CN109326526A - Stamp-mounting-paper diode pin bending and molding device - Google Patents
Stamp-mounting-paper diode pin bending and molding device Download PDFInfo
- Publication number
- CN109326526A CN109326526A CN201811370300.3A CN201811370300A CN109326526A CN 109326526 A CN109326526 A CN 109326526A CN 201811370300 A CN201811370300 A CN 201811370300A CN 109326526 A CN109326526 A CN 109326526A
- Authority
- CN
- China
- Prior art keywords
- fixture
- stamp
- mounting
- briquetting
- paper diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The present invention gives a kind of stamp-mounting-paper diode pin bending and molding devices；Including transition fixture, the first pressing assembly and the second pressing assembly；Several location holes for placing stamp-mounting-paper diode are provided in the middle part of transition fixture, transition fixture lower part two sides have notch, and the upper end of notch is communicated with several location holes；First upper pressure seat lower end surface of the first pressing assembly is provided with the first clamp groove, and the first upper pressure seat is extended with the first pressing plate to downside, and the first pressing plate has extended downwardly cutting edge；First base upper surface is provided with the first fixing groove, and first base upper surface is also provided with the first bending groove, and two the first bending grooves are in the first fixing groove two sides；The the second upper pressure seat lower end surface and transition fixture upper surface of second pressing assembly cooperate, and the second briquetting two sides are extended with the second pressing plate to downside；Second base upper surface is provided with the second fixing groove with the cooperation of transition fixture lower part.This molding machine is easy to operate, easy to use, greatly improves the processing efficiency of existing stamp-mounting-paper diode.
Description
Technical field
The present invention relates to a kind of stamp-mounting-paper diode pin bending and molding devices.
Background technique
Stamp-mounting-paper diode is also known as crystal diode, and stamp-mounting-paper diode is the most common circuit element, stamp-mounting-paper diode processing
When need first to flatten the cylindric pin of stamp-mounting-paper diode, extra pin is then cut off, by remaining flat pin bending
Molding, current stamp-mounting-paper diode manufacturing procedure need multiple devices substep to cut off extra pin, bending pin operation；But
Current process equipment manufacturing procedure is many and diverse, processing efficiency is low.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of structurally reasonable, easy to use stamp-mounting-paper diode pin foldings
Roll forming device.
In order to solve the above technical problems, the present invention provides a kind of stamp-mounting-paper diode pin bending and molding devices；
Including transition fixture, the first pressing assembly and the second pressing assembly；
Several location holes for placing stamp-mounting-paper diode are provided in the middle part of transition fixture, location hole runs through the two sides of transition fixture, patch
The two sides pin of diode stretches out outside location hole, and transition fixture lower part two sides have for the pin bending of stamp-mounting-paper diode two sides
Notch, the upper end of notch is communicated with several location holes；
First pressing assembly includes the first upper pressure seat and first base, and the first upper pressure seat lower end surface is provided with matches with transition fixture top
The first clamp groove closed, the length trend of the first clamp groove and the length trend of transition fixture are consistent, the first clamping notch
Depth be less than the distance of transition fixture upper surface to location hole, the first upper pressure seat two sides are extended with the first pressing plate to downside, the
The vertical height of one pressing plate lower end surface distance the first clamp groove upper side wall is greater than the stamp-mounting-paper diode pin in location hole
To the vertical height of transition fixture upper surface, the first pressing plate lower end surface has extended downwardly cutting edge；
First base upper surface is provided with the first fixing groove for accommodating transition fixture lower part and stamp-mounting-paper diode lower part, is placed on positioning
Stamp-mounting-paper diode two sides pin in hole is born against on first base upper surface, first base upper surface also open there are two with
First bending groove of the first pressing plate cooperation of the first upper pressure seat, two the first bending grooves are in the first fixing groove two sides, the
The distance of one bending groove to the first fixing groove is at a distance from stamp-mounting-paper diode pin root and stamp-mounting-paper diode lower end surface；
Second pressing assembly includes the second upper pressure seat and second base, and the second upper pressure seat lower end surface is matched with transition fixture upper surface
It closes, the length trend of the second upper pressure seat and the length trend of transition fixture are consistent, and the second briquetting two sides are extended with second to downside
Pressing plate, the vertical height of second pressing plate lower end surface the second upper pressure seat of distance lower end surface are greater than the stamp-mounting-paper diode in location hole
Pin to transition fixture upper surface vertical height；
Second base upper surface is provided with the second fixing groove with the cooperation of transition fixture lower part, and the depth of the second fixing groove is less than transition
The distance between fixture lower end surface and location hole lower wall.
With such a structure, transition fixture positions several stamp-mounting-paper diodes, by transition fixture and patch two
Pole pipe is arranged on the first pressing assembly, is cut off using the first stage that the first pressing assembly can complete stamp-mounting-paper diode pin
Bending operation similarly can complete the second stage bending operation of stamp-mounting-paper diode pin using the second pressing assembly.
Advantageous effects of the invention are as follows: it is easy to operate, easy to use, greatly improve adding for existing stamp-mounting-paper diode
Work efficiency rate.
Technology contents of the invention are understood in order to clearer, below by the device letter of this stamp-mounting-paper diode pin bending and molding
Referred to as this molding machine.
First pressing assembly of this molding machine further includes the first compacting cylinder, and the piston rod of the first compacting cylinder is vertically
Direction is flexible, and the piston rod end of the first compacting cylinder is fixedly connected with the first upper pressure seat；
Second pressing assembly further includes the second compacting cylinder, and the piston rod of the second compacting cylinder stretches along the vertical direction, the second pressure
The piston rod end of cylinder processed is fixedly connected with the second upper pressure seat.
With such a structure, the operation of this molding machine is realized by way of cylinder-driven, is easy to use and square
Continue Mechanized Processing after an action of the bowels.
First upper pressure seat of this molding machine includes the first briquetting, the first fixed plate, two the first pressing plates and several first
Guidance set, the first briquetting lower end surface are provided with the first clamp groove with the cooperation of transition fixture top, and the first briquetting passes through several
First guidance set is connected on the downside of the first fixed plate, and first guidance set includes the first guide rod, first baffle, first
Guide sleeve and the first spring, the first guide sleeve are fixedly connected on the upside of the first fixed plate, the first guide rod lower end and the first briquetting
Upper surface is fixedly connected, and the first guide rod upper end, which sequentially passes through the first fixed plate and the first guide sleeve and fixes with first baffle, to be connected
It connects, for the first spring pocket on the first guide rod, the first spring upper end is resisted against the lower end surface of the first fixed plate, under the first spring
End is resisted against on the upper surface of the first briquetting, and two the first pressing plates are respectively at the first briquetting two sides, first pressing plate it is upper
It holds and is fixedly connected between the first fixed plate；
Second upper pressure seat include the second briquetting, the second fixed plate, two the second pressing plates and several second guidance sets, second
Briquetting lower end surface and transition fixture upper surface cooperate, and the second briquetting is connected under the second fixed plate by several second guidance sets
Side, second guidance set include the second guide rod, second baffle, the second guide sleeve and second spring, and the second guide sleeve is solid
Surely it is connected on the upside of the second fixed plate, the second guide rod lower end is fixedly connected with the second briquetting upper surface, the second guide rod upper end
It sequentially passes through the second fixed plate and the second guide sleeve and is fixedly connected with second baffle, second spring is sleeved on the second guide rod
On, second spring upper end is resisted against the lower end surface of the second fixed plate, and second spring lower end is resisted against on the upper surface of the second briquetting,
Two the second pressing plates are respectively at the second briquetting two sides, are fixedly connected between the upper end and the second fixed plate of second pressing plate.
With such a structure, the structure of the first upper pressure seat and the second upper pressure seat is not only optimized, but also is made on first
Wedge and the second upper pressure seat are respectively provided with certain pooling feature, avoid applying excessive pressure to transition fixture and stamp-mounting-paper diode
Power influences following process.
The transition fixture of this molding machine includes upper fixture, lower fixture and hook, and upper fixture one end and lower fixture one end are cut with scissors
It connects, the upper fixture other end and the lower fixture other end are detachably connected by hook, and lower fixture upper surface is along its length successively
Several locating slots are provided with, the locating slot runs through lower fixture two sides, and lower fixture lower part two sides have for stamp-mounting-paper diode two
The notch of side pin bending, the upper end of notch are communicated with several locating slots；
When upper fixture and lower fixture cooperate, the locating slot of the lower end surface of upper fixture and lower fixture collectively constitutes placement stamp-mounting-paper diode
Location hole.
With such a structure, the structure for optimizing transition fixture facilitates the positioning of stamp-mounting-paper diode.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the usage state diagram of this molding machine embodiment.
Fig. 2 is the portion the A enlarged drawing of Fig. 1.
Fig. 3 is the portion the B enlarged drawing of Fig. 1.
Fig. 4 is the portion the C enlarged drawing of Fig. 1.
Fig. 5 is the structural schematic diagram of this molding machine embodiment transition fixture.
Fig. 6 is Fig. 5 along D-D to cross-sectional view.
Specific embodiment
As shown in Figures 1 to 6
This molding machine includes transition fixture, the first pressing assembly and the second pressing assembly.
Transition fixture includes upper fixture 11, lower fixture 12 and hook 13, the width and patch of upper fixture 11 in left and right directions
Diode 4 it is of same size, 11 rear end of upper fixture and lower 12 rear end of fixture are hinged by pin shaft, 11 front end of upper fixture and hook 13
End is hinged, and hook 13 is detachably connected with lower 12 front end of fixture by hook 13, and lower 12 upper surface of fixture is along its length
Multiple locating slots (can not show in the relational graph cooperated due to stamp-mounting-paper diode 4 and locating slot) is successively opened, locating slot runs through
Lower 12 arranged on left and right sides of fixture, lower 12 lower part arranged on left and right sides of fixture have for 4 two sides pin of stamp-mounting-paper diode, 41 bending
Notch 12b, the upper end of notch 12b are communicated with multiple locating slots, and the width of lower 12 lower part of fixture in left and right directions is less than patch two
The width of pole pipe 4.
When upper fixture 11 and lower fixture 12 cooperate, the locating slot of the lower end surface of upper fixture 11 and lower fixture 12, which collectively constitutes, to be put
Set the location hole of stamp-mounting-paper diode 4.
First pressing assembly includes the first upper pressure seat, first base 23 and the first compacting cylinder 24.
First upper pressure seat includes the first briquetting 21a, the first fixed plate 21c, two the first pressing plate 21d and four group of first guiding
Component, the first lower end surface briquetting 21a are provided with the first clamp groove 21b with the cooperation of 11 top of upper fixture of transition fixture, and first
The length trend of clamp groove 21b and the length trend of transition fixture are consistent, and the depth of the first clamping notch 12b is less than transition clamp
Has the distance of upper surface to location hole, the first briquetting 21a is connected under the first fixed plate 21c by four group of first guidance set
Side, four group of first guidance set are in distributed rectangular, and the first guidance set includes the first guide rod 22b, first baffle 22c, first
Guide sleeve 22a and the first spring 22d, the first guide sleeve 22a are welded on the first upside fixed plate 21c, the first lower end guide rod 22b
It is welded with the first upper surface briquetting 21a, the first upper end guide rod 22b sequentially passes through the first fixed plate 21c and the first guide sleeve 22a
And welded with first baffle 22c, the area of first baffle 22c is greater than the inner hole of the first guide sleeve 22a, the first spring 22d suit
On the first guide rod 22b, the first upper end spring 22d is resisted against the lower end surface of the first fixed plate 21c, the first lower end spring 22d
It is resisted against on the upper surface of the first briquetting 21a.
Two the first pressing plate 21d are respectively at left and right sides of the first briquetting 21a, and the upper end of the first pressing plate 21d is solid with first
It being welded and fixed between fixed board 21c, the first lower end pressing plate 21d is stretched out on the downside of the first lower end surface briquetting 21a, when original state, first
The vertical height of the lower end surface pressing plate 21d distance the first clamp groove 21b upper side wall is greater than the stamp-mounting-paper diode 4 in location hole
To the vertical height of 11 upper surface of upper fixture, the first lower end surface pressing plate 21d has extended downwardly cutting edge 21e, has been in left side pin 41
The first pressing plate 21d cutting edge 21e setting herein on the left of the first lower end surface pressing plate 21d, the sword of the first pressing plate 21d in right side
Mouth 21e setting is herein on the right side of the first lower end surface pressing plate 21d.
23 upper surface of first base is provided with the first fixing groove of lower 4 lower part of fixture 12 and stamp-mounting-paper diode of receiving (in figure not
Show), the 4 two sides pin 41 of stamp-mounting-paper diode for being placed on positioning hole is laid in respectively on 23 upper surface of first base, and first
23 upper surface of pedestal is also opened there are two the first bending groove 23b cooperated with the first pressing plate 21d of the first upper pressure seat, and two first
Bending groove 23b is in the first fixing groove two sides, the distance and stamp-mounting-paper diode 4 of the first bending groove 23b to the first fixing groove
41 root of pin is at a distance from 4 lower end surface of stamp-mounting-paper diode.
First compacting cylinder 24 is fixed on the upside of the first fixed plate 21c, and the piston rod of the first compacting cylinder 24 is vertically square
To stretching, the piston rod end of the first compacting cylinder 24 is welded and fixed with the first fixed plate 21c.
Second pressing assembly includes the second upper pressure seat, second base 33 and the second compacting cylinder 34.
Second upper pressure seat includes the second briquetting 31a, the second fixed plate 31b, two the second pressing plate 31c and several second guiding
Component, the second lower end surface briquetting 31a and transition fixture upper surface cooperate, length trend and the transition fixture of the second briquetting 31a
Length trend is consistent, of same size, the second briquetting of the width of the second briquetting 31a in left and right directions and transition fixture upper fixture 11
31a is connected on the downside of the second fixed plate 31b by four group of second guidance set, and four group of second guidance set is in distributed rectangular, the
Two guidance sets are identical as the first guidance set structure, and the second guidance set includes the second guide rod 32b, second baffle 32c, the
Two guide sleeve 32a and second spring 32d, the second guide sleeve 32a is welded on the upside of the second fixed plate 31b, under the second guide rod 32b
End is welded and fixed with the second upper surface briquetting 31a, and the second upper end guide rod 32b sequentially passes through the second fixed plate 31b and second and leads
It being welded and fixed to set 32a and with second baffle 32c, the area of second baffle 32c is greater than the area of the second guide sleeve 32a inner hole,
Second spring 32d is sleeved on the second guide rod 32b, and the upper end second spring 32d is resisted against the lower end surface of the second fixed plate 31b,
The lower end second spring 32d is resisted against on the upper surface of the second briquetting 31a.
Two the second pressing plate 31c are tightly attached to respectively at left and right sides of the second briquetting 31a, the upper end and second of the second pressing plate 31c
It is welded and fixed between fixed plate 31b, constitutes between the second briquetting 31a and two the second pressing plate 31c and cooperate with 11 top of upper fixture
The second clamp groove 31d, the second lower end pressing plate 31c is stretched out on the downside of the second lower end surface briquetting 31a, when original state, the second pressure
The vertical height of the lower end surface the plate 31c lower end surface distance the second briquetting 31a is greater than 4 pin 41 of stamp-mounting-paper diode in location hole
To the vertical height of transition fixture upper surface.
33 upper surface of second base is provided with (not to be shown with the second fixing groove of 12 lower part of lower fixture of transition fixture cooperation in figure
Out), the depth of the second fixing groove is less than the distance between lower 12 lower end surface of fixture and locating slot lower wall, exposes lower fixture 12
Notch 12b, for the notch 12b of 4 two sides pin of stamp-mounting-paper diode, 41 bending.
Second compacting cylinder 34 is fixed on the upside of the second fixed plate 31b, and the piston rod of the second compacting cylinder 34 is vertically square
To stretching, the piston rod end of the second compacting cylinder 34 is welded and fixed with the second fixed plate 31b.
In use, several stamp-mounting-paper diodes 4 are placed in several locating slots of lower fixture 12, the hook 13 of upper fixture 11
Cooperate with lower fixture 12, several stamp-mounting-paper diodes 4 are fixed in the location hole of transition fixture；
Transition fixture is connected to several stamp-mounting-paper diodes 4 to be placed on the first pressing assembly, the lower fixture 12 of transition fixture and the
First fixing groove of one pedestal 23 cooperates, and the first fixing groove accommodates lower 4 lower part of fixture 12 and stamp-mounting-paper diode, stamp-mounting-paper diode 4
Two sides pin 41 is laid in respectively on 23 upper surface of first base, and the two sides pin 41 of stamp-mounting-paper diode 4 extends through the first folding respectively
Curved groove 23b；
Starting the first compacting cylinder 24, the piston rod of the first compacting cylinder 24 extend downwardly, and drive the first upper pressure seat integrally downward
Mobile, in the process, the upper fixture 11 of transition fixture protrudes into the first clamp groove 21b of the first briquetting 21a, to transition clamp
Have top and carries out clamping position；First compacting cylinder 24 continues to stretch out, the first briquetting 21a by upper fixture 11 reaction force along the
One guidance set moves up, while the first pressing plate 21d continues to move down, the cutting edge 21e on the first pressing plate 21d first be in
4 pin 41 of stamp-mounting-paper diode contact on the upside of first bending groove 23b, cutting edge 21e cut the extra pin 41 of stamp-mounting-paper diode 4
After removing, the first pressing plate 21d continues to move down, and the first pressing plate 21d drives two pole of patch on the upside of the first bending groove 23b
4 pin of pipe, 41 bending completes first stage excision bending operation to 90 °, and reverse starting first suppresses cylinder 24, the first upper pressure seat
Return to original state.
The stamp-mounting-paper diode 4 for completing first stage excision bending operation and transition fixture are removed from the first pressing assembly
It is placed on the second pressing assembly, 12 lower part of lower fixture of transition fixture and the second fixing groove of second base 33 cooperate；
Starting the second compacting cylinder 34, the piston rod of the second compacting cylinder 34 extend downwardly, and drive the second upper pressure seat integrally downward
Mobile, in the process, the upper fixture 11 of transition fixture is contacted with the second briquetting 31a, the second pressure of the second briquetting 31a and two sides
Plate 31c plays the role of clamping position to upper fixture 11；Second compacting cylinder 34 continues to stretch out, and the second briquetting 31a is by upper fixture
11 reaction force is moved up along the second guidance set, while the second pressing plate 31c continues to move down, the second pressing plate 31c band
4 pin 41 of stamp-mounting-paper diode is moved from root bending to 90 °, before this pin 41 after bending by this bending overturn to patch
The lower end surface of diode 4 is bonded, and completes second stage bending operation, and reverse starting second suppresses cylinder 34, and the first upper pressure seat returns
To original state.
Transition fixture is removed, the stamp-mounting-paper diode 4 of positioning hole completes 41 bending and molding process of pin.
Above-described is only one embodiment of the present invention, it is noted that for those of ordinary skill in the art
For, without departing from the principle of the present invention, several variations and modifications can also be made, these also should be regarded as belonging to this hair
Bright protection scope.
Claims (4)
1. a kind of stamp-mounting-paper diode pin bending and molding device, it is characterized in that:
Including transition fixture, the first pressing assembly and the second pressing assembly；
Several location holes for placing stamp-mounting-paper diode are provided in the middle part of transition fixture, location hole runs through the two sides of transition fixture, patch
The two sides pin of diode stretches out outside location hole, and transition fixture lower part two sides have for the pin bending of stamp-mounting-paper diode two sides
Notch, the upper end of notch is communicated with several location holes；
First pressing assembly includes the first upper pressure seat and first base, and the first upper pressure seat lower end surface is provided with matches with transition fixture top
The first clamp groove closed, the first upper pressure seat two sides are extended with the first pressing plate, the first pressing plate lower end surface distance first folder to downside
The vertical height for holding groove upper side wall is vertical greater than the stamp-mounting-paper diode pin in location hole to transition fixture upper surface
Highly, the first pressing plate lower end surface has extended downwardly cutting edge；
First base upper surface is provided with the first fixing groove for accommodating transition fixture lower part and stamp-mounting-paper diode lower part, is placed on positioning
Stamp-mounting-paper diode two sides pin in hole is born against on first base upper surface, first base upper surface also open there are two with
First bending groove of the first pressing plate cooperation of the first upper pressure seat, the distance and patch two of the first bending groove to the first fixing groove
Pole pipe pin root is at a distance from stamp-mounting-paper diode lower end surface；
Second pressing assembly includes the second upper pressure seat and second base, and the second upper pressure seat lower end surface is matched with transition fixture upper surface
It closes, the second upper holder block two sides are extended with the second pressing plate to downside, and second pressing plate lower end surface the second upper pressure seat of distance lower end surface is hung down
Straight height is greater than the vertical height of the stamp-mounting-paper diode pin in location hole to transition fixture upper surface；
Second base upper surface is provided with the second fixing groove with the cooperation of transition fixture lower part, and the depth of the second fixing groove is less than transition
The distance between fixture lower end surface and location hole lower wall.
2. stamp-mounting-paper diode pin bending and molding device according to claim 1, it is characterized in that:
First pressing assembly further includes the first compacting cylinder, and the piston rod of the first compacting cylinder stretches along the vertical direction, the first pressure
The piston rod end of cylinder processed is fixedly connected with the first upper pressure seat；
Second pressing assembly further includes the second compacting cylinder, and the piston rod of the second compacting cylinder stretches along the vertical direction, the second pressure
The piston rod end of cylinder processed is fixedly connected with the second upper pressure seat.
3. stamp-mounting-paper diode pin bending and molding device according to claim 1, it is characterized in that:
First upper pressure seat include the first briquetting, the first fixed plate, two the first pressing plates and several first guidance sets, first
Briquetting lower end surface is provided with the first clamp groove with the cooperation of transition fixture top, and the first briquetting is connected by several first guidance sets
It connects on the downside of the first fixed plate, first guidance set includes the first guide rod, first baffle, the first guide sleeve and the first bullet
Spring, the first guide sleeve are fixedly connected on the upside of the first fixed plate, and the first guide rod lower end is fixedly connected with the first briquetting upper surface,
First guide rod upper end sequentially passes through the first fixed plate and the first guide sleeve and is fixedly connected with first baffle, the first spring suit
On the first guide rod, the first spring upper end is resisted against the lower end surface of the first fixed plate, and the first lower spring end is resisted against the first pressure
On the upper surface of block, two the first pressing plates are respectively at the first briquetting two sides, the upper end of first pressing plate and the first fixed plate
Between be fixedly connected；
Second upper pressure seat include the second briquetting, the second fixed plate, two the second pressing plates and several second guidance sets, second
Briquetting lower end surface and transition fixture upper surface cooperate, and the second briquetting is connected under the second fixed plate by several second guidance sets
Side, second guidance set include the second guide rod, second baffle, the second guide sleeve and second spring, and the second guide sleeve is solid
Surely it is connected on the upside of the second fixed plate, the second guide rod lower end is fixedly connected with the second briquetting upper surface, the second guide rod upper end
It sequentially passes through the second fixed plate and the second guide sleeve and is fixedly connected with second baffle, second spring is sleeved on the second guide rod
On, second spring upper end is resisted against the lower end surface of the second fixed plate, and second spring lower end is resisted against on the upper surface of the second briquetting,
Two the second pressing plates are respectively at the second briquetting two sides, are fixedly connected between the upper end and the second fixed plate of second pressing plate.
4. stamp-mounting-paper diode pin bending and molding device according to claim 1, it is characterized in that:
Transition fixture includes upper fixture, lower fixture and hook, and upper fixture one end and lower fixture one end are hinged, the upper fixture other end with
The lower fixture other end is detachably connected by hook, and lower fixture upper surface successively opens several locating slots, institute along its length
Locating slot is stated through lower fixture two sides, lower fixture lower part two sides have the notch for the pin bending of stamp-mounting-paper diode two sides,
The upper end of notch is communicated with several locating slots；
When upper fixture and lower fixture cooperate, the locating slot of the lower end surface of upper fixture and lower fixture collectively constitutes placement stamp-mounting-paper diode
Location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811370300.3A CN109326526A (en) | 2018-11-17 | 2018-11-17 | Stamp-mounting-paper diode pin bending and molding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811370300.3A CN109326526A (en) | 2018-11-17 | 2018-11-17 | Stamp-mounting-paper diode pin bending and molding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109326526A true CN109326526A (en) | 2019-02-12 |
Family
ID=65257805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811370300.3A Pending CN109326526A (en) | 2018-11-17 | 2018-11-17 | Stamp-mounting-paper diode pin bending and molding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109326526A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110038929A (en) * | 2019-05-31 | 2019-07-23 | 嘉兴云顶机械设备有限公司 | A kind of bilateral apparatus for bending of the plate of accurate positioning |
| CN111790855A (en) * | 2020-07-31 | 2020-10-20 | 常州银河世纪微电子股份有限公司 | Embedded full-package buffering turnover strip and die structure |
| CN114985632A (en) * | 2022-07-11 | 2022-09-02 | 四川蓝彩电子科技有限公司 | Bending device and method for precisely bending triode pin |
| CN116469806A (en) * | 2023-04-27 | 2023-07-21 | 常州富鸿达电子有限公司 | Foot wrapping machine for producing surface mount devices |
-
2018
- 2018-11-17 CN CN201811370300.3A patent/CN109326526A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110038929A (en) * | 2019-05-31 | 2019-07-23 | 嘉兴云顶机械设备有限公司 | A kind of bilateral apparatus for bending of the plate of accurate positioning |
| CN111790855A (en) * | 2020-07-31 | 2020-10-20 | 常州银河世纪微电子股份有限公司 | Embedded full-package buffering turnover strip and die structure |
| CN114985632A (en) * | 2022-07-11 | 2022-09-02 | 四川蓝彩电子科技有限公司 | Bending device and method for precisely bending triode pin |
| CN114985632B (en) * | 2022-07-11 | 2024-07-23 | 四川蓝彩电子科技有限公司 | Bending device and method for precisely bending triode pins |
| CN116469806A (en) * | 2023-04-27 | 2023-07-21 | 常州富鸿达电子有限公司 | Foot wrapping machine for producing surface mount devices |
| CN116469806B (en) * | 2023-04-27 | 2024-04-19 | 常州富鸿达电子有限公司 | Foot wrapping machine for producing surface mount devices |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109326526A (en) | Stamp-mounting-paper diode pin bending and molding device | |
| CN105945175B (en) | A kind of capacitance clubfoot forming machine | |
| CN206994625U (en) | A kind of lathe cutter of shoemaking | |
| CN208985955U (en) | Stamp-mounting-paper diode pin bending and molding device | |
| CN210558452U (en) | Pressure-sensitive adhesive laminating equipment | |
| CN209021930U (en) | A kind of clamping device with shock-absorbing function | |
| CN205165439U (en) | Take ejection mechanism's bender | |
| CN210415972U (en) | Notebook binding equipment for homework | |
| CN211210617U (en) | Seedling gathering, positioning and cutting mechanism | |
| CN204036386U (en) | Piston O type circle apparatus for assembling | |
| CN104067862B (en) | A centre gripping pressure seedling device that is used for apical bud to insert grafting stock to one side | |
| CN209273348U (en) | Optical fiber connector pressing machine | |
| CN216821945U (en) | Reshaping device for false eyelashes | |
| CN215299769U (en) | An electronic detonator pin line flexible branching mechanism | |
| CN205889406U (en) | Bamboo timber automatic analysis line machine | |
| CN212096687U (en) | Portable large-thickness binding and punching device | |
| CN203032988U (en) | Motor-driven mesh bag circular tying machine | |
| CN203409819U (en) | Paper rubbing device | |
| CN107650432A (en) | A kind of handbag wire rope handling mechanism | |
| CN209097167U (en) | Packaging bag baling press | |
| CN205364531U (en) | Automatic pulling and sticking nylon machine | |
| CN209257565U (en) | A kind of Packaging Box hitting machine | |
| CN208513437U (en) | The two-way die cutting die of double-station | |
| CN214241353U (en) | Smt material receiving belt pressing device | |
| CN205111583U (en) | Operate on mouthful anchor clamps fast |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190212 |