CN218447827U - Wafer disc mechanism of die bonder - Google Patents
Wafer disc mechanism of die bonder Download PDFInfo
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- CN218447827U CN218447827U CN202222030085.0U CN202222030085U CN218447827U CN 218447827 U CN218447827 U CN 218447827U CN 202222030085 U CN202222030085 U CN 202222030085U CN 218447827 U CN218447827 U CN 218447827U
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- sliding plate
- axis sliding
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Abstract
The utility model discloses a solid brilliant quick-witted wafer dish mechanism, include: the wafer surface mounting ring placing frame is provided with a rotating frame at the bottom; an X-axis slide plate; the Y-axis sliding plate is positioned below the X-axis sliding plate, and a first linear motor is arranged on one side of the upper surface of the Y-axis sliding plate; and the bottom plate is positioned below the Y-axis sliding plate, and second linear motors are arranged on two sides of the upper surface of the Y-axis sliding plate. The utility model discloses utilize wafer paster ring rack and swivel mount matched with mode that sets up, through the meshing between second hold-in range and the synchronizing wheel, thereby be convenient for drive each synchronizing wheel and carry out the rotation, thereby make the rotation of screw rod can drive the installation mainboard and carry out the ascending displacement motion of vertical side, thereby alright promote first stop collar and carry out the rising movement, only need use an elevator motor electricity be convenient for drive the installation mainboard and stabilize the lift, reduce electric use cost.
Description
Technical Field
The utility model relates to a wafer dish mechanism field, in particular to solid brilliant quick-witted wafer dish mechanism.
Background
The automatic die bonder is designed for semiconductor element production and is mainly used to bond silicon-based semiconductor chip to copper frame for back-end wire bonding and packaging. Carry out the rising through elevating system behind the brilliant disc with wafer paster ring push in the manual work, then with the blue membrane jack-up that makes progress of pine, blue membrane expander is tightened after the jacking, and blue membrane tightens the back, and the suction nozzle just can stably absorb the epimembranal wafer of blue, but current rising mechanism generally all drives the rack through a plurality of cylinders simultaneously and goes up and down for the lift of rack is more stable, but makes the use number of electrical apparatus more, cost increase.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a solid brilliant quick-witted wafer dish mechanism to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: die bonder wafer dish mechanism includes:
the wafer paster ring placing frame is provided with a rotating frame at the bottom;
an X-axis sliding plate connected to the bottom of the rotating frame;
the Y-axis sliding plate is positioned below the X-axis sliding plate, a first linear motor is installed on one side of the upper surface of the Y-axis sliding plate, and the output end of the first linear motor is connected with the X-axis sliding plate;
the bottom plate, it is located the below of Y axial slide, second linear electric motor is all installed to the both sides side of Y axial slide upper surface, second linear electric motor's output and Y axial slide are connected.
Preferably, the swivel mount is including installation mainboard, first stop collar, second stop collar, carousel, slewing mechanism and elevating system, the inside of installation mainboard is located to first stop collar cover, the outside of first stop collar is located to second stop collar cover, the bottom in the second stop collar is connected to the carousel, slewing mechanism installs in the bottom of installation mainboard, and is used for driving the rotation of carousel, the outside of carousel is located to the elevating system cover, elevating system alternates with the installation mainboard, and is used for the lift to the installation mainboard.
Preferably, slewing mechanism includes rotation motor and first synchronous belt, the rotation motor is installed in the bottom of installation mainboard, first synchronous belt sets up between rotation motor and carousel.
Preferably, elevating system includes elevator motor, synchronizing wheel, second hold-in range, screw rod and nut, elevator motor fixed mounting is on the installation mainboard, and is a plurality of the synchronizing wheel is connected in the bottom of nut, the second hold-in range sets up between each synchronizing wheel and elevator motor, the fixed interlude of screw rod sets up in the inside of synchronizing wheel, the screw rod alternates with the nut screw thread and is connected, the nut rotates to inlay the inside of locating the installation mainboard.
Preferably, one end of the screw is fixedly connected with the wafer paster ring placing frame, and the other end of the screw is fixedly connected with the X-axis sliding plate.
Preferably, first guide assemblies are installed on two sides of the upper surface of the Y-axis sliding plate and are arranged in parallel with the first linear motor.
Preferably, second guiding assemblies are installed on two side sides of the upper surface of the bottom plate, and the second guiding assemblies and the second linear motor are arranged in parallel.
The utility model discloses a technological effect and advantage:
(1) The utility model discloses utilize wafer paster ring rack and swivel mount matched with mode of setting, through the meshing between second hold-in range and the synchronizing wheel, thereby be convenient for drive each synchronizing wheel and carry out the rotation, then drive each screw rod and carry out synchronous rotation, cup joint through the screw thread between screw rod and the nut, thereby make the rotation of screw rod can drive the installation mainboard and carry out the displacement motion in the vertical direction, thereby alright promote first stop collar and carry out the rising movement, only need use a elevator motor electricity to be convenient for drive the installation mainboard and carry out the steady lift, reduce the use cost of electricity;
(2) The utility model discloses utilize first direction subassembly and second direction subassembly matched with mode of setting, first direction subassembly and second direction subassembly constitute by slide rail and slider, are convenient for spacing the gliding of slider through the slide rail for the rectilinear sliding of X axial slide and Y axial slide is more stable.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the explosion structure of the present invention.
Fig. 3 is a schematic view of the explosion structure at the rotating frame of the present invention.
Fig. 4 is a schematic view of the structure of the lifting mechanism of the present invention.
In the figure: 1. placing a wafer patch ring rack; 2. a rotating frame; 21. installing a main board; 22. a first stop collar; 23. a second stop collar; 24. a turntable; 25. a rotating mechanism; 251. rotating the motor; 252. a first synchronization belt; 26. a lifting mechanism; 261. a lifting motor; 262. a synchronizing wheel; 263. a second synchronous belt; 264. a screw; 265. a nut; 3. an X-axis sliding plate; 4. a Y-axis slide plate; 41. a first guide assembly; 5. a first linear motor; 6. a base plate; 61. a second guide assembly; 7. a second linear motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a solid brilliant quick-witted wafer dish mechanism as shown in fig. 1-4, include:
the wafer sticking ring placing frame 1 is provided with a rotating frame 2 at the bottom;
the rotating frame 2 comprises an installation main board 21, a first limiting sleeve 22, a second limiting sleeve 23, a rotating disc 24, a rotating mechanism 25 and a lifting mechanism 26, wherein the first limiting sleeve 22 is sleeved inside the installation main board 21, the second limiting sleeve 23 is sleeved outside the first limiting sleeve 22, the rotating disc 24 is connected to the bottom of the second limiting sleeve 23, the rotating mechanism 25 is installed at the bottom end of the installation main board 21 and used for driving the rotating disc 24 to rotate, the lifting mechanism 26 is sleeved outside the rotating disc 24, the lifting mechanism 26 is inserted into the installation main board 21 and used for lifting the installation main board 21, and the rotating disc 24 is rotatably connected to the bottom of the installation main board 21;
the rotating mechanism 25 comprises a rotating motor 251 and a first synchronous belt 252, the rotating motor 251 is installed at the bottom end of the installation main board 21, the first synchronous belt 252 is arranged between the rotating motor 251 and the rotating disc 24, and the first synchronous belt 252 can be driven to rotate by the rotating motor 251, so that the rotating disc 24 can be driven by the first synchronous belt 252 to rotate;
elevating system 26 includes elevating motor 261, synchronizing wheel 262, second hold-in range 263, screw rod 264 and nut 265, elevating motor 261 fixed mounting is on installation mainboard 21, a plurality of synchronizing wheels 262 are connected in the bottom of nut 265, second hold-in range 263 sets up between each synchronizing wheel 262 and elevating motor 261, the fixed interlude of screw rod 264 sets up in the inside of synchronizing wheel 262, screw rod 264 and nut 265 screw thread interlude are connected, nut 265 rotates to inlay in the inside of installing mainboard 21, the one end and the wafer paster ring rack 1 fixed connection of screw rod 264, the other end and the 3 fixed connection of X axial slide plate of screw rod 264, make screw rod 264 under the fixed motionless condition, as long as rotate synchronizing wheel 262, alright realize the lift of installing mainboard 21, thread interlude between screw rod 264 and nut 265, thereby alright realize the lift of installing mainboard 21, rotation through each synchronizing wheel 262, be convenient for drive each nut 265 and rotate, thereby make the edge of installing mainboard 21 can synchronous vertical motion.
An X-axis sliding plate 3 connected to the bottom of the rotating frame 2;
the Y-axis sliding plate 4 is positioned below the X-axis sliding plate 3, a first linear motor 5 is arranged on one side of the upper surface of the Y-axis sliding plate 4, and the output end of the first linear motor 5 is connected with the X-axis sliding plate 3; the bottom plate 6 is located below the Y-axis sliding plate 4, second linear motors 7 are installed on two side sides of the upper surface of the Y-axis sliding plate 4, the output end of each second linear motor 7 is connected with the Y-axis sliding plate 4, first guide assemblies 41 are installed on two sides of the upper surface of the Y-axis sliding plate 4, the first guide assemblies 41 are arranged in parallel with the first linear motors 5, second guide assemblies 61 are installed on two side sides of the upper surface of the bottom plate 6, the second guide assemblies 61 are arranged in parallel with the second linear motors 7, each first guide assembly 41 and each second guide assembly 61 are composed of a sliding rail and a sliding block, the sliding blocks are limited by the sliding rails, so that the linear sliding of the X-axis sliding plates 3 and the Y-axis sliding plates 4 is more stable, the X-axis linear movement of the X-axis sliding plates 3 is driven by the operation of the first linear motors 5, the Y-axis sliding plates 4 are driven by the operation of the second linear motors 7 to perform Y-axis linear movement, and therefore the positions of the wafer sticking ring placing frame 1 and the wafer rotating frame 2 can be compensated.
The utility model discloses theory of operation:
in use, the operation of the first linear motor 5 drives the X-axis linear motion of the X-axis sliding plate 3, the operation of the second linear motor 7 drives the Y-axis sliding plate 4 to perform the Y-axis linear motion, so as to compensate for the motion of the positions of the wafer patch ring holder 1 and the rotating frame 2, and then the wafer patch ring is pushed into the wafer patch ring holder 1 manually, and then the second synchronous belt 263 is driven to operate through the operation of the lifting motor 261, and the second synchronous belt 263 is meshed with the synchronous wheel 262, so as to drive each synchronous wheel 262 to rotate, and then each screw 264 is driven to rotate synchronously, and the screw 264 and the nut 265 are sleeved through the screw thread, so that the rotation of the screw 264 can drive the installation main board 21 to perform the displacement motion in the vertical direction, so as to drive the first limit sleeve 22 to perform the lifting motion, the loose blue film is pushed upwards, the blue film expander is tightened after being pushed up, and the blue film is tightened, the suction nozzle stably sucks the wafer on the blue film, and then the rotating motor 251 drives the rotating turntable 24 through the first synchronous belt, and the rotating motor and the rotating turntable 252 are rotated together, and the rotating platform can be used more flexibly.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. Die bonder wafer dish mechanism, its characterized in that includes:
the wafer sticking ring placing frame (1) is provided with a rotating frame (2) at the bottom;
an X-axis sliding plate (3) connected to the bottom of the rotating frame (2);
the Y-axis sliding plate (4) is positioned below the X-axis sliding plate (3), a first linear motor (5) is installed on one side of the upper surface of the Y-axis sliding plate (4), and the output end of the first linear motor (5) is connected with the X-axis sliding plate (3);
bottom plate (6), it is located the below of Y axial slide (4), second linear electric motor (7) are all installed to the both sides side of Y axial slide (4) upper surface, the output and the Y axial slide (4) of second linear electric motor (7) are connected.
2. The die bonder wafer disc mechanism according to claim 1, wherein the rotating frame (2) includes an installation main board (21), a first limiting sleeve (22), a second limiting sleeve (23), a rotating disc (24), a rotating mechanism (25) and a lifting mechanism (26), the first limiting sleeve (22) is sleeved inside the installation main board (21), the second limiting sleeve (23) is sleeved outside the first limiting sleeve (22), the rotating disc (24) is connected to the bottom of the second limiting sleeve (23), the rotating mechanism (25) is installed at the bottom end of the installation main board (21) and used for driving the rotating disc (24) to rotate, the lifting mechanism (26) is sleeved outside the rotating disc (24), and the lifting mechanism (26) is inserted into the installation main board (21) and used for lifting the installation main board (21).
3. The die bonder wafer disc mechanism according to claim 2, wherein the rotating mechanism (25) includes a rotating motor (251) and a first synchronous belt (252), the rotating motor (251) is installed at a bottom end of the installation main board (21), and the first synchronous belt (252) is disposed between the rotating motor (251) and the turntable (24).
4. The die bonder wafer disc mechanism of claim 2, wherein the lifting mechanism (26) comprises a lifting motor (261), a synchronizing wheel (262), a second synchronous belt (263), a screw (264) and a nut (265), the lifting motor (261) is fixedly installed on the installation main board (21), the synchronizing wheel (262) is connected to the bottom of the nut (265), the second synchronous belt (263) is arranged between each synchronizing wheel (262) and the lifting motor (261), the screw (264) is fixedly inserted into the synchronizing wheel (262), the screw (264) is in threaded insertion connection with the nut (265), and the nut (265) is rotatably inserted into the installation main board (21).
5. The die bonder wafer disc mechanism as claimed in claim 4, wherein one end of the screw (264) is fixedly connected with the wafer ring placement frame (1), and the other end of the screw (264) is fixedly connected with the X-axis sliding plate (3).
6. The die bonder wafer disc mechanism according to claim 1, wherein first guide assemblies (41) are mounted on both sides of the upper surface of the Y-axis sliding plate (4), and the first guide assemblies (41) and the first linear motor (5) are arranged in parallel.
7. The die bonder wafer disc mechanism as claimed in claim 1, wherein second guide assemblies (61) are mounted on two sides of the upper surface of the bottom plate (6), and the second guide assemblies (61) and the second linear motor (7) are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222030085.0U CN218447827U (en) | 2022-08-03 | 2022-08-03 | Wafer disc mechanism of die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222030085.0U CN218447827U (en) | 2022-08-03 | 2022-08-03 | Wafer disc mechanism of die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218447827U true CN218447827U (en) | 2023-02-03 |
Family
ID=85092983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222030085.0U Active CN218447827U (en) | 2022-08-03 | 2022-08-03 | Wafer disc mechanism of die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218447827U (en) |
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2022
- 2022-08-03 CN CN202222030085.0U patent/CN218447827U/en active Active
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