WO2018023962A1 - Die bonder and die bonding method - Google Patents

Abstract

A die boner and die bonding method. The die boner comprises a material table (1), a suctioning nozzle (2), a heating table (3), a rotary table (4), and a transfer table (5). The material table (1) is used to place dies. The suctioning nozzle (2) is used to suction dies on the material table (1), and attach the dies onto heat sinks. The heating table (3) is used to dispense the heat sinks and a soldering material thereon, and heat the same. The rotary table (4) is arranged below the heating table (3) to support the same to rotate on a plane. The transfer table (5) is arranged below the rotary table (4) to support the rotary table (4) and the heating table (3), and perform, on a plane, a forward, backward, left, or right movement of the heating table (3). The method is employed to increase precision of aligning dies and heat sinks, thereby increasing die bonding quality.

Description

Mounting machine and patching method

[Technical Field]

The present invention relates to the field of semiconductor laser technology, and in particular, to a chip mounter and a patch method.

 【Background technique】

Semiconductor laser (LD, Laser) Due to its small size, high photoelectric conversion efficiency, direct modulation, and wide wavelength range, Diode has become more and more widely used. In general, we often come into contact with high-power single-tube semiconductor laser chip packages including COS (Chip). On Submount), C-mount, F-mount, TO-CAN, etc., where COS is the most common. The production process of COS is mainly divided into two steps, first the patch (die Bond), then wire bond.

The patch is completed by the placement machine. The key to the quality of the patch depends on whether the chip is aligned and parallel with the heat sink. If the electrodes on the chip are not in full contact with the solder and the heat sink and produce a eutectic reaction, the characteristics of the high power semiconductor laser chip are greatly affected.

 [Summary of the Invention]

The technical problem to be solved by the present invention is to provide a chip mounter and a patching method, which can improve the precision of the alignment of the chip and the heat sink, thereby improving the quality of the patch.

In order to solve the above technical problem, a technical solution adopted by the present invention is to provide a placement machine for attaching a chip to a heat sink, including:

a material table for placing the chip;

a nozzle for sucking the chip on the material table, and attaching the chip to the heat sink;

a heating stage for placing and heating the solder on the heat sink and the heat sink;

a rotating table disposed below the heating stage for supporting and rotating the heating stage in a plane; and

A moving table is disposed under the rotating table for supporting the rotating table and the heating table, and moving the heating table back and forth, left and right in a plane.

Wherein the placement machine further comprises a microscope for observing whether the chip is aligned with the edge of the heat sink.

Wherein the placement machine further comprises a moving slide for mounting the microscope, the microscope being movable along the moving slide.

Wherein, the placement machine further comprises a moving handle, the moving handle controls the movement of the mobile station, and the moving ratio of the moving handle to the mobile station is 6:1.

Wherein the placement machine further includes an indexing table disposed between the rotating table and the mobile station, the material table is placed on the indexing table, and the indexing table is used to Or the heating stage moves below the nozzle, causing the nozzle to draw the chip and place the chip on the heat sink.

Wherein, the mobile handle is provided with a button, and the button controls the indexing table to move left and right.

Wherein, the placement machine further comprises a CCD for acquiring an image of the parallelism of the chip and the heat sink, and a display for presenting the image collected by the CCD.

Wherein, the placement machine comprises three sets of CCDs and a display, wherein a set of the CCD and the display are used to observe whether the front light emitting surface of the chip is parallel to the heat sinking surface, and the other two sets of CCDs and displays are used for observing the Whether the side of the chip is parallel to the surface of the heat sink.

Wherein, the placement machine further includes a cantilever, one end of the cantilever swings up and down with the other end of the cantilever as an axis, and the suction nozzle is mounted on one end of the cantilever that swings up and down.

Wherein, the placement machine further includes a weight disposed on the cantilever, and the pressure of the nozzle against the heat sink depends on the position of the weight on the cantilever.

Wherein, the placement machine further comprises a hand lever for operating the cantilever to swing up and down. When the hand lever is fully pressed, the suction nozzle is vacuum-closed, and the chip is separated from the suction of the suction nozzle.

Wherein, the nozzle is made of metal, and the nozzle has a heating function, and a resistance wire is disposed thereon.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a patching method for attaching a chip to a heat sink, including:

Providing a material table on which the chip is placed;

Providing a heating stage on which the heat sink with solder is placed;

Providing a rotary table disposed under the heating stage for supporting the heating stage and rotating the heating stage in a plane;

Providing a mobile station disposed under the rotating table for supporting the rotating table and the heating table, and moving the heating table in a plane to move back and forth, left and right;

Providing a nozzle for sucking the chip on the material table to press the chip down on the heat sink;

Observing the degree of alignment of the edge of the chip with the edge of the heat sink by sucking the chip on the material table through the nozzle and pressing the chip down to the heat sink, operating the mobile station And rotating the table to move or rotate the heating table, thereby adjusting the positional relationship between the chip and the heat sink, so that the edge of the chip is aligned with the edge of the heat sink.

The patching method further includes:

A moving handle is provided, the mobile station is manipulated using the moving handle, and the moving ratio of the moving handle to the mobile station is 6:1.

Wherein, before the step of the nozzle sucking the chip attached to the heat sink, the patch method further comprises:

The height of the material table and the heating station are adjusted to be substantially the same.

Wherein, when the nozzle sucks the chip, the inside of the nozzle maintains a vacuum.

The patching method further includes:

A cantilever is provided, one end of the cantilever swings up and down with the other end of the cantilever as an axis, and the suction nozzle is connected to one end of the cantilever that swings up and down.

The patching method further includes:

A weight is provided on the cantilever, and the nozzle presses the chip under the heat sink to adjust the weight of the weight to the load of the required pressed chip.

The patching method further includes:

A hand lever for operating the cantilever to swing up and down is provided. When the hand lever is fully depressed, the nozzle is vacuum-closed, and the chip is detached from the suction of the nozzle, and the nozzle still presses the chip.

The patching method further includes:

Providing an indexing station disposed between the mobile station and the rotating table, wherein the material table is placed on the indexing table, and the indexing table is configured to move the material table or the heating station to the Below the nozzle, the nozzle sucks the chip and places the chip on the heat sink.

Wherein the solder has a thickness of 3 to 5 microns.

The beneficial effects of the present invention are: different from the prior art, the placement machine of the present invention is provided with a rotary table below the heating table, a mobile station is arranged below the rotary table, and the heating platform is rotated in a plane by the rotary table, thereby Driving the heat sink on the heating table to rotate, and moving the heating table to move back and forth in a plane in the plane by the moving table, thereby driving the heat sink on the heating table to move left and right, moving left and right, and adjusting the rotation and movement of the heat sink through the rotating table and the moving table The edge and the front end of the heat sink are respectively aligned with the edge and the front end of the chip on the nozzle, thereby improving the precision of alignment of the chip with the heat sink, thereby improving the quality of the patch.

 [Description of the Drawings]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Other drawings may also be obtained from those of ordinary skill in the art in light of the inventive work.

1 is a schematic structural view of a placement machine according to an embodiment of the present invention;

2 is a schematic side view showing the structure of a placement machine according to an embodiment of the present invention;

3 is a schematic structural view of a placement machine according to another embodiment of the present invention;

4 is a schematic side view showing the structure of a placement machine according to an embodiment of the present invention;

5 is a schematic structural view of an angular displacement table of a placement machine according to an embodiment of the present invention;

6 is a schematic view of a patching method of attaching a chip to a heat sink according to still another embodiment of the present invention.

【detailed description】

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

As shown in FIG. 1 and FIG. 2, an embodiment of the present invention provides a chip mounter for attaching a chip to a heat sink, wherein the chip may be a chip of a high power semiconductor laser, such as a single chip or a bare chip. Bar and the like, wherein the placement machine of the embodiment of the present invention comprises: a material table 1, a suction nozzle 2, a heating table 3, a rotary table 4 and a moving table 5, wherein the chip is placed on the material table 1, and the heating table 3 For placing and heating the solder on the heat sink and the heat sink, a heater 18 may be disposed to be connected to the heating stage 3 for heating the heat sink. In this embodiment, a pulse heater may be employed. It is also possible to provide a heat sink and a chip for protecting the reaction by the protective gas 19, and the protective gas 19 may be an inert gas such as nitrogen. The nozzle 2 is used for sucking the chip on the material table 1 and attaching the chip to the heat sink, and the upper surface of the material table 1 and the upper surface of the heat sink on the heating table 3 are set to be the same height or the height. In order to facilitate the adsorption and placement of the chip by the nozzle 2.

The rotary table 4 is disposed below the heating stage 3 for supporting the heating stage 3, and the rotary table 4 is rotatable in a plane, for example, rotating in a plane in which the upper surface of the rotary table 4 is located, and the rotary table 4 is fixedly connected to the heating stage 3. The heating table 3 can rotate with the rotation of the rotating table 4, thereby driving the heat sink on the heating table 3 to rotate; the moving table 5 is disposed below the rotating table 4, and is connected with the rotating table 4 for supporting the rotating table 4 and the heating table 3. The mobile station 5 can move back and forth, left and right in a plane, for example, moving forward and backward in the plane where the upper surface of the mobile station 5 is located, and the mobile station 5 drives the rotating table 4 and the heating station 3 to move back and forth, left and right, and the material table. 1 can also be set on the mobile station 5, and move forward and backward, left and right with the mobile station 5 in synchronization. In the embodiment of the present invention, the plane on which the rotary table 4 rotates is parallel to the plane in which the mobile station 5 moves forward, backward, left, and right.

The mobile station 5 can be a manually rotated micrometer-type X, Y platform structure or a motor-driven X, Y platform structure.

The placement machine of the embodiment of the present invention is provided with a rotary table 4 below the heating table 3, and a moving table 5 is disposed below the rotary table 4, and the heating platform is rotated in a plane by the rotary table 4, thereby driving the heat on the heating table 3. The rotation is performed, and the heating table 3 is moved forward and backward in a plane by the moving table 5, thereby driving the heat sink on the heating table 3 to move back and forth, left and right; when the nozzle 2 sucks the chip from the material table 1, and the chip When the belt is placed above the heat sink near the heat sink, the rotation and movement of the heat sink are adjusted by the rotating table 4 and the moving table 5, so that the edge and the front end of the heat sink are respectively aligned with the edge and the front end of the chip on the nozzle 2, thereby improving the chip. The accuracy of alignment with the heat sink, which in turn improves the quality of the patch.

The placement machine of the embodiment of the present invention includes a microscope 6 disposed above the heating table 3 for observing whether the chip is aligned with the edge of the heat sink. When the chip and the heat sink are aligned, the microscope 6 is observed. In conjunction with the rotation and movement of the heat sink by the rotating table 4 and the moving table 5, the chip can be directly aligned with the end face of the heat sink; in the embodiment of the present invention, the angle between the chip and the heat sink is controlled at 90°±0.75°. Within the range, the amount of protrusion of the chip end face relative to the heat sink end face is controlled within a range of 0 to 10 μm. The microscope 6 can be a stereo microscope 6 , and the alignment of the chip with the end face of the heat sink can be clearly seen by using the stereo microscope 6 .

The placement machine of the embodiment of the present invention includes a moving slide rail 7. The microscope 6 is mounted on the moving slide rail 7, and can be moved on the moving slide rail 7. The microscope 6 can be moved by installing the moving slide rail 7, which is convenient for expanding. The observation range of the microscope 6 improves the accuracy of the patch. Wherein, the moving slide rail 7 can be disposed in parallel with the front light exiting surface of the chip.

As shown in FIG. 3 and FIG. 4, in another embodiment of the present invention, the placement machine further includes an angular displacement stage 25 disposed between the mobile station 5 and the heating stage 3, and the angular displacement stage 25 can be Rotating with respect to the plane of the heating table 3 as the moving table 5 moves back and forth, left and right, so that the heating table 3 rotates relative to the plane in which the front and rear sides move, thereby adjusting the front light emitting surface of the chip (FF, Front facet) Parallelism to the surface of the heat sink.

5, the angular stage 25 includes a base portion 251 and a rotating portion 252. The base portion 251 is provided with an arcuate groove 253. The bottom surface of the rotating portion 252 is matched with the curved groove 253, and the rotating portion 252 can be curved. The groove 253 rotates along the curved surface.

In this embodiment, by providing an angular stage 25 between the heating stage 3 and the moving table 5, the angular stage 25 can be rotated relative to the plane in which the heating stage 3 moves forward and backward, and the nozzle 2 sucks the chip from the material table 1. When the chip is brought to the heat sink and close to the heat sink, if the front light emitting surface of the chip is not parallel to the surface of the heat sink, then the angular stage 25 can be rotated to adjust the angular stage 25 to drive the heating table 3. The heat sink rotates, so that the surface of the heat sink is parallel to the front light exit surface of the chip, thereby improving the quality of the patch.

Wherein, the angular stage 25 can be disposed between the rotating table 4 and the moving table 5, and the alignment between the edge of the chip and the edge of the heat sink is adjusted by the rotating table 4 and the moving table 5, and the front light emitting surface and the heat of the chip are adjusted through the angular stage 25 The parallelism of the surface is raised to improve the quality of the patch.

Wherein, a mirror (not shown) may be disposed on the material table 1, and the front light-emitting surface of the chip may be determined by the mirror; before the nozzle 2 draws the chip from the material table 1, the chip is placed on the mirror, so that The nozzle 2 is lowered close to the chip, and the chip on the animal table 1 is slightly moved by the movement of the moving table 5, so that the edge of the chip is aligned with the edge of the nozzle, and the front end of the chip is aligned with the front end of the nozzle 2. The suction nozzle 2 presses down the suction chip, then raises the suction nozzle 2 slightly, observes the position of the front light exit surface and the rear light exit surface of the chip through the mirror, and then places the chip on the heat sink of the heating stage 3 through the suction nozzle 2.

The placement machine includes a CCD 11 for acquiring an image of the parallelism between the chip and the heat sink, and a display 12 for presenting an image collected by the CCD 11, and the CCD 11 is connected to the display 12. By setting the CCD 11 and the display 12, the parallelism between the chip and the heat sink can be visually observed, which is convenient for the operator to adjust.

The placement machine of the embodiment of the present invention includes three sets of CCD 11 and a display 12, wherein a set of CCD 11 and display 12 are used to observe whether the front light exit surface of the chip is parallel to the heat sink surface, and the other two sets of CCD 11 and display 12 respectively It is used to observe whether the side of the chip is parallel to the surface of the heat sink.

In the embodiment of the present invention, each CCD 11 may further include a lens barrel group (not shown) coupled thereto, wherein the lens barrel group includes one or more lenses.

It should be noted that the CCD 11 , the display 12 and the lens barrel structure in this embodiment can be interchanged with the stereo microscope 6 , that is, the combination of the CCD 11 , the display 12 and the lens barrel group can perform similar functions with the stereo microscope 6 . In the placement machine, any one of the structural forms can be used to complete the corresponding observation task, and those skilled in the art can select according to the specific design requirements, and details are not described herein again.

The mounting machine further includes a cantilever 13 . One end of the cantilever 13 swings up and down with the other end of the cantilever 13 as an axis, and the suction nozzle 2 is attached to one end of the cantilever 13 that swings up and down. When the material table 1 is switched to the lower side of the suction nozzle 2, the suction nozzle 2 swings downward with the cantilever 13 to press the chip, and the vacuum 21 of the suction nozzle 2 is opened to cause the suction nozzle 2 to suck the chip, at which time the cantilever 13 swings upward, so that The suction nozzle 2 leaves the material table 1, and then the heating table 3 is switched to the lower side of the suction nozzle 2, and the control cantilever 13 drives the suction nozzle 2 to swing downward to the heat sink of the chip near the heating table 3.

The placement machine further includes a weight 14 disposed on the cantilever 13 , and the weight 14 is movable on the cantilever 13 . By adjusting the position of the weight 14 on the cantilever 13 , the nozzle 2 can be adjusted to be pressed down to the heating table 3 . When the chip on the nozzle 2 is pressed against the heat sink. A pressure sensor 23 can be connected to the heating stage 3 for sensing the magnitude of the pressure received by the heating stage 3.

Wherein, the placement machine further includes a hand lever 15 for operating the cantilever 13 to swing up and down. The hand lever 15 is electrically connected to the cantilever 13 and controls the up and down swing of the cantilever 13 by pressing or lifting the hand lever 15 when the hand lever 15 is completely When depressed, the vacuum 21 of the nozzle 2 is closed to disengage the chip from the nozzle 2.

Of course, in other embodiments, the placement machine can also be vertically up and down, that is, the nozzle is not mounted on the cantilever, and the cantilever is rotated around a fixed axis, but is mounted on a vertical upper and lower mechanism, and the nozzle can be vertical. Move up and down.

In another embodiment of the present invention, when the placement machine is the above-described cantilever type placement machine including the cantilever 13, the placement machine further includes an elevation platform 24 disposed between the heating stage 3 and the mobile station 5. Specifically, the lifting table 24 may be disposed between the rotating table 4 and the angular stage 25, and the lifting table 24 may be vertically raised or lowered to adjust the height of the heating stage 3.

Since the suction nozzle 2 swings with the other end of the cantilever 13 as the axis of the cantilever 13, the swing of the suction nozzle 2 is not vertically up and down, but is swung in an arc, so the chip sucked on the suction nozzle 2 As the swing of the nozzle 2 also oscillates in an arc, when the chip swings to a different position with the nozzle 2, the angle between the side of the chip and the horizontal plane also changes, that is, when the chip is at a different height, the chip The angle between the side and the horizontal plane will also be different. According to this situation, in the embodiment of the present invention, the lifting platform 24 is disposed below the heating platform 3. When the suction nozzle 2 adsorbs the chip close to the heat sink, the CCD 11 collects and observes through the display 12 whether the side surface of the chip is parallel with the surface of the heat sink. Non-parallel, according to the inclination of the side of the chip and the surface of the heat sink, the lifting platform 24 is adjusted, and the height of the heat sink on the heating table 3 is adjusted by the lifting platform 24, thereby adjusting the height of the position where the chip contacts the heat sink, because at different heights The degree of tilt of the chip is different, so that the side of the chip is parallel to the surface of the heat sink when the chip is in contact with the heat sink by adjusting the height of the position where the chip is in contact with the heat sink.

In the present embodiment, by providing the lifting table 24 between the heating table 3 and the moving table 5, the height of the heat sink on the heating table 3 is adjusted by the lifting table 24, so that the side of the chip and the heat sink when the heat sink contacts the chip. The surfaces are kept parallel, which improves the quality of the patch. The placement machine of the embodiment of the present invention may further include a moving handle 8 electrically connected to the motor-driven X, Y platform structure mobile station 5 for controlling the movement of the mobile station 5, the mobile station 5 and The movement of the moving handle 8 is synchronized, and the moving ratio of the moving handle 8 to the moving table 5 is 6:1. It can be understood that in other embodiments, the moving handle 8 and the mobile station can be specifically set according to the size of the chip and the manual operation habits. The movement ratio of 5 is not limited to 6:1. Of course, it is within the understanding of those skilled in the art that when the mobile station 5 is a manually rotated micrometer-type X, Y platform structure, it is not necessary to provide the structure of the moving handle 8.

The placement machine of the embodiment of the present invention further includes an indexing table 9 disposed between the angular stage 25 and the mobile station 5. The material table 1 is placed on the indexing table 9, and the indexing table 9 is used for material The stage 1 or the heating stage 3 is moved below the suction nozzle 2, so that the suction nozzle 2 sucks the chip and places the chip on the heat sink.

The indexing table 9 is disposed on the mobile station 5, and can move synchronously with the movement of the mobile station 5, and the indexing table 9 can be moved on the mobile station 5, and the material table 1 and the angular stage 25 are respectively placed on the indexing table 9 Above, the movement of the indexing table 9 on the mobile station 5 causes the material table 1 and the heating table 3 to switch back and forth under the suction nozzle 2, that is, when the heating table 3 is under the suction nozzle 2, the indexing table 9 is placed on the mobile station 5 moves once, at which time the material table 1 will move to the lower side of the suction nozzle 2 with the movement of the indexing table 9; when the material table 1 is under the suction nozzle 2, the indexing table 9 is moved once on the mobile station 5, At this time, the heating stage 3 will move to the lower side of the suction nozzle 2 as the indexing table 9 moves; this facilitates the suction nozzle 2 to suck the chip from the material table 1, and place the chip on the heating stage 3.

Preferably, the indexing table 9 of the embodiment of the present invention can be driven by a pneumatic type, a manual slide type, and a motor rail type.

The pneumatic structure can be controlled to move by the pneumatic device 22; the pneumatic device 22 can be a cylinder or the like; the manual slide rail structure can include a slider and a rail structure, and the slider is disposed on the rail, and is pushed by hand or manually. The slider moves to achieve the purpose of changing the position of the indexing table. The motor rail structure of the indexing table may include a driving motor (not shown) rail and a slider (or a fixed seat) structure, and the driving motor drives the indexing table to move through the structure of the rail slider and the like, and the same can be changed. The purpose of the indexing station position.

Correspondingly, the moving handle 8 can also be provided with a button 10 for controlling the movement of the indexing table 9. It can be understood that the button 10 is an indexing table structure with an automatic control function corresponding to a pneumatic or motor rail type. The indexing table 9 is moved once by pressing the button 10; the illustration of the embodiment only shows the configuration of the pneumatic indexing table, that is, the button 10 is connected to the pneumatic device 22. In the illustration of other embodiments, the button 10 can be coupled to a structure such as a drive motor, and is beyond the scope of those skilled in the art and will not be described in detail herein.

In the embodiment of the present invention, a nozzle rotating shaft 17 may be disposed on the nozzle 2, so that the nozzle 2 is rotatably mounted on the cantilever 13; the nozzle 2 is set to be rotatable, which is beneficial to the nozzle 2 and the chip. And the alignment of the chip with the heat sink.

The nozzle 2 can also be arranged in a heatable structure, and the nozzle 2 is connected to the nozzle 2 to heat the nozzle 2, thereby heating the chip sucked by the nozzle 2, which is beneficial to the eutectic soldering of the chip and the heat sink. Temperature control. Specifically, in the embodiment of the present invention, the suction nozzle 2 is made of a metal material, and a resistance wire is disposed on the suction nozzle 2 to heat the suction nozzle 2. It can be understood that the suction nozzle 2 can also be made of a heat insulating material, and when the suction nozzle 2 is a heat insulating material, the suction nozzle 2 can be not heated.

It should be noted that each functional station (heating station 3, rotating table 4, lifting table 24, angular stage 25, indexing table 9, mobile station 5, etc.) included in the present embodiment can be posted by a person skilled in the art. The function requirements of the chip machine are arranged in part or in whole, and are not limited to the arrangement form in the embodiment, and other changes should be within the spirit of the protection of the present invention.

The specific use flow of the placement machine of the embodiment of the present invention is:

(1) adjusting the material table 1 so that the surface height of the material table 1 is almost flush with the surface height of the heating table 3;

(2) Pressing the button 10 on the moving handle 8 causes the indexing table 9 to switch the heating table 3 under the nozzle 2 (or manually change the position of the indexing table 9);

(3) fully pressing the handle bar 15 so that the cantilever 13 presses the suction nozzle 2 down onto the heating table 3, and the pressure sensor 23 feeds back the load and displays it on the control panel 20;

(4) releasing the hand lever 15 to raise the suction nozzle 2;

(5) adjusting the position of the weight 14 on the cantilever 13, repeating the operations of (2) to (4) to achieve the required load;

(6) placing the chip on the material table 1;

(7) using a stereo microscope 6 (or a combined structure of the CCD 11, the display 12, and the lens barrel) to observe and place the heat sink on which the solder has been pre-formed on the heating stage 3 and fix it;

(8) Press the button 10 on the moving handle 8, Having the indexing table 9 switch the material table 1 under the suction nozzle 2 (or manually change the position of the indexing table 9);

(9) rotating the nozzle rotating shaft 17 to the size of the nozzle 2 suitable for the chip;

(10) pressing the handle bar 15 to bring the nozzle 2 close to the edge of the chip;

(11) Observing with the microscope 6 (or a combination of the CCD 11, the display 12, and the lens barrel), using the moving handle 8 to move the mobile station 5 (or by manually rotating the micrometer-type X, Y platform structure), so that the chip and the nozzle 2 edges are flush;

(12) Observing with the microscope 6 (or the combined structure of the CCD 11, the display 12 and the lens barrel), using the moving handle 8 to move the mobile station 5 to make the chip flush with the front end of the nozzle 2;

(13) pressing the handle bar 15 to press the cantilever 13 down onto the chip, When the hand lever 15 is pressed down, the suction nozzle 2 will open the vacuum 21, and after sucking the chip, the hand lever 15 will be released, and the suction nozzle 2 will automatically rise;

(14) Pressing the button 10 on the moving handle 8 to switch the heating stage 3 to the lower side of the nozzle 2;

(15) pressing the handle bar 15 to close the suction nozzle 2 of the sucked chip to the heat sink;

(16) using the microscope 6 (or a combination of the CCD 11, the display 12, and the lens barrel) to observe whether the front end of the chip is flush with the front end of the heat sink;

(17) adjusting the rotary table 4 so that the front end and the edge of the chip are flush with the front end of the heat sink;

(18) Control the moving handle 8 to move the moving platform, and observe with the microscope 6 (or the combined structure of the CCD 11, the display 12 and the lens barrel), Control the position of the chip and the amount of protrusion at the front end of the chip;

(19) acquiring an image by using the CCD 11 and observing the parallelism between the front light emitting surface of the chip and the surface of the heat sink through the display 12 (or using a stereo microscope);

(20) adjusting the angular stage 25 to make the front light emitting surface of the chip parallel to the surface of the heat sink;

(21) acquiring an image by using the CCD 11, and observing the parallelism of the side of the chip and the surface of the heat sink through the display 12 (or using a stereo microscope);

(22) adjusting the lifting table 24 such that the side of the chip is parallel to the surface of the heat sink;

(23) After the adjustment is completed, the hand lever 15 is completely depressed, and the vacuum 2 of the nozzle 2 is closed at this time;

(24) heating the heating table 3 to heat the solder and eutectic soldering the chip to perform patching;

(25) After the solder is cooled, the hand lever 15 is released to raise the suction nozzle 2;

(26) The packaged product on the heating stage 3 is removed.

Compared with the prior art, the placement machine provided by the embodiment of the present invention sets a rotary table below the heating table, and a mobile station is arranged below the rotary table, and the heating platform is rotated in a plane through the rotary table, thereby driving the heating table. The heat sink rotates, and the heating table moves the heating table back and forth, left and right in a plane, thereby driving the heat sink on the heating table to move left and right and left and right; and also rotating and moving the heat sink through the rotating table and the moving table to make the heat The edge and the front end of the sink are respectively aligned with the edge and the front end of the chip on the nozzle, and an indexing table is arranged between the rotary table and the mobile station, so that the position of the heating table and the material table can be conveniently and quickly switched; An angular displacement table is arranged between the mobile station and the movable platform. The angular displacement table can be rotated relative to the plane in which the heating table moves forward and backward, and when the nozzle sucks the chip from the material table and brings the chip to the heat sink near the heat sink. If the front light-emitting surface of the chip is not parallel to the surface of the heat sink, then the angular stage can be rotated to adjust the angular displacement stage to drive the heat sink on the heating stage to rotate. The heat sink surface is parallel to the front light exit surface of the chip; further, a lifting platform is further disposed between the mobile station and the heating station for adjusting the height of the heating station; the above functional table structures can improve the precision of the alignment of the chip and the heat sink To improve the quality of the patch.

As shown in FIG. 6, another embodiment of the present invention provides a patching method for attaching a chip to a heat sink, and the method includes:

Step S101: providing a material table, placing the chip on the material table;

Step S102: providing a heating station, placing a heat sink with solder on the heating table;

Step S103: providing a rotating table disposed under the heating table for supporting the heating station and rotating the heating table in a plane;

Step S104: providing a mobile station, disposed under the rotating table, for supporting the rotating table and the heating station, and moving the heating table in front, rear, left and right in a plane;

Step S105: providing a nozzle, sucking the chip on the material table and pressing the chip on the heat sink;

Step S106: sucking the chip on the material table through the suction nozzle and pressing the chip down to the heat sink, observing the alignment degree of the edge of the chip and the edge of the heat sink, operating the moving table and the rotating table to move or rotate the heating table, and then Adjust the positional relationship between the chip and the heat sink so that the edge of the chip is aligned with the edge of the heat sink.

The placement machine according to the embodiment of the present invention is provided with a rotary table below the heating stage, and a moving table is arranged below the rotary table, and the heating platform is rotated in a plane by the rotary table, thereby driving the heat sink on the heating table to rotate, and passing through the mobile station The heating table is moved forward and backward in a plane, thereby driving the heat sink on the heating table to move left and right; when the nozzle sucks the chip from the material table and brings the chip to the heat sink near the heat sink, by rotating The table and the mobile station adjust the rotation and movement of the heat sink so that the edge and the front end of the heat sink are respectively aligned with the edge and the front end of the chip on the nozzle, thereby improving the precision of the alignment of the chip and the heat sink, thereby improving the quality of the patch.

The patching method of the embodiment of the present invention further includes: providing a moving handle, and using the moving handle to control the mobile station, and the moving ratio of the moving handle to the mobile station is 6:1.

The patching method of the embodiment of the present invention further includes: before the step of attaching the nozzle to the heat sink;

Adjust the height of the material table and the heating table to be approximately the same.

Wherein, when the nozzle sucks the chip, the inside of the nozzle maintains a vacuum.

The patching method of the embodiment of the present invention further includes: providing a cantilever, one end of the cantilever swings up and down with the other end of the cantilever as an axis, and the nozzle is connected to one end of the cantilever that swings up and down.

The patching method of the embodiment of the present invention further includes: providing a weight on the cantilever, and pressing the chip under the heat sink to adjust the weight of the weight to the load of the required pressed chip.

The patching method of the embodiment of the present invention further includes: providing a hand lever for operating the cantilever to swing up and down. When the hand lever is fully pressed, the nozzle is vacuum-closed, and the chip is detached from the suction nozzle, and the nozzle still presses the chip.

The patching method of the embodiment of the present invention further includes: providing an indexing table between the mobile station and the rotating table, wherein the material table is placed on the indexing table, and the indexing table is used to move the material table or the heating table to Below the nozzle, the nozzle sucks the chip and places the chip on the heat sink.

Among them, the thickness of the solder is 3 to 5 μm.

The patching method of the embodiment of the present invention can be implemented by the chip mounter of the above embodiment. For details, refer to the content of the above embodiment, and details are not described herein.

The above is only the embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Any equivalent structure or equivalent process transformation made by using the specification and the drawings of the present invention, or directly or indirectly applied to other related The technical field is equally included in the scope of patent protection of the present invention.

Claims (20)

1. A placement machine for attaching a chip to a heat sink, comprising:

   a material table for placing the chip;

   a nozzle for sucking the chip on the material table, and attaching the chip to the heat sink;

   a heating stage for placing and heating the solder on the heat sink and the heat sink;

   a rotating table disposed below the heating stage for supporting and rotating the heating stage in a plane; and

   A moving table is disposed under the rotating table for supporting the rotating table and the heating table, and moving the heating table back and forth, left and right in a plane.
2. The chip mounter of claim 1 further comprising a microscope for viewing whether said chip is aligned with a heat sink edge.
3. The chip mounter according to claim 2, further comprising a moving slide for mounting the microscope, the microscope being movable along the moving slide.
4. The placement machine according to claim 1, further comprising a pneumatic indexing table disposed between the rotary table and the mobile station, wherein the material table is placed on the pneumatic indexing table. The pneumatic indexing table is configured to move the material table or the heating table below the nozzle, so that the nozzle sucks the chip and places the chip on the heat sink.
5. The placement machine of claim 1 further comprising a CCD for acquiring an image of the chip parallel to the heat sink, and a display for presenting an image captured by the CCD.
6. The chip mounter according to claim 5, comprising three sets of CCDs and a display, wherein a set of said CCDs and displays are used to observe whether a front light emitting surface of the chip is parallel to said heat sinking surface, and the other two The group CCD and the display are used to observe whether the side of the chip is parallel to the surface of the heat sink.
7. The chip mounter according to claim 1, further comprising a cantilever, one end of the cantilever swings up and down with the other end of the cantilever as an axis, and the nozzle is mounted on the up and down swing of the cantilever One end.
8. A chip mounter according to claim 7, further comprising a weight disposed on said cantilever, said pressure of said nozzle against said heat sink being dependent on said weight on said cantilever s position.
9. The chip mounter according to claim 1, wherein the nozzle is made of metal, and the nozzle has a heating function, and a resistance wire is disposed thereon.
10. A placement machine for attaching a chip to a heat sink, comprising:

    a material table for placing the chip;

    a nozzle for sucking the chip on the material table, and attaching the chip to the heat sink;

    a heating stage for placing and heating the solder on the heat sink and the heat sink;

    a rotating table disposed under the heating stage for supporting and rotating the heating stage in a plane;

    a moving table disposed under the rotating table for supporting the rotating table and the heating table, and moving the heating table in a plane to move back and forth, left and right;

    a manual slide type indexing table is disposed between the rotary table and the mobile station, and the material table is placed on the manual slide type indexing table, and the manual slide type indexing table is used for The material table or the heating stage is moved below the nozzle such that the nozzle picks up the chip and places the chip on the heat sink.
11. A patching method for attaching a chip to a heat sink, comprising:

    Providing a material table on which the chip is placed;

    Providing a heating stage on which the heat sink with solder is placed;

    Providing a rotary table disposed under the heating stage for supporting the heating stage and rotating the heating stage in a plane;

    Providing a mobile station disposed under the rotating table for supporting the rotating table and the heating table, and moving the heating table in a plane to move back and forth, left and right;

    Providing a nozzle, sucking the chip on the material table and pressing the chip down on the heat sink;

    Observing the degree of alignment of the edge of the chip with the edge of the heat sink by sucking the chip on the material table through the nozzle and pressing the chip down to the heat sink, operating the mobile station And rotating the table to move or rotate the heating table, thereby adjusting the positional relationship between the chip and the heat sink, so that the edge of the chip is aligned with the edge of the heat sink.
12. The patching method according to claim 11, further comprising:

    A moving handle is provided, the mobile station is manipulated using the moving handle, and the moving ratio of the moving handle to the mobile station is 6:1.
13. The patching method according to claim 11, wherein before the step of sucking the chip attached to the heat sink, the method further comprises:

    The height of the material table and the heating station are adjusted to be substantially the same.
14. The patching method according to claim 11, wherein a vacuum is maintained inside the nozzle when the nozzle sucks the chip.
15. The patching method according to claim 11, further comprising:

    A cantilever is provided, one end of the cantilever swings up and down with the other end of the cantilever as an axis, and the suction nozzle is connected to one end of the cantilever that swings up and down.
16. The patching method according to claim 15, further comprising:

    A weight is provided on the cantilever, and the nozzle presses the chip under the heat sink to adjust the weight of the weight to the load of the required pressed chip.
17. The patching method according to claim 15 or 16, further comprising:

    A hand lever for operating the cantilever to swing up and down is provided, and when the hand lever is fully depressed, the nozzle is vacuum-closed, and the chip is detached from the suction of the nozzle.
18. The patching method according to claim 11, further comprising:

    Providing an indexing station disposed between the mobile station and the rotating table, wherein the material table is placed on the indexing table, and the indexing table is configured to move the material table or the heating station to the Below the nozzle, the nozzle sucks the chip and places the chip on the heat sink.
19. The patching method according to claim 11, wherein the solder has a thickness of 3 to 5 μm.
20. The patching method according to claim 18, wherein the indexing table is a pneumatic indexing table, a manual sliding type indexing table or a motor rail type indexing table.