CN116499602B - Welding detection method for CCS assembly - Google Patents
Welding detection method for CCS assembly Download PDFInfo
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- CN116499602B CN116499602B CN202310749360.0A CN202310749360A CN116499602B CN 116499602 B CN116499602 B CN 116499602B CN 202310749360 A CN202310749360 A CN 202310749360A CN 116499602 B CN116499602 B CN 116499602B
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- 238000001514 detection method Methods 0.000 title claims abstract description 81
- 238000003466 welding Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000003703 image analysis method Methods 0.000 claims abstract description 6
- 239000000523 sample Substances 0.000 claims description 46
- 238000012360 testing method Methods 0.000 claims description 38
- 230000007246 mechanism Effects 0.000 claims description 32
- 238000013016 damping Methods 0.000 claims description 24
- 230000000712 assembly Effects 0.000 claims description 21
- 238000000429 assembly Methods 0.000 claims description 21
- 238000007689 inspection Methods 0.000 claims description 7
- 230000035939 shock Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 15
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/025—Measuring very high resistances, e.g. isolation resistances, i.e. megohm-meters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/58—Testing of lines, cables or conductors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Environmental & Geological Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
Abstract
The application relates to a welding detection method of a CCS component, which comprises the following steps: s100, welding a CCS component through a laser welding device, transferring the welded CCS component to a detection device, S200, vibrating the CCS component through the detection device, detecting the performance of the vibrated CCS component, S300, detecting whether the offset of a PIN needle of the CCS component is smaller than or equal to an offset threshold value or not through an image analysis method at the detection device, and detecting whether the size of a foreign matter at the PIN needle of the CCS component is smaller than or equal to a size threshold value or not. The application simulates the vibration of the CCS component so as to simulate the actual use condition of the CCS component. The detection result is more in line with the actual situation, and is beneficial to ensuring long-term stable work of the CCS component in the actual use process.
Description
Technical Field
The application relates to the field of detection of CCS components, in particular to a welding detection method of a CCS component.
Background
The CCS component used by the new energy battery module consists of structural members such as a bracket, a nickel sheet, a palladium sheet, an FPC, a PIN needle joint and the like. In the production process of the CCS component, a plurality of nickel sheets are firstly required to be welded with a palladium sheet and an FPC (flexible printed circuit) piece respectively, then performance detection is carried out on the welded component, and the performances to be detected include a voltage withstanding test, an insulation resistance test, a wire harness internal resistance test, a wire harness on-off test and an NTC (negative temperature coefficient) test, namely Negative Temperature Coefficient.
The conventional testing method cannot simulate the actual use environment of the CCS component, so that the testing result may not be consistent with the performance of the CCS component in the actual use environment. And the traditional testing method does not check factors which possibly cause problems in the future use process after performance detection. Moreover, in the prior art, there is no detection device for CCS components with a relatively high degree of automation and a relatively high detection efficiency.
Disclosure of Invention
Based on this, a welding detection method of CCS components is provided. The method can be used for checking the factors possibly causing problems in the future use process after the performance of the CCS component is detected, and can simulate the actual use working condition of the CCS component.
A method of welding inspection of CCS components, comprising:
s100, welding the CCS component through laser welding equipment, transferring the welded CCS component to detection equipment,
s200, vibrating the CCS component through the detection device, performing a first type of test on the vibrating CCS component, wherein the first type of test comprises NTC test,
s300, after vibration of the CCS component is stopped at the detection equipment, detecting whether the offset of the PIN needle of the CCS component is smaller than or equal to an offset threshold value or not through an image analysis method, and detecting whether the size of the foreign matter at the PIN needle of the CCS component is smaller than or equal to a size threshold value or not;
the detection equipment comprises a frame, a lower layer conveying component and an upper layer conveying component are arranged on the frame, the upper layer conveying component is positioned above the lower layer conveying component,
the detection equipment also comprises a CCD detection component and a pressing detection component, wherein the CCD detection component is used for obtaining the image of the PIN needle of the CCS component on the upper layer conveying component or the lower layer conveying component, the pressing detection component comprises a lifting mechanism and a probe component connected with the lifting mechanism, the probe component is connected with a detection instrument and is used for being connected with the CCS component conveyed by the upper layer conveying component or the lower layer conveying component,
the upper layer conveying assembly comprises a first linear conveying mechanism and a first platform arranged on the first linear conveying mechanism, a plurality of first type damping assemblies are arranged on the first platform, a first carrier plate is arranged on each first type damping assembly, and a plurality of first type vibrating assemblies are further arranged at the bottom of each first carrier plate;
the lower layer conveying assembly comprises a second linear conveying mechanism, the second linear conveying mechanism is arranged on the inner side of the first linear conveying mechanism, a second platform is arranged on the second linear conveying mechanism, a plurality of second type damping assemblies are arranged on the second platform, a second carrier plate is arranged on each second type damping assembly, and a plurality of second type vibrating assemblies are further arranged at the bottom of each second carrier plate.
In one embodiment, in the step S200, the offset threshold is 0.1mm, and the size threshold is 0.3mm.
In one embodiment, the first type damping component and the second type damping component have the same structure, the first type damping component comprises a VD type rubber damping column, the VD type rubber damping column comprises a main body, one end face of the main body is provided with a screw hole, the other end of the main body is provided with a threaded column, the first type damping component further comprises a linear bearing, the linear bearing is sleeved on a movable rod, one end of the movable rod is connected with the threaded column, the other end of the movable rod is provided with a baffle, and a spring is arranged between the baffle and the lower end face of the linear bearing.
In one embodiment, the screw hole of the main body of the VD-type rubber shock absorber column between the first carrier plate and the first platform is connected with a bolt on the first carrier plate, a mounting hole is formed in the first platform, and the linear bearing is arranged in the mounting hole.
In one embodiment, the probe assembly comprises an upper magnetic suction plate and a lower guide plate, a plurality of quick-change columns are arranged between the upper magnetic suction plate and the lower guide plate, a plurality of fixing blocks are arranged on the upper magnetic suction plate, a plurality of sliding grooves are arranged at each fixing block, a clamping block is arranged in one sliding groove at each fixing block, the clamping block is clamped with the corresponding quick-change column, a plurality of probe supporting blocks are further arranged between the upper magnetic suction plate and the lower guide plate, probes are arranged at the bottom ends of the probe supporting blocks, magnets are arranged at the top ends of the probe supporting blocks, the magnets and the upper magnetic suction plate attract each other, and a plurality of positioning holes for the probe supporting blocks to pass through are arranged on the lower guide plate.
In one embodiment, the first carrier plate is provided with a plurality of positioning grooves, and the second carrier plate is provided with a plurality of positioning grooves.
In one embodiment, the detection device further comprises a code scanner.
The application has the beneficial effects that:
the application simulates the vibration of the CCS component so as to simulate the actual use condition of the CCS component. The detection result is more in line with the actual situation, and is beneficial to ensuring long-term stable work of the CCS component in the actual use process. In addition, the detection equipment disclosed by the application uses the upper conveying component and the lower conveying component, so that when the CCS component of the upper conveying component is in the detection process, another CCS component can be placed on the lower conveying component, and when the CCS component on the upper conveying component returns to the feeding station, the lower conveying component can convey the other CCS component to the detection station, and the CCS component at the feeding station can detect the offset of the PIN needle, so that the detection efficiency can be effectively improved. And the vibration damper is provided with the vibration damper, so that excessive noise on the vibration process of the CCS assembly and abnormal operation of other mechanisms caused by vibration can be prevented.
Through a great deal of research, the application discovers that because the application detects the CCS component under the vibration condition, the PIN in the PIN joint of the CCS component connected with the FPC can deviate, foreign matters can exist on the PIN, and the foreign matters can exist on the PIN both in the welding process and in the transferring process. In the actual use process, the battery module is easy to be failed due to the fact that the PIN needle offset is large. The foreign matter at the PIN needle is large in size, which may also cause the battery module to malfunction in the later use process. The application detects whether the offset of the PIN needle of the CCS component is smaller than or equal to the offset threshold value and whether the size of the foreign matter at the PIN needle of the CCS component is smaller than or equal to the size threshold value through an image analysis method.
Drawings
Fig. 1 is a perspective view of a detection apparatus according to an embodiment of the present application.
FIG. 2 is a schematic view of a plurality of shock absorbing assemblies disposed on a platform of a detection apparatus according to an embodiment of the present application.
FIG. 3 is a schematic view of a shock absorbing assembly according to an embodiment of the present application.
Fig. 4 is a schematic view of a threaded post mated with a movable rod of a shock assembly according to an embodiment of the present application.
Fig. 5 is a schematic diagram illustrating a positional relationship between a probe assembly and an underlying carrier according to an embodiment of the application.
Fig. 6 is a schematic diagram of a fixing block and a clamping block arranged on an upper magnetic attraction plate according to an embodiment of the application.
FIG. 7 is a schematic view of a probe support block according to an embodiment of the application.
Wherein:
110. a frame;
121. a first linear transport mechanism; 122. a first platform; 123. a first carrier plate; 124. a vibration motor; 125. VD type rubber shock-absorbing column; 126. a threaded column; 127. a movable rod; 128. a linear bearing; 129. a spring; 127a, baffles;
131. a second linear transport mechanism; 132. a second platform; 133. a second carrier plate;
140. a lifting mechanism; 150. a probe assembly; 151. an upper magnetic plate; 152. a lower guide plate; 153. a probe supporting block; 154. a magnet; 155. a probe; 156. a fixed block; 157. a clamping block; 158. quick-change columns; 160. a CCD detection assembly; 170. balancing weight; 180. a positioning groove; 190. a code scanner.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings.
The embodiment of the application provides a welding detection method of a CCS component, which comprises the following steps:
and S100, firstly, welding the CCS component through a laser welding device, and transferring the welded CCS component to a detection device.
S200, vibrating the CCS component through detection equipment, and performing a first type of test on the vibrated CCS component, wherein the first type of test comprises NTC test, and after the CCS component stops vibrating, performing a second type of test on the CCS component, wherein the second type of test comprises: withstand voltage test, insulation resistance test, wire harness internal resistance test, wire harness on-off test and the like.
And S300, after vibration of the CCS component is stopped at the detection device, detecting whether the offset of the PIN needle of the CCS component is smaller than or equal to an offset threshold value and detecting whether the size of the foreign matter at the PIN needle of the CCS component is smaller than or equal to a size threshold value through an image analysis method.
The application simulates the vibration of the CCS component so as to simulate the actual use condition of the CCS component. The detection result is more in line with the actual situation, and is beneficial to ensuring long-term stable work of the CCS component in the actual use process. Since the present application detects the CCS assembly under vibration, this may cause the PIN in the PIN connector of the CCS assembly connected to the FPC to be shifted and foreign matter may be present on the PIN, which may be generated in other processes. In the actual use process, the battery module is easy to be failed due to the fact that the PIN needle offset is large. The foreign matter at the PIN needle is large in size, which may also cause the battery module to malfunction in the later use process. The application detects whether the offset of the PIN needle of the CCS component is smaller than or equal to the offset threshold value and whether the size of the foreign matter at the PIN needle of the CCS component is smaller than or equal to the size threshold value through an image analysis method. If the offset of the PIN of the CCS assembly is less than or equal to the offset threshold and the size of the foreign object at the PIN of the CCS assembly is less than or equal to the size threshold, the PIN header of the CCS assembly is a qualified condition. If the offset of the PIN needle of the CCS assembly is greater than the offset threshold, or the size of the foreign object at the PIN needle of the CCS assembly is greater than the size threshold, the PIN needle joint of the CCS assembly is a failure condition.
In one embodiment, in the step S200, the offset threshold is 0.1mm, and the size threshold is 0.3mm. That is, the PIN needle is qualified within 0.1mm of the offset compared with the standard position. The maximum length of the foreign matter is less than or equal to 0.3mm, and the foreign matter is not qualified if the maximum length of the foreign matter is more than 0.3mm.
Specifically, the offset of the PIN needle and the foreign matter detection can be realized by using the existing image processing method. For example, an acquired image of a qualified product is recorded, a detection area is defined, parameters of identifiable color pixels of the detection area are recorded, and when the detection is performed, whether the PIN needle is deviated or has foreign matters is judged by acquiring the parameters of the identifiable color pixels of the detection area of the PIN needle image to be detected.
The application also provides detection equipment, as shown in fig. 1, the detection equipment comprises a rack 110, wherein a lower layer conveying component and an upper layer conveying component are arranged on the rack 110, the upper layer conveying component is positioned above the lower layer conveying component, the detection equipment further comprises a CCD detection component 160 and a pressing detection component, and the CCD detection component 160 is used for obtaining images of PIN needles in PIN needle joints of CCS components on the upper layer conveying component or the lower layer conveying component. The CCD detection assembly 160 may be composed of a CCD camera assembly and a mobile module. The push-down detection assembly includes a lift mechanism 140 and a probe assembly 150 coupled to the lift mechanism 140. The lifting mechanism 140 may include an air cylinder, a frame, a guide assembly, and the like. The probe assembly 150 is connected to the detection instrument, the probe assembly 150 is used for being connected to a CCS assembly conveyed by an upper layer conveying assembly or a lower layer conveying assembly, a part of probes are in contact with nickel plates of the CCS assembly, a part of probes are in contact with palladium plates of the CCS assembly, the upper layer conveying assembly comprises a first linear conveying mechanism 121 and a first platform 122 arranged on the first linear conveying mechanism 121, a plurality of first type damping assemblies are arranged on the first platform 122, a first carrier plate 123 is arranged on each first type damping assembly, a plurality of first type vibrating assemblies are also arranged at the bottom of the first carrier plate 123, and the first type vibrating assemblies can be a vibrating motor 124; the lower layer conveying assembly comprises a second linear conveying mechanism 131, the second linear conveying mechanism 131 is arranged on the inner side of the first linear conveying mechanism 121, a second platform 132 is arranged on the second linear conveying mechanism 131, a plurality of second type damping assemblies are arranged on the second platform 132, a second carrier plate 133 is arranged on each second type damping assembly, a plurality of second type vibrating assemblies are further arranged at the bottom of the second carrier plate 133, and the second type vibrating assemblies can be vibrating motors 124.
When the detection equipment is used, the detection equipment is provided with a feeding station and a detection station, the CCS component to be detected is fixed through the jig at the feeding station, the jig is fixed on the first carrier plate 123, and the fixing mode of the jig can be fixed by adopting modes such as screws, quick clamping pieces and the like. The PIN connector of the CCS assembly is then connected to the connector of the corresponding test instrument. The CCS assembly on the jig on the first carrier 123 is conveyed to the detection station by the first linear conveying mechanism 121, and the first vibration assembly is started to vibrate the first carrier 123 at the detection station, that is, under the probe assembly 150, where the first carrier 123 vibrates to drive the jig and the CCS assembly to vibrate. In the case of vibration, a first type of test is performed on the CCS assembly and the test results are obtained. Wherein the first type of test comprises an NTC test and the test result is obtained after the test. After the test is completed, the first vibration component is closed, and the corresponding carrier plate does not vibrate any more. Next, the probe assembly 150 is lowered by the elevating mechanism 140, the probe assembly 150 is brought into contact with the palladium sheet and the nickel sheet of the corresponding CCS assembly, and then a second type of test is performed and a test result is obtained, the second type of test including: withstand voltage test, insulation resistance test, wire harness internal resistance test, wire harness on-off test and the like. Wherein each probe on the probe assembly 150 is coupled to a corresponding detection instrument. After the detection is finished, the CCS component on the jig on the first carrier plate 123 is conveyed to the feeding station through the first linear conveying mechanism 121, and the connector of the detection instrument is separated from the PIN needle connector of the CCS component. The amount of PIN offset and the size of the foreign object in the PIN header of the CCS assembly is then detected by the CCD detection assembly 160. The detection instrument connected with the PIN joint and the detection instrument connected with the probe can use the existing related instruments.
Further, in the process of detecting the CCS on the first carrier 123 at the detecting station, a new jig may be placed on the second carrier 133, and the CCS to be detected is fixed in the jig. After the first carrier plate 123 returns to the loading station from the detecting station, the second carrier plate 133 is conveyed to the detecting station. The above steps are repeated to detect CCS components on the second carrier plate 133. The device provided by the application is provided with the first carrier plate 123 and the second carrier plate 133, so that the detection efficiency can be effectively improved. And the second linear transport mechanism 131 is disposed inside the first linear transport mechanism 121, so that the space of the apparatus can be saved while improving the detection efficiency.
In one embodiment, as shown in fig. 1, the two ends of the first carrier 123 are provided with balancing weights 170. Specifically, the first linear conveying mechanism 121 includes two motor-driven components, and two ends of the first carrier plate 123 are respectively connected to the two motor-driven components. The second linear conveying mechanism 131 comprises a motor-driven component and guide rails positioned on two sides, wherein a sliding block component is arranged on the guide rails, and two ends of the second carrier plate 133 are respectively connected with the sliding block components on the two guide rails. The space below the first carrier 123 is used for the movement of the second carrier 133.
In one embodiment, as shown in fig. 2 to 4, in order to reduce the vibration of the carrier plate and transfer the vibration to other structures, so that the other structures can stably operate for a long time, the first type damping component and the second type damping component have the same structure, the first type damping component comprises a VD type rubber damping column 125, the VD type rubber damping column 125 comprises a main body, one end surface of the main body is provided with a screw hole, the other end of the main body is provided with a threaded column 126, the first type damping component further comprises a linear bearing 128, the linear bearing 128 is sleeved on a movable rod 127, one end of the movable rod 127 is connected with the threaded column 126, the other end of the movable rod 127 is provided with a baffle 127a, and a spring 129 is arranged between the baffle 127a and the lower end surface of the linear bearing 128.
On the basis of the above, the screw hole of the main body of the VD-type rubber shock strut 125 between the first carrier 123 and the first platform 122 is connected with the bolt on the first carrier 123, the first platform 122 is provided with a mounting hole, and the linear bearing 128 is disposed in the mounting hole. Similarly, the screw hole of the main body of the VD-type rubber shock strut 125 between the second carrier plate 133 and the second platform 132 is connected with a bolt on the second carrier plate 133, the second platform 132 is provided with a mounting hole, and the linear bearing 128 is disposed in the mounting hole.
In one embodiment, as shown in fig. 5-7, this requires replacement of the probe position of the probe assembly 150 due to the different PIN needle positions of the different CCS assemblies. In order to realize quick replacement to improve detection efficiency, probe assembly 150 includes upper magnetic plate 151 and lower floor's deflector 152, be provided with a plurality of quick change posts 158 between upper magnetic plate 151 and the lower floor's deflector 152, be provided with a plurality of fixed blocks 156 on the upper magnetic plate 151, every fixed block 156 department is provided with a plurality of spouts, is provided with fixture block 157 in one of them spout of every fixed block 156 department, fixture block 157 can follow the spout and slide, the fixture block 157 is used for with corresponding quick change post 158 joint, the front end of fixture block 157 is provided with the draw-in groove, and the upper end of quick change post 158 is provided with the joint portion that is used for with draw-in groove complex, and joint portion includes the circle piece on a section diameter less cylinder and cylinder top. A plurality of probe supporting blocks 153 are further arranged between the upper magnetic attraction plate 151 and the lower guide plate 152, probes 155 are arranged at the bottom ends of the probe supporting blocks 153, magnets 154 are arranged at the top ends of the probe supporting blocks 153, the magnets 154 and the upper magnetic attraction plate 151 attract each other, and a plurality of positioning holes for the probe supporting blocks 153 to pass through are formed in the lower guide plate 152. It will be appreciated that the lower guide plate 152 may be split, i.e., the lower guide plate 152 is formed by splicing a plurality of sub-plates.
When the probe assembly 150 needs to be replaced, the fixture blocks 157 are separated from the corresponding quick-change posts 158, and the quick-change posts 158 can be removed along with the lower guide plate 152. Each of the probe supporting blocks 153 is then mounted on the new lower guide plate 152, and then the quick-change posts 158 of the new lower guide plate 152 are engaged with the corresponding clamping blocks 157. Thus, the adjustment of the probe position is completed.
Further, the first carrier 123 is provided with a plurality of positioning slots 180, and the second carrier 133 is provided with a plurality of positioning slots 180, and the positioning slots 180 are used for assisting in positioning the jig.
In one embodiment, the detection device further comprises a code scanner 190. The code scanner 190 may be a code scanner of the type of a code scanner gun or the like. The CCS component is scanned and recorded, so that detection data and the two-dimensional code of the product can be bound, and the detection data and the two-dimensional code of the product can be used for tracing the data of the later-stage product.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (7)
1. A method of welding inspection of CCS assemblies, comprising:
s100, welding the CCS component through laser welding equipment, and transferring the welded CCS component to detection equipment;
s200, vibrating the CCS component through detection equipment, and performing a first type of test on the vibrated CCS component, wherein the first type of test comprises NTC test;
s300, after vibration of the CCS component is stopped at the detection equipment, detecting whether the offset of the PIN needle of the CCS component is smaller than or equal to an offset threshold value or not through an image analysis method, and detecting whether the size of the foreign matter at the PIN needle of the CCS component is smaller than or equal to a size threshold value or not;
the detection equipment comprises a rack, wherein a lower layer conveying assembly and an upper layer conveying assembly are arranged on the rack;
the detection equipment further comprises a CCD detection assembly and a pressing detection assembly, wherein the CCD detection assembly is used for obtaining images of PIN needles of the CCS assembly on the upper layer conveying assembly or the lower layer conveying assembly, the pressing detection assembly comprises a lifting mechanism and a probe assembly connected with the lifting mechanism, the probe assembly is connected with a detection instrument, and the probe assembly is used for being connected with the CCS assembly conveyed by the upper layer conveying assembly or the lower layer conveying assembly;
the upper layer conveying assembly comprises a first linear conveying mechanism and a first platform arranged on the first linear conveying mechanism, a plurality of first type damping assemblies are arranged on the first platform, a first carrier plate is arranged on each first type damping assembly, and a plurality of first type vibrating assemblies are further arranged at the bottom of each first carrier plate;
the lower layer conveying assembly comprises a second linear conveying mechanism, the second linear conveying mechanism is arranged on the inner side of the first linear conveying mechanism, a second platform is arranged on the second linear conveying mechanism, a plurality of second type damping assemblies are arranged on the second platform, a second carrier plate is arranged on each second type damping assembly, and a plurality of second type vibrating assemblies are further arranged at the bottom of each second carrier plate.
2. The CCS assembly welding inspection method according to claim 1, wherein in S200, a shift threshold is 0.1mm and a size threshold is 0.3mm.
3. The welding detection method of CCS assemblies according to claim 1, wherein said first type of damper assembly and said second type of damper assembly are identical in structure, said first type of damper assembly includes a VD type rubber damper post, said VD type rubber damper post includes a main body, one end surface of said main body is provided with a screw hole, the other end of said main body is provided with a screw post, said first type of damper assembly further includes a linear bearing, said linear bearing is sleeved on a movable rod, one end of said movable rod is connected with said screw post, the other end of said movable rod is provided with a baffle, and a spring is provided between said baffle and a lower end surface of said linear bearing.
4. The welding inspection method of CCS assemblies as claimed in claim 3, wherein screw holes of a main body of the VD type rubber shock absorber column between the first carrier plate and the first platform are connected with bolts on the first carrier plate, mounting holes are formed in the first platform, and the linear bearings are arranged in the mounting holes.
5. The welding detection method of the CCS assembly according to claim 1, wherein the probe assembly comprises an upper magnetic plate and a lower guide plate, a plurality of quick-change posts are arranged between the upper magnetic plate and the lower guide plate, a plurality of fixing blocks are arranged on the upper magnetic plate, a plurality of sliding grooves are arranged at each fixing block, a clamping block is arranged in one sliding groove at each fixing block, the clamping block is clamped with the corresponding quick-change post, a plurality of probe supporting blocks are further arranged between the upper magnetic plate and the lower guide plate, probes are arranged at the bottom ends of the probe supporting blocks, a magnet is arranged at the top end of the probe supporting block, the magnet and the upper magnetic plate are attracted mutually, a plurality of positioning holes for the probe supporting blocks to pass through are arranged on the lower guide plate, and mounting through holes are arranged at the lower end of the probe supporting block, so that the probes are connected with corresponding wires through the mounting through holes.
6. The welding inspection method of CCS assemblies as claimed in claim 5, wherein said first carrier plate is provided with a plurality of positioning slots, and said second carrier plate is provided with a plurality of positioning slots.
7. The method of welding inspection of CCS assemblies as in claim 6, wherein said inspection apparatus further comprises a code scanner.
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| JP2004152916A (en) * | 2002-10-29 | 2004-05-27 | Nec Corp | Inspecting device and inspecting method of semiconductor device |
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