434dL/g,结构如下)。随后,将CPI溶液经流延成膜,真空条件下50-100-150-250℃的梯度升温,后经剥离获得CPI薄膜材料。
实施例4
1.高含氟联苯二胺合成
在氩气保护下,将3-溴-4-氟三氟甲苯(19.44g,80mmol,式Ⅰ-3)、CuI(1.52g,8.00mmol)、N,N-二甲基乙酰胺(DMAc)(80mL)投入200mL Schlenk瓶中,加热至130℃,保持搅拌至反应结束。随后经二氯甲烷(DCM)萃取、柱分离,获得对应的含氟联苯,2,6'-二氟-5,3'-二(三氟甲基)联苯(结构式Ⅱ-3),产物为无色透明液体。产率:81%。质谱结果:HRMS(ESI)m/z calcd for C14H6F8 +[M+H]+:327.0419,found 327.0421.
将2,6'-二氟-5,3'-二(三氟甲基)联苯(10.00g,30.66mmol,式Ⅱ-3)、发烟HNO3(7.72g,122.63mmol)、冰醋酸(40mL)加入100ml烧杯中,随后搅拌加热至30℃,直至反应结束。接着,将反应到入冰水,并使用乙酸乙酯(EA)萃取、重结晶等,获得对应目标的2,6'-二氟-5,3'-二(三氟甲基)-3,5'-二硝基联苯(浅黄色晶体,结构式Ⅲ-3)。产率:94%。质谱结果:HRMS(ESI)m/z calcd for C14H4F8N2O4 +[M+H]+:417.0118,found 417.0115.
在氮气保护下,将二硝基含氟联苯(10.00g,24.03mmol,式Ⅲ-3)、Pd/C(1g)、分散溶解于100ml的四氢呋喃(THF)中,随后滴加N2H4·H2O(8.01g,160mmol),整个体系搅拌回流在60℃下保持8h。待反应结束,经硅藻土滤除Pd/C,经DCM萃取、柱分离、重结晶,获得对应目标的2,6'-二氟-5,3'-二(三氟甲基)-3,5'-二氨基联苯(白色晶体,结构式Ⅳ-3)。产率:82%。核磁结果:1H NMR(500MHz,DMSO-d6)δ8.18-8.15(m,2H),7.03-7.00(m,2H),4.34(s,4H)。所述含氟二胺结构如下所示。
2.CPI的合成与薄膜制备
在氮气保护下,将上述2,6'-二氟-5,3'-二(三氟甲基)-3,5'-二氨基联苯(1.78g,5mmol,式Ⅳ-3)、六氟三连苯二胺(1.84g,5mmol,式ⅤI-10)、二氟联苯二酐(2.64g,8mmol,式Ⅴ-4)、六氟联苯二酐(0.86g,2mmol,式Ⅴ-4)、N-甲基吡咯烷酮(NMP)(25mL)投入至100mL的三口烧瓶中,待充分溶解后常温转子搅拌反应24h,得到粘稠的聚酰胺酸溶液(特性粘度为1.978dL/g)。将该溶液倾倒在干净的玻璃板上直接流延成膜,并在氮气环境中升温至310℃完成酰亚胺化,后经剥离获得CPI薄膜材料。
实施例5
1.含氟联苯二胺合成
在氩气保护下,将1-氟-2-碘三氟甲苯(19.44g,80mmol,式Ⅰ-2)、CuI(0.76g,4.00mmol)、Cu(0.25g,4.00mmol)、1,3-二甲基-2-咪唑啉酮(DMI)(80mL)投入200mLSchlenk瓶中,加热至180℃,保持搅拌至反应结束。随后经二氯甲烷(DCM)萃取、柱分离,获得对应的含氟联苯,2,2'-二氟-6,6'-二(三氟甲基)联苯(结构式Ⅱ-2),产物为无色透明液体。产率:80%。质谱结果:HRMS(ESI)m/z calcd for C14H6F8 +[M+H]+:327.0419,found327.0421.。
将2,2'-二氟-6,6'-二(三氟甲基)联苯(10.00g,30.66mmol,式Ⅱ-2)、发烟HNO3(7.72g,122.63mmol)、冰醋酸(40mL)加入100ml烧杯中,随后搅拌加热至55℃,直至反应结束。接着,将反应到入冰水,并使用乙酸乙酯(EA)萃取、重结晶等,获得对应目标的2,2'-二氟-6,6'-二(三氟甲基)-4,4'-二硝基联苯(浅黄色晶体,结构式Ⅲ-2)。产率:90%。质谱结果:HRMS(ESI)m/z calcd for C14H4F8N2O4 +[M+H]+:417.0118,found 417.0115.。
在氮气保护下,将上述含氟二硝基联苯(10.00g,24.03mmol,式Ⅲ-2)、Pd/C(1g)、分散溶解于100ml的乙醇(EtOH)中,随后滴加N2H4·H2O(8.01g,160mmol),整个体系搅拌回流在90℃下保持12h。待反应结束,经硅藻土滤除Pd/C,经DCM萃取、柱分离、重结晶,获得对应目标的2,2'-二氟-6,6'-二(三氟甲基)-4,4'-二氨基联苯(白色晶体,结构式Ⅳ-3)。产率:81%。核磁结果:1H NMR(500MHz,DMSO-d6)δ6.9-6.7(m,2H),6.5-6.3(m,2H),4.80(s,4H)。所述含氟二胺结构如下所示。
2.CPI的合成与薄膜制备
在氩气保护下,将2,6'-二氟-5,3'-二(三氟甲基)-3,5'-二氨基联苯(2.14g,6mmol,式Ⅳ-3)、2,2'-二氟-6,6'-二(三氟甲基)-4,4'-二氨基联苯(1.28g,4mmol,式Ⅵ-4)、六氟联苯二酐(1.29g,7mmol,式Ⅴ-4)、二氟三联苯二酐(1.22g,3mmol,式Ⅴ-8)、与间甲酚(25mL)于100mL的三口烧瓶中,待充分溶解后升温至180℃保持15h。反应体系采用甲苯带水除小分子副产物,以促进聚合与完全亚胺化。接着,通过甲醇沉淀、干燥、DMAc溶解获得对应结构的CPI溶液(固含量18wt%,特性粘度为3.068dL/g,PI结构如下)。将该溶液溶液倾倒在干净的玻璃板上直接流延成膜,并在氮气环境中升温至250℃完成去溶剂过程,后经剥离获得CPI薄膜材料。
实施例6
1.含氟联苯二胺合成
在氮气保护下,将2-溴-4-氟三氟甲氧基苯(20.72g,80mmol,式Ⅰ-4)、CuCl(0.79g,8.00mmol)、二甲基亚砜(DMSO)(80mL)投入200mL Schlenk瓶中,加热至170℃,保持搅拌至反应结束。随后经乙酸乙酯(EA)萃取、柱分离等,获得对应的含氟联苯,3,5'-二氟-6,2'-二(三氟甲氧基)联苯(结构式Ⅱ-4),产物为深棕色晶体。产率:83%。质谱结果:HRMS(ESI)m/zcalcd for C14H6F8 O2 +[M+H]+:359.0319,found 359.0327.。
将含氟联苯(10.00g,27.92mmol,式Ⅱ-4)、HNO3(7.72g,122.63mmol)、浓硫酸(40mL)加入100ml烧杯中,随后搅拌加热至50℃,直至反应结束。接着,将反应到入冰水,并使用乙酸乙酯(EA)萃取、重结晶,获得对应目标的3,5'-二氟-6,2'-二(三氟甲氧基)-4,4'-二硝基联苯(浅黄色晶体,结构式Ⅲ-4)。产率:88%。质谱结果:HRMS(ESI)m/z calcd forC14H4F8N2O6 +[M+H]+:449.0018,found 449.0016.。
在氩气保护下,将3,5'-二氟-6,2'-二(三氟甲氧基)-4,4'-二硝基联苯(10.00g,22.31mmol,式Ⅲ-4)、、SnCl2·2H2O(54.20g,240.35mmol)、浓HCl溶液(40mL)溶解于100ml的二氯甲烷中,随后搅拌加热至40℃,直至反应结束。接着,经NaOH溶液中和为弱碱性(pH=7-8),乙酸乙酯(EA)萃取、重结晶,获得对应目标的3,5'-二氟-6,2'-二(三氟甲氧基)-4,4'-二氨基联苯(白色晶体,结构式Ⅳ-4)。产率:85%。核磁结果:1H NMR(500MHz,DMSO-d6)δ7.22-7.19(m,2H),7.00-6.98(m,2H),3.76(s,4H).所述含氟二胺结构如下。
2.CPI的合成与薄膜制备
在氮气保护下,将3,5'-二氟-6,2'-二(三氟甲氧基)-4,4'-二氨基联苯(1.36g,3.5mmol,式Ⅳ-4)、2,2'-二(三氟甲基)二氨基联苯(2.08g,6.5mmol,式Ⅵ-4)、联苯二酐(1.03g,3.5mmol,式Ⅴ-3)、六氟二酐(2.89g,6.5mmol,式Ⅴ-5)、N,N-二甲基甲酰胺(DMF)(25mL)投入至100mL的三口烧瓶中,待充分溶解后常温转子搅拌反应24h,得到粘稠的聚酰胺酸溶液(特性粘度为2.399dL/g)。将该溶液在玻璃板上经流延成膜,真空条件下20-100-150-300℃的梯度升温,后经剥离获得CPI薄膜材料。
对实施例1~6所得CPI薄膜进行性能测试,结果参见表1。其中,特性粘度采用乌氏粘度计于30℃下测得,聚合物(PAA或PI)的浓度为0.5g/dL,测量三次取平均值,反映聚合物的分子量水平。CPI薄膜的玻璃化温度(Tg)由DMA测得,表征仪器为TA Q800,升温速率3℃/min,氮气氛围;5wt%热分解温度(Td5%)由TGA测得,表征仪器为TA Q50,升温速率10℃/min,氮气氛围。CPI薄膜的光学透明性,如,由UV-Vis测得,表征仪器为Shimadzu 3600Plus,范围200~800nm;黄度值(YI)与雾度(Haze)由薄膜色差仪测得,表征仪器为HunterLab,D65光源。CPI薄膜的介电性能(介电常数Dk、介电损耗Df)由矢量网络仪测得,表征仪器为AgilentN5244A,频率为10GHz,谐振腔模式。
表1
以上数据表明,本发明制备的CPI薄膜的Tg值为371~453℃,Td5%值为568~592℃,CTE为1.3~8.8ppm/K;同时,光学透过率T550值为88.1%~89.7%,黄色指数YI值为2.2~4.9;并且在力学性能中,σm值为268~367MPa,Et值为5.7~7.2GPa;此外,在10GHz高频的介电性能Dk值2.70~2.98,Df值0.0013~0.0042。
图2为实施例1和实施例4制备得到的CPI薄膜的UV-Vis曲线,反映其400-800nm波长的高光学透明性。图3为实施例2、3制备得到的CPI薄膜的DMA曲线,tanδ的峰值反映其高玻璃化温度Tg值。图4为实施例1、3制备得到的CPI薄膜的TMA曲线,其曲线斜率反映其超低的热膨胀系数CTE值。图5为实施例1-6制备得到的CPI薄膜的高频介电性能图,表明其低的高频介电常数Dk与介电损耗Df。
由上述实施例可知,基于本发明提供的高含氟芳香二胺的合成及高性能聚酰亚胺的制备方法而得到的CPI薄膜,同时满足了高透明(T550≥88.1%、最高为89.7%、YI≤4.9)、高耐热(Tg≥371℃,最高为453℃,Td5%≥568℃)、低膨胀(CTE≤8.8ppm/K,最小为1.3ppm/K)、高力学性能(σm≥268MPa,Et≥5.7GPa)、低介电(Dk低至2.70、Df低至0.0013)等多方面需求,在柔性显示、穿戴设备、薄膜电池、高频信号基板等关键领域具有极大的应用潜力。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (10)
1.一种高含氟联苯二胺的制备方法,其特征在于,包括如下步骤:
(1)惰性气氛保护下,卤代含氟单苯在非质子极性溶剂中经金属催化剂发生Ullmann偶联反应得到含氟芳香联苯,
所述卤代含氟单苯限定为如下l-1~l-6结构式中的一种或多种,
其中,X为卤素,限定为溴或碘;
所述含氟芳香联苯限定为如下Ⅱ-1~Ⅱ-6结构式中的一种,
(2)步骤(1)所述含氟芳香联苯在硝化剂条件下,发生硝化反应得到含氟联苯二硝基,
所述含氟联苯二硝基限定为如下Ⅲ-1~Ⅲ-6结构式中的一种,
(3)惰性气氛保护下,步骤(2)所述含氟联苯二硝基经还原反应制得目标的高含氟联苯二胺,
所述高含氟联苯二胺限定为如下Ⅳ-1~Ⅳ-6结构式中的一种,
2.根据权利要求1所述的一种高含氟联苯二胺的制备方法,其特征在于,
步骤(1)所述金属催化剂包括Cu、CuI、CuCl、CuBr、Cu2O、Cu(OTf)2中的一种或多种,优选的金属催化剂为Cu、CuI、CuCl中的一种或多种;
步骤(1)所述惰性气氛为氮气、氩气中的一种;
步骤(1)所述非质子极性溶剂包括N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)、1,3-二甲基-2-咪唑啉酮(DMI)的一种或多种;
步骤(1)所述Ullmann偶联反应的温度为50~250℃,优选的Ullmann偶联反应的温度为120~180℃;
步骤(2)所述硝化剂为发烟硝酸、浓硝酸、五氧化二氮、硝酸钠中的一种或多种;
步骤(2)所述硝化反应的溶剂为浓硫酸、冰醋酸、草酸、乙酐、P2O5、甲醇、乙醇、二氯甲烷、氯仿、去离子水中的一种或多种;
步骤(2)所述硝化反应的温度为-80~150℃,优选的硝化反应的温度为-10~80℃;
步骤(3)所述还原反应选择Pd/C及N2H4·H2O体系或SnCl2及HCl体系,所述Pd/C及N2H4·H2O体系中Pd/C投料量为含氟联苯二硝基的1~15wt%,N2H4·H2O投料量为含氟联苯二硝基的物质的量的2~8倍;
所述SnCl2及HCl体系中HCl为含氟侧联苯二硝基的1~100wt%,SnCl2投料量为含氟联苯二硝基的物质的量的2~16倍;
步骤(3)所述还原反应的溶剂为N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、乙醇、异丙醇、四氢呋喃、乙酸乙酯、二氧六环、甲苯、苯和水中的一种或多种;
步骤(3)所述还原反应的温度为50~150℃;
步骤(3)所述惰性气氛为氮气、氩气中的一种。
3.一种无色聚酰亚胺光学薄膜,其特征在于,所述聚酰亚胺的结构通式为:
其中,X Part为高含氟联苯二胺的残基;Ar1独立地为商品化二酐的残基;Ar2为商品化二胺的残基,n和m为对应结构单元的重复数,n:m的比值范围为1:0-5:95;
所述高含氟联苯二胺限定为如下Ⅳ-1~Ⅳ-6结构式中的一种或多种,
所述商品化二酐限定为如下Ⅴ-1~Ⅴ-10结构式中的一种或多种:
其中,R1、R2各独立地选自F、CF3的一种或两种;p及q为R1与R2基的个数,p取值为1~2,q取值为1~4;R3独立地选自、
所述商品化二胺为如下Ⅵ-1~Ⅵ-10结构式中的一种或多种:
其中R1、R2各独立地选自F、CF3的一种或两种;p及q为R1与R2基的个数,p取值为1~2,q取值为1~4;R3独立地选自、
4.根据权利要求3所述的一种无色聚酰亚胺光学薄膜,其特征在于,所述一种无色聚酰亚胺光学薄膜的玻璃化转变温度Tg为371~453℃,5wt%对应的热失重温度Td5%值为568~592℃,热膨胀系数CTE为1.3~8.8ppm/K;所述一种无色聚酰亚胺光学薄膜550nm处的光学透过率T550值为88.1%~89.7%,黄色指数YI值为2.2~4.9;所述一种无色聚酰亚胺光学薄膜拉伸强度σm值为268~367MPa,拉伸模量Et值为5.7~7.2GPa;所述一种无色聚酰亚胺光学薄膜在10GHz高频的介电常数Dk值2.70~2.98,介电损耗Df值0.0013~0.0042。
5.权利要求3-4任一项所述的一种无色聚酰亚胺光学薄膜的制备方法,其特征在于,包括如下步骤:
(a)权利要求1-2任一项所述的一种高含氟联苯二胺的制备方法制备得到的高含氟联苯二胺与商品化二酐、商品化二胺进行均聚/共聚反应得到聚酰亚胺(或者聚酰胺酸前体)溶液;
(b)步骤(a)所述聚酰亚胺(或者聚酰胺酸前体)溶液,经制膜工艺,得到一种无色聚酰亚胺光学薄膜。
6.根据权利要求5所述的一种无色聚酰亚胺光学薄膜的制备方法,其特征在于,步骤(a)所述高含氟联苯二胺与商品化二胺的物质的量之和同商品化二酐的物质的量比值为1:(0.9~1.1);
步骤(a)所述均聚/共聚反应采用一步法或两步法,
所述一步法为在惰性气氛保护下,高含氟联苯二胺与商品化二酐、商品化二胺,加入催化剂/不添加催化剂,在高沸点溶剂中高温缩聚,制得均一且粘性的聚酰亚胺溶液,所述催化剂为苯甲酸、异喹啉一种或两种,高沸点溶剂为间甲酚、对氯酚、间氯酚中的一种或多种,反应温度为150~200℃,反应时间为5~36h,惰性气氛为氮气气氛、氩气中的一种;
所述两步法高含氟联苯二胺与商品化二酐、商品化二胺,在非质子极性溶剂中低温缩聚,制得均一且粘性的聚酰胺酸溶液,所述非质子极性溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)中的一种或多种,反应温度为-10~50℃,反应时间优选为10~120h,惰性气氛为氮气、氩气中的一种;
步骤(b)所述制膜工艺包括流延和热处理,
所述流延工艺包括直接流延成膜、精密狭缝涂布成膜、流延及拉伸连续成膜中的一种或多种;
所述热处理工艺包括去溶剂过程、亚胺化过程,升温方式为连续升温、梯度升温,温度范围为20~450℃,高温气氛为氮气、氩气、真空中的一种。
7.一种柔性显示器,其特征在于,包括权利要求3-4任一项所述的一种无色聚酰亚胺光学薄膜。
8.一种可穿戴设备,其特征在于,包括权利要求3-4任一项所述的一种无色聚酰亚胺光学薄膜。
9.一种柔性电池,其特征在于,包括权利要求3-4任一项所述的一种无色聚酰亚胺光学薄膜。
10.一种5G高频通信设备,其特征在于,包括权利要求3-4任一项所述的一种无色聚酰亚胺光学薄膜。
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