CN116724098A - 热膨胀性粘接剂组合物及热膨胀性粘接片 - Google Patents

热膨胀性粘接剂组合物及热膨胀性粘接片 Download PDF

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Publication number
CN116724098A
CN116724098A CN202280008411.8A CN202280008411A CN116724098A CN 116724098 A CN116724098 A CN 116724098A CN 202280008411 A CN202280008411 A CN 202280008411A CN 116724098 A CN116724098 A CN 116724098A
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CN
China
Prior art keywords
thermally expandable
expandable adhesive
adhesive composition
resin
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280008411.8A
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English (en)
Chinese (zh)
Inventor
布施启示
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN116724098A publication Critical patent/CN116724098A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202280008411.8A 2021-03-17 2022-03-02 热膨胀性粘接剂组合物及热膨胀性粘接片 Pending CN116724098A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021043508 2021-03-17
JP2021-043508 2021-03-17
PCT/JP2022/008704 WO2022196354A1 (ja) 2021-03-17 2022-03-02 熱膨張性接着剤組成物及び熱膨張性接着シート

Publications (1)

Publication Number Publication Date
CN116724098A true CN116724098A (zh) 2023-09-08

Family

ID=83321475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280008411.8A Pending CN116724098A (zh) 2021-03-17 2022-03-02 热膨胀性粘接剂组合物及热膨胀性粘接片

Country Status (4)

Country Link
JP (1) JPWO2022196354A1 (https=)
KR (1) KR20230156301A (https=)
CN (1) CN116724098A (https=)
WO (1) WO2022196354A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7578128B2 (ja) * 2022-09-20 2024-11-06 大日本印刷株式会社 発泡性接着シートおよび構造体の製造方法
KR20260042349A (ko) * 2023-07-14 2026-03-31 도레이 카부시키가이샤 적층체 및 모터용 전기 절연 시트
WO2026014350A1 (ja) * 2024-07-08 2026-01-15 日東電工株式会社 熱伝導易解体接着組成物、熱伝導易解体接着シート、接合体、及び接合体の解体方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030192643A1 (en) * 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
JP2016118784A (ja) * 2014-12-17 2016-06-30 富士フイルム株式会社 偏光板保護フィルム、偏光板および表示装置
JP2017142319A (ja) * 2016-02-09 2017-08-17 サムスン エレクトロニクス カンパニー リミテッド トナー用外添剤及びトナー
JP2017203114A (ja) * 2016-05-12 2017-11-16 スリーエム イノベイティブ プロパティズ カンパニー 接着剤、金属部材組立体及び金属部材組立体の製造方法
CN112189041A (zh) * 2018-05-23 2021-01-05 3M创新有限公司 粘合剂片材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6586483B2 (en) * 2001-01-08 2003-07-01 3M Innovative Properties Company Foam including surface-modified nanoparticles
KR101771884B1 (ko) 2015-04-10 2017-08-25 가부시키가이샤 데라오카 세이사쿠쇼 접착 시트

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030192643A1 (en) * 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
JP2016118784A (ja) * 2014-12-17 2016-06-30 富士フイルム株式会社 偏光板保護フィルム、偏光板および表示装置
JP2017142319A (ja) * 2016-02-09 2017-08-17 サムスン エレクトロニクス カンパニー リミテッド トナー用外添剤及びトナー
JP2017203114A (ja) * 2016-05-12 2017-11-16 スリーエム イノベイティブ プロパティズ カンパニー 接着剤、金属部材組立体及び金属部材組立体の製造方法
CN112189041A (zh) * 2018-05-23 2021-01-05 3M创新有限公司 粘合剂片材

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王国全: "《聚合物改性》", 31 May 2016, 中国轻工业出版社, pages: 94 *

Also Published As

Publication number Publication date
WO2022196354A1 (ja) 2022-09-22
JPWO2022196354A1 (https=) 2022-09-22
KR20230156301A (ko) 2023-11-14
TW202244231A (zh) 2022-11-16

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