CN116469806B - Foot wrapping machine for producing surface mount devices - Google Patents
Foot wrapping machine for producing surface mount devices Download PDFInfo
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- CN116469806B CN116469806B CN202310470652.0A CN202310470652A CN116469806B CN 116469806 B CN116469806 B CN 116469806B CN 202310470652 A CN202310470652 A CN 202310470652A CN 116469806 B CN116469806 B CN 116469806B
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- 238000005452 bending Methods 0.000 claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000006073 displacement reaction Methods 0.000 claims description 35
- 210000000078 claw Anatomy 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 14
- 238000012856 packing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000000872 buffer Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000007493 shaping process Methods 0.000 abstract description 2
- 230000000153 supplemental effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000013589 supplement Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/02—Straightening
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention relates to the technical field of surface mount device production, in particular to a foot wrapping machine for surface mount device production, which comprises a cabinet, a bottom plate fixedly arranged on the cabinet, a feeding mechanism fixedly arranged on one side of the cabinet, a feeding clamping mechanism fixedly arranged on the bottom plate, a bipolar bending mechanism, a shifting and flattening combined mechanism and a forming and positioning mechanism; the bipolar bending mechanism comprises a bending seat and a bending mechanism bracket which are fixedly arranged on the bottom plate, and a first bending station and a second bending station which are arranged on the bending seat along the X direction; the shifting and flattening combined mechanism comprises a mounting bracket fixedly mounted on the bottom plate, and a shifting plate is slidably matched with the mounting bracket along the X direction. This package foot machine is through three times bending with the pin shaping, can realize the multistation and process in step, has improved machining efficiency, and each step all standardizes the processing position through fixed station and tool, has improved machining precision to product quality's stability has been improved.
Description
Technical Field
The invention relates to the technical field of surface mount device production, in particular to a foot wrapping machine for surface mount device production.
Background
The Surface Mount Device (SMD) has been widely used in integrated circuit boards because of its advantages of high packing density, small size of electronic products, light weight, good high frequency characteristics, and easy automation. In the process of manufacturing the surface mount device, some pins need to be wrapped inward to be attached to the surface of the package, which is called pin wrapping. In the current production process, the pin wrapping processing of the SMD mostly depends on manual operation, the processing efficiency is low, the pin is easy to be attached to the surface of the package, the degree of attachment is not high, and the product quality is unstable.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a foot wrapping machine for producing surface mount devices.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
A foot wrapping machine for producing surface mount devices comprises a cabinet, a bottom plate fixedly arranged on the cabinet, a feeding mechanism fixedly arranged on one side of the cabinet, a feeding clamping mechanism fixedly arranged on the bottom plate, a bipolar bending mechanism, a shifting and flattening combination mechanism and a forming and positioning mechanism;
The bipolar bending mechanism comprises a bending seat and a bending mechanism bracket which are fixedly arranged on a bottom plate, and a first bending station and a second bending station which are arranged on the bending seat along the X direction, wherein bending cylinders are respectively arranged on the lower sides of the first bending station and the second bending station, the output end of each bending cylinder is fixedly connected with a U-shaped roller frame, and the upper end of each roller frame is respectively and rotatably connected with two rollers with axes along the X direction; the bending mechanism comprises a bending mechanism support, wherein a supplemental stop block linear module is fixedly arranged on the bending mechanism support along the X direction, a supplemental stop block support is arranged on a sliding part of the supplemental stop block linear module, a supplemental stop block corresponding to a first bending station is fixedly arranged on the supplemental stop block support, a material pressing tool linear module is also arranged on the supplemental stop block support along the Z direction, and a material pressing tool corresponding to the first bending station is arranged on a sliding part of the material pressing tool linear module;
The shifting and flattening combined mechanism comprises a mounting bracket fixedly mounted on the bottom plate, a shifting plate is slidably matched on the mounting bracket along the X direction, and a shifting driving cylinder for driving the shifting plate is mounted on the mounting bracket;
The shifting plate is provided with a shifting clamping jaw cylinder frame and a flattening clamping jaw cylinder frame in a sliding fit mode along the Z direction, the shifting plate is provided with a shifting driving cylinder and a flattening driving cylinder, the output end of the shifting driving cylinder is fixedly connected with the shifting clamping jaw cylinder frame, and the output end of the flattening driving cylinder is fixedly connected with the flattening clamping jaw cylinder frame; a first shifting cylinder and a second shifting cylinder are in sliding fit with the shifting clamping jaw cylinder frame along the Z direction, the output end of the first shifting cylinder is fixedly connected with a first shifting clamping jaw, and the output end of the second shifting cylinder is fixedly connected with a second shifting clamping jaw;
The flattening fixture is fixedly connected to the flattening clamping jaw cylinder frame, the blanking clamping jaw cylinder is fixedly mounted on the flattening clamping jaw cylinder frame, and the blanking clamping jaw is fixedly connected to the output end of the blanking clamping jaw cylinder;
The forming and positioning mechanism comprises a blanking supporting seat fixed on the bottom plate, wherein a forming station is arranged on the blanking supporting seat, and the forming station, the second bending station and the first bending station are sequentially arranged from left to right along the X direction.
Preferably, the feeding clamping mechanism comprises a feeding mechanism seat fixed on the bottom plate, a feeding Y-direction linear module is fixedly arranged on the feeding mechanism seat, a feeding Z-direction linear module is arranged on a sliding part of the feeding Y-direction linear module, a feeding clamping claw cylinder is arranged on a sliding part of the feeding Z-direction linear module, and the output end of the feeding clamping claw cylinder is fixedly connected with a feeding clamping jaw.
Preferably, when the sliding part of the feeding Y-direction linear module is positioned at the rear end of the stroke along the Y-direction, the feeding clamping claw corresponds to the first bending station up and down.
Preferably, two rollers corresponding to the same station are respectively arranged on the front side and the rear side of the station.
Preferably, the left and right ends of the mounting bracket are respectively provided with a buffer.
Preferably, a flattening top block is arranged at the bottom of the flattening tool.
Preferably, the front side and the rear side of the forming station are respectively provided with a forming push block which is in sliding fit with the blanking support seat along the Y direction, the blanking support seat is provided with two forming push block motors, and each forming push block motor is used for respectively driving one forming push block.
Preferably, when the shifting plate reaches the rightmost end of the stroke under the driving of the shifting driving cylinder, the first shifting clamping jaw corresponds to the first bending station up and down, the second shifting clamping jaw corresponds to the second bending station up and down, and the blanking clamping jaw corresponds to the forming station up and down.
Preferably, when the shifting plate reaches the leftmost end of the stroke under the driving of the shifting driving cylinder, the feeding clamping jaw corresponds to the first bending station up and down, the first shifting clamping jaw corresponds to the second bending station up and down, and the second shifting clamping jaw corresponds to the forming station up and down.
The beneficial effects of the invention are as follows:
1. the pin is molded through three times of bending, multi-station synchronous processing can be realized, and all surface mount devices in a processing state can be sequentially moved to the next station at one time in each shifting process, so that the processing efficiency is improved.
2. In the pin bending processing process, the pin is folded inwards firstly, then the root part of the pin is folded, finally the pin is flattened, the processing position is standardized through a fixed station and a fixture in each step, and the processing precision is improved, so that the stability of the product quality is improved.
Drawings
Fig. 1 is a schematic perspective view of a foot wrapping machine for producing surface mount devices according to the present invention;
fig. 2 is a schematic view of the upper part of the bottom plate of the foot wrapping machine for producing surface mount devices according to the present invention;
fig. 3 is a schematic front view of the top of the bottom plate of the foot wrapping machine for producing surface mount devices according to the present invention;
fig. 4 is a schematic structural diagram of a feeding and clamping mechanism of a foot wrapping machine for producing surface mount devices according to the present invention;
Fig. 5 is a schematic structural diagram of a bipolar bending mechanism of a pin wrapping machine for producing surface mount devices according to the present invention;
fig. 6 is a schematic structural diagram of a shifting and flattening combination mechanism and a forming and positioning mechanism of a foot wrapping machine for producing surface mount devices according to the present invention;
Fig. 7 is a schematic diagram of the upper structure of a shifting plate of a foot packing machine for producing surface mount devices according to the present invention;
Fig. 8 is an enlarged schematic view of the structure of fig. 7 a of a pin wrapping machine for surface mount device production according to the present invention;
Fig. 9 is a schematic structural diagram of the surface mount device after one bending;
fig. 10 is a schematic structural diagram of the surface mount device after secondary bending;
fig. 11 is a schematic structural diagram of the surface mount device after molding.
In the figure: 1-a cabinet; 2-a feeding mechanism; 3-a feeding clamping mechanism; 31-a feeding mechanism seat; 32-feeding a Y-direction linear module; 33-feeding a Z-direction linear module; 34-feeding clamping claw air cylinders; 35-a feeding clamping jaw; 4-bipolar bending mechanism; 401-bending seat; 402-a first bending station; 403-a second bending station; 404-bending cylinder; 405-roller frame; 406-a roller; 407-bending mechanism bracket; 408-a supplemental stop line module; 409-supplemental stop bracket; 410-a supplemental stop; 411-a linear module of the pressing tool; 412-pressing a material tool; 5-shifting and flattening combined mechanism; 501-mounting a bracket; 502-a displacement drive cylinder; 503-a displacement plate; 504-a displacement drive cylinder; 505-shift jaw cylinder frame; 506-a first displacement cylinder; 507-a second displacement cylinder; 508-a first displacement jaw; 509-a second displacement jaw; 510-flattening driving cylinder; 511-flattening the jaw cylinder frame; 512-flattening tool; 5121-flattening the top block; 513-a blanking clamping claw cylinder; 514-blanking clamping jaw; 515-buffer; 6-forming and positioning mechanism; 61-blanking supporting seats; 62-a forming station; 63-a shaping pusher motor; 64-forming a pushing block; 7-a bottom plate; 8-surface mount devices.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-8, a foot wrapping machine for producing surface mount devices comprises a cabinet 1, a bottom plate 7 fixedly installed on the cabinet 1, a feeding mechanism 2 fixedly installed on one side of the cabinet 1, a feeding clamping mechanism 3 fixedly installed on the bottom plate 7, a bipolar bending mechanism 4, a shifting and flattening combination mechanism 5 and a forming and positioning mechanism 6;
The feeding clamping mechanism 3 comprises a feeding mechanism seat 31 fixed on the bottom plate 7, a feeding Y-direction linear module 32 is fixedly installed on the feeding mechanism seat 31, a feeding Z-direction linear module 33 is installed on the sliding part of the feeding Y-direction linear module 32, a feeding clamping claw cylinder 34 is installed on the sliding part of the feeding Z-direction linear module 33, and the output end of the feeding clamping claw cylinder 34 is fixedly connected with a feeding clamping claw 35.
The bipolar bending mechanism 4 comprises a bending seat 401 and a bending mechanism bracket 407 which are fixedly arranged on a bottom plate 7, a first bending station 402 and a second bending station 403 which are arranged on the bending seat 401 along the X direction, bending cylinders 404 are respectively arranged on the lower sides of the first bending station 402 and the second bending station 403, the output ends of the bending cylinders 404 are fixedly connected with U-shaped roller brackets 405, the upper end of each roller bracket 405 is respectively and rotatably connected with two rollers 406 with axes along the X direction, two rollers 406 corresponding to the same station are respectively arranged on the front side and the rear side of the corresponding station, a supplement stop linear module 408 is fixedly arranged on the bending mechanism bracket 407 along the X direction, a supplement stop bracket 409 is arranged on the sliding part of the supplement stop linear module 408, a supplement stop 410 corresponding to the first bending station 402 is fixedly arranged on the supplement stop bracket 409, a pressing tool corresponding to the first bending station 402 is also arranged on the supplement stop bracket 409 along the Z direction, and a pressing tool corresponding to the first bending station 402 is arranged on the sliding part of the pressing tool 411.
When the sliding portion of the feeding Y-direction linear module 32 is located at the rear end of the stroke along the Y-direction, the feeding gripper jaw 35 corresponds up and down to the first bending station 402.
The displacement flattening combination mechanism 5 comprises a mounting bracket 501 fixedly mounted on the bottom plate 7, a displacement plate 503 is slidingly matched on the mounting bracket 501 along the X direction, a displacement driving cylinder 502 for driving the displacement plate 503 is mounted on the mounting bracket 501, and buffers 515 are respectively arranged at the left end and the right end of the mounting bracket 501 to limit the left travel and the right travel of the displacement plate 503.
The shifting plate 503 is provided with a shifting clamping jaw cylinder frame 505 and a flattening clamping jaw cylinder frame 511 in a sliding fit manner along the Z direction, the shifting plate 503 is provided with a shifting driving cylinder 504 and a flattening driving cylinder 510, the output end of the shifting driving cylinder 504 is fixedly connected with the shifting clamping jaw cylinder frame 505, and the output end of the flattening driving cylinder 510 is fixedly connected with the flattening clamping jaw cylinder frame 511. The first shifting cylinder 506 and the second shifting cylinder 507 are slidably matched with the shifting clamping jaw cylinder frame 505 along the Z direction, the output end of the first shifting cylinder 506 is fixedly connected with a first shifting clamping jaw 508, and the output end of the second shifting cylinder 507 is fixedly connected with a second shifting clamping jaw 509.
The clamping jaw cylinder frame 511 that flattens is last fixedly connected with frock 512 that flattens, the bottom of frock 512 that flattens is provided with the kicking block 5121 that flattens, the clamping jaw cylinder 513 that flattens is last fixedly mounted with unloading clamp claw cylinder 513, the output fixedly connected with unloading clamping jaw 514 of unloading clamp claw cylinder 513.
The forming and positioning mechanism 6 comprises a blanking supporting seat 61 fixed on the bottom plate 7, a forming station 62 is arranged on the blanking supporting seat 61, the forming station 62, a first bending station 402 and a second bending station 403 are sequentially arranged from left to right along the X direction, forming push blocks 64 which are in sliding fit on the blanking supporting seat 61 along the Y direction are respectively arranged on the front side and the rear side of the forming station 62, two forming push block motors 63 are arranged on the blanking supporting seat 61, and each forming push block motor 63 drives one forming push block 64.
When the displacement plate 503 reaches the rightmost end of the stroke under the drive of the displacement driving cylinder 502, the first displacement clamping jaw 508 corresponds to the first bending station 402 up and down, the second displacement clamping jaw 509 corresponds to the second bending station 403 up and down, and the blanking clamping jaw 514 corresponds to the forming station 62 up and down. When the displacement plate 503 reaches the leftmost end of the stroke under the drive of the displacement driving cylinder 502, the feeding clamping claw 35 vertically corresponds to the first bending station 402, the first displacement clamping claw 508 vertically corresponds to the second bending station 403, and the second displacement clamping claw 509 vertically corresponds to the forming station 62.
When the surface mount device 8 is packaged, the surface mount device 8 with straight pins is fed by the feeding mechanism 2, and the feeding clamping claw 35 is driven by the feeding Y-direction linear module 32, the feeding Z-direction linear module 33 and the feeding clamping claw cylinder 34 to send the surface mount device 8 to the first bending station 402.
The linear module 408 of the supplementary stop block drives the supplementary stop block 410 to move left and press on the surface mount device 8 to determine the bending position of the pin, the linear module 411 of the pressing tool drives the pressing tool 412 to press down to fix the surface mount device 8, then the corresponding bending cylinder 404 drives the roller 406 to move upwards to bend the pin for the first time, the pin is bent inwards first, and the pin after bending is shown in fig. 9.
After that, the pressing tool 412 and the supplementary stop 410 are reset, the first shifting clamping jaw 508 clamps the surface mount device 8, the shifting driving cylinder 502 drives the shifting plate 503 to shift leftwards, and the surface mount device 8 is sent to the second bending station 403. At this time, the first displacement clamping jaw 508 holds the surface mount device 8, the corresponding bending cylinder 404 drives the roller 406 to move upwards, the pin is bent for the second time, the root of the pin is bent, and the bent pin is shown in fig. 10.
After that, the first shifting clamping jaw 508 is loosened, the shifting driving cylinder 502 drives the shifting plate 503 to shift rightwards, the second shifting clamping jaw 509 clamps the surface mounting device 8, the shifting driving cylinder 502 drives the shifting plate 503 to shift leftwards, the surface mounting device 8 is sent to the forming station 62, the shifting driving cylinder 502 drives the shifting plate 503 to shift rightwards, the forming pushing block motor 63 drives the forming pushing block 64 to bear against the surface mounting device 8 from the front side and the rear side, the flattening driving cylinder 510 drives the flattening clamping jaw cylinder frame 511 to press downwards, the flattening tool 512 is driven to press downwards, and the flattening jacking block 5121 flattens pins, as shown in fig. 11. Then, the surface mount device 8 is gripped by the discharging gripping claw 514, and the displacement driving cylinder 502 drives the displacement plate 503 to displace leftward, so that discharging is performed.
The first bending station 402, the second bending station 403 and the forming station 62 perform machining synchronously, and in each shifting process, the first shifting clamping jaw 508, the second shifting clamping jaw 509 and the blanking clamping jaw 514 operate synchronously, so that all the surface mount devices 8 in the machining state are sequentially moved to the next station at one time, and the machining efficiency is improved.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. The foot wrapping machine for producing the surface mount device is characterized by comprising a cabinet (1), a bottom plate (7) fixedly arranged on the cabinet (1), a feeding mechanism (2) fixedly arranged on one side of the cabinet (1), a feeding clamping mechanism (3) fixedly arranged on the bottom plate (7), a bipolar bending mechanism (4), a shifting and flattening combined mechanism (5) and a forming and positioning mechanism (6);
The bipolar bending mechanism (4) comprises a bending seat (401) and a bending mechanism bracket (407) which are fixedly arranged on a bottom plate (7), a first bending station (402) and a second bending station (403) which are arranged on the bending seat (401) along the X direction, bending cylinders (404) are respectively arranged on the lower sides of the first bending station (402) and the second bending station (403), the output ends of the bending cylinders (404) are fixedly connected with U-shaped roller frames (405), and the upper end of each roller frame (405) is respectively and rotatably connected with two rollers (406) with axes along the X direction; a supplementary stop block linear module (408) is fixedly arranged on the bending mechanism support (407) along the X direction, a supplementary stop block support (409) is arranged on the sliding part of the supplementary stop block linear module (408), a supplementary stop block (410) corresponding to the first bending station (402) is fixedly arranged on the supplementary stop block support (409), a material pressing tool linear module (411) is also arranged on the supplementary stop block support (409) along the Z direction, and a material pressing tool (412) corresponding to the first bending station (402) is arranged on the sliding part of the material pressing tool linear module (411);
The displacement flattening combination mechanism (5) comprises a mounting bracket (501) fixedly mounted on the bottom plate (7), a displacement plate (503) is slidably matched with the mounting bracket (501) along the X direction, and an X-direction displacement driving cylinder (502) for driving the displacement plate (503) is mounted on the mounting bracket (501);
A shifting clamping jaw cylinder frame (505) and a flattening clamping jaw cylinder frame (511) are slidably matched on the shifting plate (503) along the Z direction, a Z-direction shifting driving cylinder (504) and a flattening driving cylinder (510) are installed on the shifting plate (503), the output end of the Z-direction shifting driving cylinder (504) is fixedly connected with the shifting clamping jaw cylinder frame (505), and the output end of the flattening driving cylinder (510) is fixedly connected with the flattening clamping jaw cylinder frame (511); a first shifting cylinder (506) and a second shifting cylinder (507) are in sliding fit with the shifting clamping jaw cylinder frame (505) along the Z direction, the output end of the first shifting cylinder (506) is fixedly connected with a first shifting clamping jaw (508), and the output end of the second shifting cylinder (507) is fixedly connected with a second shifting clamping jaw (509);
The flattening clamping jaw cylinder frame (511) is fixedly connected with a flattening tool (512), the flattening clamping jaw cylinder frame (511) is fixedly provided with a blanking clamping jaw cylinder (513), and the output end of the blanking clamping jaw cylinder (513) is fixedly connected with a blanking clamping jaw (514);
The forming and positioning mechanism (6) comprises a blanking supporting seat (61) fixed on the bottom plate (7), a forming station (62) is arranged on the blanking supporting seat (61), and the forming station (62), the second bending station (403) and the first bending station (402) are sequentially arranged from left to right along the X direction;
When the displacement plate (503) reaches the rightmost end of the travel under the drive of the X-direction displacement driving cylinder (502), the first displacement clamping jaw (508) corresponds to the first bending station (402) up and down, the second displacement clamping jaw (509) corresponds to the second bending station (403) up and down, and the blanking clamping jaw (514) corresponds to the forming station (62) up and down;
When the displacement plate (503) reaches the leftmost end of the stroke under the drive of the X-direction displacement driving cylinder (502), the feeding clamping claw (35) corresponds to the first bending station (402) up and down, the first displacement clamping claw (508) corresponds to the second bending station (403) up and down, and the second displacement clamping claw (509) corresponds to the forming station (62) up and down.
2. The foot packing machine for surface mount device production according to claim 1, wherein the feeding clamping mechanism (3) comprises a feeding mechanism seat (31) fixed on the bottom plate (7), a feeding Y-direction linear module (32) is fixedly installed on the feeding mechanism seat (31), a feeding Z-direction linear module (33) is installed on a sliding part of the feeding Y-direction linear module (32), a feeding clamping claw cylinder (34) is installed on a sliding part of the feeding Z-direction linear module (33), and a feeding clamping claw (35) is fixedly connected to an output end of the feeding clamping claw cylinder (34).
3. The foot packing machine for surface mount device production according to claim 2, wherein the feeding gripper (35) corresponds up and down to the first bending station (402) when the sliding portion of the feeding Y-direction linear module (32) is located at the rear end of the stroke along the Y-direction.
4. The foot packing machine for producing surface mount devices according to claim 1, wherein in the forming station (62), the first bending station (402) and the second bending station (403), two rollers (406) corresponding to the same station are respectively disposed on the front side and the rear side of the station.
5. The foot packing machine for surface mount device production according to claim 1, wherein the mounting bracket (501) is provided with buffers (515) at both left and right ends thereof, respectively.
6. The foot packing machine for surface mount device production according to claim 1, wherein a bottom of the flattening fixture (512) is provided with a flattening top block (5121).
7. The foot packing machine for surface mount device production according to claim 1, wherein forming push blocks (64) which are slidably matched with the blanking support base (61) along the Y direction are respectively arranged on the front side and the rear side of the forming station (62), two forming push block motors (63) are arranged on the blanking support base (61), and each forming push block motor (63) respectively drives one forming push block (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310470652.0A CN116469806B (en) | 2023-04-27 | 2023-04-27 | Foot wrapping machine for producing surface mount devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310470652.0A CN116469806B (en) | 2023-04-27 | 2023-04-27 | Foot wrapping machine for producing surface mount devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116469806A CN116469806A (en) | 2023-07-21 |
| CN116469806B true CN116469806B (en) | 2024-04-19 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206263143U (en) * | 2016-11-30 | 2017-06-20 | 东莞市捷瑞电子设备有限公司 | A kind of electronic component pin forming machine |
| CN109326526A (en) * | 2018-11-17 | 2019-02-12 | 安徽瑞翔电子科技有限公司 | Stamp-mounting-paper diode pin bending and molding device |
| CN214476935U (en) * | 2021-04-14 | 2021-10-22 | 东莞市三体微电子技术有限公司 | Automatic bender of inductor |
| CN115091198A (en) * | 2022-07-05 | 2022-09-23 | 苏州常思行自动化科技有限公司 | Diode rigging equipment of buckling |
| CN115732149A (en) * | 2022-03-17 | 2023-03-03 | 深圳市合利士智能装备有限公司 | Equipment and method for processing resistor pins |
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2023
- 2023-04-27 CN CN202310470652.0A patent/CN116469806B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206263143U (en) * | 2016-11-30 | 2017-06-20 | 东莞市捷瑞电子设备有限公司 | A kind of electronic component pin forming machine |
| CN109326526A (en) * | 2018-11-17 | 2019-02-12 | 安徽瑞翔电子科技有限公司 | Stamp-mounting-paper diode pin bending and molding device |
| CN214476935U (en) * | 2021-04-14 | 2021-10-22 | 东莞市三体微电子技术有限公司 | Automatic bender of inductor |
| CN115732149A (en) * | 2022-03-17 | 2023-03-03 | 深圳市合利士智能装备有限公司 | Equipment and method for processing resistor pins |
| CN115091198A (en) * | 2022-07-05 | 2022-09-23 | 苏州常思行自动化科技有限公司 | Diode rigging equipment of buckling |
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