CN217052356U - Film layer structure - Google Patents
Film layer structure Download PDFInfo
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- CN217052356U CN217052356U CN202220435338.XU CN202220435338U CN217052356U CN 217052356 U CN217052356 U CN 217052356U CN 202220435338 U CN202220435338 U CN 202220435338U CN 217052356 U CN217052356 U CN 217052356U
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- film
- film layer
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- films
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- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 abstract description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052786 argon Inorganic materials 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004372 laser cladding Methods 0.000 description 8
- 238000005253 cladding Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 4
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
Abstract
A film layer structure comprises a base material, a plurality of first film layers and a plurality of second film layers. The first film layer is disposed on the substrate and along a first direction. The second film layer is disposed on the substrate and along a second direction. The first film layer and the second film layer are overlapped, and an included angle is formed between the first direction and the second direction. The beneficial effects of the utility model are that can provide and form metallurgical bonding, heat affected zone is little, the material is used extensively, can melt advantages such as processing with bonding wire or powder mode, can overcome the restriction that hot spraying and argon weld.
Description
Technical Field
Film layer structure, especially one for increasing tolerance
Background
In various engineering machines, whether mechanical devices or hand tools, such as bucket teeth, tongs, digging teeth, chain balls, large steel shears or oil pressure crushers, in order to improve the impact resistance and the friction resistance of the surfaces of the machines, the surfaces of the machines are coated with coatings, so that the service lives of the machines are prolonged.
At present, the common coating method is to perform surface treatment by thermal spraying or argon welding, and the like, and coat the abrasion-resistant, impact-resistant and friction-resistant material on the surface of the machine to provide the impact-resistant and friction-resistant characteristics of the machine. However, the adhesion of the thermal sprayed film is weak (mechanical joint) and easily causes peeling, while the argon welding has a large heat affected zone and is limited by the shape and material of the welding rod.
Therefore, it is worth the thinking of those skilled in the art to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a membranous layer structure forms membranous layer structure on the substrate with the laser cladding method, the beneficial effects of the utility model are that, can provide and form metallurgical bonding, the heat affected zone is little, the material uses extensively, can melt advantages such as processing with bonding wire or powder mode cladding, can overcome the restriction of hot spraying and argon welding.
A film layer structure comprises a base material, a plurality of first film layers and a plurality of second film layers. The first film layer is disposed on the substrate and along a first direction. The second film layer is disposed on the substrate and along a second direction. The first film layer and the second film layer are overlapped, and an included angle is formed between the first direction and the second direction.
The film structure is characterized in that the included angle is 40-90 degrees.
The film structure is characterized in that a plurality of first grooves are formed between the first films at intervals.
The film structure is characterized in that the first films are arranged closely to each other.
The film structure is characterized in that the first films are overlapped with each other.
The film structure is characterized in that a plurality of second grooves are formed between the second films at intervals.
The film layer structure is characterized in that the second film layers are overlapped with each other.
The film structure is characterized in that the second films are arranged close to each other.
The film structure is characterized in that the thickness of the first film and the second film is 0.5-20 mm.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is noted that the components in the drawings are merely schematic and are not necessarily to scale.
Drawings
Fig. 1 is a schematic view of the film structure of the present invention.
Fig. 2 is a top view of the film structure.
Fig. 3 is a side sectional view of the film structure.
Fig. 4 shows a film structure according to a second embodiment.
FIG. 5 is a schematic illustration of the membrane layer separation.
Fig. 6 is a top view of a film structure according to a second embodiment.
FIG. 7 is a side cross-sectional view of a film structure according to a second embodiment.
Fig. 8, fig. 10, fig. 11, fig. 12, fig. 13, fig. 14, and fig. 15 illustrate a method for manufacturing a tolerant film structure.
FIG. 9 is a schematic view of laser cladding.
FIG. 16 shows the first film layer of the third embodiment.
FIG. 17 shows a second film layer according to the third embodiment.
Detailed Description
Referring to fig. 1, fig. 1 is a diagram illustrating a film structure according to the present invention. The film structure 100 includes a substrate 101, a plurality of first films 110 and second films 120. The substrate 101 is a surface of a machine tool, such as a bucket tooth, a clamp, a digging tooth, a hammer, a large steel shear, or a surface of an oil mill. The first film layer 110 and the second film layer 120 are disposed on the surface of the substrate 101, and the first film layer 110 and the second film layer 120 are disposed on the surface of the substrate 101 in an overlapping manner.
Next, referring to fig. 2 and 3, fig. 2 is a top view of the film structure, and fig. 3 is a side sectional view of the film structure. As shown in fig. 2, the first film 110 is disposed along a first direction 111, and the first film 110 is formed in a strip shape. The second film 121 is disposed along a second direction 121, and the second film 120 is formed in a strip shape. Further, the first direction 111 and the second direction 121 have an included angle θ therebetween. In one embodiment, the included angle θ may be 40 to 90 degrees. In other words, the first film 110 and the second film 121 are staggered and disposed on the substrate 101.
Referring to fig. 3, fig. 3 is a side sectional view of a dotted line a in fig. 2. The first film layer 110 and the second film layer 121 can be seen to be interleaved and disposed on the substrate 101. Moreover, the respective first films 110 have a space therebetween, and a first trench D1 is formed. The respective second layers 120 are also spaced apart from each other and form a second trench D2. Specifically, in the embodiment, the first film 110 and the second film 121 do not completely cover the substrate 101, and the surface of the substrate 101 can still be exposed from the first trench D1 or the second trench D2. In addition, in some embodiments, the first trench D1 or the second trench D2 may be indefinite, i.e., each of the first film layers 110 may be disposed at a different distance, and each of the second film layers 120 may be disposed at a different distance.
Referring to fig. 4 and 5, fig. 4 is a diagram illustrating a film structure according to a second embodiment, and fig. 5 is a diagram illustrating a film separation. In the embodiment of fig. 4 and 5, the first films 110 are disposed on the substrate 101 in close proximity to each other, and the second films 120 are disposed on the first films 110 in close proximity to each other. Also, the first film layer 110 is still disposed along the first direction 111, and the second film layer 120 is still disposed along the second direction 121. Therefore, the first film layer 110 and the second film layer 120 are arranged in different directions to completely cover the substrate 101.
Referring to fig. 6 and 7, fig. 6 is a top view, fig. 7 is a side cross-sectional view and fig. 7 is a cross-sectional view of a film structure according to a second embodiment of the present invention, wherein the dashed line B in fig. 6 is shown in fig. 7. As can be seen in fig. 4A, the second film layers 120, which are disposed against each other, completely cover the first film layer 110. As can be seen from fig. 4 and 7, the first film 110 covered by the second film 120 is still formed in a different direction from the second film 120 and covers the substrate 101.
Referring to fig. 16 and 17, fig. 16 illustrates a first film layer according to a third embodiment. FIG. 17 shows a second film layer according to a third embodiment. In order to clearly show the features of the first film layer 110 and the second film layer 120 of the third embodiment, the first film layer 110 and the second film layer 120 are respectively illustrated in fig. 16 and 17, in actual practice, the first film layer 110 and the second film layer 120 will be disposed on the same substrate 101, and the first film layer 110 and the second film layer 120 overlap each other. In a third embodiment, the plurality of first film layers 110 may overlap each other, and a partial overlap may form an overlap 112. Similarly, the plurality of second film layers 120 may overlap each other, partially overlapping to form an overlap 122. Moreover, the first film layer 110 is still disposed along the first direction 111, and the second film layer 120 is disposed along the second direction 121.
The first film 110 and the second film 120 have various arrangements, such as an abutting arrangement, an arrangement with a gap, and an arrangement overlapping each other, but the first film 110 and the second film 120 need not be arranged in the same way. For example, the first film layer 110 is disposed in close proximity, while the second film layer 120 is disposed with a gap; alternatively, the first film 110 is disposed in spaced relation and the second film 120 is disposed in close proximity. In addition, in another embodiment, the first film layer 110 or the second film layer 120 may be disposed in a net shape.
In one embodiment, the thicknesses of the first film 110 and the second film 120 are 0.5 to 20 millimeters (mm), and the thicknesses of the first film 110 and the second film 120 may be the same or different. In addition, the first film 110 and the second film 120 have a hardness greater than that of the substrate 101, providing better impact and friction resistance to protect the substrate 101. Specifically, the first film layer 110 and the second film layer 120 are made of Tungsten steel (Tungsten steel), Tungsten carbide (Tungsten carbide), or aluminum oxide (Al) 2 O 3 ) Zirconium dioxide (ZrO) 2 ) Iron-based alloy, nickel-based alloy, or cobalt-based alloy, and the first film 110 and the second film 120 may be selected from the same or different materials.
Referring to fig. 8, fig. 10, fig. 11, fig. 12, fig. 13, fig. 14 and fig. 15, fig. 8, fig. 10, fig. 11, fig. 12, fig. 13, fig. 14 and fig. 15 illustrate a method for manufacturing a tolerant film structure. First, step S10 is performed to provide a substrate 101 (as shown in fig. 10 and 6B). Next, step S20 is performed to form a plurality of first film layers 110 on the substrate 101 along the first direction 111 (as shown in fig. 12 and 7). Then, step S30 is performed to form a plurality of second film layers 120 on the substrate 101 along the second direction 121 (as shown in fig. 14 and 8). The second layer 120 overlaps the first layer 110, and the second layer 120 covers the first layer 110.
In one embodiment, in step S20, a first film 110 is formed at intervals, such that a plurality of first trenches D1 are formed between the first films 110, and the substrate 101 can be exposed from the first trenches D1.
In one embodiment, in step S30, a second film 120 is formed at intervals, such that a plurality of second trenches D2 are formed between the first film 120, and the substrate 101 can be exposed from the first trenches D2.
In another embodiment, in step S20, a plurality of first films 110 are formed adjacent to each other such that the first films 110 cover the substrate 101. (as shown in FIG. 4 and FIG. 5)
In another embodiment, in step S30, a plurality of second films 110 are formed adjacent to each other such that the second films 110 cover the first film 110 or the substrate 101. (as shown in FIG. 4 and FIG. 5)
Referring to fig. 9, fig. 9 is a schematic diagram of laser cladding. In steps S20 and S30, the first film 110 and the second film 120 are formed by laser cladding. Laser cladding uses a laser 201 focused on the substrate 101 while spraying a powdered cladding material 221 from a nozzle 220 toward the focal point 110'. The cladding material is melted by the laser 210 and adheres to the substrate 101, and the substrate 101 is moved continuously to adhere the cladding material 221 to the substrate 101. Next, after the cladding material is cooled and solidified, the first film layer 110 or the second film layer 120 is formed.
Further, in this embodiment, Tungsten steel (Tungsten steel), Tungsten carbide (Tungsten carbide), and aluminum oxide (Al) are selected and used 2 O 3 ) Zirconium dioxide (ZrO) 2 ) An iron-based alloy, a nickel-based alloy or a cobalt-based alloy is used as a cladding material 221, and the first film layer 110 or the second film layer 120 is formed accordingly. The first film layer 110 and the second film layer 120 may be formed of the same or different materials. In one embodiment, during the laser cladding process for forming the first film 110 or the second film 120, the process gas is argon, the carrier gas flow is 0.2-1L/min, the working distance is 10-14mm, the laser power is 300-1500W, the scanning rate is 1-20mm/s, and the powder feeding rate is 10-50 g/s.
Referring back to fig. 8, in an embodiment, step S40 may be further performed to reflow the surface of the first film 110 or the second film 120 with a laser. Specifically, a low power laser is used to irradiate the surface of the first film 110 or the second film 120 for a short time to dissolve and re-cure, so as to effectively remove impurities and gases in the first film 110 or the second film 120, and further improve the hardness, the wear resistance and the corrosion resistance of the first film 110 or the second film 120. In one embodiment, in the reflow process of step S40, the laser power is 300-. After the above steps S10-S40, the film structure 100 of the present invention is completed.
The utility model discloses a membranous layer structure sees through the first rete 110 of formation and second rete 120 of laser cladding on substrate 101 to choose for use the material that hardness is higher than substrate 101 to form first rete 110 and second rete 120, so alright improve membranous layer structure's the characteristic of shocking resistance and antifriction. Compared with the traditional thermal spraying or argon welding technology, the laser cladding has the advantages of metallurgical bonding formation, small heat affected zone, wide material application, cladding processing in a wire welding or powder mode and the like, and the service life of various engineering machines is effectively prolonged.
The above-described embodiments are merely exemplary for convenience of description, and various modifications may be made by those skilled in the art without departing from the scope of the invention as claimed in the claims.
Claims (9)
1. A film layer structure comprising:
a substrate;
a plurality of first film layers arranged on the substrate, wherein the first film layers are arranged along a first direction; and
a plurality of second film layers arranged on the substrate, wherein the second film layers are arranged along a second direction;
the first film layer and the second film layer are overlapped, and an included angle is formed between the first direction and the second direction.
2. The film structure of claim 1 wherein the included angle is 40 to 90 degrees.
3. The film structure of claim 1 wherein the first films have spaces therebetween to form a plurality of first trenches.
4. The film structure of claim 1 wherein said first films are disposed in close proximity to each other.
5. The film structure of claim 1 wherein said first films overlap each other.
6. The film structure of claim 1 wherein said second films have spaces therebetween to form a plurality of second trenches.
7. The film structure of claim 1 wherein said second films are disposed in close proximity to each other.
8. The film structure of claim 1 wherein said second films overlap each other.
9. The film structure of claim 1, wherein the first film and the second film have a thickness of 0.5-20 mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111105020A TWI818433B (en) | 2022-02-11 | 2022-02-11 | Film structure and manufacturing method thereof |
| TW111105020 | 2022-02-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217052356U true CN217052356U (en) | 2022-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220435338.XU Active CN217052356U (en) | 2022-02-11 | 2022-03-02 | Film layer structure |
| CN202210197220.2A Pending CN116623166A (en) | 2022-02-11 | 2022-03-02 | Film structure and manufacturing method thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202210197220.2A Pending CN116623166A (en) | 2022-02-11 | 2022-03-02 | Film structure and manufacturing method thereof |
Country Status (2)
| Country | Link |
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| CN (2) | CN217052356U (en) |
| TW (1) | TWI818433B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621335B2 (en) * | 1988-02-24 | 1994-03-23 | 工業技術院長 | Laser spraying method |
| US11060155B2 (en) * | 2016-04-01 | 2021-07-13 | Pramet Tools, S.R.O. | Surface hardening of cemented carbide body |
| CN108456865A (en) * | 2017-02-17 | 2018-08-28 | 北京北方华创微电子装备有限公司 | Membrane deposition method |
| JP7012276B2 (en) * | 2018-09-07 | 2022-01-28 | 石川県 | Tool with abrasive grains, manufacturing method of tools with abrasive grains, and method of fixing abrasive grains |
| CN113967737A (en) * | 2020-07-23 | 2022-01-25 | 中国科学院沈阳自动化研究所 | Powder-laying type laser material increasing and decreasing processing method |
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2022
- 2022-02-11 TW TW111105020A patent/TWI818433B/en active
- 2022-03-02 CN CN202220435338.XU patent/CN217052356U/en active Active
- 2022-03-02 CN CN202210197220.2A patent/CN116623166A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116623166A (en) | 2023-08-22 |
| TW202332584A (en) | 2023-08-16 |
| TWI818433B (en) | 2023-10-11 |
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