CN116652179B - 一种钨铜合金复合材料及其制备工艺 - Google Patents
一种钨铜合金复合材料及其制备工艺 Download PDFInfo
- Publication number
- CN116652179B CN116652179B CN202310937474.8A CN202310937474A CN116652179B CN 116652179 B CN116652179 B CN 116652179B CN 202310937474 A CN202310937474 A CN 202310937474A CN 116652179 B CN116652179 B CN 116652179B
- Authority
- CN
- China
- Prior art keywords
- tungsten
- powder
- tungsten powder
- stirring
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 44
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 73
- 238000009713 electroplating Methods 0.000 claims abstract description 33
- 239000000843 powder Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000005245 sintering Methods 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 19
- 238000000137 annealing Methods 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 15
- 238000005098 hot rolling Methods 0.000 claims abstract description 13
- 238000000748 compression moulding Methods 0.000 claims abstract description 11
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 11
- 239000004094 surface-active agent Substances 0.000 claims abstract description 10
- 239000001257 hydrogen Substances 0.000 claims abstract description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 6
- 230000007935 neutral effect Effects 0.000 claims abstract description 5
- 238000005406 washing Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 58
- 239000000243 solution Substances 0.000 claims description 33
- 238000003756 stirring Methods 0.000 claims description 20
- 239000011259 mixed solution Substances 0.000 claims description 14
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 10
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 10
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 10
- 239000001119 stannous chloride Substances 0.000 claims description 10
- 235000011150 stannous chloride Nutrition 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 8
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 7
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 7
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 7
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000001509 sodium citrate Substances 0.000 claims description 7
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 7
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 7
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 7
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 7
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 7
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 7
- 229940038773 trisodium citrate Drugs 0.000 claims description 7
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- ZPIRTVJRHUMMOI-UHFFFAOYSA-N octoxybenzene Chemical compound CCCCCCCCOC1=CC=CC=C1 ZPIRTVJRHUMMOI-UHFFFAOYSA-N 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 229960004418 trolamine Drugs 0.000 claims description 4
- 238000007514 turning Methods 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 16
- 239000010949 copper Substances 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 12
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910052759 nickel Inorganic materials 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 2
- 238000000280 densification Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 239000002563 ionic surfactant Substances 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- MTJGVAJYTOXFJH-UHFFFAOYSA-N 3-aminonaphthalene-1,5-disulfonic acid Chemical compound C1=CC=C(S(O)(=O)=O)C2=CC(N)=CC(S(O)(=O)=O)=C21 MTJGVAJYTOXFJH-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1035—Liquid phase sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
- C22C32/0063—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on SiC
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
- B22F2003/185—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers by hot rolling, below sintering temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Powder Metallurgy (AREA)
Abstract
本发明公开了一种钨铜合金复合材料及其制备工艺，属于金属加工技术领域，制备工艺，包括如下步骤：S1、钨粉处理：钨粉化学镀镍，得到预处理钨粉；将预处理钨粉加入电镀液中进行搅拌‑电镀，重复搅拌‑电镀过程10次，将得到的粉体水洗至中性，真空干燥，得到复合粉体；电镀液中包括纳米碳化硅、表面活性剂；S2、将复合粉体与铜粉混合，压制成型；S3、烧结，烧结气氛为氢气；S4、多道次热轧和退火。本发明中的钨粉处理后有利于降低材料的热膨胀系数，提高材料的热导率多道次热轧工艺可提高板材组织致密化程度，可有效地消除铜相富集区以及孔洞等缺陷，使铜相在合金内部形成致密的网络状组织结构。
Description
技术领域
本发明属于金属加工技术领域，具体涉及一种钨铜合金复合材料及其制备工艺。
背景技术
钨铜合金是钨和铜组成的合金。常用合金的含铜量为10%～50%。合金用粉末冶金方法制取，具有很好的导电导热性，较好的高温强度和一定的塑性。在很高的温度下，如3000℃以上，合金中的铜被液化蒸发，大量吸收热量，降低材料表面温度。所以这类材料也称为金属发汗材料。钨铜复合材料是以钨、铜元素为主组成的一种两相结构假合金，是金属基复合材料。由于金属铜和钨物性差异较大，因此不能采用熔铸法进行生产，一般采用粉末合金技术进行生产。
钨铜合金有较广泛的用途，其中一大部分应用于航天、航空、电子、电力、冶金、机械、体育器材等行业。其次也要用来制造抗电弧烧蚀的高压电器开关的触头和火箭喷管喉衬、尾舵等高温构件，也用作电加工的电极、高温模具以及其他要求导电导热性能和高温使用的场合。钨和铜的熔点、密度相差较大且互不相溶，现有的制备钨铜热沉和封装材料的工艺有：混合法、熔渗法、纳米复合粉烧结法等，混合法生产出的钨铜合金密度偏低，仅有理论密度的95%，导电和导热性能均不良，在致密化、组分及微观组织的均匀性、致密化、形状和尺寸控制等方面都难以兼顾。
发明内容
本发明的目的在于提供一种钨铜合金复合材料及其制备工艺，以解决钨铜合金密度偏低的问题。
本发明的目的可以通过以下技术方案实现：
一种钨铜合金复合材料的制备工艺，包括如下步骤：
S1、钨粉处理：钨粉化学镀镍，得到预处理钨粉；将预处理钨粉加入电镀液中进行搅拌-电镀：电镀3min后关闭电源，搅拌1min，重复搅拌-电镀过程10次，将得到的粉体水洗至中性，真空干燥，得到复合粉体；电镀液中纳米碳化硅10-15g/L、表面活性剂0.3-0.4g/L；其中，纳米碳化硅的粒度为50-60nm。
S2、将复合粉体与铜粉混合，压制成型；
S3、烧结，烧结气氛为氢气；
S4、多道次热轧和退火。
进一步地，电镀温度为50℃；电流密度为1.8-2A/m2。
进一步地，表面活性剂为十二烷基硫酸钠和聚乙二醇辛基苯基醚按照质量比2.5：1混合而成。本发明中选择离子表面活性剂和非离子表面活性剂混合作为分散剂，离子表面活性剂可在纳米碳化硅表面形成电荷形成双电层，通过电荷作用相互排斥而不易团聚，非离子表面活性剂对纳米碳化硅的润湿、分散效果增强‚单一的离子表面活性剂会吸附在纳米碳化硅表面，解离出相反电荷抑制分散。
进一步地，钨粉化学镀镍，包括如下步骤：
将钨粉和盐酸溶液搅拌混合12h得到粗化钨粉；将粗化钨粉加入氯化亚锡和盐酸的混合液中，搅拌5min得到敏化钨粉；将敏化钨粉加入氯化钯和盐酸的混合液中，搅拌50min得到活化钨粉；将活化钨粉加入镀液中保持温度为40℃，搅拌20min，得到预处理钨粉；其中，镀液组成包括焦磷酸钠、三乙醇胺、柠檬酸三钠、次磷酸钠和硫酸镍。
盐酸溶液的质量分数为3%，钨粉和盐酸溶液的用量比为1g：10mL；氯化亚锡和盐酸的混合液中氯化亚锡的浓度为20g/L，盐酸的质量分数为5%；氯化钯和盐酸的混合液中氯化钯的浓度为0.5g/L，盐酸的质量分数为1%；镀液中焦磷酸钠的浓度为55g/L、三乙醇胺的浓度为90g/L、柠檬酸三钠的浓度为7g/L、次磷酸钠的浓度为40g/L和硫酸镍的浓度为40g/L；其中，钨粉粒径为2-3μm。
进一步地，S2中复合粉体与铜粉的用量质量比为70-90：10-30。
进一步地，S2中压制成型的压强为100-200MPa，压坯厚度2-20mm。
进一步地，S3中烧结温度为1100-1200℃，烧结时间为60-70min。
进一步地，S4中多道次热过程中轧制温度为700-800℃，多道次热轧至厚度为0.2-0.5mm。
进一步地，S4中退火温度为800-1000℃，退火时间为30-60min。
一种钨铜合金复合材料由上述制备工艺制备而成。
本发明的有益效果：
本发明选用化学镀镍在钨粉表面进行氧化还原反应得到预处理钨粉，预处理钨粉表面以金属镍为基质，通过搅拌-电镀的方式在预处理钨粉表面电镀碳化硅，在钨粉表面电镀形成复合镀层，一方面碳化硅组分的引入有利于降低材料的热膨胀系数，提高材料的热导率，进一步改善材料的使用性能，另一方面，碳化硅纳米粒子的引入，提高了钨粉表面的硬度和粗糙度，起到强化弥散的作用，金属钨、镍和碳化硅的熔点均高于铜，在烧结过程中铜颗粒熔化，熔融状态的铜会快速地进入材料空隙，快速填充完毕，让致密度进一步增大进而提高钨铜合金强度。每个钨颗粒都以更密集的结构被包裹在铜网状结构中，这时会形成最好的增强效果，钨铜颗粒不仅有更致密的结构，还可以均匀的分布，不易发生偏聚现象。
多道次热轧工艺可提高板材组织致密化程度，可有效地消除铜相富集区以及孔洞等缺陷，使铜相在合金内部形成致密的网络状组织结构。本发明制备的钨铜合金具有较高的密度、良好的导热、导电性、低的热膨胀系数，适用于大功率器件封装的材料。
具体实施方式
下面将结合本发明实施例，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
以下实施例中提到的密度、热导率、热膨胀系数的检测方法具体标准如下所示：
密度测试方法：标准号：GB/T1423-1996，标准名称：贵金属及其合金密度的测试方法。
热导率测试方法：采用激光闪射法测定，仪器为激光导热系数测量仪，型号为LFA447NanoFlash（购自德国耐驰仪器制造有限公司）。
热膨胀系数测试方法：标准号：GBT4339-2008，标准名称：金属材料热膨胀特征参数的测定。
实施例1
本实施例提供一种钨粉处理过程：
将1g钨粉和10mL盐酸溶液搅拌混合12h得到粗化钨粉；将粗化钨粉加入氯化亚锡和盐酸的混合液中，搅拌5min得到敏化钨粉；将敏化钨粉加入氯化钯和盐酸的混合液中，搅拌50min得到活化钨粉；将活化钨粉加入镀液中保持温度为40℃，搅拌20min，得到预处理钨粉；其中，镀液组成包括焦磷酸钠、三乙醇胺、柠檬酸三钠、次磷酸钠和硫酸镍。盐酸溶液的质量分数为3%；氯化亚锡和盐酸的混合液中氯化亚锡的浓度为20g/L，盐酸的质量分数为5%；氯化钯和盐酸的混合液中氯化钯的浓度为0.5g/L，盐酸的质量分数为1%；镀液中焦磷酸钠的浓度为55g/L、三乙醇胺的浓度为90g/L、柠檬酸三钠的浓度为7g/L、次磷酸钠的浓度为40g/L和硫酸镍的浓度为40g/L；其中，钨粉粒径为2-3μm。
钨粉化学镀镍，得到预处理钨粉；将预处理钨粉加入电镀液中进行搅拌-电镀：电镀3min后关闭电源，搅拌1min，重复搅拌-电镀过程10次，将得到的粉体水洗至中性，真空干燥，得到复合粉体；电镀液中纳米碳化硅10g/L、表面活性剂0.3g/L。其中，纳米碳化硅的粒度为50-60nm。电镀温度为50℃，加入硼酸和硫酸调节pH值为4；电流密度为1.8A/m2。表面活性剂为十二烷基硫酸钠和聚乙二醇辛基苯基醚按照质量比2.5：1混合而成。硼酸起到缓冲剂的作用，在水中会解离出氢离子，对电镀液的pH起到缓冲作用，提高电镀液的稳定性。
实施例2
本实施例提供一种钨粉处理过程：
将钨粉和盐酸溶液搅拌混合12h得到粗化钨粉；将粗化钨粉加入氯化亚锡和盐酸的混合液中，搅拌5min得到敏化钨粉；将敏化钨粉加入氯化钯和盐酸的混合液中，搅拌50min得到活化钨粉；将活化钨粉加入镀液中保持温度为40℃，搅拌20min，得到预处理钨粉；其中，镀液组成包括焦磷酸钠、三乙醇胺、柠檬酸三钠、次磷酸钠和硫酸镍。盐酸溶液的质量分数为3%，钨粉和盐酸溶液的用量比为1g：10mL；氯化亚锡和盐酸的混合液中氯化亚锡的浓度为20g/L，盐酸的质量分数为5%；氯化钯和盐酸的混合液中氯化钯的浓度为0.5g/L，盐酸的质量分数为1%；镀液中焦磷酸钠的浓度为55g/L、三乙醇胺的浓度为90g/L、柠檬酸三钠的浓度为7g/L、次磷酸钠的浓度为40g/L和硫酸镍的浓度为40g/L；其中，钨粉粒径为2-3μm。
钨粉化学镀镍，得到预处理钨粉；将预处理钨粉加入电镀液中进行搅拌-电镀：电镀3min后关闭电源，搅拌1min，重复搅拌-电镀过程10次，将得到的粉体水洗至中性，真空干燥，得到复合粉体；电镀液中纳米碳化硅15g/L、表面活性剂0.4g/L、pH值为4.5。其中，纳米碳化硅的粒度为50-60nm。电镀温度为50℃，加入硼酸和硫酸调节pH值为4.5；电流密度为2A/m2。表面活性剂为十二烷基硫酸钠和聚乙二醇辛基苯基醚按照质量比2.5：1混合而成。复合粉体在电镀液中要经过2天以上长时间的静置才能完全沉淀。
对比例1
本对比例与实施例2相比，将表面活性剂换成十二烷基硫酸钠，其余原料及制备过程与实施例2保持相同。复合粉体在电镀液中经过静置1天后完全沉淀。
对比例2
本对比例与实施例2相比，不进行电镀，复合粉体中仅含有预处理钨粉。
实施例3
本实施例提供一种钨铜合金复合材料的制备工艺，包括如下步骤：
S1、根据实施例1中的钨粉处理步骤，得到复合粉体；
S2、将复合粉体与铜粉混合，压制成型；复合粉体与铜粉的用量质量比为75：25；压制成型的压强为200MPa，压坯厚度2mm。
S3、烧结，烧结气氛为氢气；烧结温度为1150℃，烧结时间为60min；
S4、多道次热轧和退火；多道次热过程中轧制温度为700℃，轧制次数为5次，多道次热轧至厚度为0.2mm；退火温度为800℃，退火时间为30min。本实例制得的样品密度15.0g/cm3，热导率235W/M·K；热膨胀系数8.9×10-6/K。
实施例4
本实施例提供一种钨铜合金复合材料的制备工艺，包括如下步骤：
S1、根据实施例1中的钨粉处理步骤，得到复合粉体；
S2、将复合粉体与铜粉混合，压制成型；复合粉体与铜粉的用量质量比为90：10；压制成型的压强为100MPa，压坯厚度10mm。
S3、烧结，烧结气氛为氢气；烧结温度为1200℃，烧结时间为60min；
S4、多道次热轧和退火；多道次热过程中轧制温度为700℃，轧制次数为5次，多道次热轧至厚度为0.4mm；退火温度为900℃，退火时间为50min。本实例制得的样品密度17.8g/cm3，热导率195W/M·K；热膨胀系数6.2×10-6/K。
实施例5
本实施例提供一种钨铜合金复合材料的制备工艺，包括如下步骤：
S1、根据实施例2中的钨粉处理步骤，得到复合粉体；
S2、将复合粉体与铜粉混合，压制成型；复合粉体与铜粉的用量质量比为80：20；压制成型的压强为100MPa，压坯厚度20mm。
S3、烧结，烧结气氛为氢气；烧结温度为1200℃，烧结时间为70min；
S4、多道次热轧和退火；多道次热过程中轧制温度为800℃，轧制次数为5次，多道次热轧至厚度为0.5mm；退火温度为1000℃，退火时间为60min。本实例制得的样品密度15.7g/cm3；热导率为213.4W/m·K；热膨胀系数7.9×10-6/K。标准号ASTMF134-1985标准名称：用氦质谱仪检漏器测定电子元件密封性的试验方法：氦质谱仪检漏试验＜2×10-10Pa·m3/s。
对比例3
本对比例与实施例5相比，将S1中的复合粉体换成对比例2中的预处理钨粉，其余原料及制备过程与实施例保持相同。本对比例制得的样品密度15.3g/cm3；热导率为207.3W/m·K；热膨胀系数8.5×10-6/K。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。
Claims (9)
1.一种钨铜合金复合材料的制备工艺，其特征在于，包括如下步骤：
S1、将钨粉和盐酸溶液搅拌混合12h得到粗化钨粉；将粗化钨粉加入氯化亚锡和盐酸的混合液中，搅拌5min得到敏化钨粉；将敏化钨粉加入氯化钯和盐酸的混合液中，搅拌50min得到活化钨粉；镀液组成包括焦磷酸钠、三乙醇胺、柠檬酸三钠、次磷酸钠和硫酸镍，钨粉粒径为2-3μm；
将活化钨粉加入镀液中，保持温度为40℃，搅拌20min，得到预处理钨粉；将预处理钨粉加入电镀液中进行搅拌-电镀：电镀3min后关闭电源，搅拌1min；重复搅拌-电镀过程10次，将得到的粉体水洗至中性，真空干燥，得到复合粉体；电镀液中纳米碳化硅10-15g/L、表面活性剂0.3-0.4g/L，pH值为4-4.5；
S2、将复合粉体与铜粉混合，压制成型；
S3、烧结，烧结气氛为氢气；
S4、多道次热轧和退火。
2.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，电镀温度为50℃；电流密度为1.8-2A/m2。
3.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，表面活性剂为十二烷基硫酸钠和聚乙二醇辛基苯基醚按照质量比2.5：1混合而成。
4.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，S2中复合粉体与铜粉的用量质量比为70-90：10-30。
5.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，S2中压制成型的压强为100-200MPa，压坯厚度2-20mm。
6.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，S3中烧结温度为1100-1200℃，烧结时间为60-70min。
7.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，S4中多道次热轧过程中轧制温度为700-800℃，多道次热轧至厚度为0.2-0.5mm。
8.根据权利要求1所述的一种钨铜合金复合材料的制备工艺，其特征在于，S4中退火温度为800-1000℃，退火时间为30-60min。
9.一种钨铜合金复合材料，其特征在于，由权利要求1-8任意一项所述的制备工艺制备而成。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310937474.8A CN116652179B (zh) | 2023-07-28 | 2023-07-28 | 一种钨铜合金复合材料及其制备工艺 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310937474.8A CN116652179B (zh) | 2023-07-28 | 2023-07-28 | 一种钨铜合金复合材料及其制备工艺 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116652179A CN116652179A (zh) | 2023-08-29 |
| CN116652179B true CN116652179B (zh) | 2023-10-13 |
Family
ID=87710054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310937474.8A Active CN116652179B (zh) | 2023-07-28 | 2023-07-28 | 一种钨铜合金复合材料及其制备工艺 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116652179B (zh) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05186804A (ja) * | 1992-01-10 | 1993-07-27 | Tokyo Tungsten Co Ltd | タングステン複合粉、タングステン複合板材、及びその製造方法 |
| JPH10330861A (ja) * | 1997-05-27 | 1998-12-15 | Nikko Gould Foil Kk | 錫被覆銅粉を用いた焼結材料の製造方法 |
| KR20020058158A (ko) * | 2000-12-29 | 2002-07-12 | 김춘호 | 구리가 도금된 텅스텐 분말을 이용한 텅스텐-구리복합재료의 실형상화 방법 |
| CN102433480A (zh) * | 2011-12-01 | 2012-05-02 | 北京理工大学 | 一种低骨架连通度钨铜合金材料及其制备方法 |
| CN103418786A (zh) * | 2013-09-10 | 2013-12-04 | 北京理工大学 | 一种低W-W连接度W-Cu-Ni合金材料的制备方法 |
| WO2015112365A1 (en) * | 2014-01-24 | 2015-07-30 | United Technologies Corporation | Powder improvement for additive manufacturing |
| CN106435319A (zh) * | 2016-12-15 | 2017-02-22 | 四川恒珲新材料科技有限公司 | 钨铜合金及其制备方法 |
| CN108893637A (zh) * | 2018-07-02 | 2018-11-27 | 西安交通大学 | 一种铜钨合金掺杂石墨烯的制备方法 |
| CN110756794A (zh) * | 2018-07-27 | 2020-02-07 | 中国科学院宁波材料技术与工程研究所 | 一种石墨烯钨铜合金及其制备和应用 |
| CN112359236A (zh) * | 2020-10-16 | 2021-02-12 | 陕西斯瑞新材料股份有限公司 | 一种利用钨粉制备高致密度钨铜合金金属材料的工艺 |
| JP2023012810A (ja) * | 2021-07-14 | 2023-01-26 | 三井金属鉱業株式会社 | 銅基粉、その製造方法、および銅基粉を用いた光造形物の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100462274B1 (ko) * | 2001-12-27 | 2004-12-17 | 주식회사 나노테크 | 텅스텐-구리계 복합분말의 제조방법 및 그 제조된복합분말을 이용한 방열판용 소결 합금의 제조방법 |
-
2023
- 2023-07-28 CN CN202310937474.8A patent/CN116652179B/zh active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05186804A (ja) * | 1992-01-10 | 1993-07-27 | Tokyo Tungsten Co Ltd | タングステン複合粉、タングステン複合板材、及びその製造方法 |
| JPH10330861A (ja) * | 1997-05-27 | 1998-12-15 | Nikko Gould Foil Kk | 錫被覆銅粉を用いた焼結材料の製造方法 |
| KR20020058158A (ko) * | 2000-12-29 | 2002-07-12 | 김춘호 | 구리가 도금된 텅스텐 분말을 이용한 텅스텐-구리복합재료의 실형상화 방법 |
| CN102433480A (zh) * | 2011-12-01 | 2012-05-02 | 北京理工大学 | 一种低骨架连通度钨铜合金材料及其制备方法 |
| CN103418786A (zh) * | 2013-09-10 | 2013-12-04 | 北京理工大学 | 一种低W-W连接度W-Cu-Ni合金材料的制备方法 |
| WO2015112365A1 (en) * | 2014-01-24 | 2015-07-30 | United Technologies Corporation | Powder improvement for additive manufacturing |
| CN106435319A (zh) * | 2016-12-15 | 2017-02-22 | 四川恒珲新材料科技有限公司 | 钨铜合金及其制备方法 |
| CN108893637A (zh) * | 2018-07-02 | 2018-11-27 | 西安交通大学 | 一种铜钨合金掺杂石墨烯的制备方法 |
| CN110756794A (zh) * | 2018-07-27 | 2020-02-07 | 中国科学院宁波材料技术与工程研究所 | 一种石墨烯钨铜合金及其制备和应用 |
| CN112359236A (zh) * | 2020-10-16 | 2021-02-12 | 陕西斯瑞新材料股份有限公司 | 一种利用钨粉制备高致密度钨铜合金金属材料的工艺 |
| JP2023012810A (ja) * | 2021-07-14 | 2023-01-26 | 三井金属鉱業株式会社 | 銅基粉、その製造方法、および銅基粉を用いた光造形物の製造方法 |
Non-Patent Citations (3)
| Title |
|---|
| Cu包覆W粉体的制备工艺及表征;陈文革;胡可文;石乃良;;兵器材料科学与工程(03);第15-18页 * |
| WCu合金钨"网络"骨架的制备及其组织结构分析;石乃良;陈文革;;有色金属(冶炼部分)(04);第41-44页 * |
| 间歇式电镀法制备核壳结构钨铜包覆粉体的研究;吴鹏;李建强;周张健;马炳倩;刘鹏杰;王曼;;稀有金属材料与工程(S1);第47-51页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116652179A (zh) | 2023-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Chen et al. | Infiltration sintering of WCu alloys from copper-coated tungsten composite powders for superior mechanical properties and arc-ablation resistance | |
| Varol et al. | The effect of silver coated copper particle content on the properties of novel Cu-Ag alloys prepared by hot pressing method | |
| CN112359236B (zh) | 一种利用钨粉制备高致密度钨铜合金金属材料的工艺 | |
| CN110157932B (zh) | 一种基于原位合成的石墨烯改性铜基电触头材料的制备方法 | |
| Güler et al. | Fabrication and characterization of novel layered materials produced by electroless plating and hot pressing | |
| CN102492884A (zh) | 一种新型钨铜锌合金材料的制备方法 | |
| CN102433480A (zh) | 一种低骨架连通度钨铜合金材料及其制备方法 | |
| Li et al. | Fabrication and microstructure of W-Cu composites prepared from Ag-coated Cu powders by electroless plating | |
| CN113355550B (zh) | 一种掺杂Y2O3增强CuCrZr合金的制备方法 | |
| CN111020542A (zh) | 一种利用多巴胺制备铝合金镀银层的方法 | |
| Zangeneh-Madar et al. | Improvement of physical properties of Cu-infiltrated W compacts via electroless nickel plating of primary tungsten powder | |
| CN101591741B (zh) | 一种以铜合金为金属相的陶瓷基复合材料及其金属相加入方法 | |
| Yang et al. | Electrical conductivities and mechanical properties of Ti3SiC2 reinforced Cu-based composites prepared by cold spray | |
| Liu et al. | Microstructure and properties of silver-added W-Cu prepared by infiltration sintering | |
| CN104480335A (zh) | 一种银钨触头材料的制备方法 | |
| CN116652179B (zh) | 一种钨铜合金复合材料及其制备工艺 | |
| CN105695792B (zh) | 一种石墨烯/银镍电触头材料的制备方法 | |
| CN103045895A (zh) | 一种电接触材料及其制备方法 | |
| CN113897505B (zh) | 石墨烯增强铜铬电触头材料的制备方法 | |
| CN114807670B (zh) | 一种兼具弥散和沉淀强化的含Fe铜基材料及其制备方法 | |
| CN115178740B (zh) | 一种钨铜功能梯度材料及其制备方法 | |
| CN116552092A (zh) | 一种超导热金刚石-铜复合箔片的制备方法 | |
| Han et al. | Fabrication of Al 2 O 3 dispersion strengthened copper alloy by spray in-situ synthesis casting process | |
| CN113843416B (zh) | 一种基于高压氢还原法的铜包覆铬复合粉末的制备方法及其应用 | |
| CN112222552B (zh) | 一种伽马电极丝及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |