CN209843682U - LED double-end chip mounting machine - Google Patents
LED double-end chip mounting machine Download PDFInfo
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- CN209843682U CN209843682U CN201920955188.3U CN201920955188U CN209843682U CN 209843682 U CN209843682 U CN 209843682U CN 201920955188 U CN201920955188 U CN 201920955188U CN 209843682 U CN209843682 U CN 209843682U
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Abstract
The utility model relates to the technical field of semiconductor packaging, in particular to a LED double-head chip mounting machine, which comprises a bedplate, a bracket feeding and receiving component and two chip mounting components; the support feeding and receiving assembly is positioned in the middle of the front end of the bedplate and comprises two feeding and receiving mechanisms which are arranged in parallel; the chip mounting component comprises a support moving platform, a chip jacking component and a chip mounting mechanism, wherein the support moving platform is positioned in the middle of the bedplate, and the chip mounting mechanism is positioned at the rear end of the bedplate. The utility model provides a LED double-end chip pastes installation can improve chip and paste dress speed, reduction in production cost.
Description
Technical Field
The utility model relates to a semiconductor package technical field especially relates to a LED double-end chip mounter.
Background
A Light Emitting Diode (Light Emitting Diode), referred to as LED for short, is one of semiconductor diodes that can convert electrical energy into Light energy. The LED is called a fourth generation light source, has the characteristics of energy saving, environmental protection, safety, long service life, low power consumption, simple and convenient maintenance and the like, and has been widely used in the fields of various indications, displays, decorations, backlight sources, general illumination and the like.
The LED chip mounting equipment is automatic equipment which is used for mounting the LED wafer on the LED support after the LED wafer is absorbed from the crystal ring and is used for realizing automatic bonding of the LED wafer, and can meet the requirements of most of LED production lines. With the popularization and various application development of the LED, the demand of people on the LED is increasing day by day, and the requirements of various large LED manufacturers on the capacity and the precision of LED chip mounting equipment are higher and higher
The chip mounting machine of the traditional single-head LED chip mounting machine has the disadvantages of low chip mounting speed, low working efficiency, large occupied space and higher production cost.
In view of the above defects and market needs in the prior art, there is a strong need to develop a new LED chip mounter that can increase the speed of chip mounting and reduce the production cost.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a LED double-end chip pastes installation can improve chip and paste dress speed, reduction in production cost.
In order to achieve the purpose, the utility model provides a LED double-head chip mounting machine, which comprises a bedplate, a bracket feeding and receiving component and two chip mounting components;
the support feeding and receiving assembly is positioned in the middle of the front end of the bedplate and comprises two feeding and receiving mechanisms which are arranged in parallel, and each feeding and receiving mechanism comprises a push rod mechanism, a material box and a lifting mechanism; the material box is of a structure with two open ends, a plurality of material storage layers are arranged in the material box from top to bottom, and each material storage layer can be used for placing a row of LED supports; the push rod mechanism is positioned in front of the opening at one end of the material box and is used for ejecting the LED bracket in the material storage layer out of the opening at the other end of the material box; the lifting mechanism is fixedly connected with the bottom of the material box and used for driving the material box to move up and down;
the chip mounting component comprises:
the support moving platform is positioned at the middle part of the bedplate, is positioned at one side close to the opening at the other end of the material box and is used for receiving the LED support which is not subjected to core sticking and is supplied by the material box and returning the LED support subjected to core sticking to the material box;
the support feeding and receiving assembly and the two support moving platforms are positioned between the two chip moving platforms;
the chip jacking assembly is used for jacking the chip; the chip moving platform is fixedly connected with the chip jacking assembly and used for driving the chip jacking assembly to move along an X axis and a Y axis in the horizontal direction;
and the chip mounting mechanism is positioned at the rear end of the bedplate and is provided with a suction nozzle which can suck the chip from the upper part of the chip jacking assembly and rotate to the upper part of the support moving platform to place the chip into the LED support.
Preferably, the LED dual head chip mounter further includes:
and the two support moving platforms are both positioned above the horizontal guide rail and are in sliding connection with the horizontal guide rail along the X-axis direction.
Preferably, the cradle moving platform comprises:
the first support bottom plate is connected with the horizontal guide rail in a sliding manner;
the second support bottom plate is positioned above the first support bottom plate and is in sliding connection with the top of the first support bottom plate along the Y-axis direction;
the support positioning assembly comprises a pressing frame and a roller assembly located below the pressing frame, and the roller assembly is used for being matched with the pressing frame to transfer the LED support located between the pressing frame and the roller assembly along the Y-axis direction.
Preferably, the chip moving platform includes:
the first chip bottom plate is fixedly arranged at the top of the bedplate;
the second chip bottom plate is positioned above the first chip bottom plate and is connected with the top of the first chip bottom plate in a sliding mode along the Y-axis direction;
the third chip bottom plate is positioned above the second chip bottom plate and is in sliding connection with the top of the second chip bottom plate along the X-axis direction;
and the loading disc positioning assembly is fixedly arranged at the top of the third chip bottom plate.
Preferably, the chip jacking assembly comprises:
the jacking main body is positioned below the carrying disc positioning assembly and used for jacking up the chip;
the XOY plane adjusting platform is fixedly arranged with the carrying disc positioning assembly, the jacking main body is positioned on the XOY plane adjusting platform, and the XOY plane adjusting platform is used for adjusting the relative positions of the jacking main body and the carrying disc positioning assembly on the XOY plane.
Preferably, the chip mounting mechanism further includes:
a rotating electric machine;
one end of the mounting arm is fixedly connected with the driving end of the rotating motor, and the other end of the mounting arm is fixedly connected with the suction nozzle;
the crystal taking lens is used for acquiring first position information of a chip in the chip moving platform so as to facilitate the rotary motor to control the suction nozzle to suck the chip according to the first position information;
the glue dispensing assembly is used for placing glue into a bonding pad of the LED bracket;
and the mounting lens is used for acquiring second position information of the bonding pad in the LED bracket, so that the rotary motor can control the suction nozzle to place the chip into the glued bonding pad according to the second position information.
Preferably, the rotating motor is located between the crystal taking lens and the mounting lens, and the two dispensing assemblies are located between the mounting lens.
Preferably, the material feeding and receiving mechanism is of a double-station structure, and each station is provided with the push rod mechanism, the material box and the lifting mechanism.
The beneficial effects of the utility model reside in that: the LED double-head chip mounting machine is provided, the chip mounting speed can be improved, and the production cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an LED dual-head chip mounter according to an embodiment;
fig. 2 is an exploded schematic view of an LED dual-head chip mounter provided by the embodiment;
FIG. 3 is a schematic structural view of the rack feeding and receiving assembly according to an embodiment;
fig. 4 is an exploded schematic view of a gantry mobile platform provided by an embodiment;
fig. 5 is an exploded schematic view of a chip moving platform provided in an embodiment;
FIG. 6 is an exploded view of a chip lift assembly according to an exemplary embodiment;
fig. 7 is a schematic structural diagram of a chip mounting mechanism according to an embodiment.
In the figure:
1. a platen;
2. the support feeding and receiving assembly; 201. a push rod mechanism; 202. a magazine; 203. a lifting mechanism; 204. a second station;
3. a support moving platform; 301. a first bracket bottom plate; 302. a second bracket bottom plate; 303. a bracket positioning assembly; 3031. a pressing frame; 3032. a roller assembly;
4. a chip moving platform; 401. a first chip chassis; 402. a second chip chassis; 403. a third chip chassis; 404. a carrier positioning assembly;
5. a chip jacking assembly; 501. jacking up the main body; 502. an XOY plane adjustment platform;
6. a chip mounting mechanism; 601. a rotating electric machine; 602. mounting an arm; 603. taking a crystal lens; 604. dispensing components; 605. mounting a lens;
7. a horizontal guide rail.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention are clearly and completely described with reference to the drawings in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.
Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are only for convenience of describing the present invention, but do not indicate or imply that the device or element referred to must have the specific orientation, operate in the specific orientation configuration, and thus, should not be construed as limiting the present invention.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
Referring to fig. 1 to 7, the embodiment provides an LED dual-head chip mounter, which includes a platen 1, a support feeding and receiving assembly 2, and two chip mounting assemblies.
The support feeding and receiving assembly 2 is positioned in the middle of the front end of the bedplate 1 and comprises two feeding and receiving mechanisms which are arranged in parallel, and each feeding and receiving mechanism comprises a push rod mechanism 201, a material box 202 and a lifting mechanism 203; the material box 202 is of a structure with two open ends, a plurality of material storage layers are arranged in the material box from top to bottom, and a row of LED supports can be placed on each material storage layer; the push rod mechanism 201 is positioned in front of an opening at one end of the material box 202 and is used for ejecting the LED bracket in the material storage layer out of an opening at the other end of the material box 202; the lifting mechanism 203 is fixedly connected with the bottom of the material box 202 and is used for driving the material box 202 to move up and down. Preferably, the material feeding and receiving mechanism is a double-station structure, and each station is provided with the push rod mechanism 201, the material box 202 and the lifting mechanism 203.
The chip mounting component comprises a support moving platform 3, a chip moving platform 4, a chip jacking component 5 and a chip mounting mechanism 6, wherein the support moving platform 3, the chip moving platform 4 and the chip jacking component are positioned in the middle of the bedplate 1, and the chip mounting mechanism 6 is positioned at the rear end of the bedplate 1. The support moving platform 3 is located at a side close to the opening at the other end of the magazine 202, and is used for receiving the un-cored LED support supplied by the magazine 202 and returning the cored LED support to the magazine 202. The support feeding and receiving assembly 2 and the two support moving platforms 3 are located between the two chip moving platforms 4. The chip jacking assembly 5 is used for jacking up a chip; the chip moving platform 4 is fixedly connected with the chip jacking assembly 5 and used for driving the chip jacking assembly 5 to move along the X axis and the Y axis in the horizontal direction. The chip mounting mechanism 6 is provided with a suction nozzle which can suck the chip from the upper part of the chip jacking assembly 5 and rotate to the upper part of the support moving platform 3 to place the chip into the LED support.
Preferably, the LED double-ended chip mounter further includes a horizontal guide rail 7, and the two support moving platforms 3 are both located above the horizontal guide rail 7 and are connected to the horizontal guide rail 7 in a sliding manner along the X-axis direction. Specifically, use a set of horizontal guide 7 to supply two sets of support moving platform 3 to share, can effectively reduce the equipment volume, improve the compactness of equipment.
In this embodiment, the support moving platform 3 includes a first support base plate 301, a second support base plate 302, and a support positioning assembly 303. The first bracket bottom plate 301 is slidably connected to the horizontal guide rail 7. The second bracket bottom plate 302 is located above the first bracket bottom plate 301 and is connected with the top of the first bracket bottom plate 301 in a sliding manner along the Y-axis direction. The support positioning assembly 303 comprises a pressing frame 3031 and a roller assembly 3032 positioned below the pressing frame 3031, wherein the roller assembly 3032 is used for cooperating with the pressing frame 3031 to transfer the LED support positioned between the pressing frame 3031 and the roller assembly 3032 along the Y-axis direction. Specifically, by controlling the sliding distance between the first rack base plate 301 and the second rack base plate 302, the position of the carrier tray positioning assembly 404 on the XOY plane can be controlled.
The chip moving platform 4 includes a first chip substrate 401, a second chip substrate 402, a third chip substrate 403, and a tray positioning assembly 404. The first die pad 401 is fixedly disposed on the top of the platen 1. The second chip bottom plate 402 is located above the first chip bottom plate 401 and is connected with the top of the first chip bottom plate 401 in a sliding manner along the Y-axis direction. The third chip bottom plate 403 is located above the second chip bottom plate 402 and is connected to the top of the second chip bottom plate 402 in a sliding manner along the X-axis direction. The tray positioning assembly 404 is fixedly disposed on the top of the third chip bottom plate 403. Specifically, by controlling the sliding distance between the second chip chassis 402 and the third chip chassis 403, the position of the tray positioning assembly 404 on the XOY plane can be controlled.
The chip jacking assembly 5 comprises a jacking body 501 and an XOY plane adjustment platform 502. The jacking body 501 is located below the tray positioning assembly 404 and is used for jacking up the chip. The XOY plane adjusting platform 502 and the disk loading positioning assembly 404 are fixedly arranged, the jacking main body 501 is located on the XOY plane adjusting platform 502, and the XOY plane adjusting platform 502 is used for adjusting the relative positions of the jacking main body 501 and the disk loading positioning assembly 404 on the XOY plane.
The chip mounting mechanism 6 further includes a rotating motor 601, a mounting arm 602, a crystal taking lens 603, a dispensing component 604, and a mounting lens 605. One end of the mounting arm 602 is fixedly connected with the driving end of the rotating motor 601, and the other end of the mounting arm is fixedly connected with the suction nozzle. The crystal taking lens 603 is configured to obtain first position information of a chip in the chip moving platform 4, so that the rotary motor 601 controls the suction nozzle to suck up the chip according to the first position information. The glue dispensing assembly 604 is used to place glue into the pads of the LED support. The mounting lens 605 is configured to obtain second position information of the pad in the LED support, so that the rotating electrical machine 601 controls the suction nozzle to place the chip into the dispensed pad according to the second position information. Specifically, the rotating electrical machine 601 is located between the taking lens 603 and the mounting lens 605, and the two dispensing assemblies 604 are located between the mounting lens 605. It can be understood that such a mechanical layout makes it possible to take full advantage of the floor space provided by the table 1 and to increase the compactness of the apparatus.
The working process of the LED double-head chip mounter provided by the embodiment is as follows:
adjusting an XOY plane adjusting platform 502 according to the length of a mounting arm 602 to enable a jacking main body 501 to be positioned at a position corresponding to a suction nozzle;
secondly, a material box 202 filled with the LED support is placed into a first station of the material receiving mechanism, and the lifting mechanism 203 enables the uppermost material storage layer to be aligned with the push rod mechanism 201;
the push rod mechanism 201 extends out to push the LED support in the uppermost storage material layer out to a position between the pressing frame 3031 and the roller assembly 3032, the roller assembly 3032 rotates forwards, and the LED support is moved to the center position of the support moving platform 3;
the first support bottom plate 301 slides along the horizontal guide rail 7, the second support bottom plate 302 slides along the first support bottom plate 301, and the LED support is adjusted front, back, left and right so as to be positioned at the position where the dispensing component 604 and the suction nozzle can contact;
fourthly, the glue dispensing assembly 604 acts to place glue in the bonding pad of the LED bracket;
the second chip bottom plate 402 slides along the first chip bottom plate 401, the third chip bottom plate 403 slides along the second chip bottom plate 402, and the position of the jacking main body 501 is adjusted back and forth, left and right so that the jacking main body 501 is positioned at the position where the suction nozzles can contact;
sixthly, the crystal taking lens 603 works to obtain the position information of the carrier disc positioning assembly 404 and the chip, and the working parameters of the rotating motor 601 are adjusted to enable the suction nozzle to move right above the chip;
seventhly, the main body 501 is jacked up, the chip is jacked up, the suction nozzle descends, the chip is sucked up, and the suction nozzle ascends;
the mounting lens 605 works to obtain the position of the glued bonding pad, the working parameters of the rotating motor 601 are adjusted to enable the suction nozzle to rotate to the position above the bonding pad, the suction nozzle descends, the chip is placed in the bonding pad, and mounting of the bonding pad is completed;
ninthly, after mounting of all bonding pads among the LEDs is completed, the first support bottom plate 301 slides along the horizontal guide rail 7, the second support bottom plate 302 slides along the first support bottom plate 301, and the LED supports are adjusted front to back, left to right so as to be aligned with the storage layer on the uppermost layer; the roller assembly 3032 rotates reversely, and the LED support is sent back to the storage layer on the uppermost layer;
the elevation mechanism 203 drives the material box 202 to move downwards for a proper distance so as to align the second layer of material storage layers with the push rod mechanism 201, and the steps are repeated until the LED supports in all the material storage layers are completely mounted; placing the other material box 202 filled with the materials into the second station 204, and switching to carry out mounting on the LED support in the second station 204 when the LED supports in the material box 202 in the first station are completely mounted; when the LED supports in the material box 202 of the second station 204 are mounted, the LED supports in the material box 202 of the first station are taken away and reloaded, and the steps are repeated in such a way, so that mounting without stopping is realized, and the production efficiency is improved.
The LED double-end chip mounter that this embodiment provided possesses following advantage:
1. and the double-head design is adopted, so that the chip mounting period is short and the efficiency is high.
2. Compact structure, high utilization rate of component space, small occupied area and saving site cost.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (8)
1. An LED double-head chip mounting machine is characterized by comprising a bedplate (1), a support feeding and receiving assembly (2) and two chip mounting assemblies;
the support feeding and receiving assembly (2) is positioned in the middle of the front end of the bedplate (1) and comprises two feeding and receiving mechanisms which are arranged in parallel, and each feeding and receiving mechanism comprises a push rod mechanism (201), a material box (202) and a lifting mechanism (203); the material box (202) is of a structure with two open ends, a plurality of material storage layers are arranged in the material box from top to bottom, and a row of LED supports can be placed on each material storage layer; the push rod mechanism (201) is positioned in front of an opening at one end of the material box (202) and is used for ejecting the LED bracket in the material storage layer out of the opening at the other end of the material box (202); the lifting mechanism (203) is fixedly connected with the bottom of the material box (202) and is used for driving the material box (202) to move up and down;
the chip mounting component comprises:
the support moving platform (3) is positioned in the middle of the bedplate (1), the support moving platform (3) is positioned on one side close to the opening at the other end of the magazine (202) and is used for receiving the LED supports which are not pasted with the cores and supplied by the magazine (202) and returning the pasted LED supports to the magazine (202);
the support feeding and receiving assembly (2) and the two support moving platforms (3) are positioned between the two chip moving platforms (4);
the chip jacking assembly (5), the chip jacking assembly (5) is used for jacking up the chip; the chip moving platform (4) is fixedly connected with the chip jacking assembly (5) and is used for driving the chip jacking assembly (5) to move along an X axis and a Y axis in the horizontal direction;
and the chip mounting mechanism (6) is positioned at the rear end of the bedplate (1), and the chip mounting mechanism (6) is provided with a suction nozzle which can suck the chip from the upper part of the chip jacking assembly (5) and rotate to the upper part of the support moving platform (3) to place the chip into the LED support.
2. The LED dual head chip mounter according to claim 1, further comprising:
and the two support moving platforms (3) are both positioned above the horizontal guide rail (7) and are in sliding connection with the horizontal guide rail (7) along the X-axis direction.
3. The LED double-headed chip mounter according to claim 2, wherein said carriage moving platform (3) includes:
a first bracket bottom plate (301), wherein the first bracket bottom plate (301) is connected with the horizontal guide rail (7) in a sliding manner;
the second support bottom plate (302) is positioned above the first support bottom plate (301) and is in sliding connection with the top of the first support bottom plate (301) along the Y-axis direction;
the LED bracket comprises a bracket positioning assembly (303), wherein the bracket positioning assembly (303) comprises a pressing frame (3031) and a roller assembly (3032) positioned below the pressing frame (3031), and the roller assembly (3032) is used for being matched with the pressing frame (3031) to transfer the LED bracket positioned between the pressing frame (3031) and the roller assembly (3032) along the Y-axis direction.
4. The LED double-headed chip mounter according to claim 1, wherein said chip moving platform (4) includes:
a first die paddle (401), the first die paddle (401) being fixedly mounted on top of the platen (1);
a second chip bottom plate (402), wherein the second chip bottom plate (402) is positioned above the first chip bottom plate (401) and is connected with the top of the first chip bottom plate (401) in a sliding mode along the Y-axis direction;
a third chip bottom plate (403), wherein the third chip bottom plate (403) is positioned above the second chip bottom plate (402) and is connected with the top of the second chip bottom plate (402) in a sliding mode along the X-axis direction;
and the disc-carrying positioning assembly (404), wherein the disc-carrying positioning assembly (404) is fixedly arranged at the top of the third chip base plate (403).
5. The LED dual head chip mounter according to claim 4, wherein said chip jacking assembly (5) comprises:
the jacking main body (501), the jacking main body (501) is positioned below the carrying disc positioning assembly (404) and is used for jacking up the chip;
the XOY plane adjusting platform (502), the XOY plane adjusting platform (502) and the carrying disc positioning assembly (404) are fixedly arranged, the jacking main body (501) is positioned on the XOY plane adjusting platform (502), and the XOY plane adjusting platform (502) is used for adjusting the relative positions of the jacking main body (501) and the carrying disc positioning assembly (404) on an XOY plane.
6. The LED double-headed chip mounter according to claim 1, wherein said chip mounting mechanism (6) further comprises:
a rotating electrical machine (601);
the mounting arm (602), one end of the mounting arm (602) is fixedly connected with the driving end of the rotating motor (601), and the other end of the mounting arm is fixedly connected with the suction nozzle;
the crystal taking lens (603), wherein the crystal taking lens (603) is used for acquiring first position information of a chip in the chip moving platform (4) so as to facilitate the rotary motor (601) to control the suction nozzle to suck the chip according to the first position information;
a dispensing assembly (604), the dispensing assembly (604) for placing glue into a pad of an LED support;
and the mounting lens (605), wherein the mounting lens (605) is used for acquiring second position information of the bonding pad in the LED bracket, so that the rotary motor (601) is facilitated to control the suction nozzle to place the chip into the glued bonding pad according to the second position information.
7. The LED double-headed chip mounter according to claim 6, wherein said rotating motor (601) is located between said pick-up lens (603) and mounting lens (605), and two said dispensing assemblies (604) are located between two said mounting lenses (605).
8. The LED double-head chip mounter according to claim 1, wherein said feeding and receiving mechanism is a double-station structure, and each station is provided with said pushing rod mechanism (201), magazine (202) and lifting mechanism (203).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920955188.3U CN209843682U (en) | 2019-06-24 | 2019-06-24 | LED double-end chip mounting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920955188.3U CN209843682U (en) | 2019-06-24 | 2019-06-24 | LED double-end chip mounting machine |
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| CN209843682U true CN209843682U (en) | 2019-12-24 |
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| CN201920955188.3U Active CN209843682U (en) | 2019-06-24 | 2019-06-24 | LED double-end chip mounting machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246794A (en) * | 2019-06-24 | 2019-09-17 | 东莞市凯格精密机械有限公司 | LED double end chip attachment machine |
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2019
- 2019-06-24 CN CN201920955188.3U patent/CN209843682U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246794A (en) * | 2019-06-24 | 2019-09-17 | 东莞市凯格精密机械有限公司 | LED double end chip attachment machine |
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Address after: 523000 2 Sha long road, Dongcheng Street, Dongguan, Guangdong Patentee after: Dongguan Kaige Precision Machinery Co., Ltd Address before: 523000 2 Sha long road, Dongcheng Street, Dongguan, Guangdong Patentee before: Dongguan Kaige Precision Machine Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |