CN116614959A

CN116614959A - Plastic packaging method for exposed pins, plastic packaging circuit board and power module

Info

Publication number: CN116614959A
Application number: CN202310740494.6A
Authority: CN
Inventors: 郭文龙; 史向阳; 何明建; 刘少良
Original assignee: Sky Chip Interconnection Technology Co Ltd
Current assignee: Sky Chip Interconnection Technology Co Ltd
Priority date: 2023-06-20
Filing date: 2023-06-20
Publication date: 2023-08-18

Abstract

The application relates to the technical field of circuit board manufacturing, and discloses a plastic packaging method for exposing pins, a plastic packaging circuit board and a power module, so as to ensure that the exposed pins are free from glue overflow. The method comprises the following steps: mounting required components on a carrier plate, and mounting pins on the carrier plate, wherein one exposed end of each pin is provided with a step matched with the plastic package thickness and the pin exposure requirement, and a sealing ring is sleeved on one exposed end of each pin; a lower die provided with a pin hole is arranged on the carrier plate in a sticking way, so that a needle head of the pin is inserted into the pin hole, and the sealing ring is attached to the upper surface of the lower die to form a piece to be molded; and carrying out plastic packaging treatment on the to-be-molded part to obtain the circuit board after plastic packaging.

Description

Plastic packaging method for exposed pins, plastic packaging circuit board and power module

Technical Field

The application relates to the technical field of circuit board manufacturing, in particular to a plastic packaging method for a plated exposed contact pin, a plastic packaging circuit board and a power module.

Background

The electronic product or the equipment generally comprises a plurality of circuit modules, such as a power module, and the application scene of the power module is more, so that in order to ensure that the parts of the power module are not affected by severe environments, the parts can be packaged on the basis of a traditional packaged power supply to form a plastic package module by plastic packaging with an upper insulator, and the purposes of preventing water vapor, haze, protecting the parts and the like are achieved.

In the plastic package modules, many plastic package modules are provided with PINs (PINs) which are exposed on the surface of plastic package materials and used for realizing the electric connection between the plastic package modules and an external Printed Circuit (PCB), and the welding strength is high, but ensuring that the exposed PINs do not overflow glue is a key problem to be solved.

Disclosure of Invention

Based on the above, it is necessary to provide a plastic packaging method for exposing pins, a plastic packaging circuit board and a power module, so as to solve the technical problem of glue overflow of the exposed pins of the plastic packaging module in the prior art.

The plastic packaging method for the exposed pin comprises the following steps:

mounting required components on a carrier plate, and mounting pins on the carrier plate, wherein one exposed end of each pin is provided with a step matched with the exposure requirement of the pin with plastic package thickness;

sleeving a sealing ring at one exposed end of the contact pin;

a lower die provided with a pin hole is arranged on the carrier plate in a sticking way, so that a needle head of the pin is inserted into the pin hole, and the sealing ring is attached to the upper surface of the lower die to form a piece to be molded;

and carrying out plastic packaging treatment on the to-be-molded part to obtain the circuit board after plastic packaging.

Further, the carrier plate is attached to a lower die provided with pin holes, so that pins are inserted into the pin holes and the sealing rings are attached to the lower die to form a part to be molded, and the method comprises the following steps:

and the carrier plate is attached with a lower die provided with pin holes, so that the pins are inserted into the pin holes, and the sealing rings are attached with the lower die in vacuum to form a piece to be molded.

Further, the mounting of the required components on the carrier board includes:

attaching a first electronic element to a first surface of the carrier plate, wherein the first electronic element comprises a chip;

and a second electronic element is attached to the second surface of the carrier plate, and the second electronic element comprises a magnetic core.

Further, the attaching the pins on the carrier board includes:

and welding pins on the carrier plate by adopting a surface mounting technology.

Further, the plastic packaging treatment is performed on the to-be-molded part to obtain a circuit board after plastic packaging, which comprises the following steps:

and fixing the part to be molded in a plastic packaging die for double-sided plastic packaging to obtain the circuit board after double-sided plastic packaging.

Further, the carrier board comprises a printed circuit board PCB, a quad flat no-lead QFN frame or a package substrate.

Provided is a plastic-packaged circuit board including:

the device comprises a carrier plate, wherein required components and pins are mounted on the carrier plate, a step matched with the requirement of plastic package thickness pin exposure is arranged at one exposed end of the pin, and a sealing ring is sleeved at one exposed end of the pin;

the lower plastic package structure is packaged on one surface of the carrier plate, which is exposed out of the contact pin, wherein one end of the contact pin is exposed out of the lower plastic package structure, and the sealing ring is embedded in the lower plastic package structure and is attached to the injection molding material.

Further, the plastic package circuit board further comprises an upper plastic package structure, and the upper plastic package structure is packaged on one surface of the carrier plate, which is not exposed out of the contact pin.

There is provided a power module comprising a plastic encapsulated circuit board as claimed in any one of the preceding claims.

In one of the above schemes, a plastic packaging method for exposing the pins is provided, which is a novel plastic packaging process, because the pin holes are designed on the lower die of the pin surface, the pins can be inserted into the pin holes, the sealing rings and the lower die are completely attached, and in the plastic packaging process, the pin overflow glue can be effectively avoided, and the welding is blocked, so that the plastic packaging module for exposing the pins can not appear or reduce the overflow glue, and the plastic packaging method has higher practicability.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments of the present application will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flow chart of a molding method for exposing pins according to an embodiment of the present application;

fig. 2 to fig. 5 are schematic views of each preparation process of a plastic packaging method for exposed pins according to an embodiment of the present application.

Fig. 6 is a schematic diagram of a plastic package circuit board prepared by a plastic package method for exposing pins according to an embodiment of the present application.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects solved by the application more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments.

It is to be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

It will be further understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

It will be further understood that the terms "upper," "lower," "left," "right," "front," "rear," "bottom," "middle," "top," and the like may be used herein to describe various elements and that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings merely to facilitate describing the application and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operate in a particular orientation, and that these elements should not be limited by these terms.

These terms are only used to distinguish one element from another element. For example, a first element could be termed a "upper" element, and, similarly, a second element could be termed a "upper" element, depending on the relative orientation of the elements, without departing from the scope of the present disclosure.

It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

In an embodiment of the present application, as shown in fig. 1, a plastic packaging method for exposing pins is provided, which is a novel plastic packaging process, so that a plastic packaging module for exposing pins does not appear or reduce the occurrence of glue overflow, and the plastic packaging method includes:

s101: mounting required components on a carrier plate, and mounting pins on the carrier plate, wherein one exposed end of each pin is provided with a step matched with the plastic package thickness and pin exposure requirements;

in this embodiment, a carrier board is provided first, then according to the requirements of the circuit module to be manufactured, the required components, such as a chip, a resistor, a capacitor and the like, are mounted on the carrier board, and according to the requirements of the circuit module to be manufactured, pins are mounted on the carrier board, and the number of pins required by the circuit module is used for connecting with an external PCB board. The exposed end of the pin is provided with a step matching with the plastic package thickness and the pin exposure requirement, and the step may be a circular step as illustrated in fig. 3, or another form of step, which is not limited in particular. The exposed pin is required to include the length, shape, etc. of the exposed portion, and is not particularly limited, as long as it is required to be a circuit module. And attaching contact pins on the carrier plate

In an embodiment, the mounting of the required components on the carrier includes:

In this embodiment, as shown in fig. 2-3, according to the requirements of the circuit module to be manufactured, the first surface and the second surface of the carrier board are respectively attached with the required electronic components, as shown in fig. 1, and the carrier board is provided with pin through holes, which are exemplified by two pin jacks, but not limited thereto. Illustratively, a first electronic component such as a Flip Chip (FC), an inductor, a resistor, and a capacitor is attached to the first surface of the carrier. Then, a second electronic element such as a magnetic core, an inductor, a resistor, a capacitor and the like is attached to the second surface of the carrier, namely the other surface opposite to the first surface, and one ends of the two pins are respectively attached to the two pin through holes of the carrier.

It should be noted that, the examples of the drawings are only illustrative, and not limiting to the embodiments of the present application, and in other embodiments, the differences from the circuit modules may be corresponding changes, such as electronic components, the number of veneers, and the number of pins, which are not specifically illustrated.

In an embodiment, the attaching the pins on the carrier includes: and welding pins (SMT welding pins) on the carrier plate by adopting a surface mounting technology. In this embodiment, due to the plastic packaging characteristic and further preventing glue overflow, the surface mounting technology is adopted to mount the pins, so as to ensure the plastic packaging effect to the greatest extent. Of course, other pin mounting processes may be used, and the method is not particularly limited.

In one embodiment, the carrier comprises a printed circuit board PCB, a quad flat no-lead QFN frame, or a package substrate. That is, the plastic packaging method provided by the embodiment of the application has various application scenes, and the carrier plates such as a Printed Circuit Board (PCB), a square flat pin-free QFN frame or a packaging substrate can be used for effectively preventing the plastic packaged circuit module with exposed pins from overflowing glue, so that the safety and reliability of the circuit module are ensured.

S102: sleeving a sealing ring at one exposed end of the contact pin;

in this embodiment, after the pin is mounted on the carrier, a sealing ring is sleeved on the exposed end of the pin, so that the sealing ring is attached to the step side of the step opposite to the carrier, where the sealing ring needs to have characteristics that meet requirements, including toughness and high temperature resistance, and the sealing ring needs to be set according to the required product design requirements, including parameters such as dimensional tolerance. For example, as shown in fig. 4, the sealing ring may also be a circular sealing ring, which is matched with a circular step provided at one end of the pin, and is not limited in particular.

S103: and the carrier plate is attached with a lower die provided with pin holes, so that the needle heads of the pins are inserted into the pin holes, and the sealing rings are attached with the upper surface of the lower die to form a piece to be molded.

In an embodiment, the mounting of the carrier plate on the lower die with pin holes, inserting the pins into the pin holes and bonding the seal ring with the lower die to form a part to be molded includes: and the carrier plate is attached with a lower die provided with pin holes, so that the pins are inserted into the pin holes, and the sealing rings are attached with the lower die in vacuum to form a piece to be molded.

As shown in fig. 4, a lower mold (cavity bar) with pin holes is mounted on the carrier plate, so that the pins are inserted into the pin holes and the sealing rings are vacuum bonded with the lower mold to form a to-be-molded part, and the sealing performance can be improved in a vacuum bonding manner, so that the glue overflow condition is reduced.

It should be noted that, the lower die needs special design, designs the contact pin hole at contact pin face lower die, makes its contact pin can insert wherein, contact pin and sealing washer/mould trompil design match and sealing washer and lower die jack vacuum laminate completely, is very effectual improvement contact pin glue spilling key technology, reinforcing and carrier plate welding strength and reliability, in the plastic envelope process, can effectively avoid the contact pin glue spilling to avoid hindering the welding.

S104: and carrying out plastic packaging treatment on the to-be-molded part to obtain the circuit board after plastic packaging.

After a sealing ring is sleeved on one exposed end of the contact pin, a lower die with a contact pin hole is arranged on the carrier plate, the needle head of the contact pin is inserted into the contact pin hole, the sealing ring is attached to the upper surface of the lower die, a part to be molded is formed, and then the part to be molded is subjected to plastic packaging treatment, so that the circuit board after plastic packaging is obtained.

In an embodiment, the performing plastic packaging on the to-be-molded part to obtain a circuit board after plastic packaging includes: and fixing the part to be molded in a plastic packaging die for double-sided plastic packaging to obtain the circuit board after double-sided plastic packaging.

As shown in fig. 4 to 6, in this embodiment, if electronic components are attached to both sides of the carrier board, the piece to be molded may be fixed in a molding die for double-sided molding, that is, the first side of the carrier board is covered by an upper die (cavity bar), and then double-sided molding is performed, so that the circuit board after double-sided molding as shown in fig. 6 is obtained, and the safety of the device on the first side of the carrier board is also ensured.

It should be noted that, the circuit board formed by the double-sided plastic package may include one or more circuit modules, for example, include a plurality of power modules, so that the circuit board after being obtained by plastic packaging is cut into a single piece, thereby obtaining each circuit module.

Therefore, in the embodiment, the plastic packaging method for the exposed pin is provided, and is a novel plastic packaging process, because the pin holes are designed on the lower die of the pin surface, the pins can be inserted into the pin holes, the sealing rings and the lower die are completely attached, and in the plastic packaging process, the pin overflow glue can be effectively avoided, and the welding is blocked, so that the plastic packaging module for the exposed pin can not appear or reduce the glue overflow situation, and the plastic packaging method has higher practicability.

In one embodiment, a plastic encapsulated circuit board is provided, the plastic encapsulated circuit board comprising:

In the embodiment, the plastic package circuit board obtained by the plastic package method using the exposed pins is a novel plastic package process, and because the pin holes are designed on the lower die of the pin surface, the pins can be inserted into the pin holes, the sealing rings and the lower die are completely attached, and glue overflow of the pins can be effectively avoided and welding is prevented in the plastic package process, so that the plastic package circuit board with the exposed pins cannot occur or can be reduced, and the plastic package circuit board has higher practicability.

In an embodiment, the plastic package circuit board further includes an upper plastic package structure, and the upper plastic package structure is packaged on a surface of the carrier board, which is not exposed by the pins. The first surface of the carrier plate is covered by an upper die (cavity bar), and then double-sided plastic packaging is carried out, so that the circuit board with the double-sided plastic packaging shown in fig. 6 is obtained, and the safety of devices on the first surface of the carrier plate is ensured.

In one embodiment, the carrier comprises a printed circuit board PCB, a quad flat no-lead QFN frame, or a package substrate. That is, the plastic package circuit board provided by the embodiment of the application has various application scenes, and the carrier boards such as a printed circuit board PCB, a square flat pin-free QFN frame or a packaging substrate can adopt the plastic package method provided by the application, so that the situation that glue overflows on the plastic packaged circuit module with exposed pins is effectively prevented, and the safety and reliability of the circuit module are ensured.

In an embodiment, a power module includes a plastic-encapsulated circuit board obtained by the plastic-encapsulated method of any of the embodiments.

The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims

1. The plastic packaging method for the exposed pin is characterized by comprising the following steps of:

mounting required components on a carrier plate, and mounting pins on the carrier plate, wherein one exposed end of each pin is provided with a step matched with the plastic package thickness and pin exposure requirements;

sleeving a sealing ring at one exposed end of the contact pin;

2. The method for molding exposed pins according to claim 1, wherein said mounting a lower die with pin holes thereon to insert said pins into said pin holes and said sealing ring is bonded to said lower die to form a part to be molded, comprises:

3. The method for plastic packaging of exposed pins as set forth in claim 1, wherein said mounting the required components on the carrier comprises:

4. The method for plastic packaging of exposed pins as set forth in claim 1, wherein said attaching pins to said carrier comprises:

5. The method for plastic packaging the exposed pin according to claim 1, wherein the plastic packaging the to-be-molded part to obtain the circuit board after plastic packaging comprises:

6. The method of claim 1, wherein the carrier comprises a printed circuit board PCB, a quad flat no-lead QFN frame, or a package substrate.

7. A plastic-encapsulated circuit board, characterized in that the plastic-encapsulated circuit board comprises:

8. The plastic-packaged circuit board of claim 7, further comprising an upper plastic-packaged structure, wherein the upper plastic-packaged structure is packaged on a side of the carrier plate not exposed by the pins.

9. The plastic packaged circuit board of claim 7, wherein the carrier comprises a printed circuit board PCB, a quad flat no-lead QFN frame, or a package substrate.

10. A power module comprising a plastic encapsulated circuit board according to any of claims 7-9.