CN116669329A - Circuit board chip mounter capable of automatically removing impurities from welding spots - Google Patents
Circuit board chip mounter capable of automatically removing impurities from welding spots Download PDFInfo
- Publication number
- CN116669329A CN116669329A CN202310938230.1A CN202310938230A CN116669329A CN 116669329 A CN116669329 A CN 116669329A CN 202310938230 A CN202310938230 A CN 202310938230A CN 116669329 A CN116669329 A CN 116669329A
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- China
- Prior art keywords
- seat
- circuit board
- chip
- hot air
- chip mounter
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- 239000012535 impurity Substances 0.000 title claims abstract description 31
- 238000003466 welding Methods 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 claims description 52
- 238000006073 displacement reaction Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 4
- 238000003032 molecular docking Methods 0.000 claims description 2
- 210000001503 joint Anatomy 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 21
- 239000007788 liquid Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000007664 blowing Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a circuit board chip mounter capable of automatically removing impurities from welding spots, and relates to the technical field of chip mounters. The invention ensures that the positions of the conveying pipe, the pneumatic control sucking disc and the chip mounting seat are uniform and corresponding because the arrangement positions of the conveying pipe at the bottom of the lifting plate are consistent with the arrangement positions of all chips on the circuit board, the chips can be moved into the chip mounting seat in a state of keeping the position positioning of the chip mounting point, the size of the pin head at the bottom end of the butt joint plate is consistent with the size of the butt joint groove at the top of the arrangement seat, the position precision of the chip mounting seat when the pin head is inserted into the butt joint groove can be ensured, the chip mounting seat can be used for mounting chips at all positions on the circuit board at one time through the operation, and the trouble that a manipulator is required to frequently carry the chips when the traditional chip mounting is omitted.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a circuit board chip mounter capable of automatically removing impurities from welding spots.
Background
The chip mounter is also called a "mounter" or a "surface mounting system" (Surface Mount System), and in a production line, it is a device for accurately placing a surface mounted chip on a circuit board by moving a mounting head after a dispenser or a screen printer.
In the using process of the circuit board chip mounter, chips are usually arranged on the circuit board one by moving the mounting head, but the chip mounter can only mount a single chip at a time, so that the chip mounter has low chip mounting efficiency.
Accordingly, in view of the above, research and improvement are made to the existing structure and the existing defects, and a circuit board chip mounter with automatic impurity removal of solder joints is proposed.
Disclosure of Invention
The invention aims to provide a circuit board chip mounter capable of automatically removing impurities from welding spots so as to solve the problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an automatic edulcoration's of solder joint circuit board chip mounter, includes base, material loading subassembly and paster subassembly, the top outside of base is provided with first displacement subassembly, and the left side top of base is provided with the fixed column, the outer end of fixed column is connected with the sliding seat, and the outer end of sliding seat is provided with the lifter plate, the material loading subassembly is disposed in the bottom of lifter plate, and the inboard of material loading subassembly is settled there is the chip, the top of base is settled there is the second displacement subassembly, and the bottom inboard of second displacement subassembly is provided with the paster subassembly, the top right side of base is provided with the conveyer belt, and the top outside of conveyer belt is settled there is the seat, the butt joint groove has been seted up to the top inboard of seat, and the inboard of seat is provided with the circuit board.
Further, the first displacement assembly comprises a first rotating column, a connecting plate, an air control seat and an air control sucking disc, wherein the connecting plate is connected to two sides of the outer portion of the first rotating column, the air control seat is arranged at the tail end of the connecting plate, and the air control sucking disc is arranged on the outer side of the top of the air control seat.
Further, the pneumatic control seat is communicated with the pneumatic control sucking disc, and the pneumatic control sucking disc and the chip are mutually adsorbed.
Further, the material loading subassembly includes conveying pipeline, pan feeding groove, spout, motor, lead screw, pushes down seat and separation blade, the pan feeding groove has been seted up on the left side top of conveying pipeline, and the spout has been seted up in the right part outside of conveying pipeline, the right part outer end of conveying pipeline is connected with the motor, and the output of motor is connected with the lead screw, the outer end of lead screw is provided with pushes down the seat, the separation blade has been settled to the bottom inboard of conveying pipeline.
Further, the positions of the conveying pipes and the pneumatic control sucking discs are in one-to-one correspondence, and the chips are arranged in an array mode in the conveying pipes.
Further, the second displacement subassembly includes second pivoted post, rolling disc, linking seat, first electric push rod, lifting seat, butt joint board, plug and air heater, the top outside of second pivoted post is provided with the rolling disc, and the bottom both sides of rolling disc are provided with the linking seat, the bottom outside of linking seat is provided with first electric push rod, and the bottom of first electric push rod is connected with the lifting seat, the outside both sides of lifting seat are provided with the butt joint board, and the bottom outside of butt joint board is connected with the plug, the air heater is settled in the top outside of lifting seat.
Further, the paster subassembly includes second electric putter, paster seat, suction pump, suction tube, heat pipe, hot air port, solder paste storage tank, go out tin mouth, extension spring, attached sucking disc, pulling force inductor, contact block, first flexible dog and second flexible dog, the bottom outside of second electric putter is provided with the paster seat, and installs the suction pump in the inboard of paster seat, the outer end of suction pump is connected with the suction tube, the outer end of paster seat is provided with the heat pipe, the end-to-end connection of heat pipe has the hot air pipe, the hot air port has been seted up to the bottom inboard of paster seat, the inboard of paster seat is provided with the solder paste storage tank, the solder paste mouth has been seted up in the top outside of hot air port, the inboard of paster seat is provided with extension spring, and the bottom of extension spring is connected with attached sucking disc, the top outside of attached sucking disc is provided with pulling force inductor, and the outer edge of attached sucking disc is provided with the contact block, the inboard of paster seat is connected with first flexible dog, and the outside of first flexible dog is provided with the second flexible dog.
Further, the positions of the pneumatic control sucking discs are in one-to-one correspondence with the positions of the patch seats, and the patch seats and the circuit board are vertically distributed.
Further, the air heater is communicated with the hot air pipe through the heat transmission pipe, and the hot air pipe is communicated with the hot air port.
Further, the attached sucking disc is mutually adsorbed with the chip, and the attached sucking disc is elastically connected with the stretching spring.
The invention provides a circuit board chip mounter capable of automatically removing impurities from welding spots, which has the following beneficial effects:
1. according to the invention, the arrangement positions of the conveying pipe at the bottom of the lifting plate are consistent with the arrangement positions of all chips on the circuit board, the conveying pipe corresponds to the positions of the pneumatic control sucking discs one by one, and the pneumatic control sucking discs correspond to the positions of the patch seats one by one, so that the chips can be ensured to move into the patch seats under the state of positioning the positions of the patch points, the size of the plug head at the bottom end of the butt plate is consistent with the size of the butt joint groove at the top of the arrangement seat, the plug head is inserted into the butt joint groove, the position accuracy of the patch seats when the patch seats are in contact with the circuit board can be ensured, the chips at all positions on the circuit board can be subjected to patch operation at one time by the above operation, the trouble that a mechanical arm is required to frequently carry the chips when the traditional patch is omitted, so that the patch efficiency of the equipment is improved, and in addition, the patch process can avoid the situation that the chips are subjected to patch position errors by positioning in advance.
2. The invention can generate suction force in the coverage area of the patch seat to the circuit board through the suction pump, through suction, impurities adhered on the surface of the circuit board can be cleaned, so that the conditions of chip short circuit and the like caused by interference between the impurities and chips or the positions of the impurities at welding spots in the process of pasting can be avoided, in addition, the bottom of the pasting seat can be gradually changed into vacuum by the suction force, in the sucking process, the attached sucker can slide downwards at the inner side of the patch seat due to the influence of the sucking force, so that the chip can be gradually closed towards the circuit board, in the sliding process of the attached sucker, the first flexible stop block can stop the attached sucker from moving downwards, at the moment, the suction pump increases the suction force, this allows the attached suction cup to continue to move downward through the first flexible stop, and be blocked by the second flexible stop, because the suction force of the suction pump is increased at this time, the solder paste in the solder paste storage tank flows out from the solder outlet due to the increased suction force and is smeared on the welding point of the circuit board, after the tin paste is smeared, the suction force of the suction pump is increased to the maximum, so that the attached sucker can pass through the second flexible stop block to attach the chip to the circuit board, and after the suction force of the suction pump is maximized, the hot air blower also works, so that hot air can pass through the heat transmission pipe, the hot air pipe and the hot air port to contact with the chip, under the blowing of hot air, the solder paste can be melted into tin liquid and coated on the welding spots of the chip and the circuit board, the hot air machine pauses the work, the tin liquid is solidified, the surface mounting of the equipment is completed, in the operation, the device can automatically realize the smearing of the solder paste and the attachment of the chip and the circuit board by adopting the suction force, the method can greatly reduce the difficulty of the equipment in the process of pasting, and in addition, the process of pasting is carried out in a closed environment, so that the interference of the external environment to the process of pasting can be reduced.
3. The invention can release the adhesion between the patch seat and the circuit board through the second electric push rod, so that the vacuum environment in the patch seat can be released, at the moment, the adhesion sucking disc can rebound along with the tension spring due to the loss of vacuum suction, and therefore, the adhesion sucking disc and the chip are adsorbed, and the chip is welded on the circuit board, at the moment, the adsorption force of the adhesion sucking disc is equal to the rebound force, rebound can not occur, and at the moment, the tension sensor is in a stretching state, so that the tension sensor can read out the tension value, and if the chip and the circuit board are not welded, the chip can rebound along with the adhesion sucking disc, the tension sensor can not sense the tension value.
Drawings
FIG. 1 is a schematic view of the left end structure of a base of a circuit board chip mounter with automatic impurity removal of welding spots;
fig. 2 is a schematic diagram of the right end structure of a circuit board chip mounter base with automatic impurity removal of welding spots;
fig. 3 is a schematic diagram of a feeding assembly of a circuit board chip mounter with automatic impurity removal of welding spots;
fig. 4 is a schematic structural diagram of a chip mounter for circuit board, in which the welding spots are automatically removed;
fig. 5 is an enlarged schematic view of the circuit board chip mounter with automatic impurity removal of solder joints in fig. 4;
fig. 6 is a schematic diagram of a solder paste storage tank and a solder outlet of a circuit board chip mounter with automatic impurity removal of solder points according to the present invention;
fig. 7 is a schematic diagram of a hot air pipe and a hot air port of a circuit board chip mounter with automatic impurity removal of welding spots.
In the figure: 1. a base; 2. a first displacement assembly; 201. a first rotating column; 202. a splice plate; 203. a pneumatic control seat; 204. a pneumatic control sucker; 3. fixing the column; 4. a sliding seat; 5. a lifting plate; 6. a feeding assembly; 601. a material conveying pipe; 602. feeding a trough; 603. a chute; 604. a motor; 605. a screw rod; 606. pressing down a seat; 607. a baffle; 7. a chip; 8. a second displacement assembly; 801. a second rotating column; 802. a rotating disc; 803. a connecting seat; 804. a first electrical push rod; 805. a lifting seat; 806. an abutting plate; 807. a pin head; 808. an air heater; 9. a patch assembly; 901. a second electric push rod; 902. a patch seat; 903. a suction pump; 904. a suction tube; 905. a heat transfer pipe; 906. a hot air pipe; 907. a hot air port; 908. a solder paste storage tank; 909. a tin outlet; 910. a tension spring; 911. attaching a sucking disc; 912. a tension sensor; 913. a contact block; 914. a first flexible stop; 915. a second flexible stop; 10. a transmission belt; 11. a setting seat; 12. a butt joint groove; 13. and a circuit board.
Detailed Description
Referring to fig. 1 to 7, the present invention provides the following technical solutions: the utility model provides a circuit board chip mounter of automatic edulcoration of solder joint, including base 1, material loading subassembly 6 and paster subassembly 9, the top outside of base 1 is provided with first displacement subassembly 2, and the left side top of base 1 is provided with fixed column 3, the outer end of fixed column 3 is connected with sliding seat 4, and the outer end of sliding seat 4 is provided with lifter plate 5, material loading subassembly 6 settles in lifter plate 5's bottom, and the inboard of material loading subassembly 6 has settled chip 7, second displacement subassembly 8 has been settled at the top of base 1, and the bottom inboard of second displacement subassembly 8 is provided with paster subassembly 9, the top right side of base 1 is provided with conveyer belt 10, and settling seat 11 is settled in the top outside of conveyer belt 10, docking groove 12 has been seted up to settling seat 11's top inboard, and settling seat 11's inboard is provided with circuit board 13.
Referring to fig. 1 to 7, the first displacement assembly 2 includes a first rotating column 201, a connecting plate 202, a pneumatic control seat 203 and a pneumatic control chuck 204, wherein the connecting plate 202 is connected to two sides of the outer portion of the first rotating column 201, the pneumatic control seat 203 is disposed at the end of the connecting plate 202, the pneumatic control chuck 204 is disposed at the outer side of the top of the pneumatic control seat 203, the pneumatic control seat 203 is communicated with the pneumatic control chuck 204, the pneumatic control chuck 204 and the chip 7 are mutually adsorbed, the feeding assembly 6 includes a feeding pipe 601, a feeding groove 602, a sliding groove 603, a motor 604, a screw 605, a pressing seat 606 and a baffle 607, the feeding groove 602 is disposed at the top end of the left side of the feeding pipe 601, the sliding groove 603 is disposed at the outer side of the right portion of the feeding pipe 601, the motor 604 is connected to the outer end of the right portion of the feeding pipe 601, the screw 605 is connected to the screw 605, the pressing seat 606 is disposed at the outer end of the screw 605, the inner side of the bottom of the feeding pipe 601 is disposed with the baffle 607, the positions of the conveying pipe 601 and the pneumatic sucking discs 204 are in one-to-one correspondence, chips 7 are arrayed in the conveying pipe 601, the second displacement assembly 8 comprises a second rotating column 801, a rotating disc 802, a connecting seat 803, a first electric push rod 804, a lifting seat 805, a butt joint plate 806, a plug head 807 and an air heater 808, the rotating disc 802 is arranged on the outer side of the top of the second rotating column 801, the connecting seats 803 are arranged on two sides of the bottom of the rotating disc 802, the first electric push rod 804 is arranged on the outer side of the bottom of the connecting seat 803, the lifting seat 805 is connected with the bottom of the first electric push rod 804, the butt joint plate 806 is arranged on two sides of the outer side of the lifting seat 805, the plug head 807 is connected with the outer side of the bottom of the butt joint plate 806, the air heater 808 is arranged on the outer side of the top of the lifting seat 805, the patch assembly 9 comprises a second electric push rod 901, a patch seat 902, a suction pump 903, a suction pipe 904, a heat pipe 905, a heat pipe 906, a hot air inlet 907, the solder paste storage tank 908, the solder outlet 909, the tension spring 910, the attached sucker 911, the tension sensor 912, the contact block 913, the first flexible stop 914 and the second flexible stop 915, the outside of the bottom of the second electric push rod 901 is provided with the solder paste seat 902, the inside of the solder paste seat 902 is provided with the suction pump 903, the outer end of the suction pump 903 is connected with the suction pipe 904, the outer end of the solder paste seat 902 is provided with the heat transmission pipe 905, the tail end of the heat transmission pipe 905 is connected with the hot air pipe 906, the inside of the bottom of the solder paste seat 902 is provided with the hot air port 907, the inside of the solder paste seat 902 is provided with the solder paste storage tank 908, the outside of the top of the hot air port 907 is provided with the solder outlet 909, the inside of the solder paste seat 902 is provided with the tension spring 910, the bottom end of the tension spring 910 is connected with an attached sucker 911, a tension sensor 912 is arranged on the outer side of the top of the attached sucker 911, a contact block 913 is arranged on the outer edge of the attached sucker 911, the inner side of the patch seat 902 is connected with a first flexible stop 914, a second flexible stop 915 is arranged on the outer side of the bottom of the first flexible stop 914, the positions of the pneumatic control suckers 204 are in one-to-one correspondence with the positions of the patch seat 902, the patch seat 902 and the circuit board 13 are vertically distributed, the air heater 808 is communicated with the air heater 906 through a heat pipe 905, the air heater 906 is communicated with the air heater 907, the attached sucker 911 and the chip 7 are mutually adsorbed, and the attached sucker 911 is elastically connected with the tension spring 910;
the specific operation is as follows: the working staff or the mechanical gripper can put the chip 7 to be pasted into the conveying pipe 601 from the feeding groove 602, the inner outline size of the conveying pipe 601 is consistent with the outer outline size of the chip 7, the chip 7 can be piled up in the conveying pipe 601, the position of the conveying pipe 601 at the arrangement position of the bottom of the lifting plate 5 is consistent with the position of the arrangement position of all the chips 7 on the circuit board 13, the chip 7 can realize the position positioning of the pasting point in the piling up process, after the chip 7 is piled up, the first rotating column 201 works, the connecting plate 202 can drive the pneumatic control seat 203 to move to the bottom of the lifting plate 5, the sliding seat 4 slides outside the fixed column 3 at the moment, the lifting plate 5 can be driven to move downwards, the conveying pipe 601 can move downwards, the pneumatic control sucking disc 204 moves to the inner side of the lifting plate, the motor 604 drives the screw 605 to rotate at the moment, the pushing seat 606 can slide inside the sliding groove 603, so that the pushing seat 606 can squeeze the chip 7 to pass through the baffle 607, the chip 7 can move to the top end of the pneumatic control sucker 204, the pneumatic control seat 203 works to enable the pneumatic control sucker 204 to generate suction force, the chip 7 can be fixed by the pneumatic control sucker 204, the chip 7 can still keep the positioning of the patch point in the transferring process due to the one-to-one correspondence of the position of the pneumatic control sucker 204 and the conveying pipe 601, after the chip 7 moves to the top end of the pneumatic control sucker 204, the lifting plate 5 moves upwards to enable the conveying pipe 601 to be separated from the pneumatic control sucker 204, the first rotating column 201 rotates at the moment, the pneumatic control seat 203 can drive the pneumatic control sucker 204 to move to the bottom end of the patch seat 902, the first electric push rod 804 works at the moment, the lifting seat 805 can drive the abutting plate 806 to move downwards, the pneumatic control sucker 204 can move to the inner side of the patch seat 902, and the attaching suction cup 911 is made to adhere to the air-controlled suction cup 204, the air-controlled suction cup 204 is made to correspond to the position of the patch seat 902 one by one, which makes the chip 7 move to the inside of the patch seat 902 in a state of keeping the position of the patch point positioned, and the work is suspended by the air-controlled seat 203, the suction force of the air-controlled suction cup 204 can be released, which makes the chip 7 move to adhere to the attaching suction cup 911, at this time, the first electric push rod 804 moves upward, while the second rotating column 801 rotates, makes the patch seat 902 move to the top end of the conveyor belt 10, at this time, the conveyor belt 10 works, makes the placement seat 11 with the circuit board 13 move to the bottom end of the patch seat 902, at this time, the first electric push rod 804 moves downward, makes the patch seat 902 contact with the circuit board 13, the size of the pin head 807 at the bottom end of the abutment plate 806 coincides with the size of the abutment groove 12 at the top of the placement seat 11, by inserting the pin head 807 to the inside of the abutment groove 12, the position accuracy of the patch seat 902 and the circuit board 13 can be ensured, after the patch seat 902 and the circuit board 13 are attached, suction force can be generated in the coverage area of the circuit board 13 by the suction pump 903, impurities adhered on the surface of the circuit board 13 can be cleaned by suction force suction, the conditions of short circuit of the chip 7 and the like caused by interference of the impurities with the chip 7 or the position of the impurities at a welding point in the patch process can be avoided, in addition, the bottom of the patch seat 902 can be gradually changed into vacuum by the suction force, in the suction process, the attached sucker 911 can slide downwards on the inner side of the patch seat 902 due to the influence of the suction force, the chip 7 can be gradually drawn towards the circuit board 13, the attached sucker 911 can be blocked from moving downwards in the sliding process, the suction force is increased by the suction pump 903, the attached sucker 911 can continuously move downwards through the first flexible stopper 914, and is blocked by the second flexible block 915, so that the suction force of the suction pump 903 is increased, at this time, the solder paste in the solder paste storage tank 908 flows out from the solder outlet 909 and is smeared on the solder joint of the circuit board 13 due to the increased suction force, after the solder paste is smeared, the suction force of the suction pump 903 is increased to the maximum, so that the attaching suction cup 911 can pass through the second flexible block 915 to attach the chip 7 to the circuit board 13, and the suction force of the suction pump 903 is increased to the maximum, the air heater 808 also works, so that the hot air can contact with the chip 7 through the heat pipe 905, the hot air pipe 906 and the hot air port 907, under the blowing of the hot air, the solder paste can be melted into the solder liquid and is wrapped on the solder joint of the chip 7 and the circuit board 13, the operation of the air heater 808 is suspended, and the solder liquid is solidified, so that the attaching of the chip 7 and the circuit board 13 is completed, in the above operation, by adopting the suction force, the device can automatically realize the solder paste smeared and the attaching of the chip 7 to the circuit board 13, the sticking difficulty of the equipment can be greatly reduced, in addition, the sticking process is carried out in a closed environment, the interference of the external environment on the sticking process can be reduced, after the sticking is finished, the sticking of the sticking seat 902 and the circuit board 13 can be relieved through the working of the second electric push rod 901, the vacuum environment in the sticking seat 902 can also be relieved, at the moment, the sticking suction cup 911 can rebound along with the tension spring 910 due to the loss of the vacuum suction force, and therefore, the sticking suction cup 911 and the chip 7 absorb each other, the chip 7 already finishes the welding on the circuit board 13, at the moment, the absorption force of the sticking suction cup 911 is equal to the rebound force, no rebound occurs, at the moment, the tension sensor 912 is in a tensile state, the tension sensor 912 can read out the tension value, and if the chip 7 and the circuit board 13 are not welded, the chip 7 can rebound along with the sticking suction cup, this leads to the fact that the tension sensor 912 can't induce the tension value, through above characteristics, and in the use of equipment, only need observe whether tension sensor 912 has the tension value, can easily judge whether current chip 7 welds firmly, and this detection degree of difficulty that can very big reduction equipment.
In summary, when the circuit board chip mounter with automatic impurity removal of welding spots is used, firstly, a worker or a mechanical gripper works to put chips 7 needing to be subjected to chip mounting into the conveying pipe 601 from the feeding groove 602, the inner outline size of the conveying pipe 601 is consistent with the outer outline size of the chips 7, so that the chips 7 can be stacked in the conveying pipe 601, the layout site of the conveying pipe 601 at the bottom of the lifting plate 5 is consistent with the layout site of all the chips 7 on the circuit board 13, the chips 7 can realize the position positioning of the chip mounting points in the stacking process, after the chips 7 are stacked, the first rotating column 201 works to drive the pneumatic control seat 203 to move to the bottom end of the lifting plate 5 by the connecting plate 202, at this time, the sliding seat 4 slides outside the fixed column 3 and can drive the lifting plate 5 to move downwards, so that the conveying pipe 601 can move downwards and the pneumatic suction disc 204 moves to the inner side of the lifting plate, at this time, the motor 604 drives the screw rod 605 to rotate and can enable the pressing seat 606 to slide inside the sliding groove 603, so that the pressing seat 606 can squeeze the chip 7 and enable the chip 7 to pass through the baffle 607, the chip 7 can move to the top end of the pneumatic suction disc 204, at this time, the pneumatic suction disc 203 works to enable the pneumatic suction disc 204 to generate suction force, the chip 7 can be fixed by the pneumatic suction disc 204, and the chip 7 can still keep the position positioning of the patch point in the transferring process due to the one-to-one correspondence between the position of the pneumatic suction disc 204 and the conveying pipe 601;
then, after the chip 7 moves to the top end of the pneumatic chuck 204, the lifting plate 5 moves upwards to separate the material conveying pipe 601 from the pneumatic chuck 204, and at this time, the first rotating column 201 rotates to enable the pneumatic chuck 203 to drive the pneumatic chuck 204 to move to the bottom end of the patch seat 902, and at this time, the first electric push rod 804 works to enable the lifting seat 805 to drive the butt plate 806 to move downwards, so that the pneumatic chuck 204 can move to the inner side of the patch seat 902, and the attaching chuck 911 and the pneumatic chuck 204 absorb, the positions of the pneumatic chuck 204 and the patch seat 902 are in one-to-one correspondence, so that the chip 7 can move to the inside of the patch seat 902 under the state of keeping the position positioning of the patch point, and the operation is suspended by the pneumatic chuck 203, the suction force of the pneumatic suction cup 204 can be relieved, the chip 7 can be moved to be adsorbed by the attaching suction cup 911, the first electric push rod 804 moves upwards at the moment, the second rotating column 801 rotates, the patch seat 902 can be moved to the top end of the conveying belt 10, the conveying belt 10 works at the moment, the placement seat 11 provided with the circuit board 13 can be moved to the bottom end of the patch seat 902, the first electric push rod 804 moves downwards at the moment, the patch seat 902 can be contacted with the circuit board 13, the size of the plug head 807 at the bottom end of the abutting plate 806 is consistent with the size of the abutting groove 12 at the top of the placement seat 11, and the position accuracy of the patch seat 902 and the circuit board 13 can be ensured by inserting the plug head 807 into the inner side of the abutting groove 12;
then, after the bonding of the patch seat 902 and the circuit board 13 is completed, suction force can be generated in the coverage area of the circuit board 13 by the suction pump 903, impurities adhered on the surface of the circuit board 13 can be cleaned by suction force, the conditions of interference between the impurities and the chip 7 in the process of bonding or short circuit of the chip 7 caused by the impurities at the welding point position can be avoided, in addition, the bottom of the patch seat 902 can gradually become vacuum by the suction force, in the process of suction, the attached sucker 911 can slide downwards at the inner side of the patch seat 902 due to the influence of the suction force, the chip 7 can be gradually closed towards the circuit board 13, the attached sucker 911 can be blocked from moving downwards in the process of sliding downwards, at the moment, the suction force is increased by the suction pump 903, the attached sucker 911 can pass through the first flexible stopper 914 to continue moving downwards, the suction force of the suction pump 903 is increased when the solder paste in the solder paste storage tank 908 flows out of the solder outlet 909 due to the increased suction force and is smeared on the welding spot of the circuit board 13, after the solder paste is smeared, the suction force of the suction pump 903 is increased to the maximum, the attached sucking disc 911 can penetrate through the second flexible stop 915 to enable the chip 7 to be attached to the circuit board 13, and after the suction force of the suction pump 903 is increased to the maximum, the air heater 808 also works, so that hot air can contact with the chip 7 through the heat pipe 905, the hot air pipe 906 and the hot air port 907, under the blowing of hot air, the solder paste can be melted into solder liquid and is coated on the welding spot of the chip 7 and the circuit board 13, the air heater 808 pauses working, and the solder liquid is solidified, and the chip of the equipment is finished;
after the patch is finished, the second electric push rod 901 works, so that the bonding between the patch seat 902 and the circuit board 13 is released, the vacuum environment in the patch seat 902 can be released, at the moment, the bonding suction cup 911 can rebound along with the tension spring 910 due to the loss of vacuum suction, and therefore, the bonding suction cup 911 and the chip 7 are adsorbed, the chip 7 is welded on the circuit board 13, at the moment, the adsorption force of the bonding suction cup 911 is equal to the rebound force and rebound can not occur, and at the moment, the tension sensor 912 is in a tensile state, so that the tension sensor 912 can read out the tension value, and if the chip 7 and the circuit board 13 are not welded well, the chip 7 can rebound along with the bonding suction cup 911, so that the tension sensor 912 can not sense the tension value.
The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. The utility model provides an automatic edulcoration's of solder joint circuit board chip mounter, its characterized in that, including base (1), material loading subassembly (6) and paster subassembly (9), the top outside of base (1) is provided with first displacement subassembly (2), and the left side top of base (1) is provided with fixed column (3), the outer end of fixed column (3) is connected with sliding seat (4), and the outer end of sliding seat (4) is provided with lifter plate (5), material loading subassembly (6) settle in the bottom of lifter plate (5), and the inboard of material loading subassembly (6) is settled there is chip (7), second displacement subassembly (8) are settled at the top of base (1), and the bottom inboard of second displacement subassembly (8) is provided with paster subassembly (9), the top right side of base (1) is provided with conveyer belt (10), and settles seat (11) in the top outside of conveyer belt (10), docking groove (12) have been seted up to the top inboard of settling seat (11), and the inboard of settling seat (11) is provided with circuit board (13).
2. The circuit board chip mounter with automatic impurity removal of welding spots according to claim 1, wherein the first displacement assembly (2) comprises a first rotating column (201), a connecting plate (202), an air control seat (203) and an air control sucker (204), the connecting plate (202) is connected to two sides of the outer portion of the first rotating column (201), the air control seat (203) is arranged at the tail end of the connecting plate (202), and the air control sucker (204) is arranged on the outer side of the top of the air control seat (203).
3. The automatic impurity removal circuit board chip mounter for welding spots according to claim 2, wherein the air control seat (203) is communicated with the air control sucker (204), and the air control sucker (204) and the chip (7) are mutually adsorbed.
4. The circuit board chip mounter of automatic edulcoration of solder joint according to claim 2, characterized in that, material loading subassembly (6) include conveying pipeline (601), pan feeding groove (602), spout (603), motor (604), lead screw (605), push down seat (606) and separation blade (607), pan feeding groove (602) has been seted up on the left side top of conveying pipeline (601), and spout (603) has been seted up on the right part outside of conveying pipeline (601), the right part outer end of conveying pipeline (601) is connected with motor (604), and the output of motor (604) is connected with lead screw (605), the outer end of lead screw (605) is provided with pushes down seat (606), separation blade (607) is settled to the bottom inboard of conveying pipeline (601).
5. The automatic impurity removal circuit board chip mounter for welding spots according to claim 4, wherein positions of the material conveying pipes (601) and the pneumatic sucking discs (204) are in one-to-one correspondence, and the chips (7) are arrayed in the material conveying pipes (601).
6. The circuit board chip mounter with automatic impurity removal of welding spots according to claim 2, wherein the second displacement assembly (8) comprises a second rotating column (801), a rotating disc (802), a connecting seat (803), a first electric push rod (804), a lifting seat (805), an abutting plate (806), a plug head (807) and a hot air blower (808), the rotating disc (802) is arranged on the outer side of the top of the second rotating column (801), the connecting seat (803) is arranged on two sides of the bottom of the rotating disc (802), the first electric push rod (804) is arranged on the outer side of the bottom of the connecting seat (803), the lifting seat (805) is connected to the bottom of the first electric push rod (804), the abutting plate (806) is arranged on two sides of the outer side of the lifting seat (805), the plug head (807) is connected to the outer side of the bottom of the abutting plate (806), and the hot air blower (808) is arranged on the outer side of the top of the lifting seat (805).
7. The automatic solder joint impurity removal circuit board chip mounter according to claim 6, wherein the chip mounter (9) comprises a second electric push rod (901), a chip mounting seat (902), a suction pump (903), a suction pipe (904), a heat transmission pipe (905), a hot air pipe (906), a hot air port (907), a solder paste storage tank (908), a solder outlet (909), a tension spring (910), an attaching suction cup (911), a tension sensor (912), a contact block (913), a first flexible stop (914) and a second flexible stop (915), a chip mounting seat (902) is arranged on the outer side of the bottom of the second electric push rod (901), the suction pump (903) is arranged on the inner side of the chip mounting seat (902), the suction pump (903) is connected with the suction pipe (904) at the outer end, the heat transmission pipe (905) is arranged at the outer end of the chip mounting seat (902), the hot air port (907) is arranged on the inner side of the bottom of the chip mounting seat (902), the solder paste storage tank (908) is arranged on the inner side of the solder paste storage tank, the solder paste (908) is arranged on the inner side of the bottom of the chip mounting seat (902), the solder paste (910) is connected with the tension spring (910) at the bottom of the chip mounting seat (902), the top outside of attached sucking disc (911) is provided with pulling force inductor (912), and the outer edge of attached sucking disc (911) is provided with contact block (913), the inboard of paster seat (902) is connected with first flexible dog (914), and the bottom outside of first flexible dog (914) is provided with second flexible dog (915).
8. The automatic impurity removal circuit board mounting machine for welding spots according to claim 7, wherein the positions of the pneumatic control sucking discs (204) are in one-to-one correspondence with the positions of the mounting bases (902), and the mounting bases (902) are vertically distributed with the circuit board (13).
9. The automatic impurity removal circuit board chip mounter for welding spots according to claim 7, wherein said air heater (808) is communicated with a hot air pipe (906) through a heat transmission pipe (905), and the hot air pipe (906) is communicated with a hot air port (907).
10. The automatic impurity removal circuit board chip mounter for welding spots according to claim 7, wherein the attaching suction cup (911) is attached to the chip (7) and the attaching suction cup (911) is elastically connected with the tension spring (910).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310938230.1A CN116669329B (en) | 2023-07-28 | 2023-07-28 | Circuit board chip mounter capable of automatically removing impurities from welding spots |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310938230.1A CN116669329B (en) | 2023-07-28 | 2023-07-28 | Circuit board chip mounter capable of automatically removing impurities from welding spots |
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| Publication Number | Publication Date |
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| CN116669329A true CN116669329A (en) | 2023-08-29 |
| CN116669329B CN116669329B (en) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310938230.1A Active CN116669329B (en) | 2023-07-28 | 2023-07-28 | Circuit board chip mounter capable of automatically removing impurities from welding spots |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018023962A1 (en) * | 2016-08-05 | 2018-02-08 | 深圳瑞波光电子有限公司 | Die bonder and die bonding method |
| CN214901475U (en) * | 2021-04-22 | 2021-11-26 | 苏州鼎政电子科技有限公司 | Efficient chip mounter |
| CN115635158A (en) * | 2022-10-22 | 2023-01-24 | 深圳市铭四海电子科技有限公司 | Automatic assembling equipment for copper-based circuit board for new energy automobile |
| CN218456571U (en) * | 2022-06-17 | 2023-02-07 | 深圳一造鼎焌电子有限公司 | SMT paster processing chip mounter |
-
2023
- 2023-07-28 CN CN202310938230.1A patent/CN116669329B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018023962A1 (en) * | 2016-08-05 | 2018-02-08 | 深圳瑞波光电子有限公司 | Die bonder and die bonding method |
| CN214901475U (en) * | 2021-04-22 | 2021-11-26 | 苏州鼎政电子科技有限公司 | Efficient chip mounter |
| CN218456571U (en) * | 2022-06-17 | 2023-02-07 | 深圳一造鼎焌电子有限公司 | SMT paster processing chip mounter |
| CN115635158A (en) * | 2022-10-22 | 2023-01-24 | 深圳市铭四海电子科技有限公司 | Automatic assembling equipment for copper-based circuit board for new energy automobile |
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| CN116669329B (en) | 2024-01-30 |
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