CN216449724U

CN216449724U - Laser radar device

Info

Publication number: CN216449724U
Application number: CN202220750278.0U
Authority: CN
Inventors: 周志国; 钟峰
Original assignee: Dongguan Chunrui Electronic Technology Co ltd
Current assignee: Dongguan Chunrui Electronic Technology Co ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-05-06
Anticipated expiration: 2032-04-02

Abstract

The utility model discloses a laser radar device, which comprises a first substrate and a second substrate, wherein the second substrate is pressed on the first substrate, the second substrate is provided with a mounting hole for forming a step, a functional chip is arranged in the mounting hole, the functional chip is bonded and connected with the first substrate, an optical unit is also arranged above the functional chip, the optical unit is fixedly arranged on the step, the size of the sensor is smaller compared with a sensor packaged by ceramics, the complexity and precision of a bonding circuit can meet the packaging requirement of a high-performance chip, the manufacturing process is simple, and the first substrate and the second substrate can be completely bonded into a whole due to the fact that the surface of a PCB is subjected to flattening treatment, so that the air tightness and reliability of the whole packaging support plate can well meet the requirements of vehicle specifications.

Description

Laser radar device

Technical Field

The utility model belongs to the technical field of sensors, and particularly relates to a laser radar device.

Background

The high-performance solid-state laser radar device package generally adopts a ceramic substrate as a package carrier plate, and has the advantages of good sealing performance, high stability, good heat dissipation performance and the like, but the ceramic substrate has the defects of brittle and fragile texture, poor adhesion of a surface metal circuit, difficulty in complex precision processing and the like, so that the finished sensor device has a large overall dimension, cannot be processed by complex precision circuits, is difficult to meet the package requirement of a higher-performance chip, and the size or the performance of the packaged laser radar device is limited;

in addition, the lidar device generally includes an optical component for filtering unwanted light, and is usually fixed on the package carrier by pressing, but the optical component is easy to slide during pressing, so that the optical component and the package are dislocated, which affects the normal use of the lidar device.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a laser radar device that solves the problems set forth in the background art described above.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a laser radar device, includes base plate one to and pressfitting base plate two on base plate one, be equipped with the mounting hole that forms the step on base plate two, be equipped with the function chip in the mounting hole, the function chip is bound with base plate one and is connected, is located function chip top and still is equipped with optical unit, optical unit sets firmly on the step.

According to the technical scheme, the two substrates comprise a first light cup plate and a second light cup plate which are connected in a pressing mode, a first light cup hole is formed in the first light cup plate, a second light cup hole corresponding to the first light cup hole is formed in the second light cup plate, the aperture of the second light cup hole is larger than that of the first light cup hole, a mounting hole with a step is formed above the functional chip, and an optical unit is fixedly arranged in the mounting hole.

According to the technical scheme, the first substrate comprises a PCB, two surfaces of the PCB are respectively provided with a first packaging pad and a second packaging pad which are communicated with each other, and solder resist materials are filled on the PCB and subjected to windowing treatment, so that two surfaces of the PCB are flat.

According to the further technical scheme, a first through hole is formed in the PCB in a drilling mode, a conducting layer is arranged in the first through hole, and the first packaging pad is connected with the second packaging pad.

Further technical scheme, be equipped with the connection pad that is used for connecting the binding line on the first light cup board, connection pad is connected with the encapsulation pad three of establishing on the PCB board, encapsulation pad three is located same one side of encapsulation pad two.

According to the further technical scheme, a second through hole penetrating through the first cup board and the PCB is formed in a drilling mode, and a conducting layer is arranged in the second through hole to enable the connecting pad to be connected with the third packaging pad.

In a further technical scheme, the optical unit is an optical filter or an optical lens.

In a further technical scheme, the optical unit is a light-transmitting block formed by injecting resin, wherein the resin is filled in the mounting hole to wrap the functional chip.

According to a further technical scheme, the light-transmitting block extends outwards to form an arch.

The utility model has the beneficial effects that:

1. compared with a sensor packaged by ceramics, the sensor has smaller volume, the complexity and precision of a bonding circuit can meet the packaging requirement of a high-performance chip, the manufacturing process is simple, and the first substrate and the second substrate can be completely laminated into a whole due to the flattening treatment of the surface of the PCB, so that the air tightness and reliability of the whole packaging carrier plate can well meet the requirements of vehicle specifications;

2. through the setting of two-layer light cup board pressfitting, make and form the step between first light cup board and the second light cup board, the optics unit can the pressfitting on the step, can effectively play spacing effect to the optics unit through the mounting hole, avoids sliding the aversion at the in-process of hot pressing.

3. The first optical cup plate is provided with the connecting bonding pads, staggered distribution is formed between the first optical cup plate and the first packaging bonding pads, and the first packaging bonding pads and the connecting bonding pads for bonding the chip are not on the same plane, so that the problem that bonding difficulty is high due to high density can be solved, and meanwhile, the welding line is shorter, and the error rate is reduced.

Additional features and advantages of the utility model will be set forth in the detailed description which follows.

Drawings

FIG. 1: the utility model discloses a schematic mechanism diagram of a first substrate and a second substrate.

FIG. 2: the structure of the utility model is schematically shown as I.

FIG. 3: the structure of the utility model is schematically shown in figure two.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Please refer to fig. 1-2;

the conventional laser radar sensor comprises a receiving part and a transmitting part, wherein the laser radar device in the utility model is the transmitting part and specifically comprises a first substrate 1, a second substrate 2, a functional chip 3 and an optical unit 4, in the embodiment, the substrate comprises a PCB (printed Circuit Board), a first packaging pad 12 and a second packaging pad 13 which are communicated with each other are respectively formed on two surfaces of the PCB through the steps of silk-screen printing, exposure and development, electroplating, etching and the like, and the second substrate 2 can form a mounting hole 23 with a step 233 through etching; the sensor package carrier plate is formed by connecting a first substrate 1 and a second substrate 2 through a step 233 with a mounting hole 23 in a hot-press manner, and it should be noted that, because the size of the sensor package carrier plate is very small, the sensor package carrier plate cannot be manufactured individually under normal conditions, a carrier plate profile is formed by hot-press by generally adopting a whole large substrate 1 and a large substrate 2, and finally the carrier profile is divided into individual sensor package carrier plates through a cutting manner; then, bonding the functional chip 3 and the first package pad 12 by using equipment, and then pressing the optical unit 4 into the step 233 in a hot press manner, wherein the step 233 is also located in the mounting hole 23, that is, the optical unit 4 is also located in the mounting hole 23, and the mounting hole 23 can effectively limit the optical unit 4, so as to avoid sliding displacement in the hot press process, when displacement occurs, the adhesive can block the emission and reception of the functional chip 3, and can also affect the sealing performance, the step 233 can be fixed and pressed, and can also be sealed on the vertical surface of the step 233, that is, the side surface of the optical filter (the pressing adhesive can wrap the side surface);

the structure of the second substrate 2 is explained in this embodiment;

the second substrate 2 may be a unitary plate, and the mounting hole 23 having the step 233 is formed by etching, in the embodiment, the second substrate 2 includes a first cup plate 21 and a second cup plate 22, the first cup plate 21 and the second cup plate 22 are cut by a slow wire cutting machine to form a first cup hole 231 and a second cup hole 232 corresponding to the first package pad 12, wherein the aperture of the second cup hole 232 is larger than that of the first cup hole 231, and then the PCB board and the first cup board 21 are pressed together by the hot press, meanwhile, the first package pad 12 is made to correspond to the first cup hole 231, and the second cup plate 22 is pressed on the first cup plate 21 by thermal pressing, meanwhile, the second cup hole 232 corresponds to the first cup hole 231, and certainly, the PCB, the first cup plate and the second cup plate 22 can be thermally laminated at one time without steps and can be selected according to actual situations;

since the aperture of the second cup hole 232 is larger than that of the first cup plate 21, the mounting hole 23 having the step 233 is formed in combination with the protruding portion of the second cup hole 232 and the first cup plate 21,

in this embodiment, before the PCB and the first optical cup plate 21 are laminated, the solder resist material 14 is filled on the PCB, and a windowing process is performed to flatten the surface of the PCB, which is to be described, it is described that the steps of filling the solder resist material 14 in and windowing the PCB belong to the prior art, and the description is omitted here, and after the surface of the PCB is flattened, the PCB is laminated with the first optical cup plate 21, so that the first optical cup plate 21 and the PCB can be completely attached to each other, and thus the airtightness of the formed sensor package support is ensured;

in this embodiment, a first through hole 15 is formed in the PCB by drilling, and a conductive layer is disposed in the first through hole 15, so that the first package pad 12 is connected to the second package pad 13.

Traditional bonding mode needs set up two at least pads that are used for the bonding on the PCB board, and one is used for solid brilliant (fixed function chip 3), and another is used for bonding the bonding wire, and in order to realize high accuracy and high sensitivity, the more bonding wire that just needs more bonding pads to be used for connecting the bonding wire of function chip 3 that uses to the further miniaturization of encapsulation carrier plate has been restricted.

Referring to fig. 3, in order to solve the above problems, the first cup plate 21 is provided with the connection pads 24 for connecting the bonding wires, so that the connection pads 24 and the package pads one 12 are distributed in a staggered manner, and the package pads one 12 and the connection pads 24 for bonding the functional chip 3 are not in a plane, thereby solving the problem caused by high density; in addition, the distance of bonding welding lines is shorter, the cost is low, the reliability is high (the possibility of problems caused by the shorter lines is lower), the space is saved, and the protection of the functional chip 3 is enhanced;

the connection pad 24 and the package pad three 16 are connected by drilling a second through hole 25 penetrating through the first cup board 21 and the PCB board, and a conductive layer is provided in the second through hole 25 to connect the connection pad 24 and the package pad three 16.

The optical unit 4 according to the present invention also has various embodiments according to the two bonding methods of the above-described bonding wire, specifically as follows:

in the first embodiment, the functional chip 3 and the bonding wire are both bonded to the first package pad 12 located in the first cup hole 231, and the optical unit 4 is an optical filter and is mounted in the mounting location, which is formed on the basis of the above embodiment, and the technical effects brought by the solution are the same, and specific contents can be referred to the description in the above embodiment;

in the second embodiment, the functional chip 3 and the bonding wires are bonded to the first package pad 12 in the first cup hole 231, and the optical unit 4 is a light-transmitting block formed by injecting resin, wherein the resin fills the package space and covers the functional chip 3.

In the third embodiment, the bonding wires of the functional chip 32 are connected to the connection pads 24, and since the connection pads 24 are disposed on the first cup plate 21, if there is a possibility of pressing the bonding wires using the optical filter, the optical unit 4 also uses a light-transmitting block formed by injecting resin, wherein the mounting holes 23 are filled with resin to wrap the functional chip 3, and the resin extends outward to form an arch, and the arch structure can be realized by a mold during injecting the resin.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it will be understood by those skilled in the art that the specification as a whole and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A laser radar device comprises a first substrate (1) and a second substrate (2) pressed on the first substrate (1), and is characterized in that: be equipped with mounting hole (23) that form step (233) on base plate two (2), be equipped with function chip (3) in mounting hole (23), function chip (3) are bound with base plate (1) and are connected, are located function chip (3) top and still are equipped with optical unit (4), optical unit (4) set firmly on step (233).

2. A lidar device according to claim 1, wherein: the second substrate (2) comprises a first light cup plate (21) and a second light cup plate (22) which are connected in a pressing mode, a first light cup hole (231) is formed in the first light cup plate (21), a second light cup hole (232) corresponding to the first light cup hole (231) is formed in the second light cup plate (22), the aperture of the second light cup hole (232) is larger than that of the first light cup hole (231), a mounting hole (23) with a step (233) is formed above the functional chip (3), and an optical unit (4) is fixedly arranged in the mounting hole (23).

3. A lidar device according to claim 2, characterized in that: the first substrate (1) comprises a PCB, two sides of the PCB are respectively provided with a first packaging pad (12) and a second packaging pad (13) which are communicated with each other, and solder resist materials (14) are filled on the PCB and windowing processing is carried out, so that two sides of the PCB become flat.

4. A lidar device according to claim 3, characterized in that: and forming a first through hole (15) on the PCB in a drilling mode, wherein a conductive layer is arranged in the first through hole (15), so that the first packaging pad (12) is connected with the second packaging pad (13).

5. A lidar device according to claim 3, characterized in that: be equipped with on first light cup board (21) and be used for connecting connection pad (24) of bonding line, connection pad (24) are connected with package pad three (16) of establishing on the PCB board, package pad three (16) are located the same one side of package pad two (13).

6. A lidar device according to claim 5, wherein: and forming a second through hole (25) penetrating through the first cup board (21) and the PCB board in a drilling mode, wherein a conductive layer is arranged in the second through hole (25) to connect the connecting pad (24) with the third packaging pad (16).

7. A lidar device according to claim 3, characterized in that: the optical unit (4) is an optical filter or an optical lens.

8. A lidar device according to claim 5, wherein: the optical unit (4) is a light-transmitting block formed by injecting resin, wherein the mounting hole (23) is filled with the resin to wrap the functional chip (3).

9. A lidar device according to claim 8, wherein: the light-transmitting block extends outwards to form an arch.