CN215499713U - Hollowed-out circuit board and camera module - Google Patents
Hollowed-out circuit board and camera module Download PDFInfo
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- CN215499713U CN215499713U CN202121527496.XU CN202121527496U CN215499713U CN 215499713 U CN215499713 U CN 215499713U CN 202121527496 U CN202121527496 U CN 202121527496U CN 215499713 U CN215499713 U CN 215499713U
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Abstract
The utility model discloses a hollowed-out circuit board and a camera module, relates to the technical field of electronic equipment circuit boards, and solves the technical problem that the hollowed-out circuit board is low in structural strength due to the fact that a hollowed-out part is arranged. This fretwork circuit board includes base plate, reinforcement piece and injection molding material, and the fretwork position has been seted up to the base plate, and the reinforcement piece sets up in the fretwork position of base plate, and the base plate passes through injection molding material integrated injection moulding with the reinforcement piece, and the reinforcement piece inlays to be located in the injection molding material and lie in the fretwork position department of base plate. According to the utility model, the reinforcing sheet is arranged at the hollow part of the substrate, and the substrate and the reinforcing sheet are integrally injection molded by the injection molding material, so that the external force borne by the substrate can be transmitted to the reinforcing sheet through the cured injection molding material, and the purpose of enhancing the structural strength of the substrate is achieved. In addition, the base plate and the reinforcing sheet are integrally formed by injection molding of injection molding materials, and the reinforcing sheet can be prevented from directly contacting with the base plate, so that the problem that the reinforcing sheet damages wiring on the base plate is avoided.
Description
Technical Field
The utility model relates to the technical field of circuit boards of electronic equipment, in particular to a hollowed-out circuit board and a camera module.
Background
The hollow circuit board greatly reduces the structural strength of the circuit board due to the arrangement of the hollow part. The hollow circuit board is easy to be affected by external force in the production processes of transferring, assembling or component making and the like of the hollow circuit board, and the result of deformation and even breakage is easy to generate for the hollow circuit board with low structural strength, so that the rejection rate of the hollow circuit board is increased, and the production and manufacturing efficiency of electronic equipment is influenced. In addition, because the wiring density on the circuit board is very high, if the structural strength of the circuit board is increased by directly connecting the reinforcing part on the circuit board, the problem of damage to the wiring of the circuit board can be caused. Therefore, how to reinforce the structure of the hollow circuit board is a technical problem that needs to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to overcome the defects in the prior art, and in a first aspect, a hollow circuit board is provided to solve the technical problem of low structural strength of the hollow circuit board due to the arrangement of a hollow portion.
The technical scheme adopted by the utility model for solving the technical problem is as follows:
a hollowed-out wiring board comprising:
the substrate is provided with a hollow part;
the reinforcing sheet is arranged at the hollow part of the substrate; and the number of the first and second groups,
the base plate and the reinforcing sheet are integrally injection-molded through the injection molding material;
the reinforcing sheet is embedded in the injection molding material and is positioned at the hollow part of the substrate.
On the basis of the technical scheme, the hollow circuit board can be further improved as follows.
Optionally, the reinforcing sheet is provided with a plurality of embedding holes, and the injection molding material is filled in the embedding holes.
Optionally, the embedding hole is a circular through hole, and the circular through hole is opened at the edge of the reinforcing sheet.
Optionally, the edge of the reinforcing sheet is embedded in the injection molding material, and the bottom surface of the reinforcing sheet at the hollowed-out part is flush with the bottom surface of the injection molding material.
Optionally, the reinforcing sheet is made of a metal sheet.
Optionally, an outer layer circuit is further disposed inside the injection molding material, the outer layer circuit is conducted with the substrate, and an insulating layer is disposed between the outer layer circuit and the substrate.
Optionally, the material of the injection molding material is a thermosetting resin material.
Optionally, the substrate is a hard board, a soft board, a rigid-flex board or a ceramic substrate.
In a second aspect, the utility model further provides a camera module, which includes a photosensitive chip and the hollow circuit board.
On the basis of the technical scheme, the camera module can be further improved as follows.
Optionally, the photosensitive chip is located at the hollowed-out part of the hollowed-out circuit board and is fixedly connected to the middle part of the reinforcing sheet.
Compared with the prior art, the hollow circuit board provided by the utility model has the beneficial effects that:
according to the utility model, the reinforcing sheet is arranged at the hollow part of the substrate, and the substrate and the reinforcing sheet are integrally injection molded by the injection molding material, so that the external force borne by the substrate can be transmitted to the reinforcing sheet through the cured injection molding material, and the purpose of enhancing the structural strength of the substrate is achieved. In addition, the base plate and the reinforcing sheet are integrally formed by injection molding of injection molding materials, and the reinforcing sheet can be prevented from directly contacting with the base plate, so that the problem that the reinforcing sheet damages wiring on the base plate is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a front view structure of the hollowed-out circuit board of the utility model;
FIG. 2 is a schematic diagram of a rear view structure of the hollowed-out circuit board of the utility model;
FIG. 3 is a schematic cross-sectional view of the substrate of FIG. 1;
FIG. 4 is a schematic view of a side of the reinforcing sheet of FIG. 3;
FIG. 5 is another schematic view of the reinforcing sheet of FIG. 3;
fig. 6 is a schematic structural diagram of the camera module according to the present invention.
In the figure:
10-a substrate; 11-hollowed parts; 12-flexible flat cable; 13-a connector; 101-substrate circuit layer; 102-an insulating layer;
20-a reinforcing sheet; 21-embedding holes; 22-reinforcement panel edge; 23-middle part of the reinforcing sheet;
30-injection molding material;
40-outer layer circuit;
50-photosensitive chip; 51-conducting wire.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely a few embodiments of the utility model and are not to be taken as a comprehensive embodiment. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Example 1:
the utility model provides a hollow Circuit Board, which comprises a Circuit Board made of various plates such as a hard Board (PCB for short), a soft Board (FPC for short), a Flexible Printed Circuit Board (FPCB for short) or a ceramic substrate. The circuit board of the camera module shown in fig. 1 and 2 is taken as an example, and includes a substrate 10 of a PCB portion, a flexible flat cable 12 of an FPC portion, and a connector 13 connected to the flexible flat cable 12. The substrate 10 is provided with the hollow portion 11, and when the substrate 10 is subjected to an external force, the substrate 10 is easily deformed or even broken, so that the structural strength of the substrate 10 at the hollow portion 11 is low.
As shown in fig. 3 to 5, a reinforcing plate 20 is disposed at the hollow portion 11 of the substrate 10, and the area of the reinforcing plate 20 is larger than the area of the hollow portion 11 of the substrate 10. Specifically, the reinforcing sheet 20 includes two portions, a reinforcing sheet edge 22 and a reinforcing sheet middle portion 23. The reinforcing sheet middle part 23 is located at the position of the hollowed-out part 11 of the substrate 10, and the reinforcing sheet edge 22 extends to the edge position close to the substrate 10 towards the plate part of the substrate 10. The base plate 10 and the reinforcing sheet 20 are arranged oppositely, the base plate 10 and the reinforcing sheet 20 are placed in an injection mold, and injection molding material 30 is injected for solidification and molding. The thickness and size of the injection molding material 30 are not particularly limited in this embodiment. Of course, the outer dimension of the reinforcing plate 20 may be equal to or slightly smaller than the dimension of the hollow portion 11.
In some embodiments, the material of the injection molding material 30 may be a thermosetting resin material, and the material of the reinforcing sheet may be a metal sheet such as a copper sheet, a steel sheet or an alloy sheet. Of course, the material of the injection molding material 30 may also be rubber or other materials as the injection molding material 30.
When the substrate 10 is acted by an external force, the substrate 10, the reinforcing sheet 20 and the solidified injection molding material 30 are connected and stressed, so that the substrate 10 can transmit the acting force to the reinforcing sheet 20 through the solidified injection molding material 30, and finally the reinforcing sheet 20 bears the external force, thereby improving the overall strength of the substrate 10. The injection molding material 30 completely wraps the peripheries of the substrate 10 and the reinforcing sheet 20 to form an integral structure, and the situations of warping, layering and the like can not occur. In addition, because the substrate 10 and the reinforcing sheet 20 are completely coated by the injection molding material 30, the substrate 10 can play a role in buffering through the injection molding material 30, so that the damage after the substrate 10 falls down can be effectively avoided, and the rejection rate of the hollow circuit board is reduced.
It can be understood that, as shown in fig. 1, for some connectors 13 provided with a sink structure, when the connector 13 is subjected to an external force, the connector is easily deformed or even broken. Therefore, it is also conceivable to provide a reinforcing sheet 20 (not shown) in a sunken groove of the connecting head 13 and to integrally injection-mold the connecting head 13 and the reinforcing sheet 20 with an injection-molded material 30 to improve the structural strength of the connecting head 13. Of course, the substrate 10 of the PCB portion, the flexible flat cable 12 of the FPC portion, and the connector 13 connected to the flexible flat cable 12 may also be integrally injection-molded by the injection molding compound 30, so as to improve the structural integrity of the circuit board of the camera module.
As shown in fig. 3 and 4, in order to reduce the amount of injection molding of the hollow wiring board, the reinforcing-piece middle portion 23 may be provided in a stepped shape with respect to the reinforcing-piece edge 22. After the reinforcing sheet 20 and the base plate 10 are injection-molded and cured, the reinforcing sheet edge 22 is embedded in the injection molding material 30, and the bottom surface of the reinforcing sheet middle part 23 is flush with the bottom surface of the injection molding material 30, so that the injection molding material 30 of the reinforcing sheet middle part 23 is saved. Of course, the reinforcing sheet 20 may be designed to have a flat structural shape, but the injection molding material 30 is required to cover all the reinforcing sheets 20 to prevent the reinforcing sheets 20 from falling off.
As shown in fig. 4, in order to improve the connection strength between the base plate 10 and the reinforcing sheet 20, the reinforcing sheet edge 22 is further provided with a plurality of insertion holes 21, and the plurality of insertion holes 21 are uniformly spaced along the reinforcing sheet edge 22. After the reinforcing sheet 20 and the substrate 10 are injection-molded and cured, the injection molding material 30 is filled in the embedding hole 21, so that the mechanical engaging force between the injection molding material 30 and the reinforcing sheet 20 can be increased, and the reinforcing sheet 20 is prevented from falling off.
It will be appreciated that the shape of the insert hole 21 may be designed to be circular to reduce the problem of stress concentrations in the injection-molded plastic 30 at the location of the insert hole 21. Of course, the insertion hole 21 may be formed in other shapes such as a kidney shape or a polygon shape. The embedding hole 21 can be designed as a through hole or a counter bore. When the insert hole 21 is designed as a through hole, the injection molding material 30 in the insert hole 21 can be continuously disposed, thereby increasing the coupling strength between the base plate 10 and the reinforcing sheet 20.
As shown in fig. 3, in some embodiments, after the substrate 10 and the reinforcing sheet 20 are integrally injection-molded and cured, one or more layers of outer layer circuits 40 may be further disposed on the surface of the cured injection-molded material 30. Specifically, the substrate 10 is originally provided with the substrate circuit layer 101, and after the substrate 10 and the reinforcing sheet 20 are integrally injection-molded and cured, the substrate circuit layer 101 is encapsulated in the cured injection-molded material 30. And arranging one or more outer layer circuits 40 on the surface of the solidified injection molding material 30, wherein the plurality of outer layer circuits 40 are stacked relative to the substrate circuit layer 101, insulating layers 102 can be arranged between the adjacent outer layer circuits 40, between the adjacent substrate circuit layers 101 or between the adjacent outer layer circuits 40 and the substrate circuit layers 101, and the insulating layers 102 can prevent the outer layer circuits 40 and the substrate circuit layers 101 from generating signal interference or short circuit. The outer layer circuit 40 may be welded to the substrate circuit layer 101, or the outer layer circuit 40 may be connected to the substrate circuit layer 101 by gold wires, so as to achieve conduction between the outer layer circuit 40 and the substrate circuit layer 101. Finally, the substrate 10 with the outer layer circuit 40 added is placed into an injection mold for two times, and injection molding material 30 is injected for solidification and molding.
The present embodiment realizes the function of integrating the multilayer outer layer circuit 40 on the substrate 10 by the secondary injection molding of the injection molding material 30 on the substrate 10. Aiming at the increasingly rich functional requirements of electronic equipment, the multilayer outer layer circuit 40 supporting more functions is stacked, and the plane size of the hollowed-out circuit board is not additionally increased, so that the internal space of the electronic equipment is saved, and the miniaturization of the electronic equipment is realized.
It should be understood that the outer layer circuit 40 in this embodiment includes, but is not limited to, a pure circuit structure, and also includes circuit boards made of various boards such as PCB, FPC, FPCB or ceramic substrate. When the outer layer circuit 40 is set to be a pure circuit structure, an insulating layer 102 may be provided on the surface of the injection molding material 30 after the first curing; when the outer layer circuit 40 is set as a circuit board such as a PCB, FPC, FPCB or ceramic substrate, it may be directly injection-molded twice on the basis of the injection-molded material 30 after the first curing. The multilayer outer layer circuit 40 may be disposed on the same side of the substrate circuit layer 101, or may be disposed on both sides of the substrate circuit layer 101.
Example 2:
the present invention provides a camera module, as shown in fig. 6, including a photosensitive chip 50 and the hollow circuit board in the above embodiments. The surfaces of the photosensitive chip 50 and the hollow circuit board are respectively provided with corresponding bonding pads, and the bonding pads of the photosensitive chip 50 and the bonding pads of the hollow circuit board are welded through wires 51, so that the photosensitive chip 50 and the hollow circuit board are conducted. The photosensitive chip 50 can be connected and fixed in the middle 23 of the reinforcing sheet by a method including but not limited to glue, and is located at the hollow part 11 of the hollow circuit board, and the middle 23 of the reinforcing sheet plays a supporting role for the photosensitive chip 50.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (10)
1. The utility model provides a fretwork circuit board which characterized in that includes:
the substrate is provided with a hollow part;
the reinforcing sheet is arranged at the hollow part of the substrate; and the number of the first and second groups,
the base plate and the reinforcing sheet are integrally injection-molded through the injection molding material;
the reinforcing sheet is embedded in the injection molding material and is positioned at the hollow part of the substrate.
2. The hollow circuit board according to claim 1, wherein the reinforcing sheet has a plurality of embedding holes, and the injection molding material is filled in the embedding holes.
3. The hollow circuit board according to claim 2, wherein the fitting hole is a circular through hole, and the plurality of circular through holes are provided at an edge of the reinforcing sheet.
4. The hollow circuit board according to claim 3, wherein the edge of the reinforcing sheet is embedded in the injection molding material, and the bottom surface of the reinforcing sheet at the hollow part is flush with the bottom surface of the injection molding material.
5. The hollow circuit board according to claim 4, wherein the reinforcing sheet is made of a metal sheet.
6. The hollow circuit board according to claim 1, wherein an outer layer circuit is further arranged inside the injection molding material, the outer layer circuit is conducted with the substrate, and an insulating layer is arranged between the outer layer circuit and the substrate.
7. The hollow circuit board according to claim 6, wherein the injection molding material is a thermosetting resin material.
8. The hollowed-out circuit board according to any one of claims 1 to 7, wherein the substrate is a hard board, a soft board, a rigid-flex board or a ceramic substrate.
9. A camera module, characterized in that, includes sensitization chip and the fretwork circuit board of any one of claims 1 to 8.
10. The camera module according to claim 9, wherein the photosensitive chip is located at a hollow portion of the hollow circuit board and is fixedly connected to a middle portion of the reinforcing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121527496.XU CN215499713U (en) | 2021-07-06 | 2021-07-06 | Hollowed-out circuit board and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121527496.XU CN215499713U (en) | 2021-07-06 | 2021-07-06 | Hollowed-out circuit board and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215499713U true CN215499713U (en) | 2022-01-11 |
Family
ID=79724783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121527496.XU Active CN215499713U (en) | 2021-07-06 | 2021-07-06 | Hollowed-out circuit board and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215499713U (en) |
-
2021
- 2021-07-06 CN CN202121527496.XU patent/CN215499713U/en active Active
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