CN116635497A - Composition for silicone adhesive coating and adhesive film comprising same - Google Patents
Composition for silicone adhesive coating and adhesive film comprising same Download PDFInfo
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- CN116635497A CN116635497A CN202180088224.0A CN202180088224A CN116635497A CN 116635497 A CN116635497 A CN 116635497A CN 202180088224 A CN202180088224 A CN 202180088224A CN 116635497 A CN116635497 A CN 116635497A
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- 239000000203 mixture Substances 0.000 title claims abstract description 55
- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 45
- 238000000576 coating method Methods 0.000 title claims abstract description 41
- 239000011248 coating agent Substances 0.000 title claims abstract description 40
- 239000002313 adhesive film Substances 0.000 title abstract description 44
- 239000012790 adhesive layer Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000008199 coating composition Substances 0.000 claims abstract description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 137
- 239000000126 substance Substances 0.000 claims description 81
- 239000002041 carbon nanotube Substances 0.000 claims description 63
- -1 polysiloxane Polymers 0.000 claims description 54
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 52
- 239000006185 dispersion Substances 0.000 claims description 51
- 229920001296 polysiloxane Polymers 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 40
- 239000003431 cross linking reagent Substances 0.000 claims description 26
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 25
- 239000003054 catalyst Substances 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 239000002904 solvent Substances 0.000 claims description 19
- 125000001424 substituent group Chemical group 0.000 claims description 19
- 125000003342 alkenyl group Chemical group 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 229920002554 vinyl polymer Polymers 0.000 claims description 15
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 14
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 125000001072 heteroaryl group Chemical group 0.000 claims description 12
- 125000004446 heteroarylalkyl group Chemical group 0.000 claims description 12
- 125000000304 alkynyl group Chemical group 0.000 claims description 11
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 11
- 125000000592 heterocycloalkyl group Chemical group 0.000 claims description 11
- 125000004404 heteroalkyl group Chemical group 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 8
- 150000002367 halogens Chemical class 0.000 claims description 8
- 125000004475 heteroaralkyl group Chemical group 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 3
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 claims description 3
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 claims description 3
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 claims description 3
- HFYAEUXHCMTPOL-UHFFFAOYSA-N 3-Methyl-1-penten-3-ol Chemical compound CCC(C)(O)C=C HFYAEUXHCMTPOL-UHFFFAOYSA-N 0.000 claims description 3
- LAKYCCVWZNCNIO-UHFFFAOYSA-N 3-methylidenepent-1-yne Chemical compound CCC(=C)C#C LAKYCCVWZNCNIO-UHFFFAOYSA-N 0.000 claims description 3
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Chemical class OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- RSLWZZXJRRZAOD-UHFFFAOYSA-N but-1-en-3-yn-2-ylbenzene Chemical compound C#CC(=C)C1=CC=CC=C1 RSLWZZXJRRZAOD-UHFFFAOYSA-N 0.000 claims description 3
- KPWVUBSQUODFPP-UHFFFAOYSA-N ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(C=C)O[Si](C)(C=C)C1=CC=CC=C1 KPWVUBSQUODFPP-UHFFFAOYSA-N 0.000 claims description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 claims description 3
- 150000002432 hydroperoxides Chemical class 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical class OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Chemical class 0.000 claims description 3
- CRJSCSRODDRNDN-UHFFFAOYSA-N methyl-tris(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(OC(C)(C)C#C)OC(C)(C)C#C CRJSCSRODDRNDN-UHFFFAOYSA-N 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Chemical class OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 3
- CGHIBGNXEGJPQZ-UHFFFAOYSA-N 1-hexyne Chemical compound CCCCC#C CGHIBGNXEGJPQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- YVXHZKKCZYLQOP-UHFFFAOYSA-N hept-1-yne Chemical compound CCCCCC#C YVXHZKKCZYLQOP-UHFFFAOYSA-N 0.000 claims description 2
- 239000003146 anticoagulant agent Substances 0.000 claims 2
- 229940127090 anticoagulant agent Drugs 0.000 claims 1
- 229940127219 anticoagulant drug Drugs 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 32
- 238000000034 method Methods 0.000 abstract description 21
- 239000010410 layer Substances 0.000 abstract description 18
- 238000003698 laser cutting Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 10
- 230000008859 change Effects 0.000 abstract description 9
- 230000000704 physical effect Effects 0.000 abstract description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 description 51
- 230000001070 adhesive effect Effects 0.000 description 30
- 239000000853 adhesive Substances 0.000 description 28
- 125000004429 atom Chemical group 0.000 description 12
- 239000002270 dispersing agent Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000001747 exhibiting effect Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000004971 Cross linker Substances 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000002048 multi walled nanotube Substances 0.000 description 4
- 239000002109 single walled nanotube Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000000701 coagulant Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920002959 polymer blend Polymers 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000002079 double walled nanotube Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000003406 indolizinyl group Chemical group C=1(C=CN2C=CC=CC12)* 0.000 description 2
- 125000001041 indolyl group Chemical group 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 125000000561 purinyl group Chemical group N1=C(N=C2N=CNC2=C1)* 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical group [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- 125000002941 2-furyl group Chemical group O1C([*])=C([H])C([H])=C1[H] 0.000 description 1
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
- 125000004105 2-pyridyl group Chemical group N1=C([*])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical group [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- DKNWSYNQZKUICI-UHFFFAOYSA-N amantadine Chemical compound C1C(C2)CC3CC2CC1(N)C3 DKNWSYNQZKUICI-UHFFFAOYSA-N 0.000 description 1
- 229960003805 amantadine Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
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- 125000001691 aryl alkyl amino group Chemical group 0.000 description 1
- 125000001769 aryl amino group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
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- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
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- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- RSPZSDWVQWRAEF-UHFFFAOYSA-N hepta-1,6-diyne Chemical compound C#CCCCC#C RSPZSDWVQWRAEF-UHFFFAOYSA-N 0.000 description 1
- 125000005241 heteroarylamino group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- KIWAUQFHKHLABA-UHFFFAOYSA-N hex-3-en-1,5-diyne Chemical compound C#CC=CC#C KIWAUQFHKHLABA-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 125000002962 imidazol-1-yl group Chemical group [*]N1C([H])=NC([H])=C1[H] 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- BUZRAOJSFRKWPD-UHFFFAOYSA-N isocyanatosilane Chemical compound [SiH3]N=C=O BUZRAOJSFRKWPD-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- RMTGISUVUCWJIT-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine;hydrochloride Chemical compound Cl.NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 RMTGISUVUCWJIT-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- MOVRCMBPGBESLI-UHFFFAOYSA-N prop-2-enoyloxysilicon Chemical compound [Si]OC(=O)C=C MOVRCMBPGBESLI-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 125000003373 pyrazinyl group Chemical group 0.000 description 1
- 125000002098 pyridazinyl group Chemical group 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000000246 pyrimidin-2-yl group Chemical group [H]C1=NC(*)=NC([H])=C1[H] 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 125000005493 quinolyl group Chemical group 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000004306 triazinyl group Chemical group 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a composition for silicone adhesive coating and an adhesive film comprising the same, in particular, the adhesive film is used for the manufacture of an OLED, and the adhesive film exhibits minimal time characteristics without change of physical properties during a process, and no foreign matter is generated during an OLED laser cutting process, and no damage is caused to an OLED layer according to removal of the adhesive film due to low adhesion. Also, the coating composition for adhesion can form an adhesive layer which is formed on one surface of a substrate film, and the composition can exhibit an antistatic effect based on the adhesive layer without additional electrostatic treatment of the substrate film, and can exhibit an excellent antistatic effect even if the thickness of the adhesive layer is increased due to the adhesive film used in manufacturing an OLED.
Description
Technical Field
The present invention relates to a composition for silicone adhesive coating and an adhesive film comprising the same, and more particularly, to a composition for silicone adhesive coating which is excellent in toughness and can exhibit an antistatic effect, and an adhesive film comprising the same.
Background
The adhesive is one of adhesives, and is often used in the form of an adhesive tape or an adhesive label obtained by applying and curing an adhesive on a substrate, and is a representative example of articles for which an adhesive is usually used. The articles are used for various purposes, such as labels for identifying objects, for packaging luggage, or for connecting multiple objects together.
The base materials used for constituting the adhesive are of various types, and are largely classified into rubber type, acrylic type, silicone type, and the like.
Rubber-based adhesives are general-purpose base materials which have been used since a long time ago, and are inexpensive and used for general-purpose adhesive tapes and the like.
The acrylic adhesive uses polyacrylate as a substrate, and thus has superior chemical properties and the like to rubber adhesives, and thus can be applied to adhesive products having higher functionality than rubber adhesives.
The silicone adhesive contains a silicone raw rubber (gum) and a silicone resin having a high viscosity and a plurality of siloxane bonds in the main chain, and in view of this, it has various excellent characteristics, specifically, heat resistance, cold resistance, weather resistance, chemical resistance, electrical insulation, and the like.
The silicone adhesive uses the excellent characteristics as described above, is used for high-performance industrial tapes such as heat-resistant tapes, industrial masking tapes, and mica tapes having flame retardancy, and is used in a condition that can exert the characteristics even under a severe environment of use.
However, in recent years, demand for silicone adhesives has been rapidly expanding, because of expansion of the product market using touch panels mounted on smartphones or tablet terminals.
In most touch panels, a screen protective film is attached to prevent contamination or defects of an interface for use in view of direct manipulation by a human finger. Most of such an adhesive layer for a screen protective film is a silicone adhesive, which takes advantage of the characteristic of excellent wettability or reworkability of the silicone adhesive to an adherend.
The base material for the screen protective film is a plastic film, and a polyester film such as PET having transparency is often used.
However, it is generally believed that the adhesion of plastic films to adhesives is poor compared to paper substrates. It is widely believed that this is because the plastic film has a flat surface and the adhesive penetrates into the substrate to have a weaker fixing (anchor) effect than the paper having a larger concavity and convexity.
If the adhesion is poor, the following problems may occur: when wound into a roll (roll), adheres to the back surface, or adheres to an adherend, so that when peeled off after a lapse of time, the adhesive layer is transferred to the adherend.
In recent years, demand for OLED panels is increasing. To manufacture an OLED panel, a PI film is laminated on Carrier glass (Carrier glass), and after an OLED layer is formed on the PI film, an encapsulation layer is placed and the OLED panel is protected with an adhesive film. Thereafter, the OLED panel and Carrier glass (Carrier glass) are removed, but at this time, the adhesion of the OLED layer is weak, damage may be caused by removing the mucosa, and a problem may occur in that the adhesive material remains at a portion in contact with the OLED panel.
In addition, it is required that there is no change in physical properties during the process and no generation of foreign substances during the OLED laser cutting process.
There is a need to develop an adhesive film capable of satisfying the above-mentioned requirements.
Prior art literature
Patent literature
Patent document 1KR 10-2017-0048831A1
Disclosure of Invention
Problems to be solved by the invention
An object of the present invention is to provide a composition for silicone adhesive coating and an adhesive film comprising the same.
Another object of the present invention is to provide a composition for silicone adhesive coating and an adhesive film comprising the same, wherein the composition for silicone adhesive coating is used for an adhesive film for the manufacture of an OLED, and the adhesive film exhibits minimal time characteristics without change of physical properties during a process, and generates no foreign substances during an OLED laser cutting process, and does not damage an OLED layer according to the removal of the adhesive film due to low adhesion.
Another object of the present invention is to provide a composition for silicone adhesive coating and an adhesive film comprising the same, wherein the composition for adhesive coating is capable of forming an adhesive layer which is formed on one surface of a substrate film, and the composition is capable of exhibiting an antistatic effect based on the adhesive layer without additional electrostatic treatment of the substrate film, and is capable of exhibiting an excellent antistatic effect even if the thickness of the adhesive layer is increased due to the adhesive film utilized in manufacturing an OLED.
Means for solving the problems
In order to achieve the above object, a composition for silicone adhesive coating according to an embodiment of the present invention may include: a solvent, a polysiloxane, a Carbon Nanotube (CNT) dispersion, a coagulant, a crosslinking agent, and a catalyst; wherein the polysiloxane may be selected from the group consisting of a compound represented by the following chemical formula 1, a compound represented by the following chemical formula 2, and a mixture thereof:
[ chemical formula 1]
[ chemical formula 2]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
R 1 to R 14 Are the same or different from each other and are each independently selected from hydrogen and halogenA group consisting of a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 24 carbon atoms, a substituted or unsubstituted heteroalkyl group having 2 to 30 carbon atoms, a substituted or unsubstituted aralkyl group having 6 to 30 carbon atoms, a substituted or unsubstituted aryl group having 5 to 30 carbon atoms, a substituted or unsubstituted heteroaryl group having 2 to 30 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heterocycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted cycloalkenyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group having 1 to 20 carbon atoms;
The R is 1 To R 10 At least one of which is a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms.
The polydimethylsiloxane represented by the chemical formula 1 may include at least one vinyl group as a substituent.
The crosslinking agent may be selected from the group consisting of a compound represented by the following chemical formula 3, a compound represented by the following chemical formula 4, and a mixture thereof:
[ chemical formula 3]
[ chemical formula 4]
Wherein,,
o, p and q are the same or different from each other and each independently is an integer of 1 to 1000,
R 15 to R 30 Are the same or different from each other and are each independently selected from hydrogen, halogen, substituted or unsubstituted alkyl having 1 to 30 carbon atoms, substituted or unsubstituted carbonAlkenyl having 2 to 30 atoms, substituted or unsubstituted alkynyl having 2 to 24 atoms, substituted or unsubstituted heteroalkyl having 2 to 30 atoms, substituted or unsubstituted aralkyl having 6 to 30 atoms, substituted or unsubstituted aryl having 5 to 30 atoms, substituted or unsubstituted heteroaryl having 2 to 30 atoms, substituted or unsubstituted heteroarylalkyl having 3 to 30 atoms, substituted or unsubstituted cycloalkyl having 3 to 20 atoms, substituted or unsubstituted heterocycloalkyl having 3 to 20 atoms, substituted or unsubstituted cycloalkenyl having 3 to 20 atoms, substituted or unsubstituted heteroarylalkyl having 3 to 30 atoms, and substituted or unsubstituted heteroalkenyl having 1 to 20 atoms;
The R is 15 To R 21 Is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms,
the R is 22 To R 30 Is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms.
The retarder may be selected from the group consisting of 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 3, 5-dimethyl-1-hexyn-3-ol, 1-ethynyl cyclohexanol, 1, 5-hexenediyne, 1, 6-heptdiyne, 3, 5-dimethyl-1-hexen-1-yne, 3-ethyl-3-butene-1-yne, 3-phenyl-3-butene-1-yne, 1, 3-divinyl tetramethyl disiloxane, 1,3,5, 7-tetravinyl tetramethyl cyclotetrasiloxane, 1, 3-divinyl-1, 3-diphenyl dimethyl disiloxane and methyl tris (3-methyl-1-butyn-3-oxy) silane, tributylamine, tetramethyl ethylenediamine, benzotriazole, triphenylphosphine, sulfur-containing compounds, hydroperoxides, maleic acid derivatives-1-ethynyl cyclohexanol, 3-methyl-1-pentene-3-ol, and mixtures thereof.
The CNT dispersion includes a first CNT dispersion that is a dispersion in which CNTs having a wall number of 3 to 9 are uniformly dispersed, and a second CNT dispersion that is a dispersion in which CNTs having a wall number of less than 3 are uniformly dispersed.
The silicone adhesive coating composition may further include a vinyl MQ resin.
A silicone adhesive film according to another embodiment of the present invention includes: a base film, and an adhesive layer formed on one surface of the base film; wherein the adhesive layer is formed by applying a composition for silicone adhesive coating.
The adhesive layer may be formed by dissolving a solvent; a polysiloxane represented by the following chemical formula 1; a main agent in which the CNT dispersion, the retarder and the crosslinking agent are uniformly dispersed; and a catalyst is mixed to prepare a coating composition before being coated on one surface of a substrate film and then coated on one surface of the substrate film to form an adhesive layer, wherein the polysiloxane may be selected from the group consisting of a compound represented by the following chemical formula 1, a compound represented by the following chemical formula 2, and a mixture thereof:
[ chemical formula 1]
[ chemical formula 2]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
R 1 to R 14 Each of which is the same or different from the other and is independently selected from the group consisting of hydrogen, halogen, substituted or unsubstituted alkyl having 1 to 30 carbon atoms, substituted or unsubstituted alkenyl having 2 to 30 carbon atoms, substituted or unsubstituted alkynyl having 2 to 24 carbon atoms, substituted or unsubstituted heteroalkyl having 2 to 30 carbon atoms, substituted or unsubstituted aralkyl having 6 to 30 carbon atoms, substituted or unsubstituted aryl having 5 to 30 carbon atoms, substituted or unsubstituted heteroaryl having 2 to 30 carbon atoms, substituted or unsubstituted heteroarylalkyl having 3 to 30 carbon atoms, substituted or unsubstituted cycloalkyl having 3 to 20 carbon atoms, substituted or unsubstituted heterocycloalkyl having 3 to 20 carbon atoms, and substituted or unsubstituted cycloalkyl having 3 to 20 carbon atoms A cycloalkenyl group of 3 to 20, a substituted or unsubstituted heteroaralkyl group of 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group of 1 to 20 carbon atoms;
the R is 1 To R 10 At least one of which is a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms.
In the present invention, "alkyl" means a monovalent substituent derived from a saturated hydrocarbon having 1 to 40 carbon atoms, which is straight or branched. Examples thereof include, but are not limited to, methyl, ethyl, propyl, isobutyl, sec-butyl, pentyl, isopentyl, hexyl, and the like.
In the present invention, "alkenyl" refers to a monovalent substituent derived from a linear or branched unsaturated hydrocarbon having 2 to 40 carbon atoms and having one or more carbon-carbon double bonds. Examples thereof include vinyl (vinyl), allyl (allyl), isopropenyl (isopropenyl), and 2-butenyl (2-butenyl), but are not limited thereto.
In the present invention, "alkynyl" means a monovalent substituent derived from a linear or branched unsaturated hydrocarbon having 2 to 40 carbon atoms and having one or more carbon-carbon triple bonds. Examples thereof include, but are not limited to, ethynyl (ethyl), 2-propynyl (2-propynyl), and the like.
In the present invention, "aralkyl" refers to an aryl-alkyl group in which the aryl group and alkyl group are as described above. Preferred aralkyl groups include lower alkyl groups. Non-limiting examples of preferred aralkyl groups include benzyl, 2-phenethyl, and naphthylmethyl. Bonding to the parent residue is achieved through alkyl groups.
In the present invention, "aryl" means a monovalent substituent derived from an aromatic hydrocarbon having 6 to 60 carbon atoms in which a single ring or two or more rings are bonded. And, more than two ring-side links (pendants) or fused forms may be included. Examples of such aryl groups include, but are not limited to, phenyl, naphthyl, phenanthryl, anthracyl, fluorenyl, dimethylfluorenyl, and the like.
In the present invention, "heteroaryl" means a monovalent substituent derived from a mono-or polyheterocyclic aromatic hydrocarbon having 6 to 30 carbon atoms. At this time, one or more carbons, preferably 1 to 3 carbons, in the ring are substituted with a heteroatom such as N, O, S or Se. And, may include forms in which two or more rings are laterally linked (pendant) or fused to each other, and may include forms fused to an aryl group. Examples of such heteroaryl groups include 6-membered monocyclic groups such as pyridyl, pyrazinyl, pyrimidinyl, pyridazinyl, triazinyl and the like, polycyclic groups such as phenolthienyl (phenyloxathianyl), indolizinyl (indolizinyl), indolyl (indolyl), purinyl (purinyl), quinolinyl (quinolyl), benzothiazole (benzothiazole), carbazolyl (carbazolyl), 2-furyl, N-imidazolyl, 2-isoxazolyl, 2-pyridyl, 2-pyrimidinyl and the like, but are not limited thereto.
In the present invention, "heteroaralkyl" refers to an aryl-alkyl group substituted with a heterocyclic group.
In the present invention, "cycloalkyl" refers to a monovalent substituent derived from a monocyclic or polycyclic non-aromatic hydrocarbon having 3 to 40 carbon atoms. Examples of such cycloalkyl groups include, but are not limited to, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, norbornyl (norbornyl), adamantane (amantadine), and the like.
In the present invention, "heterocycloalkyl" means a monovalent substituent derived from a non-aromatic hydrocarbon having 3 to 40 carbon atoms, and one or more carbons, preferably 1 to 3 carbons in the ring are substituted with a heteroatom such as N, O, S or Se. Examples of such heterocycloalkyl groups include, but are not limited to, morpholine, piperazine, and the like.
In the present invention, "substitution" means that a hydrogen atom bonded to a carbon atom of a compound is replaced with another substituent, and the substitution position is not limited as long as it is a position where a hydrogen atom can be substituted, that is, a position where a substituent can be substituted, and when two or more substituents are substituted, two or more substituents are the same or different from each other. The above substituent may be substituted with one or more substituents selected from the group consisting of hydrogen, deuterium, cyano, nitro, halo, hydroxy, alkyl having 1 to 30 carbon atoms, alkenyl having 2 to 30 carbon atoms, alkynyl having 2 to 24 carbon atoms, heteroalkyl having 2 to 30 carbon atoms, alkyl having 6 to 30 carbon atoms, aryl having 5 to 30 carbon atoms, heteroaryl having 2 to 30 carbon atoms, heteroarylalkyl having 3 to 30 carbon atoms, alkoxy having 1 to 30 carbon atoms, alkylamino having 1 to 30 carbon atoms, arylamino having 6 to 30 carbon atoms, aralkylamino having 6 to 30 carbon atoms and heteroarylamino having 2 to 24 carbon atoms, but is not limited to the above examples.
Effects of the invention
The composition for silicone adhesive coating of the present invention is used for an adhesive film which is used for the manufacture of an OLED and which exhibits minimal time characteristics without change of physical properties during a process, and generates no foreign substances during an OLED laser cutting process and does not damage an OLED layer according to the removal of the adhesive film due to low adhesion.
Also, the coating composition for adhesion can form an adhesive layer which is formed on one surface of a substrate film, and the composition can exhibit an antistatic effect based on the adhesive layer without additional electrostatic treatment of the substrate film, and can exhibit an excellent antistatic effect even if the thickness of the adhesive layer is increased due to the adhesive film used in manufacturing an OLED.
Detailed Description
The present invention relates to a composition for silicone adhesive coating comprising: a solvent; a polysiloxane; a CNT dispersion; a coagulant inhibitor; a cross-linking agent; and (3) a catalyst.
Hereinafter, embodiments of the present invention are described in detail to facilitate the implementation of the present invention by those skilled in the art. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The organic light emitting element has the advantages of high response speed, thinness, small size, low power consumption, self-luminous element, flexibility and the like. Thus, in recent years, demand for illumination and the like has increased not only for next-generation display elements and flexible displays.
The organic light emitting element is formed by sequentially depositing a transparent electrode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a metal electrode on a glass substrate, and is characterized in that light emission is performed using energy released while electrons and holes supplied from both electrodes are recombined in the organic light emitting layer.
Since the organic light emitting element is degraded by external moisture and external factors such as oxygen or ultraviolet rays, a packaging (encapsulation) technique for sealing the organic light emitting element is important, and in order to be applied to various applications, the organic light emitting display device is required to be manufactured to be thin.
Also, in manufacturing the OLED panel, the laser cutting process is performed in a state where the protective film is adhered, and thus it is necessary to prevent foreign materials generated by the cutting process. In the case where the modulus is too low, foreign matter is easily generated at the time of laser cutting, and in the case where the modulus is high, the adhesive layer becomes too hard to exert the intended adhesive force.
The composition for silicone adhesive coating according to an embodiment of the present invention may be provided as an adhesive film by forming an adhesive layer by coating on one surface of a substrate film.
In order to prevent static electricity, conventional adhesive films are subjected to static electricity treatment or an antistatic layer is additionally formed between the adhesive film and the base film. However, the adhesive film according to an embodiment of the present invention forms an adhesive layer using the composition for an adhesive coating, thereby being capable of exhibiting an antistatic effect based on the adhesive layer, so that an additional electrostatic treatment is not required.
Further, the adhesive force with the OLED panel is excellent and the appropriate modulus characteristic is exhibited, so that no foreign matter is generated in the laser cutting process, and thus the defective rate can be reduced.
Specifically, a composition for silicone adhesive coating according to an embodiment of the present invention comprises: a solvent; a polysiloxane; a Carbon Nanotube (CNT) dispersion; a coagulant inhibitor; a cross-linking agent; and a catalyst, wherein the polysiloxane may be selected from the group consisting of a compound represented by the following chemical formula 1, a compound represented by the following chemical formula 2, and a mixture thereof:
[ chemical formula 1]
[ chemical formula 2]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
R 1 To R 14 Each of which is the same or different from the other, is selected from the group consisting of hydrogen, halogen, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 24 carbon atoms, a substituted or unsubstituted heteroalkyl group having 2 to 30 carbon atoms, a substituted or unsubstituted aralkyl group having 6 to 30 carbon atoms, a substituted or unsubstituted aryl group having 5 to 30 carbon atoms, a substituted or unsubstituted heteroaryl group having 2 to 30 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heterocycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted cycloalkenyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heteroaralkyl group having 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group having 1 to 20 carbon atoms;
the R is 1 To R 10 At least one of which is a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms.
The polydimethylsiloxane represented by chemical formula 1 may include at least one vinyl group as a substituent.
More specifically, the polydimethylsiloxane represented by the chemical formula 1 may be a compound represented by the following chemical formula 5 and a compound represented by the following chemical formula 6.
[ chemical formula 5]
[ chemical formula 6]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
specifically, the polysiloxane represented by the chemical formula 1 may include at least one vinyl group as a substituent. As described below, the polysiloxane can combine with Si-H in the crosslinker to form an adhesive layer.
The following have been disclosed in the prior art: the release coating composition using polysiloxane contains vinyl group and is combined with a crosslinking agent. However, none of the Si-H bonds in the crosslinking agent react with Si-H bonds still present.
Si—h remaining in the adhesive layer due to the mixing of the crosslinking agent and the lack of reaction with the polysiloxane can be said to cause the induced time-dependent change.
In other words, the adhesive film should have no change in adhesiveness under a high-temperature and high-humidity environment, but si—h bonds remaining in the adhesive layer exhibit a change in physical properties under a high-temperature and high-humidity environment, whereby a problem of deterioration in the aged property occurs.
Therefore, in the present invention, it is intended to improve the stability with time by minimizing si—h remaining in the bond between the polysiloxane and the crosslinking agent.
Specifically, the polysiloxane represented by the chemical formula 1 may include at least one vinyl group as a substituent, more preferably, may include vinyl groups as substituents at both ends, and a polysiloxane having a substituted vinyl group at a side chain.
Further, the polysiloxane of the present invention may contain a compound represented by chemical formula 2 in addition to the compound represented by chemical formula 1, so that an adhesive layer can be formed by crosslinking and bonding with a crosslinking agent.
As described above, according to the inclusion of two polysiloxanes, it is possible to provide an adhesive film exhibiting unbonded characteristics.
The crosslinking agent may be selected from the group consisting of a compound represented by the following chemical formula 3, a compound represented by the following chemical formula 4, and a mixture thereof:
[ chemical formula 3]
[ chemical formula 4]
Wherein,,
p, q and r are the same or different from each other and are each independently an integer of 1 to 1000;
R 15 to R 30 Each of which is the same or different from the other, is selected from the group consisting of hydrogen, halogen, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 24 carbon atoms, a substituted or unsubstituted heteroalkyl group having 2 to 30 carbon atoms, a substituted or unsubstituted aralkyl group having 6 to 30 carbon atoms, a substituted or unsubstituted aryl group having 5 to 30 carbon atoms, a substituted or unsubstituted heteroaryl group having 2 to 30 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heterocycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted cycloalkenyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heteroaralkyl group having 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group having 1 to 20 carbon atoms;
The R is 15 To R 21 Is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms,
the R is 22 To R 30 Is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms.
More specifically, the crosslinking agent is a compound represented by the following chemical formula 7 and chemical formula 8:
[ chemical formula 7]
[ chemical formula 8]
Wherein,,
p, q and r are identical or different and are each independently integers from 1 to 1000.
The crosslinking agent containing the si—h group undergoes an addition reaction with the polysiloxane containing the above vinylsilane group due to a catalyst described later, so that the two compounds can be linked together.
As described above, when the hydrogen atoms bonded to the silicon atoms in the crosslinking agent are increased, the crosslinking density in the adhesive layer is increased, and the physical properties of the adhesive layer can be improved. However, when the residual amount of the hydrogen atoms bonded to the silicon atoms in the adhesive layer increases, there is a problem that the minimum timeliness cannot be ensured.
Accordingly, in the present invention, with the use of the crosslinking agent as described above, when provided as an adhesive layer, physical properties are ensured by maintaining the crosslinking density while minimizing si—h remaining in the adhesive layer, so that minimal timeliness can be exhibited.
And, the polysiloxane has a vinyl group in addition to both terminals, so that an adhesive layer having a high crosslinking density can be formed near the surface of the substrate layer, thereby providing temporal stability at peeling to achieve unbonded characteristics.
The set retarder may be selected from the group consisting of 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 3, 5-dimethyl-1-hexyn-3-ol, 1-ethynyl cyclohexanol, 1, 5-hexyne, 1, 6-heptyne, 3, 5-dimethyl-1-hexen-1-yne, 3-ethyl-3-butene-1-yne, 3-phenyl-3-butene-1-yne, 1, 3-divinyl tetramethyl disiloxane, 1,3,5, 7-tetravinyl tetramethyl cyclotetrasiloxane, 1, 3-divinyl-1, 3-diphenyl dimethyl disiloxane and methyl tris (3-methyl-1-butyn-3-oxy) silane, tributylamine, tetramethyl ethylenediamine, benzotriazole, triphenylphosphine, sulfur-containing compounds, hydroperoxides, maleic acid derivatives-1-ethynyl cyclohexanol, 3-methyl-1-pentene-3-ol, and mixtures thereof.
For the purpose of promoting the polymerization reaction, the catalyst may generally be a platinum-based catalyst, a palladium-based catalyst or a rhodium-based catalyst, preferably a platinum-based catalyst, but is not limited to the above examples, and catalyst types or contents other than the above-exemplified catalysts may be used in the range generally used in the adhesive film field.
As a method for imparting an antistatic function to the adhesive film, for example, an antistatic layer made of a cationic antistatic agent is provided on one surface of a base film, and an adhesive layer is formed on the other surface. In the prior art, the method is generally used for imparting an antistatic function to an adhesive film, and although a certain antistatic effect can be exerted, there are problems as follows: as the thickness of the adhesive layer is thicker, the antistatic effect to the adhesive surface is not exhibited due to the thickness of the adhesive layer.
Further, a method of imparting an antistatic function to an adhesive film by forming an antistatic layer between a base film and the adhesive layer has been proposed. In the proposed technique, two coating steps are required to form two coating layers on a base film, and thus there are problems that the cost required for the steps is high and the production efficiency is low.
Therefore, as described above, the adhesive film exhibiting the antistatic effect has the following problems: the antistatic effect is low or the economical efficiency is low due to the steps in the manufacturing.
The present invention is characterized in that the CNT dispersion is mixed so as to exhibit an antistatic effect.
For the silicone adhesive coating composition including the CNT dispersion, when the CNT dispersion is uniformly dispersed in the adhesive coating composition and an adhesive layer is formed on one surface of a substrate film, the adhesive layer may exhibit an antistatic effect, thereby being able to be provided as a one-liquid silicone adhesive coating composition.
The CNT is a carbon nanotube and may be selected from the group consisting of single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, and mixtures thereof. Generally, CNTs are classified into single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes according to the number of bonds forming the wall. It is known that the antistatic effect also shows a difference according to the number of tube walls, and that single-walled carbon nanotubes can exhibit the most excellent antistatic effect.
However, production costs are a problem due to the higher price of single-walled carbon nanotubes compared to multi-walled carbon nanotubes. Accordingly, in the present invention, a CNT dispersion that can exhibit excellent antistatic effect using multi-walled carbon nanotubes can be utilized.
The CNT dispersion includes a first CNT dispersion that is a dispersion in which CNTs having a wall number of 3 to 9 are uniformly dispersed, and a second CNT dispersion that is a dispersion in which CNTs having a wall number of less than 3 are uniformly dispersed.
The first CNT dispersion and the second CNT dispersion are mixed in the state of a dispersion solution, respectively, and the CNT dispersion is a mixture of a solvent, CNTs, and a dispersant.
The dispersant may be selected from the group consisting of surfactants, coupling agents, block copolymers, monomers, oligomers, vinyl, lactic acid, caprolactone, silicone, waxes, silanes, fluoro, ethers, alcohols, esters and mixtures thereof. Preferably, it may be selected from the group consisting of anionic surfactants (SDS, naDDBS), cationic surfactants (CTAB), nonionic surfactants TWEEN, TRITION and amphoteric surfactants Tego5 and SAZM Z-3-18, more preferably, it may be selected from the group consisting of NaDDBS, dispersed PVP, tego5, SDS and mixtures thereof.
The solvent may be selected from the group consisting of water, alcohols, cellosolves, ketones, amides, esters, ethers, aromatic hydrocarbons, and mixtures thereof.
Specifically, at least one of the first CNT dispersion and the second CNT dispersion may exist in a state of silane coupling to the polysiloxane. More specifically, the polysiloxane is chemically coupled by the interaction of the functional groups present on the surface of the CNT and the polysiloxane, so that when the polysiloxane is mixed in a state of being silane-coupled with the CNT, the dispersibility can be improved to improve the CNT-based antistatic effect when it is subsequently mixed with the composition for adhesive coating.
As the silane coupling agent, there may be used a vinylsilane coupling agent (e.g., vinyltrimethoxysilane, vinyltriethoxysilane, etc.), epoxysilane coupling agent (e.g., 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltrimethoxysilane, etc.), styrylsilane coupling agent (e.g., p-styryltrimethoxysilane, etc.), methacryloxysilane coupling agent (e.g., 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, etc.), acryloxysilane coupling agent (e.g., 3-acryloxypropyltrimethoxysilane, etc.), aminosilane coupling agent (e.g., N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (3-aminopropyl) -3-trimethoxy-propyl silane, 3-triethoxysilane, 3-aminopropyl-triethoxysilane, 1-triethoxysilane N-phenyl-3-aminopropyl trimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyl trimethoxysilane hydrochloride, and the like), ureido silane coupling agents (e.g., 3-ureido propyl trialkoxysilane, and the like), isocyanato silane coupling agents (e.g., 3-isocyanate-propyl triethoxysilane, and the like), isocyanurate silane coupling agents (e.g., tris (trimethoxysilylpropyl) isocyanurate, and the like), or mercapto silane coupling agents (e.g., 3-mercaptopropyl methyl dimethoxy silane, 3-mercaptopropyl trimethoxysilane, and the like).
More specifically, the first CNT dispersion includes a solvent, CNTs, and a dispersant, and the second CNT dispersion includes a solvent, CNTs, and a silane coupling agent as a dispersant.
For the composition for silicone adhesive coating of the present invention, an adhesive layer is formed by one-time coating one surface of a base film, and has 10 12 Resistance of Ω/≡or less, thereby being capable of exhibiting excellent antistatic effect.
The silicone adhesive coating composition may further include a vinyl MQ resin. The vinyl MQ resin comprises an adhesive composition, so that the elastic modulus can be improved, and the crosslinking density of the adhesive layer can be improved to improve the modulus to an appropriate level, thereby preventing the generation of foreign matters when laser cutting is performed in the manufacturing process of the OLED.
More specifically, the vinyl MQ resin is contained in the form of a mixture of an alkenyl MQ resin and a polymer, and may be contained in the form of a mixture of a vinyl MQ resin and a polysiloxane represented by the following chemical formula 9:
[ chemical formula 9]
Wherein,,
s is an integer of 1 to 1000.
The vinyl MQ resin and the compound represented by chemical formula 9 may be prepared by mixing a vinyl MQ resin with a compound represented by chemical formula 1:3 to 3:5 by weight, and mixing the materials. When the content is mixed within the above range, the dispersion of the vinyl MQ resin in the silicone adhesive coating composition is easy, and the vinyl group contained in the compound is bonded to the crosslinking agent to prevent the si—h group from remaining in the adhesive layer, whereby the stability with time can be exhibited and the mechanical properties can be improved.
The composition for a silicone adhesive coating according to an embodiment of the present invention may include 50 to 70 parts by weight of the polysiloxane represented by the chemical formula 1, 80 to 120 parts by weight of the polysiloxane represented by the chemical formula 2, 0.1 to 1 part by weight of the retarder, 1 to 10 parts by weight of the crosslinking agent represented by the chemical formula 3, 1 to 5 parts by weight of the crosslinking agent represented by the chemical formula 4, 3 to 10 parts by weight of the catalyst, 50 to 70 parts by weight of the vinyl MQ resin/polymer mixture, and 30 to 40 parts by weight of the CNT dispersion based on 100 parts by weight of the solvent. When used in combination within the above range, an adhesive layer exhibiting an antistatic effect can be produced, and also exhibits stability over time even under high-temperature and high-humidity environments, and can prevent the generation of foreign substances when laser cutting is performed in an OLED manufacturing process.
A silicone adhesive film according to another embodiment of the present invention includes a substrate film; and an adhesive layer formed on one surface of the base film, wherein the adhesive layer is formed by coating the composition for silicone adhesive coating.
For the adhesive layer, by dissolving a solvent; a polysiloxane; a main agent in which the CNT dispersion, the retarder and the crosslinking agent are uniformly dispersed; and a step of preparing a coating composition by mixing the catalyst before coating the catalyst on one surface of the substrate film and then coating the catalyst on one surface of the substrate film to form an adhesive layer, wherein the polysiloxane may be selected from the group consisting of a compound represented by the following chemical formula 1, a compound represented by the following chemical formula 2, and a mixture thereof:
[ chemical formula 1]
[ chemical formula 2]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
R 1 to R 14 Each of which is the same or different from the other, is selected from the group consisting of hydrogen, halogen, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 24 carbon atoms, a substituted or unsubstituted heteroalkyl group having 2 to 30 carbon atoms, a substituted or unsubstituted aralkyl group having 6 to 30 carbon atoms, a substituted or unsubstituted aryl group having 5 to 30 carbon atoms, a substituted or unsubstituted heteroaryl group having 2 to 30 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heterocycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted cycloalkenyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heteroaralkyl group having 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group having 1 to 20 carbon atoms;
The R is 1 To R 10 At least one of which is a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms.
The polysiloxane is crosslinked with a crosslinking agent, and the crosslinking is performed by a reaction of a catalyst, and when the composition for adhesive coating is prepared, the adhesive layer cannot be prepared by mixing the catalyst. Therefore, immediately before being coated on one surface of the substrate film, the catalyst is mixed with the main chain and coated on the substrate film to form an adhesive layer.
The adhesive layer of the adhesive film is characterized in that the adhesive layer is formed in a thickness of 20 to 80 mu m and has a surface resistance of 10 9 Omega/≡to 10 12 Ω/□。
As described above, in order to prevent static electricity, the conventional adhesive film performs static electricity treatment on one surface of the base film and forms an adhesive layer on the other surface. For the formation of the antistatic layer as described above, when a thinner adhesive layer having a thickness of about 3 μm is formed, an antistatic effect can be exhibited, but when an adhesive layer having a thicker thickness is formed as in the present invention, the antistatic effect is weak.
In addition, in the case of an adhesive film in which an antistatic layer is formed between a base film and an adhesive layer, there is a problem that the antistatic effect is lowered as the thickness of the adhesive layer increases, as described above, in addition to the problem that the economical efficiency is lowered due to the increase in the manufacturing process.
In contrast, with the adhesive film of the present invention, as described above, the CNT dispersion is contained in the adhesive layer, and as the CNT dispersion is uniformly distributed in the adhesive layer, an excellent antistatic effect can be exhibited. Even if a thicker adhesive layer having a thickness of 80 μm is formed, an antistatic effect by the adhesive layer itself is exhibited, and the antistatic effect can be exhibited only by the formation of the adhesive layer, so that a problem of a high manufacturing unit price can be prevented.
As a method of applying the composition for an adhesive coating to a substrate film, a known method such as a gravure roll coating method, a slit die coating method, a reverse roll coating method, an air knife coating method, or the like can be used, and as a drying method after application, a hot air drying method is mainly used. The higher the curing temperature at the time of drying, the shorter the curing time, but in view of productivity at a temperature at which the film is not deformed, it is preferable to perform curing at an appropriate temperature. Preferably, drying conditions within 1 minute to 5 minutes at a temperature of 80 ℃ to 180 ℃ are suitable.
Preparation example 1
Preparation of CNT dispersion
Carbon nanotubes having an average diameter of 5nm, an average length of 200 μm and a tube wall number of 5 were used as the first CNTs, and carbon nanotubes having an average diameter of 1.5nm, an average length of 1.5 μm and a tube wall number of 1 were used as the second CNTs.
For the first CNT dispersion, naphthalene (99%, sigma aldrich (Sigmaaldrich)) and dih 673 (TEGO Dispers 673) (winning groups (EVONIK)) were used as dispersants, and toluene was used as a solvent, and the first CNT dispersion was prepared with respect to the entire weight: 0.35 wt% of the first CNT, 0.2 wt% of naphthalene as a dispersant, 0.5 wt% of di-high 673 (TEGO Dispers 673), and the balance solvent. The first CNT and the dispersant are weighed and mixed in the solvent, and then stirred at 10000rpm for 2 hours using a homomixer (model name: T25 digital ULTRA-TURRAX, IKA).
For the second CNT dispersion, as a dispersant, low viscosity silicone (Xiameter PMX-200silicone 100cSt) was used, and as a solvent, toluene was used, and the second CNT dispersion was prepared as follows with respect to the entire weight: 0.3 wt% of the second CNT, 0.5 wt% of a dispersant, and the balance solvent. The second CNT and the dispersant are weighed and mixed in the solvent, and then stirred at 10000rpm for 4 hours using a homomixer (model name: T25 digital ULTRA-TURRAX, IKA).
Preparation example 2
Manufacture of silicone adhesive films
Toluene, a polysiloxane represented by the following chemical formula 5, a polysiloxane represented by the following chemical formula 6, 1-ethynyl cyclohexanol, a crosslinking agent compound represented by the following chemical formula 7, a polysiloxane represented by the following chemical formula 8, a first CNT dispersion, and a second CNT dispersion were mixed. Thereafter, a vinyl MQ resin dissolved in xylene and a compound represented by the following chemical formula 9 are mixed at 80 ℃ and then a polymer mixture of a volatilized xylene solvent is added thereto to prepare a main agent.
In the main agent, a platinum catalyst was mixed to prepare a silicone adhesive coating composition, and coated on one surface of a polyester film at a thickness of 1 μm, and cured at 180 ℃ for 3 minutes to prepare an adhesive film.
[ chemical formula 5]
[ chemical formula 6]
[ chemical formula 7]
[ chemical formula 8]
[ chemical formula 9]
Wherein,,
n, m, o, p, q, r and s are the same or different from each other and are each independently an integer of 1 to 1000.
The content of the silicone adhesive coating composition is shown in table 1 below.
TABLE 1
/>
(Unit: parts by weight)
Example 6
An adhesive film was prepared in the same manner as in example 3, except that the adhesive film was prepared by curing at 160℃for 3 minutes after coating the thickness of the adhesive layer at a thickness of 50. Mu.m.
Example 7
An adhesive film was prepared in the same manner as in example 3, except that the adhesive film was prepared by curing at 160℃for 3 minutes after coating the thickness of the adhesive layer at a thickness of 80. Mu.m.
Example 8
Prepared in the same manner as in example 3 except that only 160 parts by weight of the compound represented by chemical formula 5 was used as the polysiloxane.
Example 9
Prepared in the same manner as in example 3 except that only 160 parts by weight of the compound represented by chemical formula 6 was used as the polysiloxane.
Example 10
Prepared in the same manner as in example 3 except that only 10 parts by weight of the compound represented by chemical formula 7 was used as a crosslinking agent.
Example 11
Prepared in the same manner as in example 3 except that only 10 parts by weight of the compound represented by chemical formula 8 was used as a crosslinking agent.
Example 12
Prepared in the same manner as in example 3 except that the vinyl MQ resin/polymer mixture was not contained.
Example 13
In the same manner as in example 3, except that the first CNT dispersion was excluded and only the second CNT dispersion was mixed at 30 wt%.
Example 14
In the same manner as in example 3, except that the second CNT dispersion was excluded and only the first CNT dispersion was mixed at 30 wt%.
Experimental example 1
Evaluation of antistatic Properties
Antistatic properties of examples 1 to 7, examples 13 and 14 were evaluated. Based on the ASTM D257 measurement method, measurement was performed under conditions of a Relative Humidity (RH) of 55%, a temperature of 23℃and an applied voltage of 500V.
TABLE 2
According to the experimental resultsIt was confirmed that the surface resistances of examples 1, 13 and 14 exceeded 10 12 Ω/≡without exhibiting antistatic properties. In example 1, the antistatic effect was weak because the CNT content was low, and in examples 13 and 14, the antistatic effect was weak because the CNT was not uniformly dispersed.
Also, in the case of the present invention, it was confirmed that an excellent antistatic effect was exhibited even when a thicker adhesive layer having a thickness of 80 μm was formed.
Experimental example 2
Adhesive properties of protective film
The protective film prepared according to the example was cut to a width of 1 inch, and after being attached to glass at room temperature using a roll press, was left at room temperature for 30 minutes, and then peeled off at a speed of 300mm per second at 180 °, thereby measuring adhesive force, and was left at a temperature of 85 ℃ and a humidity of 85% for 72 hours, and the change with time was confirmed by the same method as that of the adhesive force measurement.
In order to confirm whether peeling of the adhesive coating layer between films occurred, the protective film prepared according to the example was left for 72 hours at a temperature of 85 ℃ and a humidity of 85%, and it was confirmed whether peeling occurred between the adhesive layer and the film.
[ evaluation criteria ]
No peeling phenomenon occurs: o (O)
Cases where peeling occurs: x is X
TABLE 3
According to the above experimental results, in examples 1, 2 and 11, the si—h content in the crosslinker compound was low, and thus the peeling phenomenon occurred. In examples 1 and 2, the non-curability due to insufficient content of the crosslinker compound shows high temporal changes. In examples 5 and 10, the si—h content of the crosslinker compound was high, and thus high time-dependent changes were shown.
When the adhesive coating composition within the scope of the present invention was used, it was confirmed that peeling phenomenon did not occur under the conditions of high temperature and high humidity, and that minimal change with time and excellent adhesive properties were exhibited.
Experimental example 3
Evaluation of operability
Using the prepared adhesive film, it was confirmed whether foreign matter was generated by laser cutting. The evaluation criteria were as follows: when the foreign matter was generated, the case was marked with X, and the case where the foreign matter was not generated was marked with O.
TABLE 4
From the above experimental results, when the adhesive coating composition within the scope of the present invention was used, it was confirmed that excellent operability was exhibited, and no foreign matter was generated even when laser cutting was performed after attaching to the protective film of the OLED panel, so that the production yield could be improved.
While the preferred embodiments of the present invention have been described in detail, the scope of the claims of the present invention is not limited thereto, and various modifications and improvements using the basic concepts of the present invention as defined in the claims may be made by those skilled in the art within the scope of the present invention.
Industrial applicability
The present invention relates to a composition for silicone adhesive coating and an adhesive film comprising the same, and more particularly, to a composition for silicone adhesive coating which is excellent in toughness and can exhibit an antistatic effect, and an adhesive film comprising the same.
Claims (8)
1. A composition for silicone adhesive coating, wherein,
comprising:
the solvent is used for the preparation of the aqueous solution,
the polysiloxane is prepared by the steps of,
the CNT dispersion liquid is used as a liquid for the production of a liquid,
the anti-coagulant agent is prepared from the following components,
a crosslinking agent, and
a catalyst;
the polysiloxane may be selected from the group consisting of a compound represented by the following chemical formula 1, a compound represented by the following chemical formula 2, and a mixture thereof:
[ chemical formula 1]
[ chemical formula 2]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
R 1 to R 14 Each of which is the same or different from the other, is selected from the group consisting of hydrogen, halogen, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 24 carbon atoms, a substituted or unsubstituted heteroalkyl group having 2 to 30 carbon atoms, a substituted or unsubstituted aralkyl group having 6 to 30 carbon atoms, a substituted or unsubstituted aryl group having 5 to 30 carbon atoms, a substituted or unsubstituted heteroaryl group having 2 to 30 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heterocycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted cycloalkenyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heteroaralkyl group having 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group having 1 to 20 carbon atoms;
the R is 1 To R 10 At least one of which is a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms.
2. The composition for silicone adhesive coating according to claim 1, wherein,
The polydimethylsiloxane represented by the chemical formula 1 includes at least one vinyl group as a substituent.
3. The composition for silicone adhesive coating according to claim 1, wherein,
the crosslinking agent is selected from the group consisting of a compound represented by the following chemical formula 3, a compound represented by the following chemical formula 4, and a mixture thereof:
[ chemical formula 3]
[ chemical formula 4]
Wherein,,
p, q and r are the same or different from each other and are each independently an integer of 1 to 1000;
R 15 to R 30 Each of which is the same or different from the other, is selected from the group consisting of hydrogen, halogen, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 24 carbon atoms, a substituted or unsubstituted heteroalkyl group having 2 to 30 carbon atoms, a substituted or unsubstituted aralkyl group having 6 to 30 carbon atoms, a substituted or unsubstituted aryl group having 5 to 30 carbon atoms, a substituted or unsubstituted heteroaryl group having 2 to 30 carbon atoms, a substituted or unsubstituted heteroarylalkyl group having 3 to 30 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heterocycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted cycloalkenyl group having 3 to 20 carbon atoms, a substituted or unsubstituted heteroaralkyl group having 3 to 30 carbon atoms, and a substituted or unsubstituted heteroalkenyl group having 1 to 20 carbon atoms;
The R is 15 To R 21 Is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms,
the R is 22 To R 30 Is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms.
4. The composition for silicone adhesive coating according to claim 1, wherein,
the anti-coagulant is selected from the group consisting of 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 3, 5-dimethyl-1-hexyn-3-ol, 1-ethynyl cyclohexanol, 1, 5-hexyn, 1, 6-heptyne, 3, 5-dimethyl-1-hexen-1-yne, 3-ethyl-3-butene-1-yne, 3-phenyl-3-butene-1-yne, 1, 3-divinyl tetramethyl disiloxane, 1,3,5, 7-tetravinyl tetramethyl-cyclotetrasiloxane, 1, 3-divinyl-1, 3-diphenyl dimethyl disiloxane and methyl tris (3-methyl-1-butyn-3-oxy) silane, tributylamine, tetramethyl ethylenediamine, benzotriazole, triphenylphosphine, sulfur-containing compounds, hydroperoxides, maleic acid derivatives-1-ethynyl cyclohexanol, 3-methyl-1-penten-3-ol, and mixtures thereof.
5. The composition for silicone adhesive coating according to claim 1, wherein,
the CNT dispersion includes a first CNT dispersion and a second CNT dispersion,
the first CNT dispersion is a dispersion in which CNTs having a wall number of 3 to 9 are uniformly dispersed,
The second CNT dispersion is a dispersion in which CNTs having less than 3 tube wall numbers are uniformly dispersed.
6. The composition for silicone adhesive coating according to claim 1, wherein,
the silicone adhesive coating composition further includes a vinyl MQ resin.
7. A silicone adhesive film, wherein,
comprising the following steps:
substrate film, and
an adhesive layer formed on one surface of the base film;
the adhesive layer is formed by applying the composition for silicone adhesive coating according to any one of claims 1 to 6.
8. The silicone adhesive film of claim 7 wherein,
the adhesive layer is formed by dissolving a solvent; a polysiloxane; a main agent in which the CNT dispersion, the retarder and the crosslinking agent are uniformly dispersed; and a step of preparing a coating composition by mixing the catalyst before applying the catalyst to one surface of the substrate film and then applying the catalyst to one surface of the substrate film to form an adhesive layer, wherein the polysiloxane may be selected from the group consisting of a compound represented by the following chemical formula 1, a compound represented by the following chemical formula 2, and a mixture thereof:
[ chemical formula 1]
[ chemical formula 2]
Wherein,,
n, m and o are the same or different from each other and each independently is an integer of 1 to 1000;
R 1 To R 14 Each of which is the same or different from the other and is independently selected from the group consisting of hydrogen, halogen, substituted or unsubstituted alkyl having 1 to 30 carbon atoms, substituted or unsubstituted alkenyl having 2 to 30 carbon atoms, substituted or unsubstituted alkynyl having 2 to 24 carbon atoms, substituted or unsubstituted heteroalkyl having 2 to 30 carbon atoms, substituted or unsubstituted aralkyl having 6 to 30 carbon atoms, substituted or unsubstituted aryl having 5 to 30 carbon atoms, substituted or unsubstituted heteroaryl having 2 to 30 carbon atoms, substituted or unsubstituted heteroarylalkyl having 3 to 30 carbon atoms, and substituted or unsubstituted aryl having 3 to 30 carbon atomsCycloalkyl having 3 to 20 carbon atoms, substituted or unsubstituted heterocycloalkyl having 3 to 20 carbon atoms, substituted or unsubstituted cycloalkenyl having 3 to 20 carbon atoms, substituted or unsubstituted heteroaralkyl having 3 to 30 carbon atoms, and substituted or unsubstituted heteroalkenyl having 1 to 20 carbon atoms;
the R is 1 To R 10 At least one of which is a substituted or unsubstituted alkenyl group having 2 to 30 carbon atoms.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200184536A KR102512239B1 (en) | 2020-12-28 | 2020-12-28 | Composition for silicone adhesive coating and adhesive film comprising the same |
| KR10-2020-0184536 | 2020-12-28 | ||
| PCT/KR2021/013678 WO2022145643A1 (en) | 2020-12-28 | 2021-10-06 | Silicone adhesive coating composition, and adhesive film comprising same |
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| Publication Number | Publication Date |
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| CN116635497A true CN116635497A (en) | 2023-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180088224.0A Pending CN116635497A (en) | 2020-12-28 | 2021-10-06 | Composition for silicone adhesive coating and adhesive film comprising same |
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| Country | Link |
|---|---|
| KR (1) | KR102512239B1 (en) |
| CN (1) | CN116635497A (en) |
| WO (1) | WO2022145643A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101902581B1 (en) * | 2012-03-28 | 2018-11-07 | 주식회사 케이씨씨 | Silicone Pressure Sensitive Adhesive Composition |
| KR20170043841A (en) * | 2015-10-14 | 2017-04-24 | 정상희 | Manufacturing method of silicone adhesive and silicone adhesive using the same |
| KR20170047540A (en) * | 2015-10-23 | 2017-05-08 | 동우 화인켐 주식회사 | Silicone adhesive composition |
| KR20170048831A (en) | 2015-10-27 | 2017-05-10 | 동우 화인켐 주식회사 | Silicone adhesive composition |
| KR101949420B1 (en) * | 2017-07-11 | 2019-02-18 | 그레이스 콘티넨탈 코리아 주식회사 | Antistatic adhesive composition |
| TWI802631B (en) * | 2018-01-16 | 2023-05-21 | 日商信越化學工業股份有限公司 | Silicone adhesive composition, cured product, adhesive film and adhesive tape |
-
2020
- 2020-12-28 KR KR1020200184536A patent/KR102512239B1/en active IP Right Grant
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2021
- 2021-10-06 WO PCT/KR2021/013678 patent/WO2022145643A1/en active Application Filing
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| Publication number | Publication date |
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| KR20220093628A (en) | 2022-07-05 |
| KR102512239B1 (en) | 2023-03-21 |
| WO2022145643A1 (en) | 2022-07-07 |
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