CN116709660A - Metal-clad laminate - Google Patents

Metal-clad laminate Download PDF

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Publication number
CN116709660A
CN116709660A CN202310192551.1A CN202310192551A CN116709660A CN 116709660 A CN116709660 A CN 116709660A CN 202310192551 A CN202310192551 A CN 202310192551A CN 116709660 A CN116709660 A CN 116709660A
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CN
China
Prior art keywords
layer
metal
clad laminate
photosensitive
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310192551.1A
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Chinese (zh)
Inventor
大角友规
西野晃太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN116709660A publication Critical patent/CN116709660A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a metal-clad laminate. A metal layer (2) for forming a metal supporting substrate (12) of a wired circuit board (11) and a photosensitive resin layer (3) which is a precursor of a 1 st insulating layer (13) of the wired circuit board (11) and is disposed on the metal layer (2) are provided on the metal-clad laminate (1) for manufacturing the wired circuit board (11) by a subtractive method.

Description

Metal-clad laminate
Technical Field
The present invention relates to a metal-clad laminate.
Background
Conventionally, a method of manufacturing a suspension board by a subtractive process using a laminate in which a metal board, an insulating layer, a seed layer, and a metal plating layer are laminated in this order has been known (for example, refer to patent document 1 below).
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2013-145628
Disclosure of Invention
Problems to be solved by the invention
In the method for manufacturing a wired circuit board described in patent document 1, after a resist for etching is made on an insulating layer, the insulating layer is etched with an etching solution, whereby the insulating layer is processed, and then the resist for etching is peeled off.
Therefore, it is difficult to shorten the time taken for the plate making operation of the etching resist, the etching treatment of the insulating layer, and the peeling operation of the etching resist, and it is difficult to improve the manufacturing efficiency.
The invention provides a metal-clad laminate capable of efficiently manufacturing a wired circuit board.
Solution for solving the problem
The invention [1] includes a metal-clad laminate for use in the production of a wired circuit board by a subtractive process, the metal-clad laminate not having a non-photosensitive resin layer, the metal-clad laminate including a metal layer and a photosensitive resin layer which is a precursor of an insulating layer of the wired circuit board and is disposed on the metal layer.
The invention [2] includes the metal-clad laminate of [1], wherein the photosensitive resin layer is disposed on the metal layer via a photosensitive adhesive layer.
The invention [3] includes the metal-clad laminate of the above [1] or [2], which further includes a photosensitive adhesive layer disposed on the photosensitive resin layer.
The invention [4] includes the metal-clad laminate of [1] or [2], which further includes a conductor layer disposed on the photosensitive resin layer.
The invention [5] includes the metal-clad laminate of [4], wherein the conductor layer is disposed on the photosensitive resin layer via a photosensitive adhesive layer.
The invention [6] includes the metal-clad laminate of the above [4] or [5], wherein the conductor layer is formed of copper.
The invention [7] includes the metal-clad laminate according to any one of [1] to [6], wherein the metal layer is formed of a copper alloy or stainless steel.
The invention [8] includes a metal-clad laminate for use in the production of a wired circuit board by a subtractive process, the metal-clad laminate not having a non-photosensitive resin layer, and having a conductor layer and a photosensitive resin layer which is a precursor of an insulating layer of the wired circuit board and is disposed on the conductor layer.
The invention [9] includes the metal-clad laminate of [8], wherein the photosensitive resin layer is disposed on the conductor layer via a photosensitive adhesive layer.
The invention [10] includes the metal-clad laminate of [8] or [9], which further includes a photosensitive adhesive layer disposed on the photosensitive resin layer.
The invention [11] includes the metal-clad laminate of [8] or [9], which further includes a 2 nd conductor layer disposed on the photosensitive resin layer.
The invention [12] includes the metal-clad laminate of [11], wherein the 2 nd conductor layer is disposed on the photosensitive resin layer via a photosensitive adhesive layer.
The invention [13] includes the metal-clad laminate of [11] or [12], wherein the 2 nd conductor layer is formed of copper.
The invention [14] includes the metal-clad laminate according to any one of [8] to [13], wherein the conductor layer is formed of copper.
The invention [15] includes the metal-clad laminate according to any one of [1] to [14], wherein the photosensitive resin layer is formed of a photosensitive polyimide.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the metal-clad laminate of the present invention, the photosensitive resin layer is processed into a predetermined shape by a simple process such as exposure and development, and then the photosensitive resin layer is cured, whereby an insulating layer of a predetermined shape can be obtained.
Therefore, the insulating layer can be obtained efficiently as compared with the case where the cured insulating layer is processed.
As a result, the wired circuit board can be manufactured efficiently.
Drawings
Fig. 1 is a cross-sectional view of a metal-clad laminate according to embodiment 1.
Fig. 2 is a cross-sectional view of a wired circuit board manufactured using the metal-clad laminate shown in fig. 1.
Fig. 3 a to 3D are process charts of the method for manufacturing a wired circuit board according to embodiment 1, in which fig. 3 a shows a preparation process, fig. 3B shows a development process, fig. 3C shows a placement process, and fig. 3D shows an etching process.
Fig. 4a and 4B are process drawings showing a method of manufacturing a wired circuit board according to embodiment 1, in which fig. 4a and 4B are continued to fig. 3D, and fig. 4a shows a via (via) forming process and fig. 4B shows a 2 nd insulating layer forming process.
Fig. 5a to 5C are cross-sectional views showing a modification of the metal-clad laminate of embodiment 1, fig. 5a showing modification 1, fig. 5B showing modification 2, and fig. 5C showing modification 3.
Fig. 6 a to 6D are process charts of the method for manufacturing a wired circuit board according to embodiment 2, in which fig. 6 a shows a preparation process, fig. 6B shows a development process, fig. 6C shows a placement process, and fig. 6D shows an etching process and a 2 nd etching process.
Fig. 7 a and 7B are flowcharts showing a method for manufacturing a wired circuit board according to embodiment 2, in which fig. 7 a and 7B are continued to fig. 6D, and fig. 7 a shows a via forming step and fig. 7B shows a 2 nd insulating layer forming step.
Fig. 8 a to 8D are process charts of the method for manufacturing a wired circuit board according to embodiment 3, in which fig. 8 a shows a preparation process, fig. 8B shows a placement process, fig. 8C shows an etching process, and fig. 8D shows a development process.
Fig. 9 a to 9D are process charts of the method for manufacturing a wired circuit board according to embodiment 4, in which fig. 9 a shows a preparation process, fig. 9B shows a placement process, fig. 9C shows an etching process and a 2 nd etching process, and fig. 9D shows a development process.
Fig. 10 a and 10B are process charts of the method for manufacturing a wired circuit board according to embodiment 5, in which fig. 10 a shows a via forming process and fig. 10B shows a 2 nd insulating layer forming process.
Fig. 11 a to 11F are process charts of the method for manufacturing a wired circuit board according to embodiment 6, in which fig. 11 a shows a preparation process, fig. 11B shows a 2 nd etching process, fig. 11C shows a process for preparing a conductor layer, fig. 11D shows an etching process, fig. 11E shows a placement process, and fig. 11F shows a development process.
Fig. 12 is a cross-sectional view of a metal-clad laminate of embodiment 7.
Fig. 13 a to 13C are sectional views showing a modification of the metal-clad laminate of embodiment 7, in which fig. 13 a shows modification 1, fig. 13B shows modification 2, and fig. 13C shows modification 3.
Fig. 14 is a cross-sectional view of a metal-clad laminate according to embodiment 8.
Fig. 15a to 15D are process charts of the method for manufacturing a wired circuit board according to embodiment 8, in which fig. 15a shows a preparation process, fig. 15B shows a development process, fig. 15C shows an etching process, and fig. 15D shows a metal layer bonding process.
Fig. 16 a to 16C are process diagrams showing a method for manufacturing a wired circuit board according to embodiment 8, in which fig. 16 a to 16C are connected to fig. 15D, and fig. 16 a shows a via formation process, fig. 16B shows a 2 nd insulating layer formation process, and fig. 16C shows a 2 nd etching process.
Fig. 17 a to 17C are sectional views showing a modification of the metal-clad laminate of embodiment 8, in which fig. 17 a shows modification 1, fig. 17B shows modification 2, and fig. 17C shows modification 3.
Fig. 18 is a cross-sectional view of a metal-clad laminate according to embodiment 9.
Fig. 19 a to 19D are process charts of the method for manufacturing a wired circuit board according to embodiment 9, in which fig. 19 a shows a preparation process, fig. 19B shows an etching process, fig. 19C shows a developing process, and fig. 19D shows a metal layer bonding process.
Fig. 20 a to 20C are process diagrams showing a method of manufacturing a wired circuit board according to embodiment 9, in which fig. 20 a to 20C are connected to fig. 19D, and fig. 20 a shows a via forming process, fig. 20B shows a 2 nd insulating layer forming process, and fig. 20C shows a 2 nd etching process.
Fig. 21 a to 21C are cross-sectional views showing a modification of the metal-clad laminate of embodiment 9, in which fig. 21 a shows modification 1, fig. 21B shows modification 2, and fig. 21C shows modification 3.
Description of the reference numerals
1 Metal clad laminate
2 Metal layer
3 photosensitive resin layer
4 photosensitive adhesive layer
6 photosensitive adhesive layer
11-wiring circuit board
12 Metal supporting substrate
13 1 st insulating layer (an example of an insulating layer)
14 conductor pattern
140 conductor layer
100-clad metal laminate
200 metal-clad laminate
300 metal clad laminate
301 nd conductor layer
302 nd conductor pattern 2
303 photosensitive adhesive layer
Detailed Description
1. Metal-clad laminate
A metal-clad laminate 1 according to embodiment 1 will be described with reference to fig. 1 and 2.
The metal-clad laminate 1 shown in fig. 1 is used for manufacturing a wiring circuit board 11 (see fig. 2) by a subtractive method. The metal-clad laminate 1 is independently subjected to a transaction as a raw material for manufacturing the wiring circuit board 11 by the subtractive method. The metal-clad laminate 1 does not include a laminate formed during the production of the wiring circuit board 11. The wired circuit board 11 and the method of manufacturing the wired circuit board 11 will be described later.
The metal-clad laminate 1 of the present embodiment is a single-sided metal-clad laminate having a metal layer 2 on one surface in the thickness direction. The metal-clad laminate 1 includes a metal layer 2, a photosensitive resin layer 3, a photosensitive adhesive layer 4, and a protective film 5.
The metal-clad laminate 1 does not have a non-photosensitive resin layer. The non-photosensitive resin layer is a resin layer which is present in a development step of a method for manufacturing the wiring circuit board 11 described later and cannot be patterned by exposure and development. Examples of the non-photosensitive resin layer include an insulating layer of a copper-clad laminate and an insulating layer of a wired circuit board. The protective film 5 is peeled off in a preparation step of a method for manufacturing the wiring circuit board 11, which will be described later, and therefore is not present in the developing step. Therefore, the protective film 5 is not included in the non-photosensitive resin layer.
(1) Metal layer
The metal layer 2 is a layer of a metal supporting board 12 (see fig. 2) for forming the wiring circuit board 11.
The material of the metal layer 2 is not limited as long as the rigidity required for the metal supporting board 12 can be obtained. Examples of the material of the metal layer 2 include copper alloy, stainless steel, copper, 42 alloy, monel (Monel). Preferably, the metal layer 2 is formed of copper alloy or stainless steel.
The thickness of the metal layer 2 is not limited as long as the rigidity required for the metal supporting board 12 can be obtained. The thickness of the metal layer 2 is, for example, 1 μm or more and, for example, 250 μm or less.
(2) Photosensitive resin layer
The photosensitive resin layer 3 is a precursor of a 1 st insulating layer 13 (see fig. 2) which is an example of an insulating layer of the wired circuit board 11. The photosensitive resin layer 3 is disposed on the metal layer 2 in the thickness direction of the metal-clad laminate 1.
The photosensitive resin layer 3 can be patterned by exposure and development. Examples of the material of the photosensitive resin layer 3 include photosensitive polyimide, photosensitive epoxy resin, and photosensitive polybenzoxazole.
The photosensitive resin layer 3 is preferably formed of photosensitive polyimide. The photosensitive polyimide contains, for example, a polyamic acid (uncured polyimide) having a photoreactive functional group. The photosensitive polyimide may contain a polyamic acid and a sensitizer.
The photosensitive resin layer 3 is patterned by exposure and development, and then cured by heating as needed. The photosensitive resin layer 3 may be a negative type in which the exposed portion is insoluble in a developing solution, or a positive type in which the exposed portion is soluble in a developing solution. The photosensitive resin layer 3 is preferably negative.
The thickness of the photosensitive resin layer 3 is, for example, 1 μm or more and, for example, 50 μm or less.
(3) Photosensitive adhesive layer
The photosensitive adhesive layer 4 is disposed on the photosensitive resin layer 3 in the thickness direction of the metal-clad laminate 1. The photosensitive adhesive layer 4 can be patterned together with the photosensitive resin layer 3 by exposure and development. That is, when the photosensitive resin layer 3 is negative, the photosensitive adhesive layer 4 is also negative, and when the photosensitive resin layer 3 is positive, the photosensitive adhesive layer 4 is also positive.
After exposure and development of the photosensitive adhesive layer 4 and before curing of the photosensitive adhesive layer 4 is completed, the photosensitive adhesive layer 4 has a stronger adhesive force than the photosensitive resin layer 3. The photosensitive adhesive layer 4 may have adhesive force before exposure and development and after exposure and development. The photosensitive adhesive layer 4 bonds the photosensitive resin layer 3 and the conductor layer 140 in a step of disposing the wiring circuit board 11 (see C of fig. 3) to be described later.
The photosensitive adhesive layer 4 contains, for example, an uncured thermosetting resin having a photoreactive functional group. The photosensitive adhesive layer 4 may contain an uncured thermosetting resin and a photosensitive agent. The photosensitive adhesive layer may contain a thermoplastic resin having a photoreactive functional group. The photosensitive adhesive layer 4 may contain a thermoplastic resin and a photosensitive agent.
Examples of the material of the photosensitive adhesive layer 4 include a photosensitive thermosetting resin and a photosensitive thermoplastic resin. Examples of the photosensitive thermosetting resin include a photosensitive epoxy resin, a photosensitive polyimide, and a photosensitive urethane resin. Examples of the photosensitive thermoplastic resin include photosensitive acrylic resins.
Examples of the negative photosensitive epoxy resin used for the photosensitive adhesive layer 4 include a biphenyl type epoxy resin (uncured thermosetting resin) and a mixture of a bisphenol F type epoxy resin (uncured thermosetting resin) and 4, 4-bis [ bis (β -hydroxyethoxy) phenylthio ] benzene sulfide bis (hexafluoroantimonate) (sensitizer).
Examples of the negative photosensitive polyimide used for the photosensitive adhesive layer 4 include a mixture of ethylene glycol bis-trimellitic dianhydride (acid dianhydride component), 1, 12-diaminodecane (diamine component), and a reaction product (polyamic acid) of 1, 3-bis- (3-aminopropyl) tetramethyldisiloxane (diamine component) with 1-ethyl-3, 5-dimethoxycarbonyl-4- (2-nitrophenyl) -1, 4-dihydropyridine (sensitizer).
The photosensitive adhesive layer 4 is thinner than the photosensitive resin layer 3. The photosensitive adhesive layer 4 may have the same thickness as the photosensitive resin layer 3. The thickness of the photosensitive adhesive layer 4 is, for example, 1 times or less, preferably 1/2 or less, for example, 1/3 or more, of the thickness of the photosensitive resin layer 3. The thickness of the photosensitive adhesive layer 4 is, for example, 1 μm or more and, for example, 25 μm or less.
(4) Protective film
The protective film 5 protects the photosensitive resin layer 3 and the photosensitive adhesive layer 4. The protective film 5 is disposed on the photosensitive adhesive layer 4 in the thickness direction of the metal-clad laminate 1. The protective film 5 covers the photosensitive resin layer 3 and the photosensitive adhesive layer 4. The protective film 5 can be peeled from the photosensitive adhesive layer 4.
2. Method for manufacturing metal-clad laminate
To manufacture the metal-clad laminate 1, first, the photosensitive resin layer 3 is formed on the metal layer 2.
When the photosensitive resin layer 3 is formed, for example, a solution (varnish) of the photosensitive resin is applied to the metal layer 2 and dried. Thereby, the photosensitive resin layer 3 is formed on the metal layer 2.
Next, a photosensitive adhesive layer 4 is formed on the photosensitive resin layer 3.
In forming the photosensitive adhesive layer 4, for example, a solution (varnish) of the photosensitive adhesive is applied to the photosensitive resin layer 3 and dried. Thereby, the photosensitive adhesive layer 4 is formed on the photosensitive resin layer 3.
Next, a protective film 5 is bonded to the photosensitive adhesive layer 4. As described above, the metal-clad laminate 1 is obtained.
In order to produce the metal-clad laminate 1, the photosensitive adhesive layer 4 and the photosensitive resin layer 3 may be sequentially formed on the protective film 5, and then the metal layer 2 may be bonded to the photosensitive resin layer 3.
3. Wiring circuit board
Next, a wiring circuit board 11 manufactured using the metal-clad laminate 1 will be described with reference to fig. 2.
The wired circuit board 11 includes: a metal supporting board 12, a 1 st insulating layer 13 as an example of an insulating layer, a conductor pattern 14, a via 15, and a 2 nd insulating layer 16. The wiring circuit board 11 may not have the via 15.
(1) Metal supporting substrate
The metal supporting board 12 supports the 1 st insulating layer 13, the conductor pattern 14, the via 15, and the 2 nd insulating layer 16. In the present embodiment, the metal support board 12 is formed of the metal layer 2 (see fig. 1) of the metal-clad laminate 1.
(2) 1 st insulating layer
The 1 st insulating layer 13 is disposed on the metal supporting board 12 in the thickness direction of the wiring circuit board 11. The 1 st insulating layer 13 is disposed between the metal supporting board 12 and the conductor pattern 14. The 1 st insulating layer 13 insulates the metal supporting board 12 from the conductor pattern 14. The 1 st insulating layer 13 is provided at a portion where the conductor pattern 14 is formed. The 1 st insulating layer 13 is a cured product of the photosensitive resin layer 3 (see fig. 1) of the metal-clad laminate 1.
(3) Conductor pattern
The conductor pattern 14 is arranged on the 1 st insulating layer 13 in the thickness direction of the wiring circuit board 11. The conductor pattern 14 is arranged on the 1 st insulating layer 13 via a bonding layer 17 which is a cured product of the photosensitive adhesive layer 4 in the thickness direction of the wiring circuit board 11. The bonding layer 17 bonds the 1 st insulating layer 13 to the conductor pattern 14.
The conductor pattern 14 is formed of metal. Examples of the metal include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. Copper is preferable from the viewpoint of obtaining good electrical characteristics.
The shape of the conductor pattern 14 is not limited. In the present embodiment, the conductor pattern 14 has a plurality of wiring patterns 14A, 14B, 14C, and 14D that are independent of each other.
(4) Passage way
The via 15 penetrates the D of the wiring pattern 14, the bonding layer 17, and the 1 st insulating layer 13 in the thickness direction of the wired circuit board 11. The via 15 electrically connects the wiring pattern 14D with the metal supporting board 12.
(5) 2 nd insulating layer
The 2 nd insulating layer 16 covers the conductor pattern 14 and the via 15. The 2 nd insulating layer 16 is disposed on the bonding layer 17 in the thickness direction of the wiring circuit board 11. The 2 nd insulating layer 16 is formed of a thermosetting resin. Examples of the thermosetting resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.
4. Method for manufacturing wired circuit board
Next, a method of manufacturing the wired circuit board 11 will be described with reference to B of fig. 2 to 4.
The method for manufacturing the wired circuit board comprises the following steps: a preparation process (see a of fig. 3), a development process (see B of fig. 3), a disposition process (see C of fig. 3), an etching process (see D of fig. 3), a via formation process (see a of fig. 4), a 2 nd insulating layer formation process (see B of fig. 4), and a 2 nd etching process (see B of fig. 4 and fig. 2). In this embodiment, the preparation step, the development step, the arrangement step, the etching step, the 2 nd insulating layer formation step, and the 2 nd etching step are sequentially performed. That is, the disposing step is performed after the developing step, and the etching step is performed after the disposing step.
(1) Preparation step
As shown in a of fig. 3, in the preparation step, the metal-clad laminate 1 is prepared and the protective film 5 (see fig. 1) is peeled off. In the present embodiment, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are negative type.
(2) Development process
Next, as shown in fig. 3B, in the development step, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are exposed to light and developed. Thus, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are patterned into a desired shape.
Specifically, in the development step, first, a part of the photosensitive resin layer 3 and the photosensitive adhesive layer 4 is exposed to light through a photoresist. In this way, the exposed portions of the photosensitive resin layer 3 and the photosensitive adhesive layer 4 become insoluble to the developer.
Next, the exposed photosensitive resin layer 3 and photosensitive adhesive layer 4 are immersed in a developing solution. In this way, the unexposed portions of the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are dissolved in the developer and removed. The exposed portions of the photosensitive resin layer 3 and the photosensitive adhesive layer 4 remain insoluble in the developer. Thus, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are developed in a desired pattern.
The photosensitive resin layer 3 and the photosensitive adhesive layer 4 after the development step are in an uncured state.
(3) Configuration procedure
Next, as shown in fig. 3C, in the disposing step, the conductor layer 140 is disposed on the photosensitive resin layer 3.
Specifically, in the disposing step, the conductor layer 140 formed of a metal foil is bonded to the photosensitive adhesive layer 4.
The conductor layer 140 is a layer for forming the conductor pattern 14. The conductor layer 140 is formed of metal. Examples of the metal include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical characteristics, the conductor layer 140 is preferably formed of copper.
The conductor layer 140 is thinner than the metal layer 2. The thickness of the conductor layer 140 is, for example, 1 μm or more and, for example, 50 μm or less.
The conductor layer 140 is disposed on the photosensitive resin layer 3 via the photosensitive adhesive layer 4. The conductor layer 140 is bonded to the photosensitive resin layer 3 via the photosensitive adhesive layer 4.
Then, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are heated and cured as necessary. Thereby, the 1 st insulating layer 13 obtained by curing the photosensitive resin layer 3 and the bonding layer 17 obtained by curing the photosensitive adhesive layer 4 are formed.
(4) Etching process
Next, as shown in fig. 3D, in the etching step, a portion of the conductor layer 140 is etched to form the conductor pattern 14.
Specifically, in the etching step, first, a dry film resist is adhered to the conductor layer 140.
Next, the dry film resist is exposed and developed to form an etching resist. The etching resist covers a portion of the conductor layer 140 which becomes the conductor pattern 14.
Next, the portion of the conductor layer 140 exposed from the etching resist is etched by an etching solution.
Thereby, the portion of the conductor layer 140 exposed from the etching resist is removed, and the conductor pattern 14 is formed.
(5) Via formation step
Next, as shown in a of fig. 4, in the via forming step, a via 15 is formed.
In order to form the via 15, a via hole 15A penetrating the wiring pattern 14D, the bonding layer 17, and the 1 st insulating layer 13 is formed by, for example, laser etching.
Next, the via 15 is formed in the via hole 15A by electroplating or electroless plating.
(6) Step 2 of insulating layer formation
Next, as shown in B of fig. 4, in the insulating layer 2 forming step, the insulating layer 2 16 is formed.
To form the 2 nd insulating layer 16, first, a dry film of the material of the 2 nd insulating layer is adhered to the bonding layer 17 so as to cover the conductor pattern 14.
Next, the dry film is exposed to light and developed, and heated as necessary to be cured, thereby forming the 2 nd insulating layer 16.
(7) 2 nd etching step
Next, as shown in fig. 4B and 2, in the 2 nd etching step, a part of the metal layer 2 is etched to form a metal supporting board 12.
Specifically, in the 2 nd etching step, first, a dry film resist is adhered to the metal layer 2.
Next, the dry film resist is exposed and developed to form an etching resist. The etching resist covers a portion of the metal layer 2 which becomes the metal supporting board 12.
Next, the portion of the metal layer 2 exposed from the etching resist is etched by an etching solution.
Thereby, the portion of the metal layer 2 exposed from the etching resist is removed, and the metal support substrate 12 is formed.
As described above, the production of the wired circuit board 11 is completed, and the wired circuit board 11 is obtained as shown in fig. 2.
5. Effects of action
According to the metal-clad laminate 1, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are processed into a predetermined shape by a simple process of exposing and developing the photosensitive resin layer 3 and the photosensitive adhesive layer 4 as shown in fig. 3 a and 3B, and then the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are cured as shown in fig. 3C and 3D, whereby the 1 st insulating layer 13 and the bonding layer 17 having the predetermined shape can be obtained.
Therefore, the 1 st insulating layer 13 can be obtained efficiently as compared with the case where the cured insulating layer is processed.
As a result, the wired circuit board 11 can be manufactured efficiently.
6. Modification of Metal-clad laminate
A modification of the metal-clad laminate 1 will be described with reference to a to C in fig. 5. In the modification of the metal-clad laminate 1, the same components as those of embodiment 1 are given the same reference numerals, and the description thereof is omitted.
(1) As shown in a of fig. 5, the metal-clad laminate 1 may not have the photosensitive adhesive layer 4. At this time, the metal-clad laminate 1 includes a metal layer 2, a photosensitive resin layer 3, and a protective film 5 in this order in the thickness direction. The photosensitive resin layer 3 has an adhesive force after exposure and development and before curing is completed. The protective film 5 is disposed on the photosensitive resin layer 3. In the arrangement step (see C in fig. 3) of the method for manufacturing the wired circuit board 11, the conductor layer 140 is directly bonded to the photosensitive resin layer 3.
(2) As shown in fig. 5B, the metal-clad laminate 1 may not have the photosensitive adhesive layer 4, and may have the photosensitive adhesive layer 6 between the metal layer 2 and the photosensitive resin layer 3. In other words, the photosensitive resin layer 3 may be disposed on the metal layer 2 via the photosensitive adhesive layer 6. At this time, the metal-clad laminate 1 has a metal layer 2, a photosensitive adhesive layer 6, a photosensitive resin layer 3, and a protective film 5 in this order in the thickness direction. In the development step (see B of fig. 3) of the method for manufacturing the wiring circuit board 11, the photosensitive adhesive layer 6 is exposed and developed together with the photosensitive resin layer 3, and is patterned into a desired shape. Then, the photosensitive adhesive layer 6 is cured to form a bonding layer for bonding the metal support substrate 12 (see fig. 2) and the 1 st insulating layer 13 (see fig. 2).
(3) As shown in fig. 5C, the metal-clad laminate 1 may include a metal layer 2, a photosensitive adhesive layer 6, a photosensitive resin layer 3, a photosensitive adhesive layer 4, and a protective film 5 in this order in the thickness direction.
(4) The metal-clad laminate plates 1 according to modification (1) to (3) can also obtain the same operational effects as those of embodiment 1.
7. Embodiment 2
Next, embodiment 2 will be described with reference to a to B of fig. 6 to 7. In embodiment 2, the same steps as those in embodiment 1 are omitted.
In embodiment 2, the preparation step (see fig. 6 a), the development step (see fig. 6B), the arrangement step (see fig. 6C), the etching step and the 2 nd etching step (see fig. 6D), the via formation step (see fig. 7 a), and the 2 nd insulating layer formation step (see fig. 7B) are sequentially performed. In embodiment 2, as shown in D of fig. 6, the etching step and the 2 nd etching step are simultaneously performed, and the metal supporting board 12 and the conductor pattern 14 are simultaneously formed. This can shorten the manufacturing process of the wired circuit board 11, compared with the case where the metal supporting board 12 and the conductor pattern 14 are formed by different processes.
In embodiment 2, the same operational effects as those in embodiment 1 can be obtained.
8. Embodiment 3
Next, embodiment 3 will be described with reference to fig. 8 a to 8D, fig. 4a, fig. 4B, and fig. 2. In embodiment 3, the same steps as those in embodiment 1 are omitted.
In embodiment 3, the preparation step (see fig. 8 a), the arrangement step (see fig. 8B), the etching step (see fig. 8C), the development step (see fig. 8D), the via formation step (see fig. 4 a), the 2 nd insulating layer formation step (see fig. 4B), and the 2 nd etching step (see fig. 4B and fig. 2) are sequentially performed. That is, in embodiment 3, an etching process is performed after the disposing process, and a developing process is performed after the etching process.
In embodiment 3, as shown in D of fig. 8, in the development step, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are exposed and developed, and then heated as necessary to be cured.
In embodiment 3, the same operational effects as those in embodiment 1 can be obtained.
9. Embodiment 4
Next, embodiment 4 will be described with reference to a to D in fig. 9, a in fig. 4, and B in fig. 4. In embodiment 4, the same steps as those in embodiment 1 are omitted.
In embodiment 4, the preparation step (see fig. 9 a), the arrangement step (see fig. 9B), the etching step and the 2 nd etching step (see fig. 9C), the development step (see fig. 9D), the via formation step (see fig. 4 a), and the 2 nd insulating layer formation step (see fig. 4B) are sequentially performed.
In embodiment 4, as shown in fig. 9C, the etching step and the 2 nd etching step are simultaneously performed, and the metal supporting board 12 and the conductor pattern 14 are simultaneously formed. This can shorten the manufacturing process of the wired circuit board 11, compared with the case where the metal supporting board 12 and the conductor pattern 14 are formed by different processes.
In embodiment 4, the same operational effects as those in embodiment 1 can be obtained.
10. Embodiment 5
Next, embodiment 5 will be described with reference to fig. 9 a to 9C, fig. 10 a, fig. 10B, and fig. 2. In embodiment 5, the same steps as those in embodiment 4 will be omitted.
In embodiment 5, a preparation process (see a of fig. 9), an arrangement process (see B of fig. 9), an etching process and a 2 nd etching process (see C of fig. 9), a via formation process (see a of fig. 10), a 2 nd insulating layer formation process (see B of fig. 10), and a development process (see B of fig. 10 and fig. 2) are sequentially performed.
In embodiment 5, as shown in fig. 10 a, in the via forming step, a via hole 15A is formed to penetrate the wiring pattern 14D, the photosensitive adhesive layer 4 before exposure, and the photosensitive resin layer 3 before exposure, and a via 15 is formed in the via hole 15A.
In embodiment 5, as shown in fig. 10B, in the insulating layer 2 forming step, the insulating layer 2 16 is formed on the photosensitive adhesive layer 4 before exposure.
In embodiment 5, as shown in fig. 10B and 2, in the development step, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are exposed and developed, and then heated as necessary to be cured.
In embodiment 5, the same operational effects as those in embodiment 4 can be obtained.
11. Embodiment 6
Next, embodiment 6 will be described with reference to fig. 11 a to 11F, fig. 7 a, and fig. 7B. In embodiment 6, the same steps as those in embodiment 1 are omitted.
In embodiment 6, first, a preparation step (see fig. 11 a) and a 2 nd etching step (see fig. 11B) are performed.
In addition, unlike the preparation step and the 2 nd etching step, as shown in fig. 11C and 11D, before the conductor layer 140 is disposed on the photosensitive adhesive layer 4, a part of the conductor layer 140 is etched to form the conductor pattern 14 (etching step).
Next, as shown in E of fig. 11, the conductor pattern 14 is arranged on the photosensitive adhesive layer 4 (arrangement step). That is, in embodiment 6, the arrangement step is performed after the etching step.
Next, as shown in F of fig. 11, a developing process is performed. That is, in embodiment 6, the developing process is performed after the disposing process.
Then, a via forming step (see a of fig. 7) and a 2 nd insulating layer forming step (see B of fig. 7) are performed.
In embodiment 6, the same operational effects as those in embodiment 1 can be obtained.
In embodiment 6, in the disposing step, a wired circuit board having the conductor pattern 14 may be disposed on the photosensitive adhesive layer 4 instead of the conductor pattern 14.
12. Embodiment 7
Next, embodiment 7 will be described with reference to fig. 12, fig. 8B to fig. 8D, fig. 4a, fig. 4B, fig. 2, fig. 9B to fig. 9D, fig. 10 a, fig. 10B, and fig. 13 a to fig. 13C. In embodiment 7, the same members as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
As shown in fig. 12, a metal-clad laminate 100 according to embodiment 7 is a double-sided metal-clad laminate having a metal layer 2 on one surface in the thickness direction and a conductor layer 140 on the other surface in the thickness direction. In embodiment 7, the metal-clad laminate 100 includes a metal layer 2, a photosensitive resin layer 3, a photosensitive adhesive layer 4, and a conductor layer 140 in this order in the thickness direction. The conductor layer 140 is disposed on the photosensitive resin layer 3 via the photosensitive adhesive layer 4.
In embodiment 7, in the method for manufacturing the wired circuit board 11, the disposing step is not required. That is, in embodiment 7, in the method for manufacturing the wired circuit board 11, for example, a preparation step (see B of fig. 8), an etching step (see C of fig. 8), a developing step (see D of fig. 8), a via forming step (see a of fig. 4), a 2 nd insulating layer forming step (see B of fig. 4), and a 2 nd etching step (see B of fig. 4 and fig. 2) are sequentially performed.
In embodiment 7, in the method of manufacturing the wiring circuit board 11, the preparation step (see B of fig. 9), the etching step and the 2 nd etching step (see C of fig. 9), the development step (see D of fig. 9), the via formation step (see a of fig. 4), and the 2 nd insulating layer formation step (see B of fig. 4) may be sequentially performed.
In embodiment 7, in the method for manufacturing the wired circuit board 11, the preparation step (see B of fig. 9), the etching step and the 2 nd etching step (see C of fig. 9), the via formation step (see a of fig. 10), the 2 nd insulating layer formation step (see B of fig. 10), and the development step (see B of fig. 10 and fig. 2) may be sequentially performed.
As shown in a of fig. 13, the metal-clad laminate 100 of embodiment 7 may not have the photosensitive adhesive layer 4.
As shown in fig. 13B, the metal-clad laminate 100 of embodiment 7 may not have the photosensitive adhesive layer 4, and may have the photosensitive adhesive layer 6 between the metal layer 2 and the photosensitive resin layer 3.
As shown in fig. 13C, the metal-clad laminate 100 according to embodiment 7 may include a metal layer 2, a photosensitive adhesive layer 6, a photosensitive resin layer 3, a photosensitive adhesive layer 4, and a conductor layer 140 in this order in the thickness direction.
In embodiment 7, the same operational effects as those in embodiment 1 can be obtained.
13. Embodiment 8
Next, embodiment 8 will be described with reference to C of fig. 14 to 17. In embodiment 8, the same members as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
As shown in fig. 14, a metal-clad laminate 200 according to embodiment 8 is a single-sided metal-clad laminate having a conductor layer 140 on one surface in the thickness direction. In embodiment 8, the metal-clad laminate 200 includes, in order in the thickness direction, a conductor layer 140, a photosensitive adhesive layer 4, a photosensitive resin layer 3, and a protective film 5. In embodiment 8, the photosensitive resin layer 3 is disposed on the conductor layer 140 via the photosensitive adhesive layer 4.
In embodiment 8, in the method for manufacturing the wired circuit board 11, for example, a preparation process (see a of fig. 15), a development process (see B of fig. 15), an etching process (see C of fig. 15), a metal layer bonding process (see D of fig. 15), a via formation process (see a of fig. 16), a 2 nd insulating layer formation process (see B of fig. 16), and a 2 nd etching process (see B of fig. 16 and C of fig. 16) are sequentially performed.
As shown in a of fig. 15, in the preparation step, the metal-clad laminate 200 (see fig. 14) is prepared.
As shown in fig. 15B, in the development step, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are exposed and developed, and cured.
As shown in fig. 15C, in the etching step, a portion of the conductor layer 140 is etched to form the conductor pattern 14.
As shown in D of fig. 15, in the metal layer bonding step, the metal layer 2 is bonded to the other surface of the 1 st insulating layer 13 in the thickness direction via the adhesive layer 201.
As shown in a of fig. 16, in the via forming step, a via hole 15A is formed through which the wiring pattern 14D, the bonding layer 17, the 1 st insulating layer 13, and the adhesive layer 201 pass, and the via 15 is formed in the via hole 15A.
As shown in fig. 16B, in the 2 nd insulating layer forming step, the 2 nd insulating layer 16 is formed on the bonding layer 17 so as to cover the conductor pattern 14.
As shown in B of fig. 16 and C of fig. 16, in the 2 nd etching step, a part of the metal layer 2 is etched to form the metal supporting board 12.
In embodiment 8, in the method for manufacturing the wiring circuit board 11, for example, a preparation step (see fig. 15 a), an etching step (see fig. 15C), a developing step (see fig. 15B), a metal layer bonding step (see fig. 15D), a via formation step (see fig. 16 a), a 2 nd insulating layer formation step (see fig. 16B), and a 2 nd etching step (see fig. 16B and fig. 16C) may be sequentially performed.
In embodiment 8, in the method for manufacturing the wired circuit board 11, for example, it is also possible to: first, a preparation step (see fig. 15 a), a development step (see fig. 15B), and an etching step (see fig. 15C) are performed, and a part of the metal layer 2 is etched separately to form a metal support substrate 12 (the 2 nd etching step), and then the metal support substrate 12 is bonded to the 1 st insulating layer 13 via the adhesive layer 201 (the metal layer bonding step).
As shown in a of fig. 17, the metal-clad laminate 200 may not have the photosensitive adhesive layer 4. At this time, the metal-clad laminate 200 includes the conductor layer 140, the photosensitive resin layer 3, and the protective film 5 in this order in the thickness direction. The photosensitive resin layer 3 has an adhesive force after exposure and development and before curing is completed. In the metal layer bonding step (see D in fig. 15) of the method for manufacturing the wiring circuit board 11, the metal layer 2 is directly bonded to the photosensitive resin layer 3.
As shown in fig. 17B, the metal-clad laminate 200 may not have the photosensitive adhesive layer 4 and may have the photosensitive adhesive layer 6. The photosensitive adhesive layer 6 is disposed on the photosensitive resin layer 3. At this time, the metal-clad laminate 200 includes the conductor layer 140, the photosensitive resin layer 3, the photosensitive adhesive layer 6, and the protective film 5 in this order in the thickness direction. In the metal layer bonding step (see D in fig. 15) of the method for manufacturing the wiring circuit board 11, the metal layer 2 is bonded to the photosensitive resin layer 3 through the photosensitive adhesive layer 6. That is, in the metal layer bonding step (see D in fig. 15) of the method for manufacturing the wiring circuit board 11, the adhesive layer 201 is not required.
As shown in fig. 17C, the metal-clad laminate 200 may include the conductor layer 140, the photosensitive adhesive layer 4, the photosensitive resin layer 3, the photosensitive adhesive layer 6, and the protective film 5 in this order in the thickness direction.
In embodiment 8, the same operational effects as those in embodiment 1 can be obtained.
14. Embodiment 9
Next, embodiment 8 will be described with reference to C in fig. 18 to 21. In embodiment 8, the same members as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
As shown in fig. 18, a metal-clad laminate 300 according to embodiment 9 is a double-sided metal-clad laminate having a conductor layer 140 on one surface in the thickness direction and a 2 nd conductor layer 301 on the other surface in the thickness direction. In embodiment 9, the metal-clad laminate 300 includes, in order in the thickness direction, a conductor layer 140, a photosensitive adhesive layer 4, a photosensitive resin layer 3, and a 2 nd conductor layer 301.
The 2 nd conductor layer 301 is disposed on the photosensitive resin layer 3. The 2 nd conductor layer 301 is a layer for forming the 2 nd conductor pattern 302. For example, in order to reduce the transmission loss of the wiring patterns 14A, 14B, 14C, and 14D (see C of fig. 20), the 2 nd conductor pattern 302 is arranged on the opposite side of the wiring patterns 14A, 14B, 14C, and 14D with respect to the 1 st insulating layer 13 (see C of fig. 20).
The 2 nd conductor layer 301 is formed of metal. Examples of the metal include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical characteristics, the 2 nd conductor layer 301 is preferably formed of copper.
The thickness of the 2 nd conductor layer 301 is, for example, 1 μm or more and, for example, 50 μm or less.
In embodiment 9, in the method for manufacturing the wired circuit board 11, for example, a preparation process (see fig. 19 a), an etching process (see fig. 19B), a developing process (see fig. 19C), a metal layer bonding process (see fig. 19D), a via formation process (see fig. 20 a), a 2 nd insulating layer formation process (see fig. 20B), and a 2 nd etching process (see fig. 20B and 20C) are sequentially performed.
As shown in a of fig. 19, in the preparation step, the metal-clad laminate 300 (see fig. 18) is prepared.
As shown in fig. 19B, in the etching step, a part of the conductor layer 140 is etched to form the conductor pattern 14, and a part of the 2 nd conductor layer 301 is etched to form the 2 nd conductor pattern 302.
As shown in fig. 19C, in the development step, the photosensitive resin layer 3 and the photosensitive adhesive layer 4 are exposed and developed, and cured.
As shown in D of fig. 19, in the metal layer bonding step, the metal layer 2 is bonded to the 2 nd conductor pattern 302 via the adhesive layer 201.
As shown in a of fig. 20, in the via forming step, a via hole 15A is formed through which the wiring pattern 14D, the bonding layer 17, the 1 st insulating layer 13, the 2 nd conductor pattern 302, and the adhesive layer 201 pass, and the via 15 is formed in the via hole 15A.
As shown in fig. 20B, in the 2 nd insulating layer forming step, the 2 nd insulating layer 16 is formed on the bonding layer 17 so as to cover the conductor pattern 14.
As shown in B of fig. 20 and C of fig. 20, in the 2 nd etching step, a part of the metal layer 2 is etched to form the metal supporting board 12.
As shown in a of fig. 21, the metal-clad laminate 300 may not have the photosensitive adhesive layer 4. At this time, the metal-clad laminate 300 includes the conductor layer 140, the photosensitive resin layer 3, and the 2 nd conductor layer 301 in this order in the thickness direction.
As shown in fig. 21B, the metal-clad laminate 300 may not have the photosensitive adhesive layer 4 and may have the photosensitive adhesive layer 303. The photosensitive adhesive layer 303 is disposed between the photosensitive resin layer 3 and the 2 nd conductor layer 301. In other words, the 2 nd conductor layer 301 is disposed on the photosensitive resin layer 3 via the photosensitive adhesive layer 303. At this time, the metal-clad laminate 300 includes, in order in the thickness direction, the conductor layer 140, the photosensitive resin layer 3, the photosensitive adhesive layer 303, and the 2 nd conductor layer 301.
As shown in fig. 21C, the metal-clad laminate 300 may include the conductor layer 140, the photosensitive adhesive layer 4, the photosensitive resin layer 3, the photosensitive adhesive layer 303, and the 2 nd conductor layer 301 in this order in the thickness direction.
In embodiment 9, the same operational effects as those in embodiment 1 can be obtained.
The invention described above is provided as an exemplary embodiment of the present invention, but this is merely an example and is not to be construed as limiting. Variations of the present invention that are apparent to those skilled in the art are included in the scope of the claims.
Industrial applicability
The metal-clad laminate of the present invention is used for manufacturing a wired circuit board by a subtractive method.

Claims (15)

1. A metal-clad laminate for use in the manufacture of wired circuit boards by a subtractive process,
the metal-clad laminate does not have a non-photosensitive resin layer,
a metal layer provided with a metal supporting board for forming the wired circuit board, and
and a photosensitive resin layer which is a precursor of the insulating layer of the wired circuit board and is disposed on the metal layer.
2. The metal-clad laminate according to claim 1, wherein the photosensitive resin layer is disposed on the metal layer via a photosensitive adhesive layer.
3. The metal-clad laminate according to claim 1 or 2, further comprising a photosensitive adhesive layer disposed on the photosensitive resin layer.
4. The metal-clad laminate according to claim 1 or 2, further comprising a conductor layer disposed on the photosensitive resin layer, the conductor layer being used for forming a conductor pattern of the wired circuit board.
5. The metal-clad laminate according to claim 4, wherein the conductor layer is disposed on the photosensitive resin layer via a photosensitive adhesive layer.
6. The metal-clad laminate of claim 4 wherein the conductor layer is formed of copper.
7. The metal-clad laminate of claim 1 wherein the metal layer is formed of a copper alloy or stainless steel.
8. A metal-clad laminate for use in the manufacture of wired circuit boards by a subtractive process,
the metal-clad laminate does not have a non-photosensitive resin layer,
a conductor layer having a conductor pattern for forming the wired circuit board, and
and a photosensitive resin layer which is a precursor of the insulating layer of the wired circuit board and is disposed on the conductor layer.
9. The metal-clad laminate according to claim 8, wherein the photosensitive resin layer is disposed on the conductor layer via a photosensitive adhesive layer.
10. The metal-clad laminate according to claim 8 or 9, further comprising a photosensitive adhesive layer disposed on the photosensitive resin layer.
11. The metal-clad laminate according to claim 8 or 9, further comprising a 2 nd conductor layer disposed on the photosensitive resin layer, the 2 nd conductor layer being used for forming a 2 nd conductor pattern of the wired circuit board.
12. The metal-clad laminate according to claim 11, wherein the 2 nd conductor layer is disposed on the photosensitive resin layer via a photosensitive adhesive layer.
13. The metal-clad laminate of claim 11 wherein the 2 nd conductor layer is formed of copper.
14. The metal-clad laminate of claim 8 wherein the conductor layer is formed of copper.
15. The metal-clad laminate according to claim 1 or 8, wherein the photosensitive resin layer is formed of photosensitive polyimide.
CN202310192551.1A 2022-03-04 2023-03-02 Metal-clad laminate Pending CN116709660A (en)

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