CN116709762A - LED chip mounter - Google Patents
LED chip mounter Download PDFInfo
- Publication number
- CN116709762A CN116709762A CN202310054568.0A CN202310054568A CN116709762A CN 116709762 A CN116709762 A CN 116709762A CN 202310054568 A CN202310054568 A CN 202310054568A CN 116709762 A CN116709762 A CN 116709762A
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- Prior art keywords
- rail
- circuit board
- sliding
- led chip
- supporting
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- 230000008093 supporting effect Effects 0.000 claims abstract description 61
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 230000008878 coupling Effects 0.000 claims description 20
- 238000010168 coupling process Methods 0.000 claims description 20
- 238000005859 coupling reaction Methods 0.000 claims description 20
- 239000013013 elastic material Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000011343 solid material Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention belongs to the field of chip mounters, in particular to an LED chip mounter, which comprises a control box and a chip mounting box, wherein the control box is positioned on one side of the chip mounting box, a display board is fixedly connected to the front end of the control box close to the top surface, a fixed seat is fixedly connected to the bottom end of the inner side of the chip mounting box, a turret type chip mounting head is arranged at the top end of the fixed seat, a movable rail is arranged on the inner side of the chip mounting box and positioned below the turret type chip mounting head, a plurality of supporting components are arranged on the top surface of the movable rail and used for supporting a circuit board, the circuit board can be supported through the arrangement of the supporting components, meanwhile, impact force generated during chip mounting can be absorbed and counteracted by the supporting components, the supporting components can bypass pins penetrating downwards, the chip pins cannot be prevented from being inserted, the circuit board is only placed on the movable rail, and the chip mounting operation can be completed by downwards pressing and attaching the chip onto the circuit board through the turret type chip mounting head.
Description
Technical Field
The invention belongs to the field of chip mounters, and particularly relates to an LED chip mounter.
Background
The LED chip is a solid-state semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end is a negative electrode, and the other end is connected with the positive electrode of a power supply.
The full-automatic chip mounter is used for realizing high-speed and high-precision full-automatic mounting of components, and is a device for accurately placing the surface-mounted components on a PCB bonding pad by moving a mounting head. The chip is small, and a chip mounter is generally used for connection in the process of connecting the chip and a circuit board.
In the process of the chip on the circuit board, in order to ensure the chip mounting efficiency, the chip can be quickly contacted and attached to the circuit board under the drive of equipment, so that the attached impact force is easily applied to the circuit board, the circuit board is stressed and bent, the chip and the circuit board are combined in two ways, one way is that pins are directly placed and welded on the surface of the circuit board, the pins always penetrate through reserved holes on the surface of the circuit board, and the pins reach the lower side of the circuit board, so that the impact force cannot be counteracted by simply filling a baffle below the circuit board.
Therefore, the invention provides an LED chip mounter.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.
The technical scheme adopted for solving the technical problems is as follows: the LED chip mounter comprises a control box and a mounting box, wherein the control box is positioned on one side of the mounting box, a display board is fixedly connected to the front end of the control box close to the top surface, a fixed seat is fixedly connected to the bottom end of the inner side of the mounting box, a turret type mounting head is arranged at the top end of the fixed seat, a movable rail is arranged on the inner side of the mounting box and positioned below the turret type mounting head, a plurality of supporting components are arranged on the top surface of the movable rail and used for supporting a circuit board, the circuit board can be supported through the arrangement of the supporting components, impact force generated during mounting can be absorbed and counteracted by the supporting components, the supporting components can bypass pins worn down, the insertion of chip pins is not hindered, and the chip can be mounted on the movable rail by pressing down the chip through the turret type mounting head.
Preferably, the movable rail comprises two clamping rails which are arranged opposite to each other, a second conveyor belt is arranged on the inner side wall of the clamping rails, the supporting assembly comprises a central disc, two ends of the top surface of the central disc are fixedly connected with the bottoms of the two clamping rails, a plurality of groups of sliding grooves are formed in the top surface of the central disc, the inner sides of the sliding grooves are slidably connected with top blocks, the top ends of the top blocks are made of elastic materials, the clamping rails can be effectively adapted to the lamination of various chips, impact force generated during lamination can be absorbed and counteracted, and the problem of bending damage of a circuit board is solved.
Preferably, the bottom rigid coupling of center dish has multiaxis arm, the bottom rigid coupling of multiaxis arm has the base, base and paster case rigid coupling, the front end rigid coupling of paster case has the entering rail, the rear end rigid coupling of paster case has the export rail, export rail and entering rail are the symmetry setting, export rail and entering rail's structure the same, and export rail and entering rail are the symmetry setting, need not turret-type paster head and remove, because turret-type paster head equipment is heavier, and precision instrument is more, always removes and influences precision and life-span easily, after the paster is finished, lets again that the movable rail will paste the circuit board that has moved to export on the rail to realized moving and quiet conversion.
Preferably, the entering rail comprises two symmetrically arranged sliding rails, limiting blocks are fixedly connected between the end parts of the two sliding rails, a first conveying belt is arranged on the inner wall of the sliding rail, a placing groove is formed in the top surface of the sliding rail, the sliding rail is clamped into the sliding rail through the placing groove, the circuit board is transported inwards through the first conveying belt and is caught by the moving rail, the moving rail utilizes a second conveying belt on the inner side of the moving rail to transport the circuit board to the middle part of the patch box for carrying out patch, after patch is finished, the circuit board is transported to the guiding rail through the second conveying belt, and the circuit board is taken out through the other placing groove, so that the feeding and discharging processes are facilitated.
Preferably, the kicking block includes the slider, the top rigid coupling of slider has hollow post, the top rigid coupling of hollow post has the contact cover, the contact cover is hollow setting, and contacts cover flexible material, the surface package of contact cover has the puncture-resistant surface course, can not influence the sinking of chip pin, can also normally support the circuit board simultaneously for sharing undershoot dynamics.
Preferably, the top surface of hollow post has seted up the vent that link up to one side, the top rigid coupling of vent has the fan, reduces the influence that friction brought, and the expansion of wind-force simultaneously can guarantee that the contact cover can be stable withstands the circuit board, still can not excessively go up the top circuit board simultaneously.
Preferably, the bottom of spout runs through the bottom of center dish, slider and spout sliding connection, and the bottom rigid coupling of slider has the transmission line, and during operation, the structure setting of cooperation spout lets the fan in the slider can communicate with external circuit, need not to set up embedded circuit.
Preferably, the support bar that two symmetries set up is fixedly connected on the top surface of hollow post, the support bar is the arc setting, and the top of support bar is slick and sly excessively sets up, the support bar is elastic material, and the setting of support bar can give the contact cover an initial supporting effect, and when the fan is inoperative, the supporting effect of support bar lets the contact cover top surface just be located the below of circuit board, makes it can be under the air current effect quick expansion jack-up, guarantees the equipment and decide high-speed operation.
Preferably, sliding connection has two sets of supporting shoes on the central disk, and two sets of supporting shoes are the symmetry setting, the top of supporting shoe is solid material, and the outside of supporting shoe is provided with locating component, locating component is used for driving the supporting shoe and removes the location, through the setting of supporting shoe, and the supporting shoe supports in the place that does not have hole pin on the circuit board under locating component's drive, provides a plurality of supporting points for the circuit board middle part to further improved the stability of circuit board at high-speed paster in-process, reduced the impaired crooked problem of circuit board lamination.
Preferably, the locating component includes the electronic round, the electronic round is located one side of slider, and the laminating of the inner wall of electronic round and spout, the top rigid coupling of slider has laser emission module, the bottom middle part rigid coupling of fixing base has the receiving block, has realized supporting circuit board through this kind of mode, can not influence the effect that the guide leg is sunk simultaneously.
The beneficial effects of the invention are as follows:
1. according to the LED chip mounter, the circuit board can be supported through the arrangement of the supporting component, meanwhile, impact force generated during chip mounting can be absorbed and counteracted by the supporting component, the supporting component can bypass the pins which penetrate downwards, insertion of the pins of the chip cannot be prevented, the circuit board is only placed on the moving rail during chip mounting, and the chip is pressed down and attached to the circuit board through the turret type chip mounting head, so that chip mounting work can be completed.
2. According to the LED chip mounter, the movable rail can be driven to integrally move through the arrangement of the multi-axis mechanical arm, the whole equipment comprises three sections of rails, a circuit board is placed in from the entering rail and is transited to the movable rail, the movable rail can move in multiple directions in the mounting box after receiving the circuit board, so that the chip mounting operation of the turret type chip mounting head is matched, the turret type chip mounting head is not required to move, the precision and the life surface are easily influenced due to the fact that the turret type chip mounting head equipment is heavy and precise instruments are more, and when the mounting is finished, the movable rail moves the mounted circuit board to the guiding rail, so that the conversion between motion and static is realized.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is a perspective view of an access rail in accordance with the present invention;
fig. 4 is a perspective view of a turret-type patch head and a moving rail of the present invention;
FIG. 5 is a perspective view of a moving rail in the present invention;
FIG. 6 is a perspective view of a top block of the present invention;
FIG. 7 is a bottom perspective view of the holder of the present invention;
in the figure: 1. a control box; 2. a patch box; 3. a guide rail; 4. a display panel; 5. entering a rail; 6. a fixing seat; 7. turret type patch head; 8. a moving rail; 9. a base; 11. a slide rail; 12. a placement groove; 13. a limiting block; 14. a first conveyor belt; 15. a multi-axis mechanical arm; 16. clamping the rail; 17. a center plate; 18. a chute; 19. a top block; 20. a support block; 21. a transmission line; 22. a slide block; 24. a hollow column; 25. a vent; 26. a blower; 27. a support bar; 28. a contact cover; 29. a block is received.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
Example 1
As shown in fig. 1 to 2, the LED chip mounter according to the embodiments of the present invention includes a control box 1, a chip mounting box 2, a display board 4, a turret type chip mounting head 7 and a moving rail 8, where the control box 1 is located at one side of the chip mounting box 2, the front end of the control box 1 is fixedly connected with the display board 4 near the top surface, the bottom end of the inner side of the chip mounting box 2 is fixedly connected with a fixing seat 6, the top end of the fixing seat 6 is provided with the turret type chip mounting head 7, the inner side of the chip mounting box 2 is provided with the moving rail 8, the moving rail 8 is located below the turret type chip mounting head 7, the top surface of the moving rail 8 is provided with a plurality of support components, and the support components are used for supporting a circuit board.
As shown in fig. 1 to 5, the moving rail 8 includes two opposite clamping rails 16, and a second conveyor belt is disposed on an inner side wall of the clamping rails 16. The circuit board is opened to two conveyer belts II and then is transported, the supporting component includes central dish 17, the top surface both ends and the bottom rigid coupling of two card rails 16 of central dish 17, the multiunit spout 18 has been seted up on the top surface of central dish 17, the inboard sliding connection of spout 18 has kicking block 19, the top of kicking block 19 is elastic material, during operation, because there is certain gap between central dish 17 and the card rail 16, lets kicking block 19 can be located between central dish 17 and the card rail 16, and the top surface of kicking block 19 laminating with the bottom surface of circuit board, and a plurality of kicking blocks 19 are covered between the bottom surface of circuit board, can play the supporting effect, and because the top of kicking block 19 is elastic material, when the pin passes the circuit board, can be with elastic kicking block 19 down, can not puncture kicking block 19 simultaneously, lets the pin can normally laminate, through this kind of setting, can effectually adapt to the laminating of various types of chips, can absorb the problem of impact force when offset laminating, the bending damage of circuit board simultaneously.
As shown in fig. 1 to 3, the bottom rigid coupling of center dish 17 has multiaxis arm 15, multiaxis arm 15's bottom rigid coupling has base 9, base 9 and paster case 2 rigid coupling, paster case 2's front end rigid coupling has into rail 5, paster case 2's rear end rigid coupling has out rail 3, it is symmetrical setting with entering rail 5 to export rail 3, export rail 3 and entering rail 5's structure is the same, and export rail 3 and entering rail 5 are symmetrical setting, during operation, through multiaxis arm 15's setting, can drive movable rail 8 whole and remove, and whole equipment includes the three-section track, and the circuit board is put into from entering rail 5, excessively to movable rail 8 on, after movable rail 8 received the circuit board, can remove in paster case 2 to the chip work of cooperation turret type paster head 7 need not turret type paster head 7 to remove, because turret type paster head 7 equipment is heavier, and accurate instrument always moves and influences precision and face easily, lets movable rail 8 remove to have moved to good circuit board and has been moved to the stationary instrument 3 again after the movable rail has been moved to the movable rail 3 has realized and has moved to the movable rail 3.
As shown in fig. 3, the entering rail 5 comprises two symmetrically arranged sliding rails 11, a limiting block 13 is fixedly connected between the end parts of the two sliding rails 11, a first conveyor belt 14 is arranged on the inner wall of the sliding rail 11, a placing groove 12 is formed in the top surface of the sliding rail 11, during operation, a circuit board directly falls down from the upper part of the entering rail 5, is clamped into the sliding rail 11 through the placing groove 12, is transported inwards through the first conveyor belt 14 and is caught by the moving rail 8, the moving rail 8 utilizes a second conveyor belt on the inner side of the moving rail 8 to transport the circuit board to the middle part of the patch box 2 for patch, and after patch is finished, the circuit board is transported to the leading-out rail 3 through the second conveyor belt, and is taken out through the other placing groove 12, so that the feeding and discharging processes are facilitated.
As shown in fig. 4 to 6, the top block 19 includes a slider 22, a hollow column 24 is fixedly connected to the top end of the slider 22, a contact cover 28 is fixedly connected to the top end of the hollow column 24, the contact cover 28 is hollow, and is made of a flexible material, the surface of the contact cover 28 is wrapped with a puncture-resistant surface layer, and when the pins of a chip pass through the circuit board in the process of mounting, the pins of the chip are in contact with the outer surface of the contact cover 28, and the contact cover 28 of the contact point is pushed downwards, so that sinking of the pins of the chip is not affected, and meanwhile, the circuit board can be normally supported to share the undershoot force.
As shown in fig. 5 to 6, the top surface of the hollow column 24 is provided with a ventilation opening 25 penetrating to one side, the top end of the ventilation opening 25 is fixedly connected with a fan 26, when the circuit board is in operation, if the contact cover 28 is set to be a common elastic block, the contact cover is easy to deform after long-term use, so that the supporting effect is lost, the contact cover 28 always keeps in an upward-pushing state and is unfavorable for the moving process of the circuit board, when the contact cover 28 is required to be pushed up, the contact cover 28 can be pushed up by only opening the fan 26 to fill air pressure into the contact cover 28, the circuit board is supported by the air pressure, meanwhile, after the patch is finished, the fan 26 is closed, the air pressure in the contact cover 28 is lost, the bottom of the circuit board cannot be rubbed, the circuit board can be smoothly moved outwards, the influence caused by friction is reduced, meanwhile, the expansion of the air force can ensure that the contact cover 28 can stably push up the circuit board, and meanwhile, the circuit board cannot be excessively pushed up.
As shown in fig. 5 to 6, the bottom end of the chute 18 penetrates through the bottom end of the central disc 17, the sliding block 22 is slidably connected with the chute 18, and the bottom end of the sliding block 22 is fixedly connected with the transmission line 21.
As shown in fig. 6, two support bars 27 are fixedly connected to the top surface of the hollow column 24, the support bars 27 are in an arc shape, the top ends of the support bars 27 are in smooth transition, the support bars 27 are made of elastic materials, and when in operation, the support bars 27 can provide an initial supporting effect for the contact cover 28, and when the fan 26 is not in operation, the support effect of the support bars 27 enables the top surface of the contact cover 28 to be just located below the circuit board, so that the contact cover 28 can be quickly expanded and jacked under the action of air flow, and the equipment can be guaranteed to run at a high speed.
As shown in fig. 5, two sets of supporting blocks 20 are slidably connected on the central disk 17, the two sets of supporting blocks 20 are symmetrically arranged, the top ends of the supporting blocks 20 are made of solid materials, positioning components are arranged on the outer sides of the supporting blocks 20 and used for driving the supporting blocks 20 to move and position, when the circuit board is in operation, simple elastic supporting effects are common, impact bending is easy to occur, the supporting blocks 20 can be moved to a place without hole pins on the circuit board to support under the driving of the positioning components through the arrangement of the supporting blocks 20, and a plurality of supporting points are provided for the middle part of the circuit board, so that the stability of the circuit board in the high-speed surface mounting process is further improved, and the problem that the circuit board is damaged and bent due to the pressing is reduced.
Example two
As shown in fig. 5 to 7, a comparative example one, in which another embodiment of the present invention is: the positioning assembly comprises an electric wheel, the electric wheel is located on one side of the sliding block 22, the electric wheel is attached to the inner wall of the sliding groove 18, a laser emitting module is fixedly connected to the top end of the sliding block 22, a receiving block 29 is fixedly connected to the middle of the bottom end of the fixing seat 6, when the circuit board moves to the lower portion of the turret type patch head 7 in operation, the laser emitting module at the top end of the sliding block 22 is started to emit laser outwards, if the sliding block 22 is located at the bottom of a pin hole, the laser is received by the receiving block 29 through the pin hole, the sliding block 22 is driven to move through the electric wheel at the moment, the position is changed until the receiving block 29 cannot receive the laser, the circuit board is supported in a mode, and the effect of sinking of the guide foot cannot be affected.
In the process of pasting the chip onto the circuit board, in order to ensure the pasting efficiency, the chip can be quickly contacted and pasted with the circuit board under the drive of equipment, so that the pasting impact force is easy to act on the circuit board, the circuit board is stressed and bent, the chip and the circuit board are combined in two ways, one way is that pins are directly placed and welded on the surface of the circuit board, always the pins penetrate through holes reserved on the surface of the circuit board, and reach the lower part of the circuit board, so that the impact force can not be simply counteracted by a baffle plate on the lower part of the circuit board, the circuit board can be supported by the arrangement of the supporting component, meanwhile, the impact force during pasting can be absorbed and counteracted by the supporting component, the supporting component can bypass the pins which are penetrated downwards, the chip pins can not be hindered from being inserted, the chip can be pressed down and pasted onto the circuit board through the turret type paster head 7, and the pasting work can be completed; because a certain gap exists between the central disc 17 and the clamping rail 16, the top blocks 19 can be positioned between the central disc 17 and the clamping rail 16, the top surfaces of the top blocks 19 are attached to the bottom surface of the circuit board, a plurality of top blocks 19 are fully distributed between the bottom surfaces of the circuit board, a supporting effect can be achieved, and because the top ends of the top blocks 19 are made of elastic materials, when pins pass through the circuit board, the elastic top blocks 19 can be pressed downwards, the top blocks 19 cannot be pierced, the pins can be attached normally, through the arrangement, the device can be effectively suitable for attaching various types of chips, impact force during attaching can be absorbed and offset, and the problem of bending damage of the circuit board is solved; through the arrangement of the multi-axis mechanical arm 15, the movable rail 8 can be driven to integrally move, the whole equipment comprises three sections of rails, a circuit board is put in from the entering rail 5 and is transited to the movable rail 8, the movable rail 8 can move in multiple directions in the patch box 2 after receiving the circuit board, so that the turret type patch head 7 is matched with the chip pasting work without moving the turret type patch head 7, as the turret type patch head 7 equipment is heavier and precise instruments are more, the precision and the life surface are easy to influence due to the continuous movement, and after the patch is finished, the movable rail 8 moves the pasted circuit board to the leading-out rail 3, so that the conversion between motion and static is realized; the circuit board directly falls from the upper part of the entering rail 5, is clamped into the sliding rail 11 through the placing groove 12, is transported inwards through the first conveyor belt 14 and is received by the moving rail 8, the moving rail 8 utilizes the second conveyor belt on the inner side of the moving rail 8 to transport the circuit board to the middle part of the patch box 2 for patch, and after patch is finished, the circuit board is transported to the leading-out rail 3 through the second conveyor belt, and is taken out through the other placing groove 12, so that the feeding and discharging processes are facilitated; when the pins of the chip pass through the circuit board in the process of pasting, the pins are contacted with the outer surface of the contact cover 28, and the contact cover 28 of the contact point is pushed downwards, so that the sinking of the pins of the chip is not influenced, and the circuit board can be normally supported to share the undershoot force; if the contact cover 28 is set to be a common elastic block, the contact cover is easy to deform after long-term use, so that the supporting effect is lost, the contact cover 28 keeps an upward-pushing state all the time and is not beneficial to the moving process of the circuit board, when the contact cover 28 needs to be pushed up, the contact cover 28 can be pushed up by opening the fan 26 to fill air pressure into the contact cover 28 through the hollow arrangement of the fan 26, the circuit board is supported by using air pressure, meanwhile, after the surface mounting is finished, the fan 26 is closed, the air pressure in the contact cover 28 is lost, the bottom of the circuit board cannot be rubbed against the bottom surface of the circuit board, the circuit board can be smoothly moved outwards, the influence caused by friction is reduced, meanwhile, the expansion of wind force can ensure that the contact cover 28 can stably push up the circuit board, and meanwhile, the circuit board cannot be excessively pushed up; the blower 26 in the slide block 22 can be communicated with an external circuit by matching with the structural arrangement of the slide groove 18, and an embedded circuit is not required to be arranged; the arrangement of the supporting bars 27 can provide an initial supporting effect for the contact cover 28, and when the fan 26 does not work, the supporting effect of the supporting bars 27 ensures that the top surface of the contact cover 28 is just positioned below the circuit board, so that the contact cover can be quickly expanded and jacked under the action of air flow, and the equipment can be ensured to run at a high speed; the simple elastic supporting effect is common, impact bending is easy to cause, through the arrangement of the supporting blocks 20, the supporting blocks 20 can move to a position without hole pins on the circuit board to support under the drive of the positioning assembly, and a plurality of supporting points are provided for the middle part of the circuit board, so that the stability of the circuit board in the high-speed surface mounting process is further improved, and the problem of damage bending caused by the press fit of the circuit board is solved; when the circuit board moves to the lower part of the turret type patch head 7, the laser emitting module at the top end of the sliding block 22 is started to emit laser outwards, if the sliding block 22 is positioned at the bottom of the pin hole, the laser is received by the receiving block 29 through the pin hole, and the sliding block 22 is driven to move through the electric wheel at the moment to change the position until the receiving block 29 can not receive the laser, so that the circuit board is supported, and the sinking effect of the pins is not influenced.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. An LED chip mounter, its characterized in that: including control box (1) and paster case (2), control box (1) is located one side of paster case (2), the front end of control box (1) is leaned on the top surface rigid coupling to have display panel (4), the inboard bottom rigid coupling of paster case (2) has fixing base (6), the top of fixing base (6) is provided with capstan head formula paster head (7), the inboard of paster case (2) is provided with movable rail (8), movable rail (8) are located the below of capstan head formula paster head (7), the top surface of movable rail (8) is provided with a plurality of supporting components, supporting component is used for supporting the circuit board.
2. The LED chip mounter according to claim 1, wherein: the movable rail (8) comprises two clamping rails (16) which are arranged opposite to each other, a second conveying belt is arranged on the inner side wall of each clamping rail (16), the supporting assembly comprises a central disc (17), two ends of the top surface of the central disc (17) are fixedly connected with the bottoms of the two clamping rails (16), a plurality of groups of sliding grooves (18) are formed in the top surface of the central disc (17), top blocks (19) are connected to the inner sides of the sliding grooves (18) in a sliding mode, and the top ends of the top blocks (19) are made of elastic materials.
3. The LED chip mounter according to claim 2, wherein: the utility model discloses a multi-axis mechanical arm, including center dish (17), base (9), paster case (2), lead out rail (3) and get into rail (5) and be symmetrical setting, lead out rail (3) and get into rail (5) the structure the same of (5), and lead out rail (3) and get into rail (5) and be symmetrical setting.
4. A LED chip mounter according to claim 3, wherein: the entrance rail (5) comprises two symmetrically arranged sliding rails (11), limiting blocks (13) are fixedly connected between the end parts of the two sliding rails (11), a first conveyor belt (14) is arranged on the inner wall of the sliding rail (11), and a placing groove (12) is formed in the top surface of the sliding rail (11).
5. The LED chip mounter according to claim 2, wherein: the top block (19) comprises a sliding block (22), a hollow column (24) is fixedly connected to the top end of the sliding block (22), a contact cover (28) is fixedly connected to the top end of the hollow column (24), the contact cover (28) is arranged in a hollow mode, and the contact cover (28) is made of flexible materials.
6. The LED chip mounter according to claim 5, wherein: the top surface of the hollow column (24) is provided with a vent (25) penetrating to one side, and the top end of the vent (25) is fixedly connected with a fan (26).
7. The LED chip mounter according to claim 5, wherein: the bottom of spout (18) runs through the bottom of center dish (17), slider (22) and spout (18) sliding connection, and the bottom rigid coupling of slider (22) has transmission line (21), and during operation, the structure setting of cooperation spout 18 lets the fan 26 in slider 22 communicate with external circuit, need not to set up embedded circuit.
8. The LED chip mounter according to claim 7, wherein: two support bars (27) which are symmetrically arranged are fixedly connected to the top surface of the hollow column (24), the support bars (27) are arranged in an arc shape, the top ends of the support bars (27) are arranged in a smooth transition mode, and the support bars (27) are made of elastic materials.
9. The LED chip mounter according to claim 8, wherein: two groups of supporting blocks (20) are connected to the center plate (17) in a sliding mode, the two groups of supporting blocks (20) are symmetrically arranged, the top ends of the supporting blocks (20) are made of solid materials, positioning components are arranged on the outer sides of the supporting blocks (20), and the positioning components are used for driving the supporting blocks (20) to move and position.
10. The LED chip mounter according to claim 9, wherein: the positioning assembly comprises an electric wheel, the electric wheel is located on one side of the sliding block (22), the electric wheel is attached to the inner wall of the sliding groove (18), a laser emitting module is fixedly connected to the top end of the sliding block (22), and a receiving block (29) is fixedly connected to the middle of the bottom end of the fixing seat (6).
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| CN202310054568.0A CN116709762B (en) | 2023-02-03 | 2023-02-03 | LED chip mounter |
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| CN202310054568.0A CN116709762B (en) | 2023-02-03 | 2023-02-03 | LED chip mounter |
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| CN116709762B CN116709762B (en) | 2024-04-16 |
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