CN113517208A - Manual eutectic chip mounting device, system and method - Google Patents
Manual eutectic chip mounting device, system and method Download PDFInfo
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- CN113517208A CN113517208A CN202110790873.7A CN202110790873A CN113517208A CN 113517208 A CN113517208 A CN 113517208A CN 202110790873 A CN202110790873 A CN 202110790873A CN 113517208 A CN113517208 A CN 113517208A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/752—Protection means against electrical discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
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Abstract
The invention relates to the field of eutectic paster, and particularly discloses a manual eutectic paster device, a system and a method, wherein the manual eutectic paster device comprises a preheating chamber and an eutectic chamber which are arranged in parallel; the preheating chamber is internally provided with a preheating platform and a first heating unit for heating the preheating platform, and the eutectic chamber is internally provided with an eutectic platform and a second heating unit for heating the eutectic platform; the preheating chamber is provided with a first nitrogen injection unit for injecting nitrogen into the preheating platform, and the eutectic chamber is provided with a second nitrogen injection unit for injecting nitrogen into the eutectic platform. The invention aims to provide a manual eutectic chip mounting device with a simple structure, which solves the technical problem that a full-automatic chip mounter is complex in structure on one hand, solves the technical problem that eutectic chips are poor in quality on the other hand, and provides a solution for the production problem of chips with small batches and multiple varieties.
Description
Technical Field
The invention relates to the field of eutectic paster, and particularly discloses a manual eutectic paster device, a manual eutectic paster system and a manual eutectic paster method.
Background
The eutectic chip mounting process is to form a welding layer by metal alloy welding flux and weld a chip on a corresponding carrier.
At present, although a full-automatic chip mounter is mature and widely applied, the full-automatic chip mounter is complex in structure and high in cost, and has no advantages when meeting the eutectic chip mounting requirements of small-batch and multi-variety chips. In addition, the temperature of the conventional eutectic chip device is unstable when the eutectic chip device is used for chip mounting, and the quality of the eutectic chip device cannot be completely guaranteed.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a manual eutectic die attach device with a simple structure, which solves the technical problem of complex structure of a full-automatic die attach machine, and solves the technical problem of poor quality of eutectic die attach, and provides a solution for the production of small-lot and multi-variety chips.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, the invention provides a manual eutectic chip device, which comprises a preheating chamber and an eutectic chamber which are arranged in parallel; the preheating chamber is internally provided with a preheating platform and a first heating unit for heating the preheating platform, and the eutectic chamber is internally provided with an eutectic platform and a second heating unit for heating the eutectic platform; the preheating chamber is provided with a first nitrogen injection unit for injecting nitrogen into the preheating platform, and the eutectic chamber is provided with a second nitrogen injection unit for injecting nitrogen into the eutectic platform.
Optionally, the preheating chamber includes a heating bin, a vertical through heating port is arranged at the top of the heating bin, and the preheating platform is arranged in the heating port.
Optionally, the first nitrogen injection unit comprises an air shower plate and a nitrogen injection plate which are connected to the heating bin and sequentially arranged; the air shower plate covers the upper part of the preheating platform, and the air shower plate and the heating bin enclose to form a nitrogen spraying space with an opening on the side surface; a first nitrogen injection port is formed in the surface, away from the air shower plate, of the nitrogen injection plate, and a nitrogen flow distribution space communicated with the first nitrogen injection port is formed in the surface, facing the air shower plate, of the nitrogen injection plate; and the air shower plate is provided with a plurality of shower holes so that the nitrogen shower space is communicated with the nitrogen shunting space.
Optionally, the top of the eutectic chamber has an operation port that runs through vertically, the eutectic platform is located below the operation port, the second nitrogen injection unit is a second nitrogen injection port disposed on a side wall of the eutectic chamber, and a horizontal position of the second nitrogen injection port is lower than a horizontal position of the eutectic platform.
In order to facilitate operation, a lifting tray is arranged on the side wall of the eutectic chamber.
In a second aspect, the invention further provides a manual eutectic die bonding system, which comprises the manual eutectic die bonding device, a controller and a first temperature control system electrically connected with the controller;
first temperature control system for control the temperature to preheating the platform, include:
the first temperature detection module is used for detecting the temperature of the preheating platform;
the first signal processing module is used for receiving the temperature signal detected by the first temperature detection module, performing analog-to-digital conversion processing on the temperature signal and sending a processed digital signal to the controller;
the first temperature control solid-state relay is electrically connected with the first heating unit;
the controller is used for judging whether the temperature of the preheating platform exceeds a first preset threshold value according to the digital signal sent by the first signal processing module, and controlling the first temperature control solid-state relay to cut off the power supply of the first heating unit if the temperature of the preheating platform exceeds the first preset threshold value.
Optionally, a first safety system electrically connected to the controller;
the first safety system is used for carrying out overtemperature protection on the preheating platform and comprises:
the second temperature detection module is used for detecting the temperature of the preheating platform;
the second signal processing module is used for receiving the temperature signal detected by the second temperature detection module, performing analog-to-digital conversion processing on the temperature signal and sending a processed digital signal to the controller;
the first protection solid-state relay is electrically connected with the first temperature control solid-state relay through the alternating current contactor;
the controller is further used for judging whether the temperature of the preheating platform exceeds a second preset threshold value according to the digital signal sent by the second temperature detection module, and controlling the first protection solid-state relay to cut off the power supply of the first heating unit if the temperature of the preheating platform exceeds the second preset threshold value.
Optionally, the system further comprises a second temperature control system and a second safety system, the second temperature control system and the second safety system are electrically connected with the controller, the second temperature control system is used for controlling the temperature of the eutectic platform, and the second safety system is used for performing over-temperature protection on the eutectic platform.
Optionally, the system further comprises an upper computer electrically connected with the controller, and the temperature information acquired by the controller is stored in the upper computer.
In a third aspect, the invention further provides a manual eutectic die bonding method, which comprises the following steps:
1) providing a preheating chamber and an eutectic chamber, arranging a preheating platform in the preheating chamber, and arranging an eutectic platform in the eutectic chamber;
2) placing the chip on a preheating platform, heating the preheating platform, and injecting nitrogen into a preheating chamber to enable the chip to be in a nitrogen environment;
3) acquiring temperature information of the preheating platform, and transferring the chip to the eutectic platform when the temperature value of the preheating platform reaches a preset value;
4) heating the eutectic platform to perform eutectic, and injecting nitrogen into the eutectic chamber to enable the chip to be in a nitrogen environment;
5) and acquiring temperature information of the eutectic platform, and stopping heating the eutectic platform when the temperature value of the eutectic platform exceeds a preset value.
The beneficial effect of this scheme lies in:
firstly, the manual eutectic chip mounting device is simple in structure, and the nitrogen protection is provided in the chip preheating and eutectic chip mounting processes, so that the eutectic chip mounting quality can be improved;
secondly, a first temperature control system and a first safety system arranged in the manual eutectic chip mounting system can ensure the temperature stability;
thirdly, two groups of thermocouples are used in the heating unit in the manual eutectic chip mounting system, so that the isolation of temperature control and over-temperature protection is realized, and the safety of the eutectic chip mounting table is effectively ensured;
fourthly, the manual eutectic paster system has a visual sound-light alarm function;
fifthly, the manual eutectic chip mounting system can inquire historical data through the upper computer, and is beneficial to fault detection and maintenance.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention may be realized and attained by the means of the instrumentalities and combinations particularly pointed out hereinafter.
Drawings
FIG. 1 is a schematic perspective view of a manual eutectic die attach device in an embodiment;
FIG. 2 is a schematic top view of the structure of FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a schematic view of a partial structure of a preheating chamber and a eutectic chamber in the embodiment;
FIG. 5 is a schematic perspective view of an embodiment of the air shower plate;
FIG. 6 is a schematic perspective view of an exemplary pre-heating stage;
FIG. 7 is a schematic perspective view of an embodiment of a eutectic platform;
FIG. 8 is a schematic perspective view of an embodiment of a hand tray;
FIG. 9 is a schematic perspective view of a first heating unit in the embodiment;
FIG. 10 is a schematic front view of the structure of FIG. 9;
FIG. 11 is a schematic cross-sectional view taken along line B-B of FIG. 10;
FIG. 12 is a schematic diagram of a frame of a manual eutectic die attach system in an embodiment;
FIG. 13 is a block diagram of a controller, a first temperature control system, and a first safety system according to an embodiment;
fig. 14 is a schematic flow chart of a manual eutectic die attach method in an embodiment.
The drawings are numbered as follows:
a base plate 100; the preheating device comprises a preheating chamber 200, a preheating platform 210, a groove 211, a material taking and placing port 212, a first heating unit 220, a heating bracket 221, a first mounting table 222, a heating bin 230, a heating port 231, an air shower plate 240, a first support plate 241, a second support plate 242, a third support plate 243, a spraying hole 243a, a nitrogen injection plate 250 and a first nitrogen injection port 251; the eutectic chamber 300, the operation opening 301, the second nitrogen injection opening 302, the eutectic platform 310, the pin slot 311, the second heating unit 320, the hand tray 330, the H-shaped fixing support 331, the T-shaped lifting support 332, the sliding slot 332a, the disc-shaped tray 333 and the adjusting bolt 334; a controller 400; the temperature control system comprises a first temperature control system 500, a second temperature control system 500', a first temperature detection module 510, a first signal processing module 520, a first temperature control solid state relay 530 and a heating rod 540; a first safety system 600, a second safety system 600', a second temperature detection module 610, a second signal processing module 620, a protective solid-state relay 630, an alternating current contactor 640 and an audible and visual alarm 650; and an upper computer 700.
Detailed Description
The following is further detailed by way of specific embodiments:
as shown in fig. 1 and 3, the manual eutectic die mounting system includes a manual eutectic die mounting device, which includes a base plate 100, wherein a preheating chamber 200 and a eutectic chamber 300 are arranged on the base plate 100 in parallel; the preheating chamber 200 is provided with a preheating platform 210 and a first heating unit 220 for heating the preheating platform 210, and the eutectic chamber 300 is provided with a eutectic platform 310 and a second heating unit 320 for heating the eutectic platform 310; the preheating chamber 200 is provided with a first nitrogen gas injection unit for injecting nitrogen gas into the preheating stage 210, and the eutectic chamber 300 is provided with a second nitrogen gas injection unit for injecting nitrogen gas into the eutectic stage 310. In the present application, the bottom plate 100 is a common bottom plate of the preheating chamber 200 and the eutectic chamber 300, so that the structure is more compact, the manufacturing and installation are more convenient, and the integration level is better.
As shown in fig. 1-6, the preheating chamber 200 includes a heating chamber 230, the heating chamber 230 is a box structure, a vertically through heating port 231 is disposed at the top of the heating chamber 230, and the preheating platform 210 is disposed at the heating port 231. The first heating unit 220 is disposed in the heating chamber 230 and attached to the preheating stage 210, so as to heat the preheating stage 210.
The preheating stage 210 is used for preheating the chip. The preheating platform 210 is provided with a groove 211 capable of accommodating a chip carrying plate, one side of the groove 211 is open, and a material taking and placing opening 212 is arranged at the opening of the groove 211. The chip is placed on the chip carrying plate when preheating, the chip carrying plate is placed in the groove 211, and the material taking and placing port 212 is arranged to facilitate taking and placing the chip carrying plate through tools such as tweezers.
Preferably, as shown in fig. 9 to 11, the first heating unit 220 includes a heating bracket 221 and a first mounting table 222 fixed to the heating bracket 221, and the first mounting table 222 passes through the heating opening 231 to be attached to the preheating stage 210 under the support of the heating bracket 221. The first mounting platform 222 and the preheating platform 210 are made of a heat conducting material (e.g., a copper material with good heat conductivity), and a heating rod 540, a first temperature detection module 510, and a second temperature detection module 610 are disposed on the first mounting platform 222. During heating, the heating temperature of the heating rod 540 is conducted to the preheating platform 210 through the first mounting platform 222, and the preheating platform 210 transfers the heating temperature to the chip thereon, so as to complete preheating of the chip. In this embodiment, the upper surface of the preheat stage 210 extends beyond the heater bin 230.
The first nitrogen injection unit comprises an air shower plate 240 and a nitrogen injection plate 250 which are connected to the heating bin 230 and are arranged in sequence; the air shower plate 240 covers the preheating platform 210, and the air shower plate 240 and the heating bin 230 enclose to form a nitrogen spraying space with an opening on the side surface; a first nitrogen injection port 251 is arranged on the surface of the nitrogen injection plate 250, which is far away from the air shower plate 240, and a nitrogen distribution space communicated with the first nitrogen injection port 251 is arranged on the surface of the nitrogen injection plate 250, which is far towards the air shower plate 240; the air shower plate 240 is provided with a plurality of shower holes 243a so that the nitrogen gas shower space is communicated with the nitrogen gas diversion space. Specifically, the method comprises the following steps:
the air shower plate 240 comprises a first support plate 241, a second support plate 242 and a third support plate 243, wherein the first support plate 241 and the second support plate 242 are vertically arranged in a crossed mode, the third support plate 243 is transversely covered on the first support plate 241 and the second support plate 242, the spraying holes 243a are formed in the third support plate 243, the preheating platform 210 is located below the third support plate 243 in the nitrogen spraying space, and nitrogen air shower can be continuously provided for the preheating platform 210. The opening direction of the nitrogen spraying space faces the eutectic chamber, and the operation is convenient.
The nitrogen injection plate 250 includes a top plate having a shape adapted to the third strip 243, and side plates extending from edges of the top plate toward the third strip 243, the first nitrogen injection port 251 is disposed on the top plate, the side plates are connected to edges of the third strip 243, and the top plate, the side plates, and the third strip 243 surround to form the nitrogen gas diversion space.
As shown in fig. 1 to 4, in this embodiment, the top of the eutectic chamber 300 has an operation port 301 penetrating vertically, the second heating unit is disposed in the eutectic chamber 300 for supporting and heating the eutectic platform 310, and the eutectic platform 310 is located below the operation port 301, so that a worker can conveniently perform eutectic bonding through the operation port 301. The second nitrogen injection unit is a second nitrogen injection port 302 disposed on a sidewall of the eutectic chamber 300, and a level of the second nitrogen injection port 302 is lower than a level of the eutectic platform 310. Preferably, the second nitrogen injection port 302 is disposed at the bottom of the sidewall of the eutectic chamber 300, so that nitrogen gas continuously flows through the chip from bottom to top after being injected into the eutectic chamber 300, thereby maximally protecting the chip. Specifically, the method comprises the following steps:
the second heating unit 320 and the first heating unit 220 have the same structure, the second mounting platform 322 of the second heating unit 320 and the eutectic platform 310 are both made of a heat-conducting material (for example, made of a copper material with good heat conductivity), and the upper surface of the second mounting platform 322 is attached to the lower surface of the eutectic platform 310.
As shown in fig. 7, the eutectic platform 310 is used for eutectic attachment of a chip. The eutectic platform 310 is provided with pin slots 311 corresponding to different chip pins for placing the pins of different models of dual in-line circuits, and in this embodiment, the number of the pin slots 311 is three, so the eutectic platform 310 can perform eutectic die attach to the dual in-line circuits and the flat package circuits, and the application range of the eutectic die attach table is widened.
As shown in fig. 8, preferably, a lifting/lowering tray 330 is further disposed on a side wall of the eutectic chamber 300, so as to provide support for an operator's hand and facilitate operation. The liftable tray hand tray 330 comprises an H-shaped fixing support 331, a T-shaped lifting support 332, a disc-shaped tray 333 and an adjusting bolt 334, the disc-shaped tray 333 is fixed on the T-shaped lifting support 332, a sliding groove 332a is formed in the T-shaped lifting support 332, the adjusting bolt 334 penetrates through the sliding groove 332a to be connected onto the H-shaped fixing support 331, the H-shaped fixing support 331 is fixed on the side wall of the eutectic chamber 300, when the tray 333 needs to be lifted, the adjusting bolt 334 is loosened, and after the T-shaped lifting support 332 is moved in place, the adjusting bolt 334 is screwed.
As shown in fig. 12, the manual eutectic die system further includes a controller 400, a first temperature control system 500 electrically connected to the controller 400, and a first safety system 600. In this embodiment, the preheat stage 210 and the eutectic stage 310 operate at different temperatures, and therefore both have the same temperature control system and the same safety system, but are independent of each other, i.e., the preheat stage 210 corresponds to the first temperature control system 500 and the first safety system 600, and the eutectic stage 310 corresponds to the second temperature control system 500 'and the second safety system 600'. The first temperature control system 500 and the first safety system 600 corresponding to the preheat stage 210 are identical in structure and principle to the second temperature control system 500 'and the second safety system 600' corresponding to the eutectic stage 310, and therefore the first temperature control system 500 and the first safety system 600 of the preheat stage 210 will be explained below.
As shown in fig. 13, the first temperature control system 500 is used for controlling the temperature of the preheating stage 210, and the first temperature control system 500 includes a first temperature detection module 510, a first signal processing module 520, and a first temperature-controlled solid-state relay 530.
The first temperature detection module 510 is configured to detect a temperature of the preheating stage 210; the first signal processing module 520 is configured to receive the temperature signal detected by the first temperature detecting module 510, perform analog/digital conversion processing, and send a processed digital signal to the controller 400; a first temperature controlled solid state relay 530 is electrically connected to the first heating unit 220. The controller 400 is configured to determine whether the temperature of the preheating platform 210 exceeds a first preset threshold according to the digital signal sent by the first signal processing module 520, and if the temperature exceeds the first preset threshold, control the first temperature-controlled solid-state relay 530 to cut off the power supply of the first heating unit 220.
The first safety system 600 is used for performing over-temperature protection on the preheating platform 210, and the first safety system 600 includes a second temperature detection module 610, a second signal processing module 620 and a first protective solid-state relay 630.
The second temperature detecting module 610 is used for detecting the temperature of the preheating stage 210. The second signal processing module 620 is configured to receive the temperature signal detected by the second temperature detecting module 610, perform analog/digital conversion processing, and send a processed digital signal to the controller 400. The first protective solid state relay 630 is electrically connected to the first temperature controlled solid state relay 530 via an ac contactor 640. The controller 400 is further configured to determine whether the temperature of the preheating stage 210 exceeds a second preset threshold according to the digital signal sent by the second temperature detection module 610, and if the temperature exceeds the second preset threshold, control the first protective solid-state relay 630 to cut off the power supply of the first heating unit 220.
In this embodiment, the first temperature detection module 510 and the second temperature detection module 610 are both thermocouples and are used for collecting temperature data; the first signal processing module 520 and the second signal processing module 620 are both MAX6675 modules, convert the temperature data acquired by the first temperature detection module 510 and the second temperature detection module 610 into digital signals, and feed back to the controller 400 respectively; the controller 400 is an arduino mega2560 controller for controlling the first temperature control system 500 and the first safety system 600; the first temperature-control solid-state relay 530 can control the on-off of the power supply of the heating rod 540 according to the instruction sent by the controller 400, so as to achieve the purpose of controlling the temperature; the ac contactor 640 is located at the front ends of the first temperature-control and temperature-control solid-state relay 530 and the heating rod 540, and can cut off a power supply of a heating loop when the eutectic surface mount platform is out of control due to over temperature, so as to achieve a protection effect.
In this embodiment, the first safety system 600 further includes an audible and visual alarm 650 electrically connected to the controller 400, for providing an audible and visual indication when the temperature value of the preheating platform 210 exceeds a preset value.
The manual eutectic die bonding system further includes an upper computer 700 electrically connected to the controller 400, and the temperature information acquired by the controller 400 is stored in the upper computer 700. When a fault occurs or maintenance is carried out, historical temperature information in the upper computer 700 can be inquired, a fault element is judged, and the fault element is replaced in time. In this embodiment, the upper computer 700 may implement real-time temperature display, historical data query, and eutectic die attach table control through communication with the controller 400.
During operation of the manual eutectic chip mounting system, the chip is firstly placed on the chip carrying plate, then the chip carrying plate is placed in the groove 211 on the preheating platform 210, the first installation platform 222 is heated through the heating rod 540 on the first heating unit 220, and as the first installation platform 222 is attached to the preheating platform 210 and made of a heat conducting material, the first installation platform 222 conducts heat to the preheating platform 210 to preheat the chip. Meanwhile, the first nitrogen injection port 251 is communicated with a nitrogen source, so that the nitrogen passes through the nitrogen injection plate 250 and the air shower plate 240, and then the air shower protection is continuously performed on the chip.
The first temperature detection module 510 obtains temperature information of the preheating platform 210, and when the temperature value of the preheating platform 210 reaches a preset value, the chip carrying plate is clamped by using tweezers from the material taking and placing port 212 on the preheating platform 210, and the chip is transferred to the eutectic platform.
The pins of the chip are inserted into the pin slots 311, the lower surface of the chip is attached to the upper surface of the eutectic platform 310, and then the eutectic platform 310 is heated by the second heating unit 320 for eutectic, and the heating principle is the same as that of the first heating unit 220 for heating the preheating platform 210. Meanwhile, the second nitrogen injection port 302 is communicated with a nitrogen source, nitrogen enters the eutectic chamber 300 through the second nitrogen injection port 302, and the atmosphere in the eutectic chamber 300 is extruded out from the operation port 301 at the top of the eutectic chamber 300, so that the chip is continuously protected.
In the eutectic process, the temperature information of the eutectic platform 310 is obtained by using the temperature detection module in the second temperature control system 500' of the eutectic platform, and when the temperature value of the eutectic platform 310 exceeds a preset value, the controller 400 sends an instruction to control the on/off of the power supply of the heating rod to stop heating the eutectic platform 310. Meanwhile, the controller 400 sends a signal to the audible and visual alarm to make the audible and visual alarm perform audible and visual prompt.
In the eutectic die bonding operation, an operator can place a hand on the tray 330 and can adjust the height of the tray 330.
As shown in fig. 14, the present application further discloses a manual eutectic die bonding method, which can be implemented by the above manual eutectic die bonding system, and includes the following steps:
s1, providing a preheating chamber 200 and an eutectic chamber 300, arranging a preheating platform 210 in the preheating chamber 200, and arranging an eutectic platform 310 in the eutectic chamber;
s2, placing the chip on the preheating platform 210, heating the preheating platform 210, and injecting nitrogen into the preheating chamber 200 to make the chip in nitrogen environment;
s3, acquiring temperature information of the preheating platform 210, and transferring the chip to the eutectic platform 310 when the temperature value of the preheating platform 210 reaches a preset value;
s4, heating the eutectic platform 310 to perform eutectic, and injecting nitrogen into the eutectic chamber 300 to enable the chip to be in a nitrogen environment;
and S5, acquiring temperature information of the eutectic platform 310, and stopping heating the eutectic platform 310 when the temperature value of the eutectic platform 310 exceeds a preset value.
In other embodiments, further comprising:
and S6, emitting an audible and visual alarm signal when the temperature value of the eutectic platform 310 exceeds a preset value.
In other embodiments, step S3 further includes: when the temperature value of the preheating platform 210 exceeds the preset value, the preheating platform 210 is stopped from being heated.
The foregoing is merely an example of the present invention and common general knowledge of known specific structures and features of the embodiments is not described herein in any greater detail. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the present invention.
Claims (10)
1. The utility model provides a manual eutectic paster device which characterized in that: comprises a preheating chamber (200) and a eutectic chamber (300) which are arranged in parallel; the preheating chamber (200) is internally provided with a preheating platform (210) and a first heating unit (220) for heating the preheating platform (210), and the eutectic chamber (300) is internally provided with an eutectic platform (310) and a second heating unit (320) for heating the eutectic platform (310); the preheating chamber (200) is provided with a first nitrogen injection unit for injecting nitrogen into the preheating platform (210), and the eutectic chamber (300) is provided with a second nitrogen injection unit for injecting nitrogen into the eutectic platform (310).
2. The manual eutectic die attach device of claim 1, wherein: the preheating chamber (200) comprises a heating bin (230), a vertically through heating port (231) is formed in the top of the heating bin (230), and the preheating platform (210) is arranged at the heating port (231).
3. The manual eutectic die attach device of claim 2, wherein: the first nitrogen injection unit comprises an air shower plate (240) and a nitrogen injection plate (250) which are connected to the heating bin (230) and are sequentially arranged; the air shower plate (240) covers the preheating platform (210), and the air shower plate (240) and the heating bin (230) enclose to form a nitrogen spraying space with an opening on the side surface; a first nitrogen injection port (251) is formed in the surface, away from the air shower plate (240), of the nitrogen injection plate (250), and a nitrogen distribution space communicated with the first nitrogen injection port (251) is formed in the surface, facing the air shower plate (240), of the nitrogen injection plate (250); the air shower plate (240) is provided with a plurality of spray holes (243a) so that the nitrogen spray space is communicated with the nitrogen diversion space.
4. The manual eutectic die attach device of claim 1, wherein: the top of eutectic room (300) has vertical through-going operation mouth (301), eutectic platform (310) are located the below of operation mouth (301), the second nitrogen injection unit is for setting up second nitrogen injection mouth (302) on the lateral wall of eutectic room (300), the level of second nitrogen injection mouth (302) is less than the level of eutectic platform (310).
5. The manual eutectic die attach device of claim 1, wherein: a lifting hand tray (330) is arranged on the side wall of the eutectic chamber (300).
6. A manual eutectic die attach system, comprising the manual eutectic die attach apparatus of any one of claims 1 to 5, further comprising a controller (400), a first temperature control system (500) electrically connected to the controller (400);
the first temperature control system (500) is used for controlling the temperature of the preheating platform (210), and comprises:
a first temperature detection module (510) for detecting a temperature of the preheat platform (210);
the first signal processing module (520) is used for receiving the temperature signal detected by the first temperature detection module (510), performing analog-to-digital conversion processing, and sending the processed digital signal to the controller (400);
a first temperature controlled solid state relay (530) electrically connected to the first heating unit (220);
the controller (400) is used for judging whether the temperature of the preheating platform (210) exceeds a first preset threshold value according to the digital signal sent by the first signal processing module (520), and controlling the first temperature control solid-state relay (530) to cut off the power supply of the first heating unit (220) if the temperature of the preheating platform (210) exceeds the first preset threshold value.
7. The manual eutectic die system of claim 6, further comprising a first security system (600) electrically connected to the controller (400);
the first safety system (600) is used for protecting the preheating platform (210) from overtemperature, and comprises:
a second temperature detection module (610) for detecting the temperature of the preheating platform (210);
the second signal processing module (620) is used for receiving the temperature signal detected by the second temperature detection module (610), performing analog-to-digital conversion processing, and sending the processed digital signal to the controller (400);
a first protective solid state relay (630) electrically connected to the first temperature controlled solid state relay (530) via an ac contactor (640);
the controller (400) is further configured to determine whether the temperature of the preheating platform (210) exceeds a second preset threshold according to the digital signal sent by the second temperature detection module (610), and control the first protective solid-state relay (630) to cut off the power supply of the first heating unit (220) if the temperature exceeds the second preset threshold.
8. The manual eutectic patch system of claim 6 or 7, wherein: the system further comprises a second temperature control system (500 ') and a second safety system (600 '), wherein the second temperature control system (500 ') is electrically connected with the controller (400), the second temperature control system (500 ') is used for controlling the temperature of the eutectic platform (310), and the second safety system (600 ') is used for overtemperature protection of the eutectic platform (310).
9. The manual eutectic patch system of claim 6 or 7, wherein: the temperature control device is characterized by further comprising an upper computer (700) electrically connected with the controller (400), wherein the temperature information acquired by the controller (400) is stored in the upper computer (700).
10. A manual eutectic die bonding method is characterized by comprising the following steps:
1) providing a preheating chamber and an eutectic chamber, arranging a preheating platform in the preheating chamber, and arranging an eutectic platform in the eutectic chamber;
2) placing the chip on a preheating platform, heating the preheating platform, and injecting nitrogen into a preheating chamber to enable the chip to be in a nitrogen environment;
3) acquiring temperature information of the preheating platform, and transferring the chip to the eutectic platform when the temperature value of the preheating platform reaches a preset value;
4) heating the eutectic platform to perform eutectic, and injecting nitrogen into the eutectic chamber to enable the chip to be in a nitrogen environment;
5) and acquiring temperature information of the eutectic platform, and stopping heating the eutectic platform when the temperature value of the eutectic platform exceeds a preset value.
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| CN113517208B (en) | 2022-06-03 |
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