CN116507107A

CN116507107A - Accurate chip mounter

Info

Publication number: CN116507107A
Application number: CN202310778139.8A
Authority: CN
Inventors: 余耀国; 杨建军
Original assignee: Shenzhen Eton Automation Equipment Co ltd
Current assignee: Shenzhen Eton Automation Equipment Co ltd
Priority date: 2023-06-29
Filing date: 2023-06-29
Publication date: 2023-07-28

Abstract

The invention relates to an accurate chip mounter, which comprises a feeding table, a processing area, a workbench and a manipulator, wherein substrates with different types are stacked on the feeding table; the processing area is provided with a camera which is used for recording the position information of the substrate in the processing area; the workbench is used for bearing a substrate to be pasted; the manipulator grabs the substrate of the feeding table and conveys the substrate to the processing area, the camera recognizes initial model position information of the substrate, the substrate is adjusted according to the initial model position information of the substrate recognized by the camera to obtain the final model position of the substrate, and then the substrate is conveyed to the workbench. According to the precise chip mounter, the precise chip mounter comprises the feeding table, the processing area, the workbench and the manipulator, so that the manipulator can grasp substrates of different types at the feeding table to the processing area, the position information of the substrates in the processing area is recorded through the camera, and the manipulator is controlled to adjust the positions of the substrates to be accurately placed on the workbench.

Description

Accurate chip mounter

Technical Field

The invention relates to the technical field of electronic mounting, in particular to an accurate chip mounter.

Background

In the prior art, a chip mounter is an important device in an SMT (surface mount technology) assembly production line, and is also a device with highest cost and requirement in the SMT production line. With the development of the electronic industry, the requirements for mounting PCBs (printed circuit boards) in the SMT process are increasing, and the requirements for chip mounters are also increasing, so that the requirements for the chip mounters are high-speed and high-efficiency; but also requires high mounting accuracy. The efficiency of the chip mounter determines the working efficiency of the whole production line.

Along with the development of electronic technology, the size models of the PCBs are more and more diversified, higher requirements are put forward on the mounting technology of the chip mounter, the change of PCBs with different models needs to be adapted at any time, and meanwhile, the mounting precision and the mounting efficiency need to be met, so that the problem of the mounting precision and the mounting efficiency of PCBs with different models needs to be solved.

Disclosure of Invention

The invention aims to provide an accurate chip mounter, and aims to solve the problems of mounting precision and high efficiency of PCBs adapting to different models.

In order to solve the technical problems, the accurate chip mounter comprises a feeding table, a processing area, a workbench and a manipulator, wherein substrates of different types are stacked on the feeding table; the processing area is provided with a camera which is used for recording the position information of the substrate in the processing area; the workbench is used for bearing a substrate to be pasted; the manipulator comprises a grabbing component, an adjusting component, a sensor and a driving component, wherein the sensor is used for sensing the distance from the grabbing component to a substrate, the driving component drives the grabbing component to move towards the substrate of the feeding table, so that the grabbing component grabs the substrate of the feeding table to be transported to the processing area, the camera is used for identifying initial model position information of the substrate, and the adjusting component is used for adjusting the substrate according to the initial model position information of the camera to obtain the final model position of the substrate and then transporting the substrate to the workbench.

Further, the grabbing component comprises a sucking plate, a communicating vessel and a through pipe, wherein the communicating vessel is communicated between the sucking plate and the through pipe, so that the air pressure of the through pipe acts on the sucking plate, the sucking plate comprises a plurality of suckers, a connecting plate and ball beads, the connecting plate is communicated between the communicating vessel and each sucker, the ball beads are located between the suckers and the connecting plate, so that negative pressure is generated at the airtight position of the substrate when the suckers act on the substrate, or the air permeability position of the substrate when the suckers act on the ball beads are blocked between the communicating vessel and the suckers.

Further, the connecting plate comprises a first plate and a second plate, the first plate is provided with a plurality of first through holes, the second plate is provided with a plurality of second through holes, the first through holes are communicated with the suckers, the second through holes are communicated with the communicating vessel, the first plate and the second plate are covered, so that the first through holes are communicated with the second through holes, the diameter of the first through holes is larger than that of the second through holes, and the ball moves in the first through holes or is abutted to the second through holes.

Further, the adjusting assembly further comprises a first driver, an air pipe and a sealing piece, wherein the first driver is used for driving the suction plate carrying substrate to rotate, the air pipe is communicated with the through pipe to act on the sucker, and the sealing piece is sealed between the through pipe and the first driver so that the air pipe is communicated with the through pipe in a sealing mode.

Further, the adjusting assembly further comprises a first support, a second support, a driving shaft and a first bearing, wherein the first driver is connected to the first support, the second support is connected to the first support, the first bearing is arranged on the second support, one end of the driving shaft is connected to the first driver, and the other end of the driving shaft penetrates through the first bearing and is connected with the through pipe, so that the driving shaft drives the suction plate to rotate with the substrate.

Further, the grabbing assembly further comprises a second bearing and a first elastic piece, the second bearing is sleeved on the through pipe and connected with the communicating vessel, the first elastic piece is sleeved on the through pipe, and the first elastic piece is respectively abutted to the second bearing and the driving shaft.

Further, the driving assembly comprises a second driver, a screw rod and a transmission piece, the transmission piece is connected to the second bracket, one end of the screw rod is connected with the second driver, and the screw rod is connected with the transmission piece, so that the suction plate moves up and down along the direction of the through pipe.

Further, the driving assembly further comprises a sliding block, the first support comprises a sliding rail, one side of the sliding block is connected with the second support, and the other side, opposite to the sliding block, of the sliding block slides on the sliding rail.

Further, the driving assembly further comprises a second elastic piece and a fastening piece, the screw rod penetrates through the transmission piece, the fastening piece is connected to the tail end of the screw rod, the second elastic piece is sleeved on the screw rod, and the second elastic piece is respectively abutted to the second bracket and the fastening piece.

Further, the accurate chip mounter further comprises a frame, a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is connected with the frame and used for driving the manipulator to move along the X-axis direction, and the second driving mechanism is connected with the frame and used for driving the manipulator to move along the Y-axis direction.

Further, the first driving mechanism comprises a first linear motor, a first connecting piece and a first travel switch, wherein the first connecting piece is connected between the first linear motor and the manipulator, and at least two first travel switches are respectively arranged at two ends of the first linear motor.

Further, the second driving mechanism comprises a second linear motor, a second connecting piece and a second travel switch, wherein the second connecting piece is connected between the second linear motor and the first driving mechanism, and at least two second travel switches are respectively arranged at two ends of the second linear motor.

The implementation of the embodiment of the invention has the following beneficial effects:

the accurate chip mounter in the embodiment comprises a feeding table, a processing area, a workbench and a manipulator, so that the manipulator can grasp substrates of different types at the feeding table to the processing area, the position information of the substrates in the processing area is recorded through a camera, and the manipulator is controlled to adjust the positions of the substrates to be accurately placed on the workbench, so that the problems of mounting precision and high efficiency of PCBs of different types in the prior art are solved;

in the accurate chip mounter in the embodiment, as the manipulator comprises the grabbing component, the adjusting component, the sensor and the driving component, the sensor is used for sensing the distance from the grabbing component to the substrate, the driving component drives the grabbing component to move towards the substrate of the feeding table, the grabbing component is further used for conveying the substrate of the feeding table to the processing area, in the processing area, the camera is used for identifying initial model position information of the substrate, the adjusting component can adjust the substrate according to the initial model position information, and the adjusted substrate is conveyed to the workbench after being identified again by the camera to obtain final model information, so that accurate chip mounter can be used for identifying substrates of different models to carry out accurate and efficient chip mounting;

the accurate chip mounter in this embodiment is because snatch the suction plate of subassembly and include sucking disc, connecting plate and ball, connecting plate intercommunication fluid reservoir and sucking disc, and the ball is located between sucking disc and the connecting plate to make sucking disc effect produce the negative pressure in the airtight department of base plate, perhaps the sucking disc effect is blocked between fluid reservoir and the sucking disc by the ball in the ventilative department of base plate, and then can't adsorb the problem of base plate through the sucking disc when avoiding the fluid reservoir gas leakage.

The accurate chip mounter in this embodiment, because the connecting plate includes first board and second board, first board forms first through-hole, and the second board forms the second through-hole, and first through-hole intercommunication is at the sucking disc, and second through-hole intercommunication is at the intercommunication ware, and first board and second board lid are closed to first through-hole and second through-hole intercommunication, and the diameter of first through-hole is greater than the diameter of second through-hole, and then makes the ball activity at first through-hole or butt at the second through-hole, in order to guarantee the airtight when sucking disc negative pressure.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a chip mounter with a first viewing angle according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a chip mounter at a second view angle according to an embodiment of the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 1 at A;

fig. 4 is a schematic structural diagram of a manipulator according to a first view angle in an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a manipulator according to a second view angle in an embodiment of the present invention;

fig. 6 is a schematic structural view of a suction plate according to an embodiment of the present invention;

fig. 7 is a cross-sectional view at B-B in fig. 6.

Wherein: 100. a chip mounter; 110. a feeding table; 120. a treatment zone; 121. a camera; 130. a work table; 140. a manipulator; 141. a grabbing component; 1411. a suction plate; 14111. a suction cup; 14112. a connecting plate; 1411A, a first plate; 14101. a first through hole; 1411B, a second plate; 14102. a second through hole; 14113. a ball; 1412. a communicating vessel; 1413. a through pipe; 142. an adjustment assembly; 1421. a first driver; 1422. an air pipe; 1423. a seal; 1424. a first bracket; 14241. a slide rail; 1425. a second bracket; 1426. a drive shaft; 1427. a first bearing; 1428. a second bearing; 1429. a first elastic member; 143. a sensor; 144. a drive assembly; 1441. a second driver; 1442. a screw rod; 1443. a transmission member; 1444. a slide block; 1445. a second elastic member; 1446. a fastener; 150. a frame; 160. a first driving mechanism; 161. a first linear motor; 162. a first connector; 163. a first travel switch; 170. a second driving mechanism; 171. a second linear motor; 172. a second connector; 173. and a second travel switch.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-7, an embodiment of the present invention provides an accurate chip mounter 100, including a loading table 110, a processing area 120, a workbench 130 and a manipulator 140, where substrates with different types are stacked on the loading table 110; the processing area 120 is provided with a camera 121, and the camera 121 is used for recording the position information of the substrate in the processing area 120; the workbench 130 is used for bearing a substrate to be pasted; the manipulator 140 includes a grabbing component 141, an adjusting component 142, a sensor 143 and a driving component 144, the sensor 143 is used for sensing the distance from the grabbing component 141 to the substrate, the driving component 144 drives the grabbing component 141 to move towards the substrate of the feeding table 110, so that the grabbing component 141 grabs the substrate of the feeding table 110 and conveys the substrate to the processing area 120, the camera 121 identifies initial model position information of the substrate, and the adjusting component 142 adjusts the substrate according to the initial model position information of the substrate identified by the camera 121 to obtain a final model position of the substrate and conveys the substrate to the workbench 130. In a specific application, when the manipulator 140 moves to above the loading table 110, the sensor 143 on the manipulator 140 is a distance sensor 143, and is arranged on one side of the manipulator 140 facing the substrate for detecting the distance from the substrate to the grabbing component 141, then the driving component 144 controls the grabbing component 141 to move towards the substrate of the loading table 110 for conveying the substrate of the loading table 110 to the processing area 120, when the grabbing component 141 carrying the substrate hovers at the processing area 120 for the first time, the camera 121 records initial model position information of the substrate, when the initial model position information of the substrate deviates from a preset value of the chip mounter 100, the adjusting component 142 controls the substrate to adjust until the position information of the substrate is met, and after the final model position information of the substrate is recorded by the camera 121, the grabbing component 141 carries the substrate from the processing area 120 to the workbench 130, wherein the workbench 130 is provided with cushion glue (not shown) so that the grabbing component 141 releases the substrate on the cushion glue, and the cushion glue can effectively buffer the impact force of the substrate to the workbench 130, thereby preventing the substrate from being damaged, and on the other hand, and the cushion can be fixed on the substrate to the specific position of the chip mounter 100, and the chip mounter can not be mounted on the electronic chip mounter 100, and the accuracy is improved.

Referring to fig. 5-7, in one possible embodiment, the gripping assembly 141 includes a suction plate 1411, a communicating vessel 1412 and a through pipe 1413, the communicating vessel 1412 is communicated between the suction plate 1411 and the through pipe 1413, such that air pressure of the through pipe 1413 acts on the suction plate 1411, the suction plate 1411 includes a plurality of suction cups 14111, a connection plate 14112 and balls 14113, the connection plate 14112 is communicated between the communicating vessel 1412 and each suction cup 14111, the balls 14113 are located between the suction cups 14111 and the connection plate 14112, such that the suction cups 14111 act on a closed portion of the substrate to generate a negative pressure, or the suction cups 14111 act on an air permeable portion of the substrate to be blocked between the communicating vessel 1412 and the suction cups 14111 by the balls 14113. In specific applications, the substrate belongs to a circuit board, and the manner of grabbing the circuit board is diversified, wherein the suction plate 1411 comprises a plurality of suction cups 14111, a connecting plate 14112 and balls 14113, the connecting plate 14112 is communicated between the communicating vessel 1412 and each suction cup 14111, the balls 14113 are positioned between the suction cups 14111 and the connecting plate 14112, so that negative pressure is generated at the sealing part of the substrate due to the fact that the suction cups 14111 are difficult to adsorb at the position of the substrate, and the suction holes of other suction cups 14111 are caused to be reduced, in order to ensure that the substrate can be adsorbed by at least part of the suction cups 14111 to convey the substrate, the suction plates 1411 comprise a plurality of suction cups 14111, connecting plates 14112 and balls 14113, the balls 14142 are positioned between the suction cups 14111 and the connecting plates 14112, or the suction cups 14111 act on the ventilation part of the substrate and are blocked between the communicating vessel 1412 and the suction cups 14111, so that when the suction cups 14111 act on ventilation holes of the substrate, the balls 14162 are blocked between the communicating vessel 1412 and the suction cups 14111, and the suction holes of the substrate can be prevented from being accidentally sucked from entering the suction plate 14111 when the suction plate 14111 is in the outside.

Referring to fig. 5 and 7, in one possible embodiment, the connection plate 14112 includes a first plate 1411A and a second plate 1411B, the first plate 1411A is formed with a plurality of first through holes 14101, the second plate 1411B is formed with a plurality of second through holes 14102, the first through holes 14101 communicate with the suction cup 14111, the second through holes 14102 communicate with the communicating vessel 1412, the first plate 1411A is covered with the second plate 1411B such that the first through holes 14101 communicate with the second through holes 14102, and the first through holes 14101 have a larger diameter than the second through holes 14102, and the balls 14113 move in the first through holes 14101 or abut the second through holes 14102. In a specific application, the ball 14113 is placed in the first through hole 14101, and then the first plate 1411A and the second plate 1411B are hermetically covered, at this time, the ball 14113 is partially located in the first through hole 14101 and partially located in the second through hole 14102, the diameter of the first through hole 14101 is larger than that of the second through hole 14102, the diameter of the ball 14113 is smaller than that of the first through hole 14101, and is larger than that of the second through hole 14102, it is worth noting that the ball 14113 moves in the first through hole 14101 or abuts against the second through hole 14102, when the sucker 14111 acts on the sealing place of the substrate, as the communicating vessel 1412 generates a slow uniform negative pressure, the second through hole 14102 is directly communicated with the communicating vessel 1412, so that the air pressure of the second through hole 14102 is the same as that of the communicating vessel 1412, at the beginning, the air pressure of the first through hole 14101 below the ball 14113 is close to the atmospheric pressure, therefore, the air pressure of the first through hole 14101 is larger than that of the second through hole 14102 generates a larger pressure difference, such pressure difference pushes the ball 14113 to move upwards against the gravity force, so that the first through hole 14101 is communicated with the second through hole 14102, at this time, the air at the first through hole 14101 is pumped away from the second through hole 14102 by the communicating vessel 1412, so that the air pressure of the first through hole 14101 starts to decrease, but when the first through hole 14101 is communicated with the second through hole 14102, the pressure difference between the first through hole 14101 and the second through hole 14102 is destroyed, so that the ball 14113 slowly drops under the action of the gravity force, and then the ball 14113 is isolated from the first through hole 14101 and the second through hole 14102 again, so that the pressure difference is formed again between the first through hole 14101 and the second through hole 14102, the ball 14113 is pushed upwards against the gravity force again, so that the first through hole 14101 is communicated with the second through hole 14102 again, at this time, the air at the first through hole 14101 is continuously pumped away from the second through hole 14102 by the communicating vessel 1412, so that the air pressure of the first through hole 14101 is further decreased, and the ball 14113 repeatedly moves upwards, the air pressure value of the first through hole 14101 is continuously reduced to generate negative pressure, and the first through hole 14101 is communicated with the sucker 14111, so that the substrate is adsorbed on the sucker 14111 under the action of the pressure difference between the external atmospheric pressure and the first through hole 14101;

when the suction cup 14111 acts on the air holes of the substrate, since the first through hole 14101 is always the same as the external atmospheric pressure, when the communicating vessel 1412 generates negative pressure, the air pressure value of the second through hole is smaller than the atmospheric pressure, so that the ball 14113 between the first through hole 14101 and the second through hole 14102 is abutted on the second through hole 14102, thereby preventing air from further flowing into the second through hole 14102, and further avoiding the communicating vessel 1412 from communicating with the external, thus, the negative pressure generated at other suction cup 14111 closely connected with the substrate can be ensured, the adaptability of the suction plate 1411 to substrates of different sizes can be enhanced, particularly, the positions of the air holes of substrates of different sizes are different, and the substrates can be ensured to be adsorbed and conveyed to different positions.

Referring to fig. 1, 3 and 4, in one possible embodiment, the adjustment assembly 142 further includes a first driver 1421, an air tube 1422, and a sealing member 1423, wherein the first driver 1421 is configured to drive the suction plate 1411 to rotate the carrying substrate, the air tube 1422 is in communication with the suction cup 14111, and the sealing member 1423 is sealed between the suction cup 1413 and the first driver 1421, such that the air tube 1422 is in sealing communication with the suction cup 1413. In particular, since the substrate is generally required to be re-corrected by the adjusting component 142 when the substrate is in the processing area 120, but when the adjusting component 142 adjusts the position of the substrate by the first driver 1421, the adjusting component needs to be sealed between the through pipe 1413 and the first driver 1421 by the sealing component 1423, so as to prevent the pressure between the air pipe 1422 and the through pipe 1413 from being released when the first driver 1421 adjusts, further maintain the communicating vessel 1412 at a stable negative pressure value, and prevent the substrate from accidentally falling off in the processing area 120, particularly, the camera 121 is a high-precision instrument, and the camera 121 is easily damaged if the substrate falls off, thereby resulting in high maintenance cost of the chip mounter 100.

Referring to fig. 4, in one possible embodiment, the adjustment assembly 142 further includes a first support 1424, a second support 1425, a driving shaft 1426, and a first bearing 1427, where the first driver 1421 is connected to the first support 1424, the second support 1425 is connected to the first support 1424, the first bearing 1427 is disposed on the second support 1425, one end of the driving shaft 1426 is connected to the first driver 1421, and the other end passes through the first bearing 1427 and is connected to the through pipe 1413, so that the driving shaft 1426 drives the suction plate 1411 to rotate with the substrate. In a specific application, the first bearing 1427 is a thrust ball bearing, and is used for eliminating axial and radial gaps between the driving shaft 1426 and the second bearing 1428, because one end of the driving shaft 1426 is connected to the first driver 1421, the other end of the driving shaft 1426 passes through the first bearing 1427 and is connected to the through pipe 1413, the first driver 1421 drives the driving shaft 1426 to rotate, the driving shaft 1426 drives the through pipe 1413 to rotate, the through pipe 1413 drives the suction plate 1411 to carry the substrate to rotate together, and because the position of the substrate absorbed by the suction cup 14111 does not necessarily need to be the center of gravity of the substrate, shaking occurs when the substrate rotates along with the driving shaft 1426, and the shaking of the driving shaft 1426 can be effectively absorbed through the second bearing 1428, so that the accuracy of the adjusting assembly 142 in adjusting the substrate model is improved.

Referring to fig. 4, in one possible embodiment, the gripping assembly 141 further includes a second bearing 1428 and a first elastic member 1429, the second bearing 1428 is sleeved on the through pipe 1413 and connected to the communicating vessel 1412, the first elastic member 1429 is sleeved on the through pipe 1413, and the first elastic member 1429 is respectively abutted against the second bearing 1428 and the driving shaft 1426. In a specific application, when the grabbing component 141 grabs the substrate, the rigid contact between the absorbing plate 1411 and the substrate easily causes the substrate to be damaged, and the first elastic member 1429 is propped against the second bearing 1428 and the driving shaft 1426 respectively, so that the absorbing plate 1411 and the substrate are effectively buffered, and when the sucker 14111 is ensured to effectively absorb the substrate, the first elastic member 1429 is elastically deformed to counteract the impact of the absorbing plate 1411 on the substrate, thereby improving the working efficiency of the grabbing component 141 without damaging the substrate.

Referring to fig. 4, in one possible embodiment, the driving assembly 144 includes a second driver 1441, a screw 1442, and a transmission member 1443, the transmission member 1443 is connected to the second support 1425, one end of the screw 1442 is connected to the second driver 1441, and the screw 1442 is connected to the transmission member 1443 to move the suction plate 1411 up and down in the direction of the through pipe 1413. In a specific application, the transmission part 1443 of the driving assembly 144 is connected to the second bracket 1425, the second driver 1441 drives the lead screw 1442 to rotate, and the lead screw 1442 is connected to the transmission part 1443, so that the lead screw 1442 moves linearly, and the suction plate 1411 is driven to move up and down along the direction of the through pipe 1413 to adsorb the substrate or put down the substrate, in addition, the driving shaft 1426 is a telescopic rod, and can move in a telescopic way along with the up and down movement of the suction plate 1411, the lead screw 1442 has good stability in transmission, so that the movement of the suction plate 1411 is more stable.

Referring to fig. 4, in one possible embodiment, the driving assembly 144 further includes a slider 1444, the first support 1424 includes a sliding rail 14241, one side of the slider 1444 is connected to the second support 1425, and the other side opposite to the slider 1444 slides on the sliding rail 14241. In a specific application, one side of the sliding block 1444 is connected to the second bracket 1425, and the other side of the sliding block 1444 opposite to the sliding block is slid on the sliding rail 14241, so that the suction plate 1411 can move up and down relative to the sliding rail 14241, and the accuracy of the suction position of the suction plate 1411 is improved.

Referring to fig. 4, in one possible embodiment, the driving assembly 144 further includes a second elastic member 1445 and a fastening member 1446, the screw rod 1442 is threaded through the transmission member 1443, the fastening member 1446 is connected to the end of the screw rod 1442, the second elastic member 1445 is sleeved on the screw rod 1442, and the second elastic member 1445 abuts against the second bracket 1425 and the fastening member 1446, respectively. In a specific application, in order to prevent the grabbing component 141 from sliding downwards uncontrollably on the sliding rail 14241 when the power is off, the lead screw 1442 is threaded in the transmission piece 1443, the fastening piece 1446 is connected to the end of the lead screw 1442, the second elastic piece 1445 is sleeved on the lead screw 1442, and the second elastic piece 1445 is respectively abutted to the second bracket 1425 and the fastening piece 1446, so that the second elastic piece 1445 can elastically support the grabbing component 141 to slide downwards relative to the sliding rail 14241, and meanwhile, when the second driver 1441 drives the lead screw 1442 to rotate, the transmission piece 1443 moves downwards relative to the lead screw 1442, the second bracket 1425 can overcome the elastic force of the second elastic piece 1445 to drive the grabbing component 141 to move downwards to a specified position to suck or put down the substrate, and when the second bracket 1425 slides upwards relative to the sliding rail 14241, the second elastic piece 1445 resumes deformation.

Referring to fig. 1, in one possible embodiment, the precision chip mounter 100 further includes a frame 150, a first driving mechanism 160, and a second driving mechanism 170, where the first driving mechanism 160 is connected to the frame 150 for driving the robot 140 to move along the X-axis direction, and the second driving mechanism 170 is connected to the frame 150 for driving the robot 140 to move along the Y-axis direction. In a specific application, the first driving mechanism 160 moves the manipulator 140 along the X-axis direction relative to the frame 150, and the first driving mechanism 160 moves the manipulator 140 along the Y-axis direction relative to the frame 150, so that the substrate can move along the Z-axis direction relative to the frame 150 by the manipulator 140, the substrate can move along the X-axis direction relative to the frame 150 by the first mechanism, and the substrate can move along the Y-axis direction relative to the frame 150 by the second mechanism.

Referring to fig. 1 and 2, in one possible embodiment, the first driving mechanism 160 includes a first linear motor 161, a first connection member 162, and a first travel switch 163, the first connection member 162 is connected between the first linear motor 161 and the robot 140, and at least two first travel switches 163 are respectively provided at both ends of the first linear motor 161. In particular applications, in order to improve the precision of the first driving mechanism 160, the first linear motor 161 of the first driving mechanism 160 is used to drive the manipulator 140 to move along the X-axis direction relative to the frame 150, where the first linear motor 161 is a transmission device that directly converts electric energy into linear motion mechanical energy without any intermediate conversion mechanism, and can be regarded as a rotating motor that is split according to a radial direction and generates a plane, so as to reduce a mechanical error caused by the intermediate rotation device, and further improve the precision of the movement of the manipulator 140 carrying the substrate along the X-axis direction.

Referring to fig. 1 and 2, in one possible embodiment, the second driving mechanism 170 includes a second linear motor 171, a second connection member 172, and a second travel switch 173, the second connection member 172 is connected between the second linear motor 171 and the first driving mechanism 160, and at least two second travel switches 173 are respectively provided at both ends of the second linear motor 171. In particular applications, in order to improve the precision of the second driving mechanism 170, the second linear motor 171 of the second driving mechanism 170 is used to drive the manipulator 140 to move along the Y-axis direction relative to the frame 150, where the second linear motor 171 is a transmission device that directly converts electric energy into linear motion mechanical energy without any intermediate conversion mechanism, and can be regarded as a rotating motor that is split radially and generates a plane, so as to reduce the mechanical error caused by the intermediate rotation device, and further improve the precision of the movement of the manipulator 140 carrying the substrate along the Y-axis direction.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. Accurate chip mounter, its characterized in that includes:

the feeding table stacks substrates of different types;

the processing area is provided with a camera, and the camera is used for recording the position information of the substrate in the processing area;

the workbench is used for bearing a substrate to be pasted;

the manipulator comprises a grabbing component, an adjusting component, a sensor and a driving component, wherein the sensor is used for sensing the distance from the grabbing component to a substrate, the driving component drives the grabbing component to move towards the substrate of the feeding table, so that the grabbing component grabs the substrate of the feeding table to be transported to the processing area, the camera is used for identifying initial model position information of the substrate, and the adjusting component is used for adjusting the substrate according to the initial model position information of the camera to obtain the final model position of the substrate and then transporting the substrate to the workbench.

2. The precision chip mounter according to claim 1, wherein said gripping assembly includes a suction plate, a communicating vessel and a through pipe, said communicating vessel is communicated between said suction plate and said through pipe so that air pressure of said through pipe acts on said suction plate, said suction plate includes a plurality of suction cups, a connecting plate and balls, said connecting plate is communicated between said communicating vessel and each of said suction cups, said balls are located between said suction cup and said connecting plate so that said suction cup acts on a sealing portion of a substrate to generate negative pressure, or said suction cup acts on an air permeable portion of a substrate to be blocked between said communicating vessel and said suction cup by said balls.

3. The precise chip mounter according to claim 2, wherein said connection plate includes a first plate and a second plate, said first plate is formed with a plurality of first through holes, said second plate is formed with a plurality of second through holes, said first through holes are communicated with said suction cup, said second through holes are communicated with said communicating vessel, said first plate and said second plate are covered so that said first through holes are communicated with said second through holes, and the diameter of said first through holes is larger than that of said second through holes, and said ball is movable in or abutted against said first through holes.

4. A precision chip mounter according to any of claims 2 or 3, wherein said adjustment assembly further comprises a first driver for driving said suction plate carrying base plate in rotation, an air tube in communication with said through tube acting on said suction cup, and a sealing member sealed between said through tube and said first driver for sealingly communicating said air tube with said through tube.

5. The precision chip mounter according to claim 4, wherein said adjustment assembly further comprises a first bracket, a second bracket, a driving shaft and a first bearing, said first driver is connected to said first bracket, said second bracket is connected to said first bracket, said first bearing is disposed on said second bracket, one end of said driving shaft is connected to said first driver, and the other end of said driving shaft is connected to said through pipe through said first bearing, so that said driving shaft drives said suction plate carrying substrate to rotate.

6. The precise chip mounter according to claim 5, wherein said gripping assembly further comprises a second bearing and a first elastic member, said second bearing is sleeved on said through pipe and connected to said communicating vessel, said first elastic member is sleeved on said through pipe, and said first elastic member is respectively abutted against said second bearing and said driving shaft.

7. The precise placement machine of claim 5 or 6, wherein the driving assembly comprises a second driver, a screw and a transmission member, the transmission member is connected to the second bracket, one end of the screw is connected to the second driver, and the screw is connected to the transmission member, so that the suction plate moves up and down along the direction of the through pipe.

8. The precision chip mounter according to claim 7, wherein said driving assembly further comprises a slider, said first bracket comprises a slide rail, one side of said slider is connected to said second bracket, and the opposite side of said slider slides on said slide rail.

9. The precise chip mounter according to claim 7, wherein said driving assembly further comprises a second elastic member and a fastener, said screw rod is threaded through said transmission member, said fastener is connected to a distal end of said screw rod, said second elastic member is sleeved on said screw rod, and said second elastic member is respectively abutted to said second bracket and said fastener.

10. The precision chip mounter according to any one of claims 1-3, further comprising a frame, a first driving mechanism, and a second driving mechanism, said first driving mechanism being connected to said frame for driving said manipulator to move along an X-axis direction, said second driving mechanism being connected to said frame for driving said manipulator to move along a Y-axis direction.

11. The precise chip mounter according to claim 10, wherein said first driving mechanism includes a first linear motor, a first connecting member and a first travel switch, said first connecting member is connected between said first linear motor and said manipulator, and at least two of said first travel switches are respectively disposed at two ends of said first linear motor.

12. The precise chip mounter according to claim 10, wherein said second driving mechanism includes a second linear motor, a second connecting member and a second travel switch, said second connecting member is connected between said second linear motor and said first driving mechanism, and at least two of said second travel switches are respectively disposed at two ends of said second linear motor.