CN116685643B - 导热组合物和其固化物 - Google Patents

导热组合物和其固化物 Download PDF

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CN116685643B
CN116685643B CN202280010227.7A CN202280010227A CN116685643B CN 116685643 B CN116685643 B CN 116685643B CN 202280010227 A CN202280010227 A CN 202280010227A CN 116685643 B CN116685643 B CN 116685643B
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zinc oxide
thermally conductive
aluminum nitride
mass
conductive composition
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CN116685643A (zh
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佐藤光
舟桥一
行武初
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Resonac Corp
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Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
    • C08L2207/324—Liquid component is low molecular weight polymer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280010227.7A 2021-12-23 2022-11-02 导热组合物和其固化物 Active CN116685643B (zh)

Applications Claiming Priority (3)

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JP2021-209266 2021-12-23
JP2021209266 2021-12-23
PCT/JP2022/041047 WO2023119903A1 (ja) 2021-12-23 2022-11-02 熱伝導組成物及びその硬化物

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CN116685643B true CN116685643B (zh) 2024-03-26

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US (1) US20240101885A1 (https=)
EP (1) EP4276151B1 (https=)
JP (1) JP7364133B1 (https=)
CN (1) CN116685643B (https=)
WO (1) WO2023119903A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116875059A (zh) * 2023-08-01 2023-10-13 深圳先进电子材料国际创新研究院 一种兼具高阻尼、高回弹性能的导热凝胶及其制备方法
CN121532463A (zh) * 2023-09-06 2026-02-13 富士高分子工业株式会社 导热性组合物及使用其的导热性片材及其制造方法
WO2025052715A1 (ja) * 2023-09-06 2025-03-13 富士高分子工業株式会社 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法
JP2025092146A (ja) * 2023-12-08 2025-06-19 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法
JP2026002138A (ja) * 2024-06-20 2026-01-08 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2026057147A1 (de) * 2024-09-10 2026-03-19 Wacker Chemie Ag Wärmeleitfähige siliconzusammensetzung
CN119566321A (zh) * 2024-12-03 2025-03-07 浙江大学 具有微纳尺寸和水稳定性的零价铁还原材料的制备方法
JP7763573B1 (ja) * 2025-07-17 2025-11-04 信越化学工業株式会社 熱伝導性シリコーンゴムシート

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0896031A2 (en) * 1997-08-06 1999-02-10 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
JPH11307700A (ja) * 1998-04-17 1999-11-05 Denki Kagaku Kogyo Kk 放熱スペーサー
US5981641A (en) * 1996-08-09 1999-11-09 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition, heat conductive material and heat conductive silicone grease
JP2000109373A (ja) * 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
CN109312159A (zh) * 2016-05-24 2019-02-05 信越化学工业株式会社 导热性有机硅组合物及其固化物
CN109415564A (zh) * 2016-07-22 2019-03-01 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
WO2020262449A1 (ja) * 2019-06-26 2020-12-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリシロキサン組成物
CN113166542A (zh) * 2018-12-04 2021-07-23 信越化学工业株式会社 导热性有机硅组合物的固化物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3159662A (en) 1962-07-02 1964-12-01 Gen Electric Addition reaction
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3775452A (en) 1971-04-28 1973-11-27 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
WO2018016566A1 (ja) * 2016-07-22 2018-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリシロキサン組成物
JP7136203B2 (ja) * 2018-06-08 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその製造方法
WO2021109051A1 (en) * 2019-12-05 2021-06-10 Dow Silicones Corporation Highly thermally conductive flowable silicone composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981641A (en) * 1996-08-09 1999-11-09 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition, heat conductive material and heat conductive silicone grease
EP0896031A2 (en) * 1997-08-06 1999-02-10 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
JPH11307700A (ja) * 1998-04-17 1999-11-05 Denki Kagaku Kogyo Kk 放熱スペーサー
JP2000109373A (ja) * 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
CN109312159A (zh) * 2016-05-24 2019-02-05 信越化学工业株式会社 导热性有机硅组合物及其固化物
CN109415564A (zh) * 2016-07-22 2019-03-01 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
CN113166542A (zh) * 2018-12-04 2021-07-23 信越化学工业株式会社 导热性有机硅组合物的固化物
WO2020262449A1 (ja) * 2019-06-26 2020-12-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリシロキサン組成物

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WO2023119903A1 (ja) 2023-06-29
EP4276151A1 (en) 2023-11-15
CN116685643A (zh) 2023-09-01
EP4276151B1 (en) 2025-12-31
JP7364133B1 (ja) 2023-10-18
EP4276151A4 (en) 2024-10-02
JPWO2023119903A1 (https=) 2023-06-29
US20240101885A1 (en) 2024-03-28

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