CN213546318U - Three-dimensional packaging structure based on radio frequency chip - Google Patents
Three-dimensional packaging structure based on radio frequency chip Download PDFInfo
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- CN213546318U CN213546318U CN202022222287.6U CN202022222287U CN213546318U CN 213546318 U CN213546318 U CN 213546318U CN 202022222287 U CN202022222287 U CN 202022222287U CN 213546318 U CN213546318 U CN 213546318U
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Abstract
The utility model discloses a three-dimensional packaging structure based on radio frequency chip, which relates to the packaging field, and comprises a bottom plate, a first substrate, a second substrate and a metal coating, wherein the bottom plate is provided with a plurality of contact pins; the first substrate is positioned above the bottom plate and is provided with a chip and an electronic component; the second substrate is positioned above the first substrate, the second substrate is provided with a radio frequency connector and a radio frequency chip, the radio frequency chip is connected with the radio frequency connector, and an interface of the radio frequency connector is positioned on the side face of the three-dimensional packaging structure; the metal coating is arranged on the surface of the three-dimensional packaging structure. Radio frequency signals are led out from the side face of the three-dimensional packaging structure through the interface of the radio frequency connector, so that electromagnetic interference of the radio frequency signals of the module is effectively inhibited, and the working stability and reliability of the module are improved.
Description
Technical Field
The utility model relates to a packaging field, in particular to three-dimensional packaging structure based on radio frequency chip.
Background
In the related art, a sealed module is manufactured through a series of processes, however, as the integration degree of the module is more and more complex, the working frequency of an internal device is faster and faster, special processing is generally needed for designing a radio frequency signal circuit, a signal link and a connector need to shield external interference signals in communication, the radio frequency signals cannot meet the requirements in a surface wiring carving mode, and the problems that the external interference signals interfere the communication and the integrity of the signals cannot be guaranteed still exist.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a three-dimensional packaging structure based on radio frequency chip can effectively solve radio frequency signal and external signal interference, shields external interfering signal, guarantees high-speed signal integrality, improves the stability and the reliability of module.
According to the utility model discloses radio frequency chip based three-dimensional packaging structure, including bottom plate, first base plate, second base plate and metallic coating; the bottom plate is provided with a plurality of contact pins; the first substrate is positioned above the bottom plate and is provided with a chip and an electronic component; the second substrate is positioned above the first substrate, the second substrate is provided with a radio frequency connector and a radio frequency chip, the radio frequency chip is connected with the radio frequency connector, and an interface of the radio frequency connector is positioned on the side face of the three-dimensional packaging structure; the metal coating is arranged on the surface of the three-dimensional packaging structure.
According to the utility model discloses three-dimensional packaging structure based on radio frequency chip has following beneficial effect at least: the radio frequency connector is arranged on the second substrate located at the top, and the interface of the radio frequency connector is arranged on the side face of the three-dimensional packaging structure, so that the interface of the radio frequency connector is located on the side face of the top of the three-dimensional packaging structure, radio frequency signals are led out from the three-dimensional packaging structure through the interface of the radio frequency connector, and common signals are led out through a contact pin arranged on the bottom plate, so that the electromagnetic interference of the radio frequency signals of the module is effectively inhibited, and the working stability and reliability of the module are improved.
According to some embodiments of the invention, the radio frequency connector and the radio frequency chip are mounted on an upper surface of the second substrate.
According to some embodiments of the invention, the radio frequency chip is mounted on the radio frequency connector.
According to some embodiments of the present invention, the upper surface of the first substrate is provided with an analog-to-digital converter, a digital-to-analog converter and a memory device, and the lower surface of the first substrate is provided with a first resistance-capacitance device and a second resistance-capacitance device.
According to some embodiments of the invention, the first resistance-capacitance element is located below the analog-to-digital converter, and the second resistance-capacitance element is located below the digital-to-analog converter and the memory device.
According to some embodiments of the present invention, the upper surface of the second substrate is further mounted with a baseband integrated circuit module and a power supply, and the lower surface of the second substrate is mounted with a third resistance capacitance element and a fourth resistance capacitance element.
According to some embodiments of the invention, the third resistance-capacitance element is located below the baseband integrated circuit module and the power supply, and the fourth resistance-capacitance element is located below the radio frequency chip.
According to some embodiments of the present invention, the bottom plate and the first substrate have a certain gap therebetween, and the first substrate and the second substrate have a certain gap therebetween.
According to some embodiments of the invention, the baseband integrated circuit module and the power supply are connected, the digital-to-analog converter and the memory device are connected.
According to some embodiments of the invention, the three-dimensional encapsulation structure is formed by potting the bottom plate, the first substrate and the second substrate.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a three-dimensional package structure according to an embodiment of the present invention;
fig. 2 is a packaging flowchart of the three-dimensional packaging structure according to the embodiment of the present invention.
Reference numerals:
the three-dimensional package structure 100, the bottom plate 110, the first substrate 121, the second substrate 122, the pin 130, the first capacitance resisting device 141, the second capacitance resisting device 142, the third capacitance resisting device 143, the fourth capacitance resisting device 144, the analog-to-digital converter 150, the digital-to-analog converter 160, the memory device 170, the baseband integrated circuit module 180, the power supply 190, the radio frequency chip 210, the radio frequency connector 220, and the interface 221.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the present number, and the terms greater than, less than, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, a schematic diagram of a three-dimensional package structure 100 according to some embodiments is shown, in some embodiments of the present invention, a bottom plate 110 is used as a bottom layer of the three-dimensional package structure 100, and a plurality of pins 130 are mounted on the bottom plate 110, it can be understood that the number of the pins 130 used according to different circuit designs is different, and the present invention is not limited thereto. The first substrate 121 is disposed above the bottom plate 110, a gap exists between the bottom plate 110 and the first substrate 121, the analog-to-digital converter 150, the digital-to-analog converter 160 and the memory device 170 are mounted on the upper surface of the first substrate 121, and the digital-to-analog converter 160 is connected to the memory device 170. The lower surface of the first substrate 121 is provided with a first capacitance resisting device 141 and a second capacitance resisting device 142, the first capacitance resisting device 141 is located below the analog-to-digital converter 150, and the second capacitance resisting device 142 is located below the digital-to-analog converter 160 and the memory device 170, it should be noted that the first capacitance resisting device 141 and the second capacitance resisting device 142 play a role in protecting devices mounted on the upper surface of the first substrate 121, and the roles of the first capacitance resisting device 141 and the second capacitance resisting device 142 include but are not limited to a protection role.
The second substrate 122 is mounted above the first substrate 121, and a gap is formed between the first substrate 121 and the second substrate 122. The second substrate 122 has a baseband integrated circuit module 180, a power supply 190, a radio frequency chip 210 and a radio frequency connector 220 mounted on an upper surface thereof, and the baseband integrated circuit module 180 is connected to the power supply 190, it being understood that the baseband integrated circuit module 180 and the power supply 190 may be regarded as one module in the present embodiment for providing baseband signals. The lower surface of the second substrate 122 is provided with a third capacitance resisting device 143 and a fourth capacitance resisting device 144, the third capacitance resisting device 143 is installed below the baseband integrated circuit module 180 and the power supply 190, and the fourth capacitance resisting device 144 is installed below the radio frequency chip 210, it should be noted that the third capacitance resisting device 143 and the fourth capacitance resisting device 144 play a role in protecting devices installed on the upper surface of the second substrate 122, and the roles of the third capacitance resisting device 143 and the fourth capacitance resisting device 144 include but are not limited to a protection role. The interface 221 of the rf connector 220 is disposed on the side of the three-dimensional package structure 100, the rf chip 210 controls the operation of each device, the generated rf signal is led out from the side of the three-dimensional package structure 100 through the rf connector 220, and the normal signal is led out from the pin 130. The rf chip 210 and the rf connector 220 may be connected by a circuit printed on the substrate, or may be connected by a laser engraved surface circuit.
It should be noted that the resistance-capacitance device is a device or a circuit module formed by a resistor, a capacitor or a combination of the resistor and the capacitor, the number of the substrates is more than two, the number of the substrates can be increased according to the function added as required, and the number of the substrates is not limited in the present invention.
There is a gap between the bottom plate 110 and the first substrate 121, and a gap between the first substrate 121 and the second substrate 122, that is, there is a gap between each layer of the three-dimensional package structure 100, and epoxy resin is filled in the gap, and the three-dimensional package structure 100 encapsulates the bottom plate 110, the first substrate 121, and the second substrate 122 with epoxy resin to form an integral module, it can be understood that, by encapsulation, the bottom plate 110, the first substrate 121, the second substrate 122, and devices on each layer form a module capable of communicating with the outside. The encapsulation into a module can improve the resistance of the device to external impact and vibration. A metal plating layer (not shown) is disposed on the surface of the three-dimensional package structure 100 to protect the three-dimensional package structure 100, and lines may be engraved on the metal plating layer (not shown) to communicate the lines of each layer.
The radio frequency chip 210 controls the module to generate a radio frequency signal, and the radio frequency signal is led out from the side surface of the module through the interface 221 of the radio frequency connector 220, so that the electromagnetic interference of the radio frequency signal of the module is effectively inhibited, the integrity of the signal is ensured, and the working stability and reliability of the module are improved.
The utility model discloses an in some embodiments, the material for the embedment can be organosilicon gel, when using organosilicon gel to carry out the embedment, can not corrode the device on the base plate to because organosilicon gel becomes transparent elastomer after vulcanizing, can do the protection to inside device, improved the module to the resistance of external impact, vibrations, improve and to see through the device that organosilicon gel observed the encapsulation externally, still can pierce into with the needle, be convenient for detect the parameter of device, help detecting and maintaining.
Referring to fig. 2, a packaging flowchart of the three-dimensional packaging structure 100 according to an embodiment of the present invention is shown, and in some embodiments of the present invention, the packaging process of the three-dimensional packaging structure 100 includes, but is not limited to, step S110, step S120, step S130, step S140, step S150, and step S160.
In step S110, the laminate is electrically mounted.
The laminated board electric device includes: the desired devices are soldered to the base plate 110 or substrate and electrical testing is performed after the soldering is complete. It will be appreciated that the electrical test is a test that detects whether the device-mounted board 110 and the substrate can operate properly after soldering.
Step S120, the stacked plates are stacked.
The stack of laminates comprises: the lead frame (not shown), the base plate 110, the step-up plate (not shown), and the substrate are stacked in a vertical direction by using a custom mold.
Step S130, resin potting molding.
The resin potting molding comprises: through epoxy embedment press mold shaping, dry the solidification again, demolish the mould, form a sealed encapsulation module, avoid the radio frequency connector 220 of top layer through the customization mould, avoid epoxy embedment to radio frequency connector 220.
And step S140, cutting and forming.
The cutting and forming comprises the following steps: and cutting and molding the encapsulated module by using a precision resin cutting machine according to the design size requirement of the product, so that the product meets the size requirement.
Step S150, surface metallization.
The surface metallization treatment comprises the following steps: the surface of the module is completely metallized by adopting a nickel alloy material, the signal lines are interconnected through surface laser, the metal surface with the signal lines is removed, and other metal surfaces of the module are connected with a ground signal.
And step S160, surface connecting line carving.
The surface wiring engraving comprises: and (3) drawing surface circuits by a laser engraving machine according to a laser engraving drawing to realize interconnection among the circuits of each layer of the module.
In some embodiments of the present invention, the device is mounted on the bottom plate 110, the first substrate 121, and the second substrate 122 by welding, and an electrical test is performed to detect whether the bottom plate 110, the first substrate 121, and the second substrate 122 on which the device is mounted can normally operate. The lead frame (not shown), the bottom plate 110, the raised plate (not shown), the first substrate 121 and the second substrate 122 are stacked in a vertical direction by using a custom mold, and it can be understood that the lead frame (not shown) is a common structure and is a key structural member for electrically connecting the lead-out terminal of the internal circuit of the chip with the external lead to form an electrical circuit; the raised plates (not shown) leave gaps between the layers to facilitate the resin in the potting process. Resin encapsulation molding is carried out, film pressing molding is carried out through epoxy resin encapsulation, drying and curing are carried out again, the mold is removed, a sealed encapsulation module is formed, the radio frequency connector 220 on the top layer is avoided through the customized mold, and the resin encapsulation is avoided from being carried out to the radio frequency connector 220. The surface of the module is completely metallized by adopting a nickel alloy material, the signal lines are interconnected through surface laser, the metal surface with the signal lines is removed, and other metal surfaces of the module are connected with a ground signal. It should be noted that other alloy materials, such as aluminum alloy, may be used to metalize the surface of the module. And (4) engraving surface circuits on the metal coating by using a laser engraving machine according to the laser engraving pattern to realize interconnection among the circuits of each layer of the module.
Can will through above-mentioned preparation flow the utility model provides a three-dimensional packaging structure 100 makes, uses and can improve correlation technique in the technology to produce the electromagnetic interference who effectively restraines radio frequency signal, improve the stability and the reliability of module work.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. A three-dimensional packaging structure based on radio frequency chip, characterized by comprising:
the bottom plate is provided with a plurality of contact pins;
the first substrate is positioned above the bottom plate, and is provided with a chip and an electronic component;
the second substrate is positioned above the first substrate, the second substrate is provided with a radio frequency connector and a radio frequency chip, the radio frequency chip is connected with the radio frequency connector, and an interface of the radio frequency connector is positioned on the side face of the three-dimensional packaging structure;
and the metal coating is arranged on the surface of the three-dimensional packaging structure.
2. The radio frequency chip-based three-dimensional packaging structure according to claim 1, wherein the radio frequency connector and the radio frequency chip are mounted on an upper surface of the second substrate.
3. The radio frequency chip-based three-dimensional packaging structure according to claim 1, wherein the radio frequency chip is mounted close to the radio frequency connector.
4. The radio frequency chip-based three-dimensional packaging structure according to claim 1, wherein an analog-to-digital converter, a digital-to-analog converter and a memory device are mounted on an upper surface of the first substrate, and a first capacitance resisting device and a second capacitance resisting device are mounted on a lower surface of the first substrate.
5. The radio frequency chip-based three-dimensional packaging structure according to claim 4, wherein the first resistance-capacitance device is located below the analog-to-digital converter, and the second resistance-capacitance device is located below the digital-to-analog converter and the memory device.
6. The radio frequency chip-based three-dimensional package structure according to claim 5, wherein a baseband integrated circuit module and a power supply are further mounted on the upper surface of the second substrate, and a third capacitance-resisting device and a fourth capacitance-resisting device are mounted on the lower surface of the second substrate.
7. The radio frequency chip-based three-dimensional package structure according to claim 6, wherein the third capacitance resisting device is located below the baseband integrated circuit module and the power supply, and the fourth capacitance resisting device is located below the radio frequency chip.
8. The radio frequency chip-based three-dimensional package structure according to claim 1, wherein a gap is formed between the bottom plate and the first substrate, and a gap is formed between the first substrate and the second substrate.
9. The radio frequency chip-based stereoscopic packaging structure of claim 7, wherein the baseband integrated circuit module is connected to the power supply, and the digital-to-analog converter is connected to the memory device.
10. The radio frequency chip-based stereoscopic packaging structure of claim 1, wherein the stereoscopic packaging structure is formed by potting the bottom plate, the first substrate and the second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022222287.6U CN213546318U (en) | 2020-09-30 | 2020-09-30 | Three-dimensional packaging structure based on radio frequency chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022222287.6U CN213546318U (en) | 2020-09-30 | 2020-09-30 | Three-dimensional packaging structure based on radio frequency chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213546318U true CN213546318U (en) | 2021-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022222287.6U Active CN213546318U (en) | 2020-09-30 | 2020-09-30 | Three-dimensional packaging structure based on radio frequency chip |
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| Country | Link |
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| CN (1) | CN213546318U (en) |
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