TWM630157U - Film structure - Google Patents

Abstract

A film layer structure includes a base material, a plurality of first film layers and a plurality of second film layers. The first film layer is disposed on the substrate, and the first film layer is disposed along a first direction. The second film layer is disposed on the substrate, and the second film layer is disposed along a second direction. Wherein, the first film layer and the second film layer are arranged overlappingly, and the first direction and the second direction have an included angle.

Description

Membrane structure

A film structure, particularly a film structure with increased resistance.

In all kinds of engineering equipment, whether it is mechanical equipment or hand tools, such as bucket teeth, clamps, digging teeth, chain balls, large steel shears or hydraulic pulverizers and other machinery, in order to improve the impact resistance and anti-friction characteristics of the surface, Coatings are applied to their surfaces, thereby extending the life of these machines.

At present, the common coating method is to carry out surface treatment by thermal spraying or argon welding, and coat the mechanical surface with wear-resistant, impact-resistant and anti-friction materials to provide mechanical impact and anti-friction properties. However, the adhesion of the thermally sprayed film is weak (mechanical joints), and it is easy to fall off, while the argon welding has a larger heat-affected zone, which is limited by the shape and material of the electrode.

Therefore, how to solve the above problems is worth considering by those with ordinary knowledge in the field.

In view of this, this creation provides a film layer structure, which is formed on a substrate by a laser cladding method. Laser cladding can provide metallurgical bonding, small heat affected zone, wide material application, and can be used for wire bonding. Or powder method for cladding processing and other advantages, can overcome the limitations of thermal spraying and argon welding. The specific technical means are as follows:

A film layer structure includes a base material, a plurality of first film layers and a plurality of second film layers. The first film layer is disposed on the substrate, and the first film layer is disposed along a first direction. The second film layer is disposed on the substrate, and the second film layer is disposed along a second direction. Wherein, the first film layer and the second film layer are arranged overlappingly, and the first direction and the second direction have an included angle.

In the above-mentioned film layer structure, the included angle is between 40 and 90 degrees.

In the above-mentioned film layer structure, there are spaces between the first film layers, and a plurality of first trenches are formed.

In the above-mentioned film layer structure, the first film layers are arranged in close proximity to each other.

In the above-mentioned film layer structure, the first film layers are overlapped with each other.

In the above-mentioned film layer structure, there are spaces between the second film layers, and a plurality of second trenches are formed.

In the above-mentioned film layer structure, the second film layers are overlapped with each other.

In the above-mentioned film layer structure, the second film layers are disposed in close proximity to each other.

In the above-mentioned film layer structure, the thickness of the first film layer and the second film layer is 0.5-20 mm.

100: Membrane layer structure

101: Substrate

110: The first film layer

110': focus point

111: The first direction

112: Overlap

120: Second film layer

121: Second direction

122: Overlap

210: Laser

220: Nozzle

221: Cladding material

S10~S40: Flowchart steps

A, B: dotted line

D1: The first groove

D2: Second groove

θ: included angle

Figure 1 shows the film layer structure of this creation.

FIG. 2A is a top view of the film structure.

FIG. 2B is a side cross-sectional view of the film structure.

FIG. 3A shows the film layer structure of the second embodiment.

Figure 3B is a schematic diagram of membrane separation.

FIG. 4A is a top view of the film layer structure of the second embodiment.

FIG. 4B is a side cross-sectional view of the film layer structure of the second embodiment.

FIGS. 5A , 6A, 6B, 7A, 7B, 8A and 8B illustrate the manufacturing method of the resistant film structure.

FIG. 5B is a schematic diagram of laser cladding.

FIG. 9A shows the first film layer of the third embodiment.

FIG. 9B shows the second film layer of the third embodiment.

Please refer to FIG. 1. FIG. 1 shows the film layer structure of the present invention. The film structure 100 includes a substrate 101 , a plurality of first film layers 110 and a second film layer 120 . Wherein, the base material 101 refers to the surface of a mechanical tool, such as a bucket tooth, a clamp, a digging tooth, a hammer, a large steel shear or a surface of a hydraulic pulverizer. The first film layer 110 and the second film layer 120 are disposed on the surface of the substrate 101 , and the first film layer 110 and the second film layer 120 are disposed on the surface of the substrate 101 overlappingly.

Next, please refer to FIGS. 2A and 2B , FIG. 2A is a top view of the film structure, and FIG. 2B is a side cross-sectional view of the film structure. As can be seen from FIG. 2A , the first film layer 110 is disposed along a first direction 111 , and the first film layer 110 is formed in a strip shape. The second film layer 120 is disposed along a second direction 121 , and the second film layer 120 is formed in a strip shape. Further, there is an included angle θ between the first direction 111 and the second direction 121 . In one embodiment, the angle of the included angle θ may be 40-90 degrees. In other words, the first film layer 110 and the second film layer 120 are staggered and disposed on the substrate 101 .

Please refer to FIG. 2B , which is a side cross-sectional view taken along the dotted line A in FIG. 2A . It can be seen that the first film layer 110 and the second film layer 120 are staggered and disposed on the substrate 101 . In addition, there is a space between the individual first film layers 110, and a first trench D1 is formed. There is also a space between the individual second film layers 120, and a second trench D2 is formed. Specifically, in this embodiment, the first film layer 110 and the second film layer 120 are not completely covered The substrate 101, the surface of the substrate 101 can still be exposed from the first trench D1 or the second trench D2. In addition, in some embodiments, the first trench D1 or the second trench D2 may be indeterminate, that is, each of the first film layers 110 may be provided at different distances, and each of the second film layers 120 may be provided at different distances set up.

Please refer to FIG. 3A and FIG. 3B , FIG. 3A shows the film layer structure of the second embodiment, and FIG. 3B is a schematic diagram of the separation of the film layers. In the embodiment of FIGS. 3A and 3B , the plurality of first film layers 110 are disposed on the substrate 101 in close proximity to each other, and the plurality of second film layers 120 are disposed on the first film layer 110 in close proximity to each other superior. Moreover, the first film layer 110 is still arranged along the first direction 111 , and the second film layer 120 is still arranged along the second direction 121 . Therefore, the first film layer 110 and the second film layer 120 are respectively arranged in different directions to form a thin film that completely covers the substrate 101 .

Next, please refer to FIGS. 4A and 4B , FIG. 4A is a top view of the film layer structure of the second embodiment, FIG. 4B is a side cross-sectional view of the film layer structure of the second embodiment, and FIG. Sectional view of dotted line B. It can be seen from 4A that the second film layer 120 disposed next to each other completely covers the first film layer 110 . It can be seen from FIG. 3A and FIG. 4B that the first film layer 110 covered by the second film layer 120 is still formed in a different direction from the second film layer 120 and covers the substrate 101 .

Please refer to FIG. 9A and FIG. 9B , FIG. 9A shows the first film layer of the third embodiment. FIG. 9B shows the second film layer of the third embodiment. In order to clearly show the characteristics of the first film layer 110 and the second film layer 120 of the third embodiment, the first film layer 110 and the second film layer 120 are drawn in FIG. 9A and FIG. 9B respectively. The film layer 110 and the second film layer 120 will be disposed on the same substrate 101 , and the first film layer 110 and the second film layer 120 will overlap each other. In the third embodiment, the plurality of first film layers 110 may overlap with each other, and a partial overlap may form an overlap 112 . Similarly, the plurality of second film layers 120 may also overlap each other, and the overlapping portions 122 may be formed by partially overlapping. Moreover, the first film layer 110 is still disposed along the first direction 111 , and the second film layer 120 is disposed along the second direction 121 .

The above-mentioned first film layer 110 and the second film layer 120 respectively have various arrangement methods, such as close arrangement, spaced arrangement, and mutually overlapping arrangement, but not limited to the first film layer 110 and the second film layer 120. The same setting method. For example, the first film layers 110 are arranged in close proximity, and the second film layers 120 are arranged with intervals; or, the first film layers 110 are arranged with intervals, and the second film layers 120 are arranged in close proximity. In addition, in another embodiment, the first film layer 110 or the second film layer 120 can also be respectively arranged in a mesh shape.

In one embodiment, the thickness of the first film layer 110 and the second film layer 120 is 0.5˜20 millimeters (mm), and the thickness of the first film layer 110 and the second film layer 120 may be the same or different. In addition, the hardness of the first film layer 110 and the second film layer 120 is greater than that of the substrate 101 to provide better impact resistance and anti-friction properties to protect the substrate 101 . Specifically, the materials of the first film layer 110 and the second film layer 120 are selected from tungsten steel (Tungsten steel), tungsten carbide (Tungsten carbide), aluminum oxide (Al ₂ O ₃ ), zirconium dioxide (ZrO ₂ ), iron base alloy, nickel-based alloy or cobalt-based alloy, and the first film layer 110 and the second film layer 120 can be made of the same or different materials.

Please refer to Figures 5A, 6A, 6B, 7A, 7B, 8A and 8B, Figures 5A, 6A, 6B, 7A, 7B, 8A and 8B depict tolerance The manufacturing method of the film layer structure. First, step S10 is performed to provide a substrate 101 (as shown in FIGS. 6A and 6B ). Next, step S20 is performed to form a plurality of first film layers 110 on the substrate 101 along the first direction 111 (as shown in FIGS. 7A and 7B ). Then, step S30 is performed to form a plurality of second film layers 120 along the second direction 121 on the substrate 101 (as shown in FIGS. 8A and 8B ). The overlap of the second film layer 120 and the first film layer 110 is formed by covering the first film layer 110 with the second film layer 120 .

In one embodiment, in step S20 , a first film layer 110 is formed at intervals so that a plurality of first trenches D1 are formed between the first film layers 110 , and the substrate 101 can be formed from the first film layer 110 . A trench D1 is exposed.

In one embodiment, in step S30, a second film layer 120 is formed at intervals of a certain distance, so that a plurality of second trenches D2 are formed between the first film layers 110, and the substrate 101 can be formed from the first film layer 110. A trench D1 is exposed.

In another embodiment, in step S20 , a plurality of first film layers 110 are formed in close contact with each other, so that the first film layers 110 cover the substrate 101 . (As shown in Figure 3A, 3B)

In another embodiment, in step S30 , a plurality of second film layers 110 are formed close to each other, so that the second film layers 110 cover the first film layer 110 or the substrate 101 . (As shown in Figure 3A, 3B)

Please refer to FIG. 5B , which is a schematic diagram of laser cladding. In step S20 and step S30, the first film layer 110 and the second film layer 120 are formed by laser cladding. In the laser cladding, a laser 210 is used to focus on the substrate 101, and at the same time, the powder cladding material 221 is sprayed with a nozzle 220 toward the focus point 110'. These cladding materials will be melted under the influence of the laser 210 , and thus adhere to the substrate 101 . At this time, the cladding material 221 can be adhered to the substrate 101 by continuously moving the substrate 101 . Next, after the cladding material is cooled and solidified, the first film layer 110 or the second film layer 120 is formed.

Further, in this embodiment, tungsten steel (Tungsten steel), tungsten carbide (Tungsten carbide), aluminum oxide (Al ₂ O ₃ ), zirconium dioxide (ZrO ₂ ), iron-based alloy, nickel-based alloy or The cobalt-based alloy is used as the cladding material 221 to form the first film layer 110 or the second film layer 120 . Wherein, the first film layer 110 and the second film layer 120 may be formed of the same or different materials. In one embodiment, in the process of forming the first film layer 110 or the second film layer 120 by laser cladding, the process gas is argon, the flow rate of the carrier gas is 1-15 l/min, and the working distance is 10-14 mm , the laser power is 300-1500W, the scanning rate is 1-20mm/s, and the powder feeding rate is 10-50g/s.

Referring back to FIG. 5A , in one embodiment, step S40 may also be performed to re-melt the surface of the first film layer 110 or the second film layer 120 with a laser. Specifically, a low-power laser is used to irradiate the first film layer 110 or the surface of the second film layer 120 to dissolve and re-solidify for a short time, so that impurities and gases in the first film layer 110 or the second film layer 120 can be effectively eliminated, and the first film layer 110 or the second film layer 120 can be further improved. hardness, wear resistance and corrosion resistance. In one embodiment, in the remelting process of step S40, the laser power is 300-500W, the carrier gas flow is 1-15 l/min, the working distance is 10-14mm, and the scanning rate is 1-20mm/s. After the above steps S10-S40, the film layer structure 100 of the present invention is completed.

In the film layer structure of the present invention, the first film layer 110 and the second film layer 120 are formed on the base material 101 by laser cladding, and a material with a hardness higher than that of the base material 101 is selected to form the first film layer 110 and the second film layer 120 . The film layer 120 can improve the impact resistance and friction resistance of the film layer structure. Compared with traditional thermal spraying or argon welding technology, laser cladding has the advantages of forming metallurgical bonding, small heat affected zone, wide application of materials, and cladding processing by wire or powder, effectively improving various The service life of construction machinery.

This creation is described above with examples, but it is not intended to limit the scope of the patent rights claimed by this creation. The scope of patent protection shall depend on the scope of the appended patent application and its equivalent fields. Anyone with ordinary knowledge in this field, without departing from the spirit or scope of this patent, makes changes or modifications, all belong to the equivalent changes or designs completed under the spirit disclosed in this creation, and should be included in the following patent application scope Inside.

100: Membrane layer structure

101: Substrate

110: The first film layer

120: Second film layer

Claims (9)

A film layer structure comprises: a base material; a plurality of first film layers disposed on the base material, the first film layers are disposed along a first direction; and a plurality of second film layers disposed on the base material On the substrate, the second film layer is arranged along a second direction; wherein, the first film layer and the second film layer are arranged overlappingly, and the first direction and the second direction have an included angle. The film structure according to claim 1, wherein the included angle is 40-90 degrees. The film structure of claim 1, wherein the first film layers are spaced apart to form a plurality of first trenches. The film structure according to claim 1, wherein the first film layers are arranged in close proximity to each other. The film structure of claim 1, wherein the first film layers overlap each other. The film structure of claim 1, wherein the second film layers are spaced apart to form a plurality of second trenches. The film structure according to claim 1, wherein the second film layers are arranged in close proximity to each other. The film structure of claim 1, wherein the second film layers overlap each other. The film structure of claim 1, wherein the thickness of the first film layer and the second film layer is 0.5-20 mm.

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