JPWO2023119903A1 - - Google Patents
Info
- Publication number
- JPWO2023119903A1 JPWO2023119903A1 JP2023542691A JP2023542691A JPWO2023119903A1 JP WO2023119903 A1 JPWO2023119903 A1 JP WO2023119903A1 JP 2023542691 A JP2023542691 A JP 2023542691A JP 2023542691 A JP2023542691 A JP 2023542691A JP WO2023119903 A1 JPWO2023119903 A1 JP WO2023119903A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
- C08L2207/324—Liquid component is low molecular weight polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209266 | 2021-12-23 | ||
| JP2021209266 | 2021-12-23 | ||
| PCT/JP2022/041047 WO2023119903A1 (ja) | 2021-12-23 | 2022-11-02 | 熱伝導組成物及びその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023119903A1 true JPWO2023119903A1 (https=) | 2023-06-29 |
| JP7364133B1 JP7364133B1 (ja) | 2023-10-18 |
| JPWO2023119903A5 JPWO2023119903A5 (https=) | 2023-11-22 |
Family
ID=86902063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542691A Active JP7364133B1 (ja) | 2021-12-23 | 2022-11-02 | 熱伝導組成物及びその硬化物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240101885A1 (https=) |
| EP (1) | EP4276151B1 (https=) |
| JP (1) | JP7364133B1 (https=) |
| CN (1) | CN116685643B (https=) |
| WO (1) | WO2023119903A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116875059A (zh) * | 2023-08-01 | 2023-10-13 | 深圳先进电子材料国际创新研究院 | 一种兼具高阻尼、高回弹性能的导热凝胶及其制备方法 |
| CN121532463A (zh) * | 2023-09-06 | 2026-02-13 | 富士高分子工业株式会社 | 导热性组合物及使用其的导热性片材及其制造方法 |
| WO2025052715A1 (ja) * | 2023-09-06 | 2025-03-13 | 富士高分子工業株式会社 | 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 |
| JP2025092146A (ja) * | 2023-12-08 | 2025-06-19 | 信越化学工業株式会社 | 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法 |
| JP2026002138A (ja) * | 2024-06-20 | 2026-01-08 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| WO2026057147A1 (de) * | 2024-09-10 | 2026-03-19 | Wacker Chemie Ag | Wärmeleitfähige siliconzusammensetzung |
| CN119566321A (zh) * | 2024-12-03 | 2025-03-07 | 浙江大学 | 具有微纳尺寸和水稳定性的零价铁还原材料的制备方法 |
| JP7763573B1 (ja) * | 2025-07-17 | 2025-11-04 | 信越化学工業株式会社 | 熱伝導性シリコーンゴムシート |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3159601A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
| US3159662A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Addition reaction |
| US3220972A (en) | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
| US3775452A (en) | 1971-04-28 | 1973-11-27 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
| JP3142800B2 (ja) * | 1996-08-09 | 2001-03-07 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース |
| JP3195277B2 (ja) * | 1997-08-06 | 2001-08-06 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| JP3563590B2 (ja) * | 1998-04-17 | 2004-09-08 | 電気化学工業株式会社 | 放熱スペーサー |
| JP2000109373A (ja) * | 1998-10-02 | 2000-04-18 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物及びそれを使用した半導体装置 |
| JP6610429B2 (ja) * | 2016-05-24 | 2019-11-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、その硬化物及びその製造方法 |
| CN109415564B (zh) * | 2016-07-22 | 2021-12-21 | 迈图高新材料日本合同公司 | 导热性聚硅氧烷组合物 |
| WO2018016566A1 (ja) * | 2016-07-22 | 2018-01-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性ポリシロキサン組成物 |
| JP7136203B2 (ja) * | 2018-06-08 | 2022-09-13 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその製造方法 |
| JP7082563B2 (ja) * | 2018-12-04 | 2022-06-08 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物の硬化物 |
| WO2020262449A1 (ja) * | 2019-06-26 | 2020-12-30 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性ポリシロキサン組成物 |
| WO2021109051A1 (en) * | 2019-12-05 | 2021-06-10 | Dow Silicones Corporation | Highly thermally conductive flowable silicone composition |
-
2022
- 2022-11-02 EP EP22910623.2A patent/EP4276151B1/en active Active
- 2022-11-02 US US18/272,669 patent/US20240101885A1/en active Pending
- 2022-11-02 JP JP2023542691A patent/JP7364133B1/ja active Active
- 2022-11-02 WO PCT/JP2022/041047 patent/WO2023119903A1/ja not_active Ceased
- 2022-11-02 CN CN202280010227.7A patent/CN116685643B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023119903A1 (ja) | 2023-06-29 |
| EP4276151A1 (en) | 2023-11-15 |
| CN116685643A (zh) | 2023-09-01 |
| EP4276151B1 (en) | 2025-12-31 |
| JP7364133B1 (ja) | 2023-10-18 |
| CN116685643B (zh) | 2024-03-26 |
| EP4276151A4 (en) | 2024-10-02 |
| US20240101885A1 (en) | 2024-03-28 |
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