CN116623166A - Film structure and manufacturing method thereof - Google Patents
Film structure and manufacturing method thereof Download PDFInfo
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- CN116623166A CN116623166A CN202210197220.2A CN202210197220A CN116623166A CN 116623166 A CN116623166 A CN 116623166A CN 202210197220 A CN202210197220 A CN 202210197220A CN 116623166 A CN116623166 A CN 116623166A
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- film
- film layer
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- layers
- film structure
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims description 27
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 12
- 238000004372 laser cladding Methods 0.000 claims description 10
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 8
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 239000010937 tungsten Substances 0.000 claims description 8
- 229910000531 Co alloy Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004378 air conditioning Methods 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005253 cladding Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 229910052786 argon Inorganic materials 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 3
- 238000007751 thermal spraying Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
Abstract
A film structure comprises a substrate, a plurality of first film layers and a plurality of second film layers. The first film layer is arranged on the substrate and is arranged along a first direction. The second film layer is arranged on the substrate and is arranged along a second direction. The first film layer and the second film layer are overlapped, and the first direction and the second direction have an included angle. The invention has the advantages of forming metallurgical bonding, small heat affected zone, wide application of materials, cladding processing in a welding line or powder mode and the like, and can overcome the limitations of thermal spraying and argon welding.
Description
Technical Field
Film structure, in particular to film structure for increasing tolerance
Background
In various engineering devices, whether mechanical equipment or hand tools, such as bucket teeth, clamps, tooth diggers, chain balls, large steel shears or hydraulic crushers, are coated with a coating to improve the impact and friction resistance of the surface of the machine, thereby prolonging the service life of the machine.
At present, a common coating mode is to perform surface treatment by using a thermal spraying method or an argon welding method, and the like, and apply an abrasion-resistant, impact-resistant and friction-resistant material on the surface of a machine to provide impact resistance and friction resistance of the machine. However, the thermal sprayed film layer has weak adhesion (mechanical joint) and is easy to fall off, while the argon welding is a large heat affected zone and is limited by the shape and the material of the welding rod.
Therefore, how to solve the above problems is worth the ordinary person skilled in the art to think.
Disclosure of Invention
In view of the above, the invention provides a film structure, which is formed on a substrate by a laser cladding method.
A film structure comprises a substrate, a plurality of first film layers and a plurality of second film layers. The first film layer is arranged on the substrate and is arranged along a first direction. The second film layer is arranged on the substrate and is arranged along a second direction. The first film layer and the second film layer are overlapped, and the first direction and the second direction have an included angle.
The film structure is characterized in that the included angle is 40-90 degrees.
The film structure is characterized in that a plurality of first grooves are formed between the first film layers at intervals.
The film structure is characterized in that the first film layers are closely arranged.
The film structure is characterized in that the first film layers overlap each other.
The film structure is characterized in that a plurality of second grooves are formed between the second film layers at intervals.
The above-mentioned film layer structure is characterized in that the above-mentioned second film layers overlap each other.
The above-mentioned film layer structure is characterized in that the above-mentioned second film layers are arranged close to each other.
The film structure is characterized in that the thickness of the first film layer and the second film layer is 0.5-20 mm.
The invention also provides a manufacturing method of the film structure, which comprises the following steps:
a10: providing a substrate;
a20: forming a plurality of first film layers on the substrate along a first direction; a kind of electronic device with high-pressure air-conditioning system
A30: forming a plurality of second film layers along a second direction on the substrate;
the first film layer and the second film layer are overlapped and formed, and the first direction and the second direction have an included angle.
The manufacturing method of the film structure is characterized in that the included angle is 40-90 degrees.
In the method for manufacturing a film structure, in the step a20, the first film is formed of Tungsten steel (tunesten steel), tungsten carbide (tunesten carbide), aluminum oxide (Al 2O 3), zirconium dioxide (ZrO 2), an iron-based alloy, a nickel-based alloy, or a cobalt-based alloy.
In the method for manufacturing a film structure, in the step a30, the second film is formed of Tungsten steel (tunesten steel), tungsten carbide (tunesten carbide), aluminum oxide (Al 2O 3), zirconium dioxide (ZrO 2), an iron-based alloy, a nickel-based alloy, or a cobalt-based alloy.
The method for manufacturing a film structure is characterized in that in the step a20 and the step a30, the first film and the second film are formed by a laser cladding method.
The method for manufacturing the film structure further comprises the step A40: remelting the surfaces of the first film layer and the second film layer by using a laser.
In the method for manufacturing a film structure, in step a20, the first film is formed at intervals to form a plurality of first trenches, and the substrate is exposed from the first trenches.
In the method for manufacturing a film structure, in step a30, the second film is formed at intervals to form a plurality of second trenches, and the substrate is exposed from the second trenches.
In the above method for manufacturing a film structure, in step a20, the first film layers are formed to overlap each other.
In the above method for manufacturing a film structure, in step a30, the second film layers are formed to overlap each other.
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below. It should be noted that the components in the drawings are schematic and are not drawn to actual scale.
Drawings
FIG. 1 shows a film structure according to the present invention.
Fig. 2 is a top view of the film structure.
Fig. 3 is a side cross-sectional view of the film structure.
Fig. 4 shows a film structure of a second embodiment.
FIG. 5 is a schematic diagram of membrane separation.
Fig. 6 is a top view of the second embodiment of the film structure.
Fig. 7 is a side sectional view of the second embodiment of the film structure.
Fig. 8, 10, 11, 12, 13, 14 and 15 illustrate a method for manufacturing a tolerant film structure.
FIG. 9 is a schematic diagram of laser cladding.
Fig. 16 shows a first film layer of the third embodiment.
Fig. 17 shows a second film layer of the third embodiment.
Detailed Description
Referring to fig. 1, fig. 1 shows a film structure of the present invention. The film structure 100 includes a substrate 101, a plurality of first films 110 and a plurality of second films 120. The base material 101 is a surface of a machine tool, such as a bucket tooth, a clamp, a tooth, a ball, a large steel shear, or a hydraulic pulverizer. The first film 110 and the second film 120 are disposed on the surface of the substrate 101, and the first film 110 and the second film 120 are disposed on the surface of the substrate 101 in an overlapping manner.
Next, referring to fig. 2 and 3, fig. 2 is a top view of the film structure, and fig. 3 is a side sectional view of the film structure. As can be seen from fig. 2, the first film layer 110 is disposed along a first direction 111, and the first film layer 110 is formed in a strip shape. The second film 121 is disposed along a second direction 121, and the second film 120 is formed in a strip shape. Further, an included angle θ is formed between the first direction 111 and the second direction 121. In one embodiment, the included angle θ may be 40-90 degrees. In other words, the first film 110 and the second film 121 are staggered and disposed on the substrate 101.
Referring to fig. 3, fig. 3 is a side sectional view of a broken line a in fig. 2. It can be seen that the first film 110 and the second film 121 are interleaved and disposed on the substrate 101. And, the first film layers 110 are spaced apart from each other, and a first trench D1 is formed. The respective second films 120 are also spaced apart from each other, and a second trench D2 is formed. Specifically, in the present embodiment, the first film layer 110 and the second film layer 121 do not completely cover the substrate 101, and the surface of the substrate 101 may still be exposed from the first trench D1 or the second trench D2. Furthermore, in some embodiments, the first trench D1 or the second trench D2 may be an indefinite value, that is, each first film layer 110 may be disposed at a different distance, and each second film layer 120 may be disposed at a different distance.
Referring to fig. 4 and 5, fig. 4 shows a film structure according to a second embodiment, and fig. 5 is a schematic view of film separation. In the embodiments of fig. 4 and 5, the first film layers 110 are disposed on the substrate 101 and the second film layers 120 are disposed on the first film layers 110. Also, the first film layer 110 is still disposed along the first direction 111, and the second film layer 120 is still disposed along the second direction 121. Thus, the first film layer 110 and the second film layer 120 are respectively arranged in different directions so that the film completely covers the substrate 101.
Referring next to fig. 6 and 7, fig. 6 is a top view of the second embodiment of the film structure, fig. 7 is a side sectional view of the second embodiment of the film structure, and fig. 7 is a sectional view of a broken line B in fig. 6. As can be seen from fig. 4A, the second film layers 120, which are disposed closely to each other, completely cover the first film layer 110. As can be seen from fig. 4 and 7, the first film 110 covered by the second film 120 is still formed in a different direction from the second film 120 and is covered on the substrate 101.
Referring to fig. 16 and 17, fig. 16 shows a first film layer according to a third embodiment. Fig. 17 shows a second film layer of the third embodiment. To clearly characterize the first film layer 110 and the second film layer 120 of the third embodiment, the first film layer 110 and the second film layer 120 are respectively drawn in fig. 16 and 17, and in practical implementation, the first film layer 110 and the second film layer 120 are disposed on the same substrate 101, and the first film layer 110 and the second film layer 120 overlap each other. In a third embodiment, the plurality of first film layers 110 may overlap each other, and a portion of the overlap may form an overlap 112. Likewise, the plurality of second film layers 120 may also overlap one another, partially overlapping to form an overlap 122. The first film layer 110 is still disposed along the first direction 111, and the second film layer 120 is disposed along the second direction 121.
The first film layer 110 and the second film layer 120 have various arrangements, such as a close arrangement, an arrangement with a space, and an arrangement overlapping each other, but the arrangement is not limited to the same arrangement method for the first film layer 110 and the second film layer 120. For example, the first film 110 is disposed in close proximity and the second film 120 is disposed with a spacing; alternatively, the first film 110 is disposed with a spacing and the second film 120 is disposed in close proximity. In addition, in another embodiment, the first film layer 110 or the second film layer 120 may be respectively configured as a net shape.
In one embodiment, the thickness of the first film layer 110 and the second film layer 120 is 0.5-20 millimeters (mm), and the thickness of the first film layer 110 and the second film layer 120 may be the same or different. In addition, the hardness of the first film layer 110 and the second film layer 120 is greater than that of the substrate 101, providing better impact and friction resistance characteristics to protect the substrate 101. Specifically, the materials of the first film layer 110 and the second film layer 120 are Tungsten steel (Tungsten carbide), tungsten carbide (Tungsten carbide), aluminum oxide (Al) 2 O 3 ) Zirconium dioxide (ZrO) 2 ) An iron-based alloy, a nickel-based alloy, or a cobalt-based alloy, and the first and second films 110 and 120 may be made of the same or different materials.
Referring to fig. 8, 10, 11, 12, 13, 14 and 15, a method for manufacturing a film structure with tolerance is shown. First, step S10 is performed to provide a substrate 101 (as shown in fig. 10 and 11). Next, step S20 is performed to form a plurality of first film layers 110 (as shown in fig. 12 and 13) on the substrate 101 along the first direction 111. Then, step S30 is performed to form a plurality of second film layers 120 (as shown in fig. 14 and 15) on the substrate 101 along the second direction 121. And the overlapping part of the second film layer 120 and the first film layer 110 is formed by covering the first film layer 110 with the second film layer 120.
In one embodiment, in step S20, a first film layer 110 is formed at a distance, such that a plurality of first trenches D1 are formed between the first film layers 110, and the substrate 101 is exposed from the first trenches D1.
In one embodiment, in step S30, a second film 120 is formed at a distance, such that a plurality of second trenches D2 are formed between the first film 120 and the substrate 101 may be exposed from the first trenches D2.
In another embodiment, in step S20, a plurality of first film layers 110 are formed close to each other, such that the first film layers 110 cover the substrate 101. (as shown in FIGS. 4 and 5)
In another embodiment, in step S30, the plurality of second films 110 are formed close to each other, such that the second films 110 cover the first films 110 or the substrate 101. (as shown in FIGS. 4 and 5)
Referring to fig. 9, fig. 9 is a schematic diagram of laser cladding. In step S20 and step S30, the first film layer 110 and the second film layer 120 are formed by laser cladding. Laser cladding is performed using a laser 201 focused on the substrate 101 while ejecting powdered cladding material 221 through nozzle 220 against focal point 110'. The cladding material 221 is then adhered to the substrate 101 by the laser 210, which melts the cladding material and adheres to the substrate 101 while the substrate 101 is continuously moved. After the cladding material cools and solidifies, the first film layer 110 or the second film layer 120 is formed.
Further, in the present embodiment, tungsten steel (Tungsten carbide), tungsten carbide (Tungsten carbide), aluminum oxide (Al) 2 O 3 ) Zirconium dioxide (ZrO) 2 ) An iron-based alloy, a nickel-based alloy, or a cobalt-based alloy as the cladding material 221, and thereby the first film layer 110 or the second film layer 120 is formed. The first film layer 110 and the second film layer 120 may be formed of the same or different materials. In one embodiment, during the laser cladding process of forming the first film 110 or the second film 120, the process gas is argon, the carrier gas flow is 0.2-1L/min, the working distance is 10-14mm, the laser power is 300-1500W, the scanning rate is 1-20mm/s, and the powder feeding rate is 10-50g/s.
Referring back to fig. 8, in an embodiment, step S40 may be further performed to remelt the surface of the first film layer 110 or the second film layer 120 with a laser. Specifically, the surface of the first film layer 110 or the second film layer 120 is irradiated with a low-power laser to be temporarily dissolved and re-solidified, so that impurities and gases in the first film layer 110 or the second film layer 120 can be effectively removed, and the hardness, the wear resistance and the corrosiveness of the first film layer 110 or the second film layer 120 can be further improved. In one embodiment, during the remelting process of step S40, the laser power is 300-500W, the carrier gas flow is 0.2-1l/min, the working distance is 10-14mm, and the scanning rate is 1-20mm/S. After the steps S10 to S40, the film structure 100 of the present invention is completed.
The film structure of the present invention is formed by laser cladding the first film 110 and the second film 120 on the substrate 101, and the first film 110 and the second film 120 are formed by selecting the material with higher hardness than the substrate 101, so that the impact resistance and the friction resistance of the film structure can be improved. Compared with the traditional thermal spraying or argon welding technology, the laser cladding has the advantages of forming metallurgical bonding, small heat affected zone, wide material application, cladding processing in a welding wire or powder mode and the like, and the service life of various engineering machinery is effectively prolonged.
The above embodiments are for convenience of description only, and modifications may be made by those skilled in the art without departing from the scope of the invention as claimed.
Claims (21)
1. A film structure comprising:
a substrate;
the first film layers are arranged on the substrate and are arranged along a first direction; a kind of electronic device with high-pressure air-conditioning system
The second film layers are arranged on the substrate and are arranged along a second direction; the first film layer and the second film layer are overlapped, and the first direction and the second direction have an included angle.
2. The film structure of claim 1, wherein the included angle is 40-90 degrees.
3. The film structure of claim 1, wherein said first film layers have a spacing therebetween to form a plurality of first trenches.
4. The film structure of claim 1, wherein said first film layers are disposed in close proximity to each other.
5. The film structure of claim 1, wherein said first film layers overlap one another.
6. The film structure of claim 1, wherein the second film has a space therebetween to form a plurality of second trenches.
7. The film structure of claim 1, wherein said second film layers are disposed in close proximity to each other.
8. The film structure of claim 1, wherein said second film layers overlap each other.
9. The film structure of claim 1, wherein the thickness of the first film and the second film is 0.5-20 mm.
10. A method of manufacturing a film structure, comprising:
a10: providing a substrate;
a20: forming a plurality of first film layers on the substrate along a first direction; a kind of electronic device with high-pressure air-conditioning system
A30: forming a plurality of second film layers along a second direction on the substrate;
the first film layer and the second film layer are overlapped and formed, and the first direction and the second direction have an included angle.
11. The method of claim 10, wherein the included angle is 40-90 degrees.
12. The method of manufacturing a film structure according to claim 10, wherein in step A20, tungsten steel (Tungsten steel), tungsten carbide (Tungsten carbide), aluminum oxide (Al 2 O 3 ) Zirconium dioxide (ZrO) 2 ) The first film layer is formed of an iron-based alloy, a nickel-based alloy, or a cobalt-based alloy.
13. The method of manufacturing a film structure according to claim 10, wherein in step A30, tungsten steel (Tungsten steel), tungsten carbide (Tungsten carbide), aluminum oxide (Al 2 O 3 ) Zirconium dioxide (ZrO) 2 ) The second film layer is formed of an iron-based alloy, a nickel-based alloy, or a cobalt-based alloy.
14. The method of claim 10, wherein in step a20 and step a30, the first film and the second film are formed by laser cladding.
15. The method for manufacturing a film structure according to claim 10, further comprising step a40: remelting the surfaces of the first film layer and the second film layer by using a laser.
16. The method of claim 10, wherein in step a20, the first film is formed at intervals to form a plurality of first trenches from which the substrate is exposed.
17. The method of claim 10, wherein in step a30, the second film is formed at intervals to form a plurality of second trenches from which the substrate is exposed.
18. The method of claim 10, wherein in step a20, the first layers are formed in close proximity to each other.
19. The method of claim 10, wherein in step a30, the second layers are formed in close proximity to each other.
20. The method of claim 10, wherein in step a20, the first layers are formed overlapping each other.
21. The method of claim 10, wherein in step a30, the second layers are formed overlapping each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111105020 | 2022-02-11 | ||
| TW111105020A TWI818433B (en) | 2022-02-11 | 2022-02-11 | Film structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116623166A true CN116623166A (en) | 2023-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220435338.XU Active CN217052356U (en) | 2022-02-11 | 2022-03-02 | Film layer structure |
| CN202210197220.2A Pending CN116623166A (en) | 2022-02-11 | 2022-03-02 | Film structure and manufacturing method thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220435338.XU Active CN217052356U (en) | 2022-02-11 | 2022-03-02 | Film layer structure |
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| CN (2) | CN217052356U (en) |
| TW (1) | TWI818433B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621335B2 (en) * | 1988-02-24 | 1994-03-23 | 工業技術院長 | Laser spraying method |
| CN108883469B (en) * | 2016-04-01 | 2021-04-27 | 普拉米特工具制造公司 | Surface hardening of cemented carbide bodies |
| CN108456865A (en) * | 2017-02-17 | 2018-08-28 | 北京北方华创微电子装备有限公司 | Membrane deposition method |
| JP7012276B2 (en) * | 2018-09-07 | 2022-01-28 | 石川県 | Tool with abrasive grains, manufacturing method of tools with abrasive grains, and method of fixing abrasive grains |
| CN113967737A (en) * | 2020-07-23 | 2022-01-25 | 中国科学院沈阳自动化研究所 | Powder-laying type laser material increasing and decreasing processing method |
-
2022
- 2022-02-11 TW TW111105020A patent/TWI818433B/en active
- 2022-03-02 CN CN202220435338.XU patent/CN217052356U/en active Active
- 2022-03-02 CN CN202210197220.2A patent/CN116623166A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN217052356U (en) | 2022-07-26 |
| TW202332584A (en) | 2023-08-16 |
| TWI818433B (en) | 2023-10-11 |
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