CN217955807U - Double-swing-arm crystal arranging device for die bonder - Google Patents

Abstract

The utility model discloses a double pendulum arm row brilliant device for solid brilliant machine belongs to solid brilliant equipment technical field, including double pendulum arm device, double pendulum arm device includes first swing arm mechanism and second swing arm mechanism, transfer platform mechanism is located between first swing arm mechanism and the second swing arm mechanism, two vision device include first camera module and second camera module, first camera module is used for discerning the position that first swing arm mechanism absorbs the crystal, the second camera module is used for discerning the position that second swing arm mechanism absorbs the crystal in the transfer platform mechanism. Utility model adopts the double-swing arm device can shorten the wobbling stroke, reduces the time spent on the stroke, improves the transportation speed of crystal to and the automatic butt joint of going up unloading mechanism gets the material strip, gets the number of times of getting the material strip in the reducible production process, improves the saturation of production operation, realizes solid brilliant production continuous uninterrupted duty as far as, thereby improves productivity and production efficiency.

Description

Double-swing-arm crystal arranging device for die bonder

Technical Field

The utility model belongs to the technical field of solid brilliant equipment, a two swing arms row brilliant device for solid brilliant machine is related to.

Background

The die bonder is mainly used for lead frame pressing plates of various gold wire ultrasonic welding equipment and various suction nozzles, ejector pins, dispensing heads, porcelain nozzles, through needles, motors, carbon brushes, encoders and transmission belts of various chip mounting equipment.

The existing die bonding principle comprises the steps that a crystal is grabbed through a swing arm and directly placed on a to-be-bonded die position on a die tray, die bonding is carried out after glue dispensing is carried out, the die tray is taken down after the whole die bonding of the die tray is finished, the die tray is taken down repeatedly and manually, the time needed by a long-distance swing arm is longer due to the fact that the swing arm swings and the diameter of the die tray influences the swing distance of the swing arm, not only can the time occupied by taking and placing the swing arm take and the time spent by taking and placing the die tray manually, so that the whole die bonding capacity cannot be greatly broken through, and the production efficiency is low.

Therefore, it is necessary to further improve the existing die bonding equipment, so that the yield of the die bonding equipment in die bonding production is greatly broken through, and the production efficiency is improved.

SUMMERY OF THE UTILITY MODEL

The utility model provides a double-swing arm crystal arranging device for a crystal fixing machine, which aims at solving the problem provided in the background technology.

In order to achieve the above object, the utility model provides a brilliant device is arranged to double swing arm for solid brilliant machine, include:

the double-swing arm device comprises a first swing arm mechanism and a second swing arm mechanism, and the second swing arm mechanism is used for receiving and transferring the crystal sucked by the first swing arm mechanism;

the transfer table mechanism is positioned between the first swing arm mechanism and the second swing arm mechanism, the crystal sucked by the first swing arm mechanism is placed on the transfer table mechanism, and the second swing arm mechanism sucks the placed crystal from the transfer table mechanism;

the double-vision device comprises a first camera shooting assembly and a second camera shooting assembly, the first camera shooting assembly is used for identifying the position of the crystal sucked by the first swing arm mechanism, and the second camera shooting assembly is used for identifying the position of the crystal sucked by the second swing arm mechanism on the transfer table mechanism.

As preferred, first swing arm mechanism includes fourth adjustable shelf, first swing arm motor, first swing arm external member, first swing arm and first vacuum suction nozzle, be equipped with the fourth adjustable shelf on the mounting panel, the fourth adjustable shelf front end is equipped with first swing arm motor, first swing arm motor lower extreme is equipped with first swing arm external member, first swing arm external member tip is equipped with first swing arm, the tip of first swing arm is equipped with first vacuum suction nozzle, fourth adjustable shelf one side is equipped with first subassembly of making a video recording for shoot the location crystal on the brilliant disc, wherein, the fourth adjustable shelf is for violently indulging adjustable setting.

Preferably, the transfer table mechanism comprises a sixth movable frame, a transfer support and a transfer plane, the sixth movable frame is arranged on the mounting frame, the transfer support is fixed on the sixth movable frame, the transfer plane is arranged at the top of the transfer support and used for placing the sucked crystal on the first swing arm, and the sixth movable frame is arranged in a transversely and longitudinally adjustable mode.

Preferably, second swing arm mechanism includes fifth adjustable shelf, second swing arm motor, second swing arm external member, second swing arm and second vacuum nozzle, be equipped with the fifth adjustable shelf on the mounting panel, the fifth adjustable shelf front end is equipped with second swing arm motor, second swing arm motor lower extreme is equipped with second swing arm external member, second swing arm external member tip is equipped with the second swing arm, the tip of second swing arm is equipped with second vacuum nozzle, fifth adjustable shelf one side is equipped with the second subassembly of making a video recording for shoot the location crystal on the transfer plane, wherein, the fifth adjustable shelf is horizontal and vertical adjustable setting.

Further comprising:

the mounting frame comprises a mounting plate for fixedly mounting the transfer table mechanism, a mounting plate is fixedly arranged above the mounting frame, and the first swing arm mechanism and the second swing arm mechanism are arranged on the mounting plate;

the die bonding device comprises a die bonding platform assembly and a die bonding mechanism, the die bonding platform assembly is arranged on the mounting frame, and the die bonding mechanism is positioned above the die bonding platform assembly and arranged on the mounting plate;

the crystal supply mechanism is arranged on one side, located on the die bonding platform assembly, of the mounting frame;

the loading and unloading mechanism is arranged on the other side of the die bonding platform assembly of the mounting frame and used for feeding and/or taking materials to the die bonding platform assembly;

the first swing arm mechanism is used for sucking the crystal on the crystal supply mechanism and placing the crystal on the transfer table mechanism, and the second swing arm mechanism is used for sucking the crystal on the transfer table mechanism and placing the crystal on the crystal fixing platform assembly so as to fix the crystal by the crystal fixing mechanism.

As preferred, supply brilliant mechanism to include first adjustable shelf, brilliant disc, top brilliant subassembly, second adjustable shelf, wafer replacement and second motor, be equipped with first adjustable shelf, top brilliant subassembly and second adjustable shelf forward in proper order by the back on the mounting bracket, first adjustable shelf top fixed mounting has brilliant disc, second adjustable shelf top is equipped with the wafer replacement, second adjustable shelf side is located wafer replacement below fixed mounting has the second motor, the output shaft of second motor is connected in the wafer replacement, wherein, the wafer replacement is 2 rings at least wafer replacements, first adjustable shelf, second adjustable shelf are for violently indulging the setting of sliding.

As preferred, the top brilliant subassembly includes third adjustable shelf, first fixed plate, first motor, section of thick bamboo pole, thimble and movable rod, fixed mounting has first fixed plate on the third adjustable shelf, the fixed section of thick bamboo pole that is equipped with in first fixed plate top, be equipped with mobile thimble in the section of thick bamboo pole, one side of first fixed plate is equipped with the movable rod, the movable rod upper end touches with the thimble and connects, the opposite side of first fixed plate is equipped with first motor, the output shaft of first motor touches with movable rod lower extreme cam and connects, makes the movable rod slides from top to bottom, wherein, the third adjustable shelf is for violently indulging to slide adjustable setting, and first motor is step-by-step inching first motor.

Preferably, the feeding and discharging mechanism comprises a second fixing plate and a crystal material taking and placing assembly movably arranged on the second fixing plate, and the crystal material taking and placing assembly is symmetrically arranged around two sides of the second fixing plate in the length direction;

the crystal material taking and placing assembly comprises a second motor, a second movable lead screw, a third fixing plate, a third motor, a third movable lead screw, a material rack, a material feeding body and material strips, wherein the second movable lead screw is longitudinally movable on the second fixing plate, the second motor connected with the second movable lead screw is arranged below the second fixing plate, the third fixing plate is fixedly connected onto the second movable lead screw, the third movable lead screw is movable in the vertical direction and arranged on the side face of the third fixing plate, the third motor connected with the third movable lead screw is arranged below the third fixing plate, the material rack is fixedly connected onto the third movable lead screw, at least 2 material feeding bodies are arranged on the material rack, a plurality of movable material strips are arranged in the material box, and feeding and discharging are facilitated.

Preferably, the die bonding platform assembly comprises a longitudinal guide rail, a transverse slide rail, a fourth fixed plate, a material placing turntable, a fourth motor and a material pushing assembly, the longitudinal guide rail is arranged on the mounting frame, the longitudinal guide rail is provided with the slidable transverse slide rail, the transverse slide rail is provided with the slidable fourth fixed plate, the material placing turntable is arranged above the side end of the fourth fixed plate, the fourth motor is arranged below the side end of the fourth fixed plate and connected with the material placing turntable, the material pushing assembly is positioned above the longitudinal guide rail, the material pushing assembly is provided with a bracket connected to the mounting plate, two rows of material placing grooves are arranged on the material placing turntable, and the material placing grooves are used for placing material strips;

the pushing assembly comprises a connecting plate, a transverse driving module, a vertical driving module, a push rod and a vacuum chuck, the transverse driving module is arranged on the support, the connecting plate is arranged at the bottom of the support, the vertical driving module is arranged on the connecting plate, the push rod is fixedly connected with the bottom of the vertical driving module, the vacuum chuck is arranged at the front end of the push rod and used for adsorbing and pushing and pulling the material strips, and the vacuum chuck corresponds to the material groove.

As preferred, gu brilliant mechanism is including setting up subassembly, glue dish subassembly and the third subassembly of making a video recording are glued to the point on the mounting panel, the subassembly is located one side of glue dish subassembly to the point, supplies the subassembly is glued to the point after the viscose on the glue dish subassembly, it is equipped with the third subassembly of making a video recording that is used for discerning location crystal position to glue the subassembly, supplies the subassembly is glued to the point and is glued the crystal point, wherein, the tip of glue dish subassembly is equipped with and supplies the glue dish, the bottom of gluing the subassembly is equipped with the point and glues the arm, the tip of the arm is equipped with some gum covers to the point.

The utility model discloses for prior art's beneficial effect:

the utility model provides a brilliant device is arranged to double swing arm for solid brilliant machine, adopt double swing arm device to replace traditional single swing arm long distance problem consuming time, utilize transfer platform mechanism can shorten the wobbling stroke, reduce the time spent on the stroke, improve the transport speed of crystal, and adopt solid brilliant platform subassembly and put the material carousel bimaterial butt joint of material and get the material strip, get the number of times of getting the material strip in the reducible production process, improve the saturation of production operation, realize solid brilliant production continuous uninterrupted operation as far as, thereby improve productivity and production efficiency.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is an exploded view of the present invention;

FIG. 3 is a schematic perspective view of the top wafer assembly of FIG. 2;

FIG. 4 is an enlarged schematic structural view of the first swing arm mechanism of FIG. 2;

fig. 5 is a schematic perspective view of the transfer table mechanism in fig. 2;

FIG. 6 is an enlarged schematic structural view of the second swing arm mechanism of FIG. 2;

FIG. 7 is an enlarged view of the portion A in FIG. 2;

FIG. 8 is an enlarged view of the portion B in FIG. 2;

FIG. 9 is a perspective view of the pusher assembly of FIG. 2;

fig. 10 is a schematic side view of the combination of the loading/unloading mechanism and the die bonding platform assembly according to the present invention;

FIG. 11 is a schematic perspective view of the butt joint of the feeding body and the material placing turntable according to the present invention;

FIG. 12 is an enlarged schematic view of the die bonding mechanism shown in FIG. 2;

fig. 13 is a schematic view of the three-dimensional structure of the die bonder of the present invention;

reference numerals:

1. mounting a plate; 2. a die bonding platform assembly; 3. a die bonding mechanism; 4. a crystal supply mechanism; 5. a feeding and discharging mechanism; 6. a first swing arm mechanism; 7. a second swing arm mechanism; 8. a transfer table mechanism; 9. a first movable frame; 10. a wafer disc; 11. a top die assembly; 12. a second movable frame; 13. a wafer replacement; 14. a third movable frame; 15. a first fixing plate; 16. a first motor; 17. a barrel bar; 18. a movable rod; 19. a fourth movable frame; 20. a first swing arm motor; 21. a first swing arm kit; 22. a first swing arm; 23. a first vacuum nozzle; 24. a first camera assembly; 25. a sixth movable frame; 26. a transfer support; 27. a transfer plane; 28. a fifth movable frame; 29. a second swing arm motor; 30. a second swing arm kit; 31. a second swing arm; 32. a second vacuum nozzle; 33. a second camera assembly; 34. a crystal material taking and placing assembly; 35. a second motor; 36. a third fixing plate; 37. a third motor; 38. a material rack; 39. a donor body; 40. a longitudinal guide rail; 41. a transverse slide rail; 42. a fourth fixing plate; 43. a material placing turntable; 44. a support; 45. a connecting plate; 46. a transverse driving module; 47. a vertical driving module; 48. a push rod; 49. a vacuum chuck; 50. dispensing components; 51. a glue reel assembly; 52. a third camera assembly; 53. a material box; 54. a trough; 55. and (6) material strip.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

In order to achieve the above object, an embodiment of the present invention provides a double-swing arm crystal arrangement device for a die bonder, which is shown in fig. 1-2 and includes:

the double-swing arm device comprises a first swing arm mechanism 6 and a second swing arm mechanism 7, and the second swing arm mechanism 7 is used for receiving and transferring the crystal sucked by the first swing arm mechanism 6;

the transfer table mechanism 8 is positioned between the first swing arm mechanism 6 and the second swing arm mechanism 7, the crystals sucked by the first swing arm mechanism 6 are placed on the transfer table mechanism 8, and the second swing arm mechanism 7 sucks the placed crystals from the transfer table mechanism 8;

and the double-vision device comprises a first camera shooting assembly 24 and a second camera shooting assembly 33, wherein the first camera shooting assembly 24 is used for identifying the position of the first swing arm mechanism 6 for sucking the crystal, and the second camera shooting assembly 33 is used for identifying the position of the second swing arm mechanism 7 for sucking the crystal on the transfer table mechanism 8.

Referring to fig. 4, the first swing arm mechanism 6 includes a fourth movable frame 19, a first swing arm motor 20, a first swing arm external member 21, a first swing arm 22 and a first vacuum suction nozzle 23, the fourth movable frame 19 is disposed on the mounting plate 1, the first swing arm motor 20 is disposed at the front end of the fourth movable frame 19, the first swing arm external member 21 is disposed at the lower end of the first swing arm motor 20, the first swing arm 22 is disposed at the end of the first swing arm external member 21, the first vacuum suction nozzle 23 is disposed at the end of the first swing arm 22, and a first camera assembly 24 is disposed at one side of the fourth movable frame 19;

referring to fig. 5, the transfer table mechanism 8 includes a sixth movable frame 25, a transfer support 4426 and a transfer plane 27, the sixth movable frame 25 is disposed on the mounting frame, the transfer support 4426 is fixed on the sixth movable frame 25, and the transfer plane 27 is disposed on the top of the transfer support 4426;

referring to fig. 6, second swing arm mechanism 7 includes fifth adjustable shelf 28, second swing arm motor 29, second swing arm external member 30, second swing arm 31 and second vacuum nozzle 32, be equipped with fifth adjustable shelf 28 on the mounting panel 1, fifth adjustable shelf 28 front end is equipped with second swing arm motor 29, second swing arm motor 29 lower extreme is equipped with second swing arm external member 30, second swing arm external member 30 tip is equipped with second swing arm 31, second swing arm 31's tip is equipped with second vacuum nozzle 32, 28 one side of fifth adjustable shelf is equipped with second camera shooting subassembly 33.

Further comprising:

the mounting frame (not shown in the figures) comprises a mounting plate (8) for fixedly mounting the transfer table mechanism, a mounting plate (1) is fixedly arranged above the mounting frame, and the first swing arm mechanism (6) and the second swing arm mechanism (7) are arranged on the mounting plate (1);

the die bonding device comprises a die bonding platform assembly 2 and a die bonding mechanism 3, wherein the die bonding platform assembly 2 is arranged on the mounting frame, and the die bonding mechanism 3 is arranged on the mounting plate 1 above the die bonding platform assembly 2;

the crystal supply mechanism 4 is arranged on one side, located on the die bonding platform assembly 2, of the mounting frame;

the feeding and discharging mechanism 5 is arranged on the other side, located on the die bonding platform assembly 2, of the mounting frame and used for feeding and/or taking materials to the die bonding platform assembly 2;

the first swing arm mechanism 6 is used for sucking the crystal on the crystal supply mechanism 4 and placing the crystal on the transfer table mechanism 8, and the second swing arm mechanism 7 is used for sucking the crystal on the transfer table mechanism 8 and placing the crystal on the crystal fixing platform assembly 2 so as to fix the crystal by the crystal fixing mechanism 3.

In the embodiment, in order to solve the problems of long-distance time consumption and low efficiency of manual taking, placing and replacing of the traditional single swing arm, the operation of taking and placing the crystal by adopting the double-swing-arm device can shorten the swing stroke, reduce the time consumption on the stroke and improve the transfer speed of the crystal; the automatic wire feeding and taking mode of the feeding and discharging mechanism 5 is adopted to replace manual operation, and the saturation of production operation is improved by reducing the times of taking and placing the material strips 55 in the production process, so that the die bonding productivity and the production efficiency are improved.

The work flow comprises the following steps: utilize first swing arm mechanism 6 to pick a crystal from supplying brilliant mechanism 4 and place on transfer platform mechanism 8, utilize second swing arm mechanism 7 will place on transfer platform mechanism 8 crystal pick after place on solid brilliant platform subassembly 2, wherein, last unloading mechanism 5 provides in advance the material strip 55 (the following description) that is used for placing the crystal before placing, carry out the operation of gluing to the crystal on solid brilliant platform subassembly 2 through solid brilliant mechanism 3, after material strip 55 accomplishes all crystal glue dispensing, material strip 55 that unloading mechanism 5 will accomplish the crystal glue dispensing is retrieved automatically and is placed, wherein, can material loading simultaneously in the period of unloading.

In this embodiment, the first camera assembly 24 is used for shooting the crystal on the wafer disk 10, determining that there is a crystal at a position to be grabbed on the sheet, and when the first swing arm 22 rotates to a position right above the top wafer assembly 11, vacuum-sucking the crystal; and the transfer plane 27 is used for placing the crystal, so that the first swing arm 22 can place the sucked crystal; the second camera module 33 is configured to shoot a crystal on the transfer plane 27, determine that there is a crystal at a position to be grabbed on the transfer plane 27, and identify front and back sides of the crystal, so as to ensure that a front side of the crystal is dispensed, so that when the second swing arm 31 rotates to a position right above the transfer plane 27, the crystal with the front side facing upward is vacuum-sucked, and then the second swing arm 31 rotates to a next process.

Further, as shown in fig. 2-3, the crystal supply mechanism 4 includes a first movable frame 9, a wafer tray 10, a top wafer assembly 11, a second movable frame 12, a wafer replacement 13, and a second motor 35 (not shown), the first movable frame 9, the top wafer assembly 11, and the second movable frame 12 are sequentially disposed from back to front on the mounting frame, the wafer tray 10 is fixedly mounted at the top of the first movable frame 9, the wafer replacement 13 is disposed at the top of the second movable frame 12, the second motor 35 is fixedly mounted below the wafer replacement 13 on the side of the second movable frame 12, an output shaft of the second motor 35 is connected to the wafer replacement 13, the top wafer assembly 11 includes a third movable frame 14, a first fixing plate 15, a first motor 16, a cylinder 17, a thimble, and a movable rod 18, a first fixing plate 15 is fixedly mounted on the third movable frame 14, a cylinder rod 17 is fixedly disposed at the top of the first fixing plate 15, a thimble is disposed in the cylinder rod 17, a movable rod 18 is disposed on one side of the first fixing plate 15, an upper movable rod 18 and an upper end of the thimble contact rod 18 are connected to a lower end of the first motor 16, and a lower end of the first motor is connected to a lower end of the second motor 16, and a movable rod 16 is connected to the second motor.

Wherein, the chip replacement 13 is at least 2 rings of chip replacement 13, preferably 3 rings of chip replacement 13, after the crystal on the wafer disc 10 is taken out, one empty ring of the chip replacement 13 takes out the sheet with the crystal taken out by rotating, and the sheet with the crystal is mounted on the wafer disc 10 by continuing to rotate.

It should be noted that the first movable frame 9, the second movable frame 12, and the third movable frame 14 are disposed to slide horizontally and vertically, and the horizontally and vertically sliding arrangement includes a plate block sliding horizontally and a plate block sliding vertically, and both of them can move horizontally and vertically under the driving of a motor or an air cylinder.

Further, referring to fig. 7 to 10, the feeding and discharging mechanism 5 includes a second fixing plate and a crystal material taking and placing assembly 34 movably disposed on the second fixing plate, and the crystal material taking and placing assembly 34 is symmetrically disposed on two sides of the second fixing plate in the longitudinal direction; the crystal material taking and placing assembly 34 comprises a second motor 35, a second movable screw rod (not shown), a third fixing plate 36, a third motor 37, a third movable screw rod (not shown), a material rack 38, feeding bodies 39 and material strips 55, wherein the second movable screw rod which is movable longitudinally is arranged on the second fixing plate, the second motor 35 connected with the second movable screw rod is arranged below the second fixing plate, the third fixing plate 36 is fixedly connected onto the second movable screw rod, the third movable screw rod which is movable in the vertical direction is arranged on the side surface of the third fixing plate 36, the third motor 37 connected with the third movable screw rod is arranged below the third fixing plate 36, the material rack 38 is fixedly connected onto the third movable screw rod, and at least 2 feeding bodies 39 are arranged on the material rack 38; and

the die bonding platform assembly 2 comprises a longitudinal guide rail 40, a transverse slide rail 41, a fourth fixed plate 42, a material placing turntable 43, a fourth motor (not shown in the figure) and a material pushing assembly, wherein the longitudinal guide rail 40 is arranged on the mounting frame, the longitudinal guide rail 40 is provided with the transverse slide rail 41 capable of sliding, the transverse slide rail 41 is provided with the fourth fixed plate 42 capable of sliding, the material placing turntable 43 is arranged above the side end of the fourth fixed plate 42, the fourth motor is arranged below the side end of the fourth fixed plate 42 and connected with the material placing turntable 43, the material pushing assembly is arranged above the longitudinal guide rail 40, and the material pushing assembly is arranged on a support 44 arranged on the mounting plate 1; and

the material pushing assembly comprises a connecting plate 45, a transverse driving module 46, a vertical driving module 47, a push rod 48 and a vacuum chuck 49, the transverse driving module 46 is arranged on the support 44, the connecting plate 45 is arranged at the bottom of the support 44, the vertical driving module 47 is arranged on the connecting plate 45, the push rod 48 is fixedly connected to the bottom of the vertical driving module 47, and the vacuum chuck 49 is arranged at the front end of the push rod 48.

In this embodiment, referring to fig. 11, at least 2 feeding bodies 39 are disposed on one rack 38, one feeding body 39 can be disposed with a plurality of bins 53, preferably, 4 bins 53 are combined into one feeding body 39, the bin 53 is a flat rectangular structure, and has a plurality of layers of chutes, for example, 3, 6, 9, and 12 chutes, which can slide and pull out bars 55, each bar 55 is prefabricated with a plurality of crystal placing grooves, for example, 10, 12, 14, 16, 18, and 20 grooves, the 1, 3 bins 53 are for one feeding and discharging, the 2, 4 bins 53 are for one feeding and discharging, one feeding body 39 finishes the 1, 3 bins 53, then the 2, 4 bins 53 are finished, and the feeding and discharging operation of the next feeding body 39 is continued after finishing the one feeding body 39. Correspondingly, two rows of material placing grooves 54 are arranged on the material placing turntable 43, the groove width of the material placing grooves 54 is the same as that of the material strips 55, and the material placing grooves 54 are used for placing the material strips 55 for crystal dispensing. Correspondingly, the push rods 48 are arranged to be matched with the material placing grooves 54, the two ends of each push rod 48 are arranged to be in the same direction, the vacuum suction cups 49 are used for sucking and pushing the material strips 55 on the push rods 48, 2 strips can be fed or discharged at one time, feeding time is saved, feeding frequency is reduced, and production efficiency is improved.

Specifically, referring to fig. 12, the die bonder mechanism 3 includes a dispensing assembly 50, a rubber disc assembly 51, and a third camera assembly 52, the dispensing assembly 50, the rubber disc assembly 51, and the third camera assembly 52 are disposed on the mounting plate 1, the dispensing assembly 50 is located on one side of the rubber disc assembly 51, the third camera assembly 52 is disposed on the front side of the dispensing assembly 50, a rubber disc is disposed at an end of the rubber disc assembly 51, a dispensing arm is disposed at the bottom of the dispensing assembly 50, and a dispensing sleeve is disposed at an end of the dispensing arm.

In this embodiment, the third camera assembly 52 is configured to shoot the material strip 55 on the material placing turntable 43, specifically shoot a crystal to be subjected to glue dispensing on each groove of the material strip 55, identify that a crystal exists on the groove, and determine a position crystal, then drive the glue dispensing sleeve on the glue dispensing assembly 50 to firstly adhere to the glue material on the glue dispensing assembly 51, and then move above the crystal to be subjected to glue dispensing, thereby completing the glue dispensing operation.

It should be noted that the dispensing assembly 50 is structured to connect and mount a glue supply tray in a conventional motor driving manner, and the glue supply tray is adjustable to facilitate dispensing, dispensing and dispensing; the structure of the glue disc assembly 51 is that the existing motor driving mode is adopted to connect a glue mounting arm, the glue dispensing arm is movable, and glue dispensing can be carried out on the corresponding crystal through glue materials obtained by the glue dispensing sleeve.

Of course, referring to fig. 13, the die bonder body in this embodiment further includes other existing components arranged and installed, for example, an electric control device, an air pump assembly, a computer control terminal, a chassis protection shell, and the like.

To sum up, the utility model provides a brilliant device is arranged to double swing arm for solid brilliant machine, adopt double swing arm device to replace traditional single swing arm long distance problem consuming time, utilize transfer platform mechanism 8 can shorten the wobbling stroke, reduce the time spent on the stroke, improve the transport speed of crystal, and adopt solid brilliant platform subassembly 2 and put material carousel 43 double-material butt joint and get material strip 55, get the number of times of getting material strip 55 in the reducible production process, improve the saturation of production operation, realize solid brilliant production continuous uninterrupted operation as far as, thereby improve productivity and production efficiency.

The technical principle of the present invention has been described above with reference to specific embodiments, which are only preferred embodiments of the present invention. The utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the all belongings the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. Those skilled in the art will be able to conceive of other embodiments of the invention which fall within the scope of the invention without any inventive step.

Claims (10)

1. The utility model provides a brilliant device is arranged to double swing arm for solid crystal machine which characterized in that includes:

the double-swing arm device comprises a first swing arm mechanism and a second swing arm mechanism, and the second swing arm mechanism is used for receiving and transferring the crystal sucked by the first swing arm mechanism;

the transfer table mechanism is positioned between the first swing arm mechanism and the second swing arm mechanism, the crystal sucked by the first swing arm mechanism is placed on the transfer table mechanism, and the second swing arm mechanism sucks the placed crystal from the transfer table mechanism;

the double-vision device comprises a first camera shooting assembly and a second camera shooting assembly, the first camera shooting assembly is used for identifying the position of the first swing arm mechanism for sucking the crystal, and the second camera shooting assembly is used for identifying the position of the second swing arm mechanism for sucking the crystal on the transfer table mechanism.

2. The double-swing-arm crystal discharging device for the die bonder according to claim 1, wherein the first swing-arm mechanism comprises a fourth movable frame, a first swing-arm motor, a first swing-arm external member, a first swing arm and a first vacuum suction nozzle, the fourth movable frame is arranged on the mounting plate, the first swing-arm motor is arranged at the front end of the fourth movable frame, the first swing-arm external member is arranged at the lower end of the first swing-arm motor, the first swing arm is arranged at the end of the first swing-arm external member, the first vacuum suction nozzle is arranged at the end of the first swing arm, a first camera assembly is arranged at one side of the fourth movable frame and used for shooting and positioning the crystal on the crystal disc, and the fourth movable frame is arranged in a vertically and horizontally adjustable manner.

3. The double-swing-arm crystal arranging device for the die bonder according to claim 2, wherein the transfer table mechanism comprises a sixth movable frame, a transfer support and a transfer plane, the sixth movable frame is arranged on the mounting frame, the transfer support is fixed on the sixth movable frame, the transfer plane is arranged at the top of the transfer support and used for placing and taking crystals by the first swing arm, and the sixth movable frame is adjustable in transverse and longitudinal directions.

4. The double-swing-arm crystal discharging device for the die bonder according to claim 3, wherein the second swing-arm mechanism comprises a fifth movable frame, a second swing-arm motor, a second swing-arm external member, a second swing arm and a second vacuum suction nozzle, the fifth movable frame is arranged on the mounting plate, the second swing-arm motor is arranged at the front end of the fifth movable frame, the second swing-arm external member is arranged at the lower end of the second swing-arm motor, the second swing arm is arranged at the end of the second swing-arm external member, the second vacuum suction nozzle is arranged at the end of the second swing arm, a second camera assembly is arranged on one side of the fifth movable frame and used for shooting and positioning the crystal on the transfer plane, and the fifth movable frame is arranged in a vertically and horizontally adjustable manner.

5. The double-swing-arm crystal discharging device for the die bonder as claimed in claim 1, further comprising:

the mounting frame comprises a mounting plate for fixedly mounting the transfer table mechanism, a mounting plate is fixedly arranged above the mounting frame, and the first swing arm mechanism and the second swing arm mechanism are arranged on the mounting plate;

the die bonding device comprises a die bonding platform assembly and a die bonding mechanism, the die bonding platform assembly is arranged on the mounting frame, and the die bonding mechanism is arranged on the mounting plate above the die bonding platform assembly;

the crystal supply mechanism is arranged on one side, located on the die bonding platform assembly, of the mounting frame;

the feeding and discharging mechanism is arranged on the other side of the die bonding platform assembly of the mounting frame and used for feeding and/or taking materials to the die bonding platform assembly;

the first swing arm mechanism is used for sucking the crystal on the crystal supply mechanism and placing the crystal on the transfer table mechanism, and the second swing arm mechanism is used for sucking the crystal on the transfer table mechanism and placing the crystal on the crystal fixing platform assembly so as to fix the crystal by the crystal fixing mechanism.

6. The double-swing-arm crystal discharging device for the die bonder as claimed in claim 5, wherein the crystal supplying mechanism comprises a first movable frame, a wafer disc, a wafer pushing assembly, a second movable frame, a wafer replacement part and a second motor, the first movable frame, the wafer pushing assembly and the second movable frame are sequentially arranged on the mounting frame from back to front, the wafer disc is fixedly mounted at the top of the first movable frame, the wafer replacement part is arranged at the top of the second movable frame, the second motor is fixedly mounted at the side of the second movable frame below the wafer replacement part, and an output shaft of the second motor is connected to the wafer replacement part, wherein the wafer replacement part is an at least 2-ring wafer replacement part, and the first movable frame and the second movable frame are arranged in a transverse and longitudinal sliding manner.

7. The double-swing-arm die-arranging device for the die bonder as claimed in claim 6, wherein the die pushing assembly comprises a third movable frame, a first fixing plate, a first motor, a barrel rod, an ejector pin and a movable rod, the third movable frame is fixedly provided with the first fixing plate, the barrel rod is fixedly arranged at the top of the first fixing plate, the ejector pin is movably arranged in the barrel rod, the movable rod is arranged on one side of the first fixing plate, the upper end of the movable rod is in contact with the ejector pin, the first motor is arranged on the other side of the first fixing plate, an output shaft of the first motor is in contact with a cam at the lower end of the movable rod, so that the movable rod slides up and down, wherein the third movable frame is in adjustable transverse and longitudinal sliding arrangement, and the first motor is a stepping inching first motor.

8. The double-swing-arm crystal arranging device for the die bonder as claimed in claim 5, wherein the feeding and discharging mechanism comprises a second fixing plate and a crystal material taking and placing assembly movably arranged on the second fixing plate, and the crystal material taking and placing assembly is symmetrically arranged around two sides of the second fixing plate in the length direction;

the crystal material taking and placing assembly comprises a second motor, a second movable lead screw, a third fixing plate, a third motor, a third movable lead screw, a material rack, a material feeding body and material strips, wherein the second movable lead screw is longitudinally movable on the second fixing plate, the second motor connected with the second movable lead screw is arranged below the second fixing plate, the third fixing plate is fixedly connected with the second movable lead screw, the third movable lead screw is vertically movable on the side face of the third fixing plate, the third motor connected with the third movable lead screw is arranged below the third fixing plate, the material rack is fixedly connected with the third movable lead screw, at least 2 material feeding bodies are arranged on the material rack, a plurality of movable material strips are arranged in the material rack, and feeding and discharging are facilitated.

9. The double-swing-arm crystal discharging device for the crystal bonding machine as claimed in claim 5, wherein the crystal bonding platform assembly comprises a longitudinal guide rail, a transverse slide rail, a fourth fixing plate, a material placing turntable, a fourth motor and a material pushing assembly, the longitudinal guide rail is arranged on the mounting frame, the longitudinal guide rail is provided with the transverse slide rail capable of sliding, the transverse slide rail is provided with the fourth fixing plate capable of sliding, the material placing turntable is arranged above the side end of the fourth fixing plate, the fourth motor is arranged below the side end of the fourth fixing plate and connected with the material placing turntable, the material pushing assembly is arranged above the longitudinal guide rail, the material pushing assembly is arranged on a bracket arranged on the mounting plate, two material placing grooves are arranged on the material placing turntable, and the material placing grooves are used for placing material strips;

the material pushing assembly comprises a connecting plate, a transverse driving module, a vertical driving module, a push rod and a vacuum chuck, the transverse driving module is arranged on the support, the connecting plate is arranged at the bottom of the support, the vertical driving module is arranged on the connecting plate, the push rod is fixedly connected to the bottom of the vertical driving module, the vacuum chuck is arranged at the front end of the push rod and used for adsorbing and pushing and pulling the material strips, and the vacuum chuck corresponds to the material groove.

10. The double-swing-arm crystal wafer discharging device for the crystal wafer bonding machine as claimed in claim 5, wherein the crystal wafer bonding mechanism comprises a glue dispensing assembly, a glue tray assembly and a third camera assembly, the glue dispensing assembly is arranged on one side of the glue tray assembly and used for dispensing the glue of the glue dispensing assembly on the glue tray assembly and then dispensing the crystal wafer, the third camera assembly used for identifying and positioning the position of the crystal wafer is arranged on the front side of the glue dispensing assembly and used for dispensing the glue to the crystal wafer, wherein a glue supplying tray is arranged at the end part of the glue tray assembly, a glue dispensing arm is arranged at the bottom part of the glue dispensing assembly, and a glue dispensing sleeve is arranged at the end part of the glue dispensing arm.

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