CN116618571A - Automatic riveting equipment for connector and PCB on probe card - Google Patents
Automatic riveting equipment for connector and PCB on probe card Download PDFInfo
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- CN116618571A CN116618571A CN202310897765.9A CN202310897765A CN116618571A CN 116618571 A CN116618571 A CN 116618571A CN 202310897765 A CN202310897765 A CN 202310897765A CN 116618571 A CN116618571 A CN 116618571A
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- riveting
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- 239000000523 sample Substances 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 223
- 238000006073 displacement reaction Methods 0.000 claims abstract description 58
- 230000009471 action Effects 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 17
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 16
- 238000003825 pressing Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 238000002788 crimping Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/10—Riveting machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/10—Riveting machines
- B21J15/28—Control devices specially adapted to riveting machines not restricted to one of the preceding subgroups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/10—Riveting machines
- B21J15/30—Particular elements, e.g. supports; Suspension equipment specially adapted for portable riveters
- B21J15/32—Devices for inserting or holding rivets in position with or without feeding arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/38—Accessories for use in connection with riveting, e.g. pliers for upsetting; Hand tools for riveting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The application provides automatic riveting equipment for a connector on a probe card and a PCB (printed circuit board), which relates to the technical field of semiconductors and comprises a horizontal transplanting mechanism, an automatic feeding mechanism, an upper module mechanism and a lower module mechanism, wherein the horizontal transplanting mechanism is used for realizing displacement and positioning of the PCB; the automatic feeding mechanism is used for placing a connector assembly on the PCB, wherein at least one rivet is positioned above the connector assembly; the automatic feeding mechanism is used for positioning a riveting piece matched with the rivet to a position below the PCB and corresponding to the rivet; under the combined action of the upper module mechanism and the lower module mechanism, the rivet, the connector assembly, the PCB and the riveting piece are pressed tightly, and the riveting of the connector assembly and the PCB is realized through the cooperation of the rivet and the riveting piece, so that good feeding positioning and efficient riveting are realized.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to automatic riveting equipment for a connector on a probe card and a PCB.
Background
In the semiconductor wafer testing stage, unpackaged chips on a wafer need to be tested, a probe card is used in the testing process, and the probe card is mainly used for testing whether the unpackaged chips are qualified or not. One key step in the probe card fabrication process is: the connector needs to be riveted to the PCB board, for example, one connector needs 5 rivets in riveting, the whole PCB board needs 128 connectors in total, that is, 640 rivets and riveting sheets are needed respectively, but due to the high precision characteristic of the probe card, the size of each rivet is required to be very small, in the past, the connector and the rivets need to be fed separately by manpower, and the following problems exist in the process: (1) when the connector assembly is fed, 5 rivets on the LIF connector are required to be aligned and placed in 5 rivet holes on the PCB respectively, the manual alignment and placement efficiency is low, and fatigue and error are easy to occur; (2) the riveting sheets are large in number and small in size, the riveting sheets are manually clamped by means of tweezers, and due to poor stability of manual operation, the riveting sheets are easy to lose due to improper clamping or miss-fitting in the operation process.
Disclosure of Invention
In view of this, the embodiment of the present disclosure provides an automatic riveting device for a connector and a PCB board on a probe card, which simultaneously realizes automatic feeding, positioning and crimping processes of a plurality of riveting sheets, and has fast crimping speed, high positioning and operation precision, and good reliability, and even for a smaller-sized riveting part which is particularly suitable for a probe card, good positioning, accurate feeding and efficient riveting can be realized.
The embodiment of the specification provides the following technical scheme:
the automatic riveting equipment comprises a horizontal transplanting mechanism, an automatic feeding mechanism, an upper module mechanism and a lower module mechanism, wherein the horizontal transplanting mechanism is used for realizing displacement and positioning of the PCB; the automatic feeding mechanism is used for placing a connector assembly on the PCB, wherein the connector assembly is preloaded with at least one rivet; the automatic feeding mechanism is used for positioning a riveting piece matched with the rivet to a position below the PCB and corresponding to the rivet; under the combined action of the upper module mechanism and the lower module mechanism, the rivet, the connector assembly, the PCB and the riveting piece are pressed tightly, and riveting of the connector assembly and the PCB is realized through matching of the rivet and the riveting piece; the automatic feeding mechanism comprises a second vibration disc mechanism, a third displacement module, an absorbing mechanism and a camera mechanism, wherein the second vibration disc mechanism is used for conveying the riveting piece, the third displacement module is linked with the absorbing mechanism, so that the absorbing mechanism absorbs the riveting piece and places the riveting piece in a riveting piece positioning hole of the lower module mechanism, and the camera mechanism is used for detecting the positioning state of the riveting piece.
In some embodiments, the horizontal transplanting mechanism includes a first displacement module and a rotation positioning mechanism, the rotation positioning mechanism is disposed on the first displacement module, and the first displacement module is used for moving the PCB board and rotationally positioning the connector assembly to a preset assembling alignment position of the connector assembly with the upper module mechanism and the lower module mechanism through the rotation positioning mechanism.
In some embodiments, the automatic feeding mechanism includes a first vibration plate mechanism, a second displacement module, and a grabbing mechanism, where the first vibration plate mechanism 31 is used for conveying the connector assembly, and the grabbing mechanism is linked with the second displacement module to grab the connector assembly to a connector placement position on the PCB board.
In some embodiments, the upper module mechanism comprises a cylinder and a chute mechanism, and the rivet, the connector assembly, the PCB board and the rivet sheet are pressed downward under the cooperation of the cylinder and the chute mechanism.
In some embodiments, the lower module mechanism includes a fourth displacement module, a pressing mechanism, the fourth displacement module being linked with the pressing mechanism such that the pressing mechanism presses the rivet sheet, the PCB board, the connector assembly and the rivet upward.
In some embodiments, the fourth displacement module includes a cylinder push rod and a chute linkage that are linked to each other.
In some embodiments, the hold-down mechanism includes a pen cylinder and a linkage mechanism, the pen cylinder may drive the linkage mechanism to perform a thimble action to prop open the rivet such that the rivet blade is riveted to the connector assembly.
In some embodiments, the device further comprises a machine base 1, a chassis workbench and a supporting plate above the chassis workbench, wherein the horizontal transplanting mechanism, the automatic feeding mechanism, the upper module mechanism and the lower module mechanism are all arranged on the chassis workbench, and the upper module mechanism is arranged on the supporting plate.
In some embodiments, the rivets and the rivet sheets are the same number, both greater than 4.
Compared with the prior art, the beneficial effects that above-mentioned technical scheme that this description embodiment adopted can reach include at least:
(1) According to the full-automatic riveting equipment for the LIF connector and the PCB on the probe card, through the cooperation operation of the horizontal transplanting mechanism, the automatic feeding mechanism, the upper module mechanism and the lower module mechanism, the whole riveting process does not need manual interference, meanwhile, the automatic feeding, positioning and crimping processes are realized, the crimping speed is high, the positioning and operating precision is high, the reliability is good, even if the riveting parts (rivets, riveting sheets and the like) with smaller sizes are specially applicable to the probe card, the good positioning, accurate feeding and high-efficiency riveting can be realized, and the automatic production of the probe card can be realized by combining wires with other automatic equipment in the later period;
(2) The automatic feeding mechanism of the riveting sheets adopts the vibration disc mechanism to carry out material arrangement and conveying, the simultaneous suction of a plurality of riveting sheets is realized in a pneumatic control mode, the placement positions of the riveting sheets are automatically adjusted by virtue of the X module and the Z-axis rail, finally, the existence and position detection after the riveting sheets are fed are realized by virtue of the camera system, the automatic feeding mechanism of the connector assembly can be synchronously carried out, and the whole process of feeding is accurate, quick, no manual interference is required, and the missing and the loss of the riveting sheets are difficult to occur;
(3) The automatic feeding mechanism of the connector assembly adopts the vibration disc mechanism to carry out material arrangement and conveying, the grabbing of the connector assembly is realized through the grabbing mechanism, the placing position of the connector assembly is automatically adjusted by means of the Y, Z module, and the whole process has the advantages of accurate feeding, high speed, no manual interference, difficult occurrence of wrong installation, neglected installation and the like of the connector assembly;
(4) The upper module mechanism and the lower module mechanism adopt a pneumatic control mode to realize the downward pressing of the operating rod, further achieve the purpose of riveting the connector assembly and the PCB, and improve the riveting efficiency and the riveting reliability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a probe card connector provided by an embodiment of the present application before automatic riveting with a PCB board;
fig. 2 is a schematic structural diagram of a probe card connector according to an embodiment of the present application after automatic riveting with a PCB;
fig. 3 is a schematic structural diagram of an automatic riveting device for a connector on a probe card and a PCB according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an automatic riveting device for a connector on a probe card and a PCB according to an embodiment of the present application;
fig. 5 is a schematic structural view of a horizontal transplanting mechanism according to an embodiment of the present application;
fig. 6 is a schematic structural view of an automatic feeding mechanism according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of an automatic feeding mechanism according to an embodiment of the present application;
FIG. 8 is a schematic structural view of an upper module mechanism according to an embodiment of the present application;
FIG. 9 is a schematic diagram of a lower module mechanism according to an embodiment of the present application;
FIG. 10 is a schematic cross-sectional view of a lower module mechanism according to an embodiment of the present application;
FIG. 11 is a schematic view of a connector assembly according to an embodiment of the present application;
FIG. 12 is a schematic view of a partial structure of a lower module mechanism according to an embodiment of the present application;
FIG. 13 is a schematic diagram illustrating assembly of the upper and lower die set mechanism in a compressed state according to an embodiment of the present application;
fig. 14 and 15 are schematic views illustrating assembly of the automatic riveting apparatus in a riveting state according to an embodiment of the present application.
Reference numerals illustrate:
1-stand, 11-chassis table, 12-support plate, 2-horizontal transplanting mechanism, 21-first displacement module, 22-rotational positioning mechanism, 221-motor, 222-positioning plate, 3-autoloading mechanism, 31-first vibration plate mechanism, 32-second displacement module, 33-gripping mechanism, 4-autoloading mechanism, 41-second vibration plate mechanism, 42-third displacement module, 421-X-axis module, 422-Z-axis module, 44-suction mechanism, 45-camera mechanism, 5-upper module mechanism, 51-cylinder, 52-chute mechanism, 53-press block jig, 6-lower module mechanism, 61-fourth displacement module, 611-cylinder push rod, 612-chute linkage mechanism, 62-press mechanism, 63-ejector pin jig, 64-spacer jig, 622-pen cylinder, 623-linkage mechanism, 7-PCB board, 8-connector assembly, 81-connector, 82-rivet, 9-rivet piece, 10-positioning pin, 11-positioning pin jig
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present application may be practiced without these specific details.
As shown in fig. 1 to 10, the automatic riveting equipment for a connector on a probe card and a PCB board provided by the embodiment of the application mainly comprises a horizontal transplanting mechanism 2, an automatic feeding mechanism 3, an automatic feeding mechanism 4, an upper module mechanism 5 and a lower module mechanism 6. In some embodiments, the automated riveting apparatus further comprises a stand 1, a chassis table 11, and a support plate 12 above the chassis table 11. The horizontal transplanting mechanism 2, the automatic feeding mechanism 3, the automatic feeding mechanism 4, the upper module mechanism 5 and the lower module mechanism 6 are all arranged on the underframe workbench 11, the upper module mechanism 5 is arranged on the supporting plate 12, and the supporting plate 12 plays a role in supporting the upper module mechanism 5. In some embodiments, the support plates 12 may be provided in a pair on the left and right, respectively, in order to more stably support the upper die set mechanism 5.
In some embodiments, the rivet 82 is adapted to correspond with the rivet blade 9. In some embodiments, the rivets 82 are the same number as the rivet sheets 9, and are each provided in plurality. In some embodiments, the rivets 82 are the same number as the rivet sheets 9 and are each greater than 4, such as 5. In some embodiments, (e.g., 5) rivets 82 may be preloaded onto 1 connector 81 to form a set of connector assemblies 8 for loading. In some embodiments, the rivet 82 has a diameter in the range of 0.80mm-0.82mm. In some embodiments, the length of rivet 82 ranges from 1.40mm to 1.45m. In some embodiments, the rivet blade 9 has a diameter in the range of 1.5mm to 2mm and a thickness in the range of 0.5mm to 0.8mm. In some embodiments, the connector 81 in the connector assembly 8 is a LIF connector.
As shown in fig. 5, the horizontal transplanting mechanism 2 is used for realizing displacement and positioning of the PCB 7. In some embodiments, the horizontal transplanting mechanism 2 includes a first displacement module 21 and a rotation positioning mechanism 22, the rotation positioning mechanism 22 is disposed on the first displacement module 21, the first displacement module 21 is used for moving the PCB board 7, and the connector assembly 8, the upper module mechanism 5 and the lower module mechanism 6 are rotationally positioned at a preset assembly alignment position by the rotation positioning mechanism 22 (the rotation positioning mechanism 22 drives the PCB board with the connector to rotate to the preset assembly alignment position). In some embodiments, the first displacement module 21 may be configured as a three-dimensional displacement system (e.g., a three-dimensional displacement device capable of moving along an X-axis, a Y-axis, and a Z-axis, or a specific direction displacement module (e.g., an X-axis rail, as shown in fig. 5, for example)), in some embodiments, the rotary positioning mechanism 22 includes a motor 221 (e.g., a DD motor, etc.) and a positioning plate 222, and when the PCB 7 is moved to a predetermined position by the first displacement module 21, the motor 221 may drive the PCB 7 and the connector assembly 8 mounted thereon to rotate until the center line of the connector assembly 8 is aligned with the center of the PCB 7, and the center line of the upper and lower module mechanisms 5, 6, i.e., when the center line of the connector assembly 8 is aligned with the center of the PCB 7, and the center line of the upper and lower module mechanisms 5, the center line of the PCB 7, respectively, the positioning pin assemblies 8 are positioned by the positioning plate 222, and in some embodiments, the camera pin assembly is further positioned by the two camera pins 82, the positioning pin assembly is positioned by the camera pin assembly 10 and the positioning pin assembly 7 or the camera pin assembly 7 (the positioning pin assembly 10 is further positioned by the camera pin assembly 45) or the camera assembly is further positioned by the camera pin assembly 10 and the camera assembly 7 or the camera assembly is further positioned by the camera assembly 45 in the position of the positioning system, or the positioning device is further configured by the camera assembly is further accurate, so as to provide for a sufficient and efficient positioning of the subsequent upper and lower die set mechanisms 5, 6 for mutual engagement.
With further reference to fig. 6, the automatic feeding mechanism 3 is used for placing the connector assembly 8 on the PCB board 7, wherein the connector assembly 8 is preloaded with at least one rivet 82. In some embodiments, the at least one rivet 82 may be pre-positioned and mounted on the connector assembly 8, i.e., the autoloading mechanism 3 loads the connector assembly 8 preloaded with the at least one rivet 82. In some embodiments, the automatic feeding mechanism 3 includes a first vibration plate mechanism 31, a second displacement module 32, and a gripping mechanism 33, wherein the first vibration plate mechanism 31 is used for conveying the connector assembly 8, and the gripping mechanism 33 is linked with the second displacement module 32 to grip the connector assembly 8 to the connector placement position on the PCB board 7. In some embodiments, the first vibratory pan mechanism 31 may be configured to convey the connector assembly 8 in a predetermined angular positional relationship. In some embodiments, the predetermined angular positional relationship may be such that both of the alignment pins 10 on the connector 82 are in the same mounting direction for accurate assembly. In some embodiments, the second displacement module 32 may be configured as a three-dimensional displacement system (e.g., a three-dimensional displacement device movable along an X-axis, a Y-axis, a Z-axis, or a direction-specific displacement module (e.g., a Y-axis module and a Z-axis module, as illustrated schematically in fig. 6).
As shown in fig. 7, the automatic feeding mechanism 4 is used for positioning the rivet piece 9 adapted to the rivet 82 to a position below the PCB 7 and corresponding to the rivet 82. Specifically, the automatic feeding mechanism 4 includes a second vibration disc mechanism 41, a third displacement module 42, a suction mechanism 44, and a camera mechanism 45, where the second vibration disc mechanism 41 is used for conveying the riveting piece 9, and the third displacement module 42 is linked with the suction mechanism 44, so that the suction mechanism 44 sucks the riveting piece 9 and places the riveting piece 9 in a riveting piece positioning hole (not shown in the figure) of the lower module mechanism 6, and the camera mechanism 45 is used for detecting a positioning state of the riveting piece 9. In some embodiments, the third displacement module 42 may be configured as a three-dimensional displacement system (e.g., a three-dimensional displacement device movable along an X-axis, a Y-axis, and a Z-axis, or a specific direction displacement module (e.g., an X-axis module 421 and a Z-axis module 422, as illustrated in fig. 7), in some embodiments, the X-axis module 421 may be an X-axis rail for effecting displacement of the rivet sheet 9 in the X-axis direction, and the Z-axis module 422 may be a Z-axis rail for effecting displacement of the rivet sheet 9 in the Z-axis direction.
The combined action of the upper module mechanism 5 and the lower module mechanism 6 can compress the rivet 82, the connector assembly 8, the PCB 7 and the riveting piece 9, and the riveting of the connector assembly 8 and the PCB 7 is realized through the cooperation of the rivet 82 and the riveting piece 9. In some embodiments, as shown in fig. 8, the upper module mechanism 5 includes a cylinder 51 and a chute mechanism 52, and the rivet 82, the connector assembly 8, the PCB board 7 and the rivet sheet 9 are pressed downward under the cooperation of the cylinder 51 and the chute mechanism 52. In some embodiments, the horizontal pushing force of the air cylinder 51 is changed into a vertical downward force through the chute mechanism 52, so as to realize the pressing action of the connector assembly 8 (for example, the connector 81 can be indirectly acted on by directly pressing the rivet 82) and the PCB 7 and the rivet piece 9, and cooperate with the lower module mechanism 6 to realize the pressing action and subsequent riveting action of the PCB 7 and the LIF connector assembly 8 and the rivet piece 9. In some embodiments, as shown in fig. 9 and 10, the lower module mechanism 6 includes a fourth displacement module 61 and a pressing mechanism 62, and the fourth displacement module 61 is linked with the pressing mechanism 62, so that the pressing mechanism 62 presses the rivet sheet 9, the PCB board 7, the connector assembly 8 and the rivet 82 upward.
In some embodiments, the fourth displacement module 61 may be configured as a three-dimensional displacement system (e.g., a three-dimensional displacement device movable along an X-axis, a Y-axis, and a Z-axis, or a specific direction displacement module (e.g., a Z-axis module, as illustrated in fig. 10, for example). In some embodiments, the fourth displacement module 61 includes a cylinder push rod 611 and a chute linkage 612 that are linked to each other, and the Z-axis rail of the fourth displacement module 61 is configured to output a horizontal force from the cylinder push rod 611, and the chute linkage 612 is configured to be a force that is vertically upward to cooperate with the upper module mechanism 5 to achieve a more stable and better compression of the PCB board 7 with the connector assembly 8 and the rivet sheet 9. In some embodiments, as illustrated in fig. 13, a press block jig 53 (by acting on the rivet 82 and simultaneously achieving an indirect compression of the connector 81) provided on the lower module mechanism 6 may be configured to achieve a more stable and better compression.
In some embodiments, the pressing mechanism 62 includes a pen-shaped cylinder 622 and a link mechanism 623, where the pen-shaped cylinder 622 drives the link mechanism 623 to implement a thimble action, so as to spread the rivet 82 (such as spreading the tail of the rivet 82) and spread the rivet piece 9, so that the rivet piece 9 is riveted to the connector assembly 8, and riveting the connector assembly 8 and the PCB board 7 is implemented. In some embodiments, referring to fig. 14 and 15, the ejector pin fixture 63 disposed on the lower module mechanism 6 may be combined, so as to more efficiently implement the ejector pin action in the pressing process, so as to more accurately and effectively prop open the rivet 82, thereby prop open the rivet sheet 9, and rivet the rivet sheet 9 onto the connector assembly 8, thereby further improving the riveting efficiency. In some embodiments, the distance that the rivet 82 passes out of the rivet blade 9 and protrudes beyond the rivet blade 9 after riveting is controlled to be within a range of 0.15mm or less. In some embodiments, different specifications of PCB board 7 and connector assembly 8 may be riveted as desired. In some embodiments, the corresponding change selection of the rivet 82 and the rivet sheet 9 adapted according to the specific structure or the specification and the size of the PCB 7 or the connector assembly 8 may be performed, or the specific structure of the automatic riveting device may be changed adaptively without departing from the inventive concept, which is not particularly limited in the embodiments of the present application.
In some embodiments, that is, exemplary, the automatic riveting equipment for the connector on the probe card and the PCB provided by the embodiment of the present application, the working process for implementing automatic riveting of the connector on the probe card and the PCB is as follows:
preparation work before starting: the PCB board 7 is placed on the positioning plate 222 of the horizontal transplanting mechanism 2, and the LIF connector assembly 8 and the rivet 9 are respectively poured into the first vibration plate mechanism 31 and the second vibration plate mechanism 41.
Step 1: starting the full-automatic riveting equipment, firstly, enabling the horizontal transplanting mechanism 2 to act (namely enabling the placement position of the connector assembly 8 on the PCB 7 to rotate to be aligned with the central horizontal axes of the upper and lower module mechanisms by the rotary positioning mechanism 22);
step 2: the automatic feeding mechanism 3 of the LIF connector assembly 8 and the automatic feeding mechanism 4 of the riveting piece 9 act simultaneously (namely, the LIF connector assembly 8 and the riveting piece 9 are respectively arranged in the connector assembly 8 placing position of the PCB 7 and the riveting piece positioning hole of the lower module mechanism 6);
step 3: the horizontal transplanting mechanism 2 acts, namely the horizontal transplanting mechanism 2 sends the PCB 7 with the LIF connector assembly 8 to the middle position of the upper module mechanism 2 and the lower module mechanism 6;
step 4: lifting the lower module mechanism 6, pressing the upper module mechanism 5 downwards, and tightly pressing the PCB 7, the LIF connector assembly 8, the rivet 82 and the rivet piece 9 together;
step 5: the pen-shaped cylinder 622 in the lower module mechanism 6 acts to open the rivet 82;
step 6: resetting the upper module mechanism 5 and then resetting the lower module mechanism 6;
step 7: the horizontal transplanting mechanism 2 acts, that is, the horizontal transplanting mechanism 2 retreats, the first LIF connector 81 is riveted, the above steps are repeatedly executed, and the riveting of the rest LIF connectors 81 is completed in sequence.
In summary, the automatic riveting equipment for the connector on the probe card and the PCB provided by the embodiment of the application has at least the following advantages compared with the prior art:
(1) According to the full-automatic riveting equipment for the LIF connector and the PCB on the probe card, through the common cooperation operation of the horizontal transplanting mechanism 2, the automatic feeding mechanism 3, the automatic feeding mechanism 4, the upper module mechanism 5 and the lower module mechanism 6, the whole riveting process does not need manual interference, and meanwhile, the automatic feeding, positioning and crimping processes are realized, the crimping speed is high, the positioning and operation precision is high, the reliability is good, even if the riveting parts (rivets, riveting sheets and the like) with smaller sizes are specially applicable to the probe card, the good positioning, accurate feeding and efficient riveting can be realized, and the automatic production of the probe card can be realized by combining the whole riveting process with other automatic equipment in the later period;
(2) The automatic feeding mechanism of the riveting sheets adopts the vibration disc mechanism to carry out material arrangement and conveying, the simultaneous suction of a plurality of riveting sheets is realized in a pneumatic control mode, the placement positions of the riveting sheets are automatically adjusted by virtue of the X module and the Z-axis rail, finally, the existence and position detection after the riveting sheets are fed are realized by virtue of the camera system, the automatic feeding mechanism of the connector assembly can be synchronously carried out, and the whole process of feeding is accurate, quick, no manual interference is required, and the missing and the loss of the riveting sheets are difficult to occur;
(3) The automatic feeding mechanism of the connector assembly adopts the vibration disc mechanism to carry out material arrangement and conveying, the grabbing of the connector assembly is realized through the grabbing mechanism, the placing position of the connector assembly is automatically adjusted by means of the Y, Z module, and the whole process has the advantages of accurate feeding, high speed, no manual interference, difficult occurrence of wrong installation, neglected installation and the like of the connector assembly;
(4) The upper module mechanism and the lower module mechanism adopt a pneumatic control mode to realize the downward pressing of the operating rod, further achieve the purpose of riveting the connector assembly and the PCB, and improve the riveting efficiency and the riveting reliability.
It should be noted that the directions of the X axis, the Y axis and the Z axis in the above embodiments and the drawings are merely exemplary, and may be changed and selected according to the needs in the specific implementation without departing from the inventive concept claimed in the present application, and the present application is not limited to the embodiments. In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the method embodiments described later, since they correspond to the methods, the description is relatively simple, and reference should be made to the partial description of the system embodiments for relevant points.
Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.
Furthermore, the order in which the elements and sequences are processed, the use of numerical letters, or other designations in the description are not intended to limit the order in which the processes and methods of the description are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present disclosure. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing processing device or mobile device.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present application.
Claims (9)
1. The automatic riveting equipment for the connector on the probe card and the PCB is characterized by comprising a horizontal transplanting mechanism, an automatic feeding mechanism, an upper module mechanism and a lower module mechanism, wherein the horizontal transplanting mechanism is used for realizing displacement and positioning of the PCB; the automatic feeding mechanism is used for placing a connector assembly on the PCB, wherein the connector assembly is preloaded with at least one rivet; the automatic feeding mechanism is used for positioning a riveting piece matched with the rivet to a position below the PCB and corresponding to the rivet; under the combined action of the upper module mechanism and the lower module mechanism, the rivet, the connector assembly, the PCB and the riveting piece are pressed tightly, and riveting of the connector assembly and the PCB is realized through matching of the rivet and the riveting piece; the automatic feeding mechanism comprises a second vibration disc mechanism, a third displacement module, an absorbing mechanism and a camera mechanism, wherein the second vibration disc mechanism is used for conveying the riveting piece, the third displacement module is linked with the absorbing mechanism, so that the absorbing mechanism absorbs the riveting piece and places the riveting piece in a riveting piece positioning hole of the lower module mechanism, and the camera mechanism is used for detecting the positioning state of the riveting piece.
2. The automated riveting apparatus according to claim 1, wherein the horizontal transplanting mechanism comprises a first displacement module and a rotational positioning mechanism, the rotational positioning mechanism is disposed on the first displacement module, and the first displacement module is configured to move the PCB and rotationally position the connector assembly to a preset assembly alignment position with the upper and lower module mechanisms via the rotational positioning mechanism.
3. The automated riveting apparatus according to claim 1, wherein the automatic feed mechanism comprises a first vibration plate mechanism, a second displacement module, and a gripping mechanism, the first vibration plate mechanism 31 for transporting the connector assembly, the gripping mechanism being in linkage with the second displacement module to grip the connector assembly into a connector placement position on the PCB board.
4. The automated riveting apparatus of claim 3, wherein the upper die set mechanism comprises a cylinder and a chute mechanism that, under the cooperation of the cylinder and the chute mechanism, compresses the rivet, the connector assembly, the PCB board, and the rivet blade downward.
5. The automated riveting apparatus of claim 4, wherein the lower die set mechanism comprises a fourth displacement die set, a hold-down mechanism, the fourth displacement die set being in linkage with the hold-down mechanism such that the hold-down mechanism compresses the rivet sheet, the PCB board, the connector assembly, and the rivet upward.
6. The automated riveting apparatus of claim 5, wherein the fourth displacement module comprises a cylinder push rod and a chute linkage that are coupled to each other.
7. The automated riveting apparatus of claim 5, wherein the hold-down mechanism comprises a pen cylinder and a linkage, the pen cylinder operable to actuate the linkage to prop open the rivet such that the rivet blade is riveted to the connector assembly.
8. The automated riveting apparatus according to claim 7 further comprising a stand, a chassis table, and a support plate above the chassis table, wherein the horizontal transplanting mechanism, the automatic feeding mechanism, the automatic loading mechanism, the upper die set mechanism, and the lower die set mechanism are all disposed on the chassis table, and the upper die set mechanism is disposed on the support plate.
9. The automated riveting apparatus of claim 8, wherein the rivet and the rivet blade have the same number, and the number of rivets and rivet blades is greater than 4.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310897765.9A CN116618571B (en) | 2023-07-21 | 2023-07-21 | Automatic riveting equipment for connector and PCB on probe card |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310897765.9A CN116618571B (en) | 2023-07-21 | 2023-07-21 | Automatic riveting equipment for connector and PCB on probe card |
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| CN116618571A true CN116618571A (en) | 2023-08-22 |
| CN116618571B CN116618571B (en) | 2023-10-20 |
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