CN116648771A - 部件的制备方法、等离子体处理装置 - Google Patents

部件的制备方法、等离子体处理装置 Download PDF

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Publication number
CN116648771A
CN116648771A CN202180044297.XA CN202180044297A CN116648771A CN 116648771 A CN116648771 A CN 116648771A CN 202180044297 A CN202180044297 A CN 202180044297A CN 116648771 A CN116648771 A CN 116648771A
Authority
CN
China
Prior art keywords
protective layer
layer
substrate
functional group
metal oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180044297.XA
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English (en)
Chinese (zh)
Inventor
侯磊
何敏博
林军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN116648771A publication Critical patent/CN116648771A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
CN202180044297.XA 2021-12-24 2021-12-24 部件的制备方法、等离子体处理装置 Pending CN116648771A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/141347 WO2023115572A1 (fr) 2021-12-24 2021-12-24 Procédé de préparation de composant et appareil de traitement au plasma

Publications (1)

Publication Number Publication Date
CN116648771A true CN116648771A (zh) 2023-08-25

Family

ID=86901126

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180044297.XA Pending CN116648771A (zh) 2021-12-24 2021-12-24 部件的制备方法、等离子体处理装置

Country Status (2)

Country Link
CN (1) CN116648771A (fr)
WO (1) WO2023115572A1 (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532479B2 (ja) * 2003-03-31 2010-08-25 東京エレクトロン株式会社 処理部材のためのバリア層およびそれと同じものを形成する方法。
KR102540963B1 (ko) * 2017-12-27 2023-06-07 삼성전자주식회사 미세 패턴 형성 방법 및 기판 처리 장치

Also Published As

Publication number Publication date
WO2023115572A1 (fr) 2023-06-29

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