CN116469796A - 一种电子装配用半导体器件安装装置 - Google Patents

一种电子装配用半导体器件安装装置 Download PDF

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CN116469796A
CN116469796A CN202310302173.8A CN202310302173A CN116469796A CN 116469796 A CN116469796 A CN 116469796A CN 202310302173 A CN202310302173 A CN 202310302173A CN 116469796 A CN116469796 A CN 116469796A
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CN116469796B (zh
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牛玲玲
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Shenzhen Kemao Semiconductor Equipment Co ltd
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Xinmi Zuoling Electronic Technology Co ltd
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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    • H—ELECTRICITY
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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Abstract

本发明提供了一种电子装配用半导体器件安装装置，涉及半导体器件安装技术领域，包括安装支座、装配套筒、输送载座、运输支座和运输支台；所述安装支座顶部固定安装有安装顶座；所述装配套筒固定安装于液压支柱伸缩柱顶部，装配套筒套设于转动支柱顶端；所述输送载座套设于转动支柱外侧，输送载座内侧开设有安装转槽，输送载座顶部开设有装配转槽，装配转槽侧面贯穿开设有传动接槽；所述运输支座固定安装于输送载座侧面；所述运输支台内侧开设有转动支槽；通过驱动齿环进行转动，使运输支台与安装支板带动基板进行转动调节，使逐步与两组输送带对接；解决现有多数半导体器件安装装置大范围同步施加温度，而分步安装顺应性较低的问题。

Description

一种电子装配用半导体器件安装装置
技术领域
本发明涉及半导体器件安装技术领域，特别涉及一种电子装配用半导体器件安装装置。
背景技术
半导体安装装置通过临时压焊工序和正式压焊工序而构成，其中临时压焊工序利用粘接剂将由半导体元件构成的芯片部件临时固定在形成于电路基板的焊盘上，而正式压焊工序使临时固定在焊盘上的芯片部件的凸起与焊盘接合，半导体安装装置在对半导体安装时，多是对多个芯片部件同步进行加热及加压。
然而现有多数半导体器件安装装置大范围同步施加温度，不需要该温度的器件或基板的温度也会升高，会对产品的性能产生不利影响，而分步安装的顺应性较低，进而使半导体器件在进行安装时效率降低。
发明内容
有鉴于此，本发明提供一种电子装配用半导体器件安装装置，其具有安装支座、安装支柱与输送载座、运输支台，从而解决目前多数半导体器件安装装置大范围同步施加温度，而分步安装的顺应性较低的问题。
本发明提供了一种电子装配用半导体器件安装装置，具体包括：安装支座、装配套筒、输送载座、运输支座和运输支台；
所述安装支座顶部固定安装有安装顶座，安装顶座顶部固定安装有转动支柱，转动支柱侧面开设有安装支槽，同时转动支柱侧面还开设有升降滑槽，转动支柱顶部固定安装有液压支柱；所述装配套筒固定安装于液压支柱伸缩柱顶部，同时装配套筒套设于转动支柱顶端，装配套筒底部固定设置有安装滑筒，同时安装滑筒通过升降滑槽套设于转动支柱外侧，安装滑筒侧面固定设置有安装支柱，同时安装支柱底部设置有定位安装结构；所述输送载座套设于转动支柱外侧，同时输送载座内侧开设有安装转槽，输送载座顶部开设有装配转槽，装配转槽侧面贯穿开设有传动接槽；所述运输支座固定安装于输送载座侧面，运输支座顶部开设有装配卡槽，装配卡槽内侧转动安装有驱动齿轮，运输支座内侧转动设置有传动支轴，同时传动支轴与驱动齿轮传动连接，运输支座底部固定安装有驱动电机，且驱动电机与传动支轴传动连接；所述运输支台内侧开设有转动支槽，转动支槽内侧固定设置有装配卡环，同时运输支台通过装配卡环与安装支槽套设于转动支柱外侧，运输支台顶部开设有安装载槽。
可选地，安装支座侧面还开设有预设侧槽。
可选地，安装支柱上还设置有：安装卡柱和移动电机；
安装卡柱固定安装于安装支柱一端；移动电机固定安装于安装卡柱之间。
可选地，定位安装结构包括有：装配载槽、螺纹载轴、安装载柱和半导体安装板；
装配载槽开设于安装支柱底部；螺纹载轴转动安装于装配载槽内侧；安装载柱套设于螺纹载轴外侧；半导体安装板固定安装于安装载柱底端。
可选地，输送载座上还设置有：安装螺栓、承重支柱和工作台；
安装螺栓通过螺纹结构设置于输送载座内侧；承重支柱安装于输送载座侧面；工作台固定安装于承重支柱顶部。
可选地，运输支座上还设置有：输送支件、输送载轴和输送带；
输送支件固定安装于运输支座两侧；输送载轴转动安装于输送支件侧面；输送带套设于输送载轴外侧。
可选地，运输支台上还设置有：放置卡槽和驱动齿环；
放置卡槽开设于安装载槽两侧；驱动齿环固定设置于运输支台底部，同时驱动齿环设置于装配转槽内侧，且驱动齿环与驱动齿轮相啮合。
可选地，安装载槽内侧还设置有：安装支板、装配侧块和推拉支框；
安装支板设置于安装载槽内侧；装配侧块设置于安装支板两侧；推拉支框固定设置于安装支板一侧。
有益效果
1.本发明与传统线缆连接器相比，其在对线缆对接连接与断接时更加稳定。
2.通过输送载轴配合输送带，能够对半导体配件进行分组输送，同时工人立于工作台一侧，握持推拉支框能够对安装支板进行装配，同时通过安装支板对装配基板进行承载，且驱动电机配合传动支轴，能够带动驱动齿轮进行转动，进而同步带动驱动齿环进行转动，从而使运输支台与安装支板带动基板进行转动调节，从而使逐步与两组输送带对接，从而对分组的半导体配件进行固定装配，在运输支台带动安装支板转动一周后，能够对装配完半导体配件的基板进行快速回收。
3.通过液压支柱配合装配套筒，能够带动安装滑筒进行升降移动，进而同步带动两组安装支柱进行升降移动，同时移动电机能够带动螺纹载轴转动，进而同步带动安装载柱与半导体安装板进行移动，进而在运输支台与安装支板带动基板转动调节时，配合装配套筒的升降，对分组半导体配件进行拿取装配。
附图说明
为了更清楚地说明本发明的实施例的技术方案，下面将对实施例的附图作简单地介绍。
下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
在附图中：
图1示出了根据本发明实施例的装置装配主视结构示意图；
图2示出了根据本发明实施例的装置装配仰视结构示意图；
图3示出了根据本发明实施例的安装支座装配主视结构示意图；
图4示出了根据本发明实施例的安装支座装配仰视结构示意图；
图5示出了根据本发明实施例的输送载座装配主视结构示意图；
图6示出了根据本发明实施例的输送载座装配仰视结构示意图；
图7示出了根据本发明实施例的运输支台装配主视结构示意图；
图8示出了根据本发明实施例的运输支台装配仰视结构示意图。
附图标记列表
1、安装支座；
101、预设侧槽；102、安装顶座；103、转动支柱；104、安装支槽；105、升降滑槽；106、液压支柱；
2、装配套筒；
201、安装滑筒；202、安装支柱；203、安装卡柱；204、移动电机；205、装配载槽；2051、螺纹载轴；2052、安装载柱；2053、半导体安装板；
3、输送载座；
301、安装螺栓；302、承重支柱；303、工作台；304、安装转槽；305、装配转槽；306、传动接槽；
4、运输支座；
401、装配卡槽；402、驱动齿轮；403、输送支件；404、输送载轴；405、输送带；406、传动支轴；407、驱动电机；
5、运输支台；
501、转动支槽；502、装配卡环；503、安装载槽；504、放置卡槽；505、驱动齿环；506、安装支板；5061、装配侧块；5062、推拉支框。
具体实施方式
为了使得本发明的技术方案的目的、方案和优点更加清楚，下文中将结合本发明的具体实施例的附图，对本发明实施例的技术方案进行清楚、完整的描述。除非另有说明，否则本文所使用的术语具有本领域通常的含义。附图中相同的附图标记代表相同的部件。
实施例：请参考图1至图8：
本发明提出了一种电子装配用半导体器件安装装置，包括：安装支座1、装配套筒2、输送载座3、运输支座4和运输支台5；
安装支座1顶部固定安装有安装顶座102，安装顶座102顶部固定安装有转动支柱103，转动支柱103侧面开设有安装支槽104，同时转动支柱103侧面还开设有升降滑槽105，转动支柱103顶部固定安装有液压支柱106；装配套筒2固定安装于液压支柱106伸缩柱顶部，同时装配套筒2套设于转动支柱103顶端，装配套筒2底部固定设置有安装滑筒201，同时安装滑筒201通过升降滑槽105套设于转动支柱103外侧，安装滑筒201侧面固定设置有安装支柱202，同时安装支柱202底部设置有定位安装结构；输送载座3套设于转动支柱103外侧，同时输送载座3内侧开设有安装转槽304，输送载座3顶部开设有装配转槽305，装配转槽305侧面贯穿开设有传动接槽306；运输支座4固定安装于输送载座3侧面，运输支座4顶部开设有装配卡槽401，装配卡槽401内侧转动安装有驱动齿轮402，运输支座4内侧转动设置有传动支轴406，同时传动支轴406与驱动齿轮402传动连接，运输支座4底部固定安装有驱动电机407，且驱动电机407与传动支轴406传动连接；运输支台5内侧开设有转动支槽501，转动支槽501内侧固定设置有装配卡环502，同时运输支台5通过装配卡环502与安装支槽104套设于转动支柱103外侧，运输支台5顶部开设有安装载槽503。
如图5至图8所示，输送载座3上还设置有：安装螺栓301、承重支柱302和工作台303；安装螺栓301通过螺纹结构设置于输送载座3内侧；承重支柱302安装于输送载座3侧面；工作台303固定安装于承重支柱302顶部；运输支座4上还设置有：输送支件403、输送载轴404和输送带405；输送支件403固定安装于运输支座4两侧；输送载轴404转动安装于输送支件403侧面；输送带405套设于输送载轴404外侧；运输支台5上还设置有：放置卡槽504和驱动齿环505；放置卡槽504开设于安装载槽503两侧；驱动齿环505固定设置于运输支台5底部，同时驱动齿环505设置于装配转槽305内侧，且驱动齿环505与驱动齿轮402相啮合；安装载槽503内侧还设置有：安装支板506、装配侧块5061和推拉支框5062；安装支板506设置于安装载槽503内侧；装配侧块5061设置于安装支板506两侧；推拉支框5062固定设置于安装支板506一侧；通过输送载轴404配合输送带405，能够对半导体配件进行分组输送，同时工人立于工作台303一侧，握持推拉支框5062能够对安装支板506进行装配，同时通过安装支板506对装配基板进行承载，且驱动电机407配合传动支轴406，能够带动驱动齿轮402进行转动，进而同步带动驱动齿环505进行转动，从而使运输支台5与安装支板506带动基板进行转动调节，从而使逐步与两组输送带405对接，从而对分组的半导体配件进行固定装配，在运输支台5带动安装支板506转动一周后，能够对装配完半导体配件的基板进行快速回收。
如图3至图6所示，安装支座1侧面还开设有预设侧槽101；安装支柱202上还设置有：安装卡柱203和移动电机204；安装卡柱203固定安装于安装支柱202一端；移动电机204固定安装于安装卡柱203之间；定位安装结构包括有：装配载槽205、螺纹载轴2051、安装载柱2052和半导体安装板2053；装配载槽205开设于安装支柱202底部；螺纹载轴2051转动安装于装配载槽205内侧；安装载柱2052套设于螺纹载轴2051外侧；半导体安装板2053固定安装于安装载柱2052底端；通过液压支柱106配合装配套筒2，能够带动安装滑筒201进行升降移动，进而同步带动两组安装支柱202进行升降移动，同时移动电机204能够带动螺纹载轴2051转动，进而同步带动安装载柱2052与半导体安装板2053进行移动，进而在运输支台5与安装支板506带动基板转动调节时，配合装配套筒2的升降，对分组半导体配件进行拿取装配。
本实施例的具体使用方式与作用：本发明中，通过输送载轴404配合输送带405，对半导体配件进行分组输送，握持推拉支框5062对安装支板506进行装配，同时通过安装支板506对装配基板进行承载，且驱动电机407配合传动支轴406，带动驱动齿轮402进行转动，进而同步带动驱动齿环505进行转动，从而使运输支台5与安装支板506带动基板进行转动调节，从而使逐步与两组输送带405对接，液压支柱106配合装配套筒2，带动安装滑筒201进行升降移动，进而同步带动两组安装支柱202进行升降移动，同时移动电机204带动螺纹载轴2051转动，进而同步带动安装载柱2052与半导体安装板2053进行移动，进而在运输支台5与安装支板506带动基板转动调节时，配合装配套筒2的升降，对分组半导体配件进行拿取装配，在运输支台5带动安装支板506转动一周后，对装配完半导体配件的基板进行快速回收。
以上仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。

Claims (8)

1.一种电子装配用半导体器件安装装置，，包括安装支座(1)、装配套筒(2)、输送载座(3)、运输支座(4)和运输支台(5)，其特征在于：所述安装支座(1)顶部固定安装有安装顶座(102)，安装顶座(102)顶部固定安装有转动支柱(103)，转动支柱(103)侧面开设有安装支槽(104)，同时转动支柱(103)侧面还开设有升降滑槽(105)，转动支柱(103)顶部固定安装有液压支柱(106)；所述装配套筒(2)固定安装于液压支柱(106)伸缩柱顶部，同时装配套筒(2)套设于转动支柱(103)顶端，装配套筒(2)底部固定设置有安装滑筒(201)，同时安装滑筒(201)通过升降滑槽(105)套设于转动支柱(103)外侧，安装滑筒(201)侧面固定设置有安装支柱(202)，同时安装支柱(202)底部设置有定位安装结构；所述输送载座(3)套设于转动支柱(103)外侧，同时输送载座(3)内侧开设有安装转槽(304)，输送载座(3)顶部开设有装配转槽(305)，装配转槽(305)侧面贯穿开设有传动接槽(306)；所述运输支座(4)固定安装于输送载座(3)侧面，运输支座(4)顶部开设有装配卡槽(401)，装配卡槽(401)内侧转动安装有驱动齿轮(402)，运输支座(4)内侧转动设置有传动支轴(406)，同时传动支轴(406)与驱动齿轮(402)传动连接，运输支座(4)底部固定安装有驱动电机(407)，且驱动电机(407)与传动支轴(406)传动连接；所述运输支台(5)内侧开设有转动支槽(501)，转动支槽(501)内侧固定设置有装配卡环(502)，同时运输支台(5)通过装配卡环(502)与安装支槽(104)套设于转动支柱(103)外侧，运输支台(5)顶部开设有安装载槽(503)。
2.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述安装支座(1)侧面还开设有预设侧槽(101)。
3.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述安装支柱(202)上还设置有：安装卡柱(203)和移动电机(204)；
安装卡柱(203)固定安装于安装支柱(202)一端；移动电机(204)固定安装于安装卡柱(203)之间。
4.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述定位安装结构包括有：装配载槽(205)、螺纹载轴(2051)、安装载柱(2052)和半导体安装板(2053)；
装配载槽(205)开设于安装支柱(202)底部；螺纹载轴(2051)转动安装于装配载槽(205)内侧；安装载柱(2052)套设于螺纹载轴(2051)外侧；半导体安装板(2053)固定安装于安装载柱(2052)底端。
5.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述输送载座(3)上还设置有：安装螺栓(301)、承重支柱(302)和工作台(303)；
安装螺栓(301)通过螺纹结构设置于输送载座(3)内侧；承重支柱(302)安装于输送载座(3)侧面；工作台(303)固定安装于承重支柱(302)顶部。
6.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述运输支座(4)上还设置有：输送支件(403)、输送载轴(404)和输送带(405)；
输送支件(403)固定安装于运输支座(4)两侧；输送载轴(404)转动安装于输送支件(403)侧面；输送带(405)套设于输送载轴(404)外侧。
7.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述运输支台(5)上还设置有：放置卡槽(504)和驱动齿环(505)；
放置卡槽(504)开设于安装载槽(503)两侧；驱动齿环(505)固定设置于运输支台(5)底部，同时驱动齿环(505)设置于装配转槽(305)内侧，且驱动齿环(505)与驱动齿轮(402)相啮合。
8.如权利要求1所述的一种电子装配用半导体器件安装装置，其特征在于：所述安装载槽(503)内侧还设置有：安装支板(506)、装配侧块(5061)和推拉支框(5062)；
安装支板(506)设置于安装载槽(503)内侧；装配侧块(5061)设置于安装支板(506)两侧；推拉支框(5062)固定设置于安装支板(506)一侧。
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4702365A (en) * 1984-09-10 1987-10-27 Pak Chong Il Apparatus for removing individual wafer segments from a framed carrier
US5828224A (en) * 1994-03-18 1998-10-27 Fujitsu, Limited Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit
US6068317A (en) * 1997-11-08 2000-05-30 Mirae Corporation Device for adjusting space between chip in semiconductor chip tester
JP2006093317A (ja) * 2004-09-22 2006-04-06 Alps Electric Co Ltd テンプレートおよびそれを用いたチップ部品装着装置
CN104353984A (zh) * 2014-12-08 2015-02-18 深圳市奥斯珂科技有限公司 一种u盘生产设备
CN111434204A (zh) * 2017-11-21 2020-07-17 哈里斯股份有限公司 电子元器件安装装置及电子装置的制造方法
CN114334747A (zh) * 2022-01-17 2022-04-12 华顺玉 一种芯片生产稳定装贴装置
CN114473923A (zh) * 2021-12-24 2022-05-13 诺贝特空调（盐城）有限公司 一种应用于装配汽车散热器芯体的设备
CN218299779U (zh) * 2022-02-21 2023-01-13 三河市致欣科技有限公司 用于晶圆片胶边去除装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4702365A (en) * 1984-09-10 1987-10-27 Pak Chong Il Apparatus for removing individual wafer segments from a framed carrier
US5828224A (en) * 1994-03-18 1998-10-27 Fujitsu, Limited Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit
US6068317A (en) * 1997-11-08 2000-05-30 Mirae Corporation Device for adjusting space between chip in semiconductor chip tester
JP2006093317A (ja) * 2004-09-22 2006-04-06 Alps Electric Co Ltd テンプレートおよびそれを用いたチップ部品装着装置
CN104353984A (zh) * 2014-12-08 2015-02-18 深圳市奥斯珂科技有限公司 一种u盘生产设备
CN111434204A (zh) * 2017-11-21 2020-07-17 哈里斯股份有限公司 电子元器件安装装置及电子装置的制造方法
CN114473923A (zh) * 2021-12-24 2022-05-13 诺贝特空调（盐城）有限公司 一种应用于装配汽车散热器芯体的设备
CN114334747A (zh) * 2022-01-17 2022-04-12 华顺玉 一种芯片生产稳定装贴装置
CN218299779U (zh) * 2022-02-21 2023-01-13 三河市致欣科技有限公司 用于晶圆片胶边去除装置

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