CN116466548A - Silicon wafer position detection device - Google Patents
Silicon wafer position detection device Download PDFInfo
- Publication number
- CN116466548A CN116466548A CN202310506841.9A CN202310506841A CN116466548A CN 116466548 A CN116466548 A CN 116466548A CN 202310506841 A CN202310506841 A CN 202310506841A CN 116466548 A CN116466548 A CN 116466548A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- time period
- detection time
- silicon
- side panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 257
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 251
- 239000010703 silicon Substances 0.000 title claims abstract description 251
- 238000001514 detection method Methods 0.000 title claims abstract description 134
- 235000012431 wafers Nutrition 0.000 claims abstract description 259
- 230000002159 abnormal effect Effects 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000004590 computer program Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a silicon wafer position detection device, wherein the device comprises a base, a vertical support, a moving part arranged on the vertical support, a placement table, a motor, a signal transmitter, a signal receiver and a controller, wherein one end of the vertical support is fixedly connected with the base, the signal transmitter and the signal receiver are respectively fixed at the other end of the vertical support, the signal transmitter and the signal receiver are aligned, a movable space is formed between the signal transmitter and the signal receiver, the placement table is used for holding a silicon wafer box, a plurality of silicon wafers are placed in the silicon wafer box, the placement table is connected with the moving part, and the moving part is driven to move under the rotation of the motor to control the placement table to move along the vertical direction, so that the plurality of silicon wafers in the silicon wafer box sequentially pass through the movable space; and the controller determines the placement condition of the silicon chips in the silicon chip box according to the detection time corresponding to the signal receiver. The effect of accurately detecting the placement condition of the silicon wafers in the silicon wafer box is achieved.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing, in particular to a silicon wafer position detection device.
Background
In the process of manufacturing semiconductor integrated circuits, a photolithography apparatus is the most important apparatus, and the photolithography apparatus exposes a circuit pattern on a silicon wafer with a photosensitive coating, and then performs processes such as deposition, etching, doping, and the like, to finally form integrated circuits. Before the silicon wafers are transported to the photoetching equipment for exposure, the silicon wafers are stored in the silicon wafer box, so that the storage state of the silicon wafers in the box, including the existence, stacking, oblique insertion and the like of the silicon wafers, is detected, and a precondition is provided for the subsequent process.
At present, in the prior art, the method for detecting the shielding time of the side face of the wafer is to install a reflective laser sensor on the side face of the wafer box. The specific operation is as follows: and starting the lifting of the wafer box, continuously irradiating laser, shielding the laser by the side surface of the wafer, reflecting the laser back to the sensor, changing the state of the sensor from low level to high level, and finally calculating the state of the silicon wafer by detecting the position level state and time of the fixing piece slot.
However, the performance of laser reflection is greatly affected by the surface state of the side of the wafer, and when the surface finish and the shape of the side of the wafer deviate greatly, the laser reflection intensity deviates greatly, so that the detection precision of the sensor is greatly affected, and the state of the silicon wafer is inaccurately checked.
Disclosure of Invention
In view of this, an object of the present application is to provide a silicon wafer position detecting device, which can control the movement of a placement table, so that silicon wafers in a silicon wafer box pass through a movable space between a signal transmitter and a signal receiver, and determine the placement condition of a plurality of silicon wafers in the silicon wafer box according to the detection time of the signal receiver received by a controller. The method solves the problems that the performance of laser reflection in the prior art is greatly influenced by the surface state of the side edge of the wafer, when the finish degree and the shape deviation of the side surface of the wafer are large, the laser reflection intensity is large along with the deviation, and the detection precision of the sensor is greatly influenced, so that the detection of the state of the silicon wafer is inaccurate, and the effect of accurately detecting the placement condition of the silicon wafer in the silicon wafer box is achieved.
The embodiment of the application provides a silicon wafer position detection device, which comprises a base, a vertical support, a moving part arranged on the vertical support, a placement table, a motor, a signal transmitter, a signal receiver and a controller, wherein one end of the vertical support is fixedly connected with the base, the other end of the vertical support is respectively fixed with the signal transmitter and the signal receiver, the signal transmitter and the signal receiver are aligned, a movable space is formed between the signal transmitter and the signal receiver, the placement table is used for holding a silicon wafer box, a plurality of silicon wafers are placed in the silicon wafer box, the placement table is connected with the moving part, and the moving part is driven to move under the rotation of the motor to control the placement table to move along the vertical direction, so that the silicon wafers in the silicon wafer box sequentially pass through the movable space; and the controller determines the placement condition of the silicon chips in the silicon chip box according to the detection time corresponding to the signal receiver.
Optionally, the silicon wafer box includes top panel, lower panel, first side panel and second side board, and the first side of first side panel is two sides that are opposite with the first side fixed connection of top panel, and the second side of first side panel is two sides that are opposite with the second side of lower panel, and the first side of second side panel is provided with the silicon wafer standing groove in a plurality of preset positions department of first side panel, and the position department that aligns of a plurality of preset positions of second side panel and first side panel is provided with the standing groove, and a plurality of silicon wafers that place respectively in a plurality of standing grooves of first side panel and second side panel form the slot.
Optionally, the spacing between the preset positions of the first side plate is a standard spacing value, and the spacing between the preset positions of the second side plate is a standard spacing value.
Optionally, the controller is connected with the motor, wherein the controller controls the motor to rotate to drive the moving member to control the placing table to move along the vertical direction by the following way: controlling the motor to rotate so as to enable the placing table to move to a first height; the motor is controlled to rotate at a preset rotation speed and a preset rotation direction, and the moving part is driven to control the placing table to move at a preset speed along the vertical direction; judging whether the placing table moves to a second height; and if the placing table moves to the second height, controlling the motor to stop rotating.
Optionally, the detection time includes a plurality of active signal detection time periods and a plurality of inactive signal detection time periods, wherein the active signal detection time periods are used for indicating that the silicon wafer passes through the movable space in the time periods, and the inactive signal detection time periods are used for indicating that no silicon wafer passes through the movable space in the time periods.
Optionally, the controller determines the placement condition of each silicon wafer in the silicon wafer box according to the detection time corresponding to the signal receiver by the following manner: judging whether a valid signal detection time period is included in each silicon wafer detection time period; for each silicon wafer detection time period, if the silicon wafer detection time period does not comprise the effective signal detection time period, determining the position of a silicon wafer slot corresponding to the silicon wafer detection time period according to the silicon wafer detection time period, and determining that the silicon wafer slot at the position is an empty slot.
Optionally, the controller further performs the steps of: for each silicon wafer detection time period, if the silicon wafer detection time period comprises an effective signal detection time period, calculating the time length of the effective signal detection time period, and judging whether the time length of the effective signal detection time period exceeds a reference time length; and for each silicon wafer detection time period, if the time length of the effective signal detection time period exceeds the reference time length, determining the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determining that the silicon wafers in the silicon wafer slot at the position are stacked.
Optionally, the controller further performs the steps of: for each silicon wafer detection time period, if the time length of the effective signal detection time period does not exceed the reference time length, judging whether the effective signal detection time period is included in the reference time period in the silicon wafer detection time period; if the effective signal detection time period is included in the reference time period in the silicon wafer detection time period, determining the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determining that the silicon wafer in the silicon wafer slot at the position is normally placed; if the effective signal detection time period is not included in the reference time period in the silicon wafer detection time period, determining the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determining that the silicon wafer in the silicon wafer slot at the position is placed in a staggered slot.
Optionally, the controller determines each silicon wafer detection time period by: determining the moving speed of the placing table according to the preset rotating speed of the motor; determining the time length of a silicon wafer detection time period according to the moving speed of the placing table and the standard interval value; and determining each silicon wafer detection time period according to the position of each slot, the time length of the silicon wafer detection time period, the first height and the second height.
Optionally, the controller further performs the steps of: judging whether the silicon chips in the position of each silicon chip slot in the silicon chip box are normally placed or not; if the silicon wafer in the position of each silicon wafer slot in the silicon wafer box is not placed normally, determining the silicon wafer box as an abnormal silicon wafer box.
According to the silicon wafer position detection device, the silicon wafer in the silicon wafer box can pass through the movable space between the signal emitter and the signal receiver by controlling the movement of the placement table, and the placement condition of a plurality of silicon wafers in the silicon wafer box is determined according to the detection time of the signal receiver received by the controller. The method solves the problems that the performance of laser reflection in the prior art is greatly influenced by the surface state of the side edge of the wafer, when the finish degree and the shape deviation of the side surface of the wafer are large, the laser reflection intensity is large along with the deviation, and the detection precision of the sensor is greatly influenced, so that the detection of the state of the silicon wafer is inaccurate, and the effect of accurately detecting the placement condition of the silicon wafer in the silicon wafer box is achieved.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a silicon wafer detecting device according to an embodiment of the present application;
FIG. 2 is a schematic view of a silicon wafer cassette according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a controller controlling a motor according to an embodiment of the present disclosure;
FIG. 4 is a flowchart of a controller provided in an embodiment of the present application determining placement of each silicon wafer in a silicon wafer cassette;
fig. 5 is a schematic view of a silicon wafer position in a silicon wafer cassette according to an embodiment of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments of the present application, every other embodiment that a person skilled in the art would obtain without making any inventive effort is within the scope of protection of the present application.
First, application scenarios applicable to the present application will be described. The method and the device can be applied to the technical field of semiconductor manufacturing.
It has been found that in the process of manufacturing semiconductor integrated circuits, photolithography equipment is the most important equipment, and the photolithography equipment exposes the circuit pattern on a silicon wafer with a photosensitive coating, and then performs processes such as deposition, etching, doping, and the like, to finally form integrated circuits. Before the silicon wafers are transported to the photoetching equipment for exposure, the silicon wafers are stored in the silicon wafer box, so that the storage state of the silicon wafers in the box, including the existence, stacking, oblique insertion and the like of the silicon wafers, is detected, and a precondition is provided for the subsequent process.
At present, in the prior art, the method for detecting the shielding time of the side face of the wafer is to install a reflective laser sensor on the side face of the wafer box. The specific operation is as follows: and starting the lifting of the wafer box, continuously irradiating laser, shielding the laser by the side surface of the wafer, reflecting the laser back to the sensor, changing the state of the sensor from low level to high level, and finally calculating the state of the silicon wafer by detecting the position level state and time of the fixing piece slot.
However, the performance of laser reflection is greatly affected by the state of the wafer side surface. When the smooth finish and the shape deviation of the side face of the wafer are larger, the laser reflection intensity is larger along with the larger deviation, so that the detection precision of the sensor is greatly influenced, and the state of the silicon wafer is inaccurately checked.
Based on the above, the embodiment of the application provides a silicon wafer position detection device.
Referring to fig. 1, fig. 1 is a schematic diagram of a silicon wafer detecting device according to an embodiment of the present application. As shown in fig. 1, a silicon wafer detection device provided in an embodiment of the present application includes: the device comprises a base 101, a vertical support 102, a moving part 103 arranged on the vertical support, a placing table 104, a motor 105, a signal transmitter 106, a signal receiver 107, a controller (not shown in the figure) and a silicon wafer box 108.
Specifically, one end of the vertical support 102 is fixedly connected with the base 101, and the other end of the vertical support 102 is respectively fixed with a signal transmitter 106 and a signal receiver 107.
Wherein the signal transmitter 106 and the signal receiver 107 are disposed in alignment, and a movable space is formed between the signal transmitter 106 and the signal receiver 107.
It should be noted that, the signal emitter 106 and the signal receiver 107 are respectively connected with the controller, in order to adapt to the deformation of the silicon wafer in a certain range, the signal emitting and receiving angles of the signal emitter 106 and the signal receiver 107 can be finely adjusted according to the control of the controller, so that the position of the silicon wafer can be accurately detected by the signal emitter 106 and the signal receiver 107.
Referring to fig. 1, the placement stage 104 is used for placing a silicon wafer cassette 108, wherein a plurality of silicon wafers (not shown) are placed in the silicon wafer cassette 108.
The placing table 104 is connected with the moving member 103, and the moving member 103 is driven to move under the rotation of the motor 105 to control the placing table 104 to move in the vertical direction, so that a plurality of silicon wafers (not shown in the figure) in the silicon wafer box 108 sequentially pass through the movable space; and a controller (not shown in the figure) determines the placement condition of the silicon chips in the silicon chip box according to the detection time corresponding to the signal receiver.
Referring to fig. 2, fig. 2 is a schematic view of a silicon wafer cassette according to an embodiment of the present application. As shown in fig. 2, a silicon wafer box provided in an embodiment of the present application includes: the upper panel 202, the lower panel 201, the first side panel 203, the second side panel 204, the handle 206 and the silicon wafer 205, wherein a plurality of silicon wafer placing grooves 207 are formed on the first side panel 203 and the second side panel 204.
The first side of the first side panel 203 is fixedly connected with the first side of the upper panel 202, the second side of the first side panel 203 is fixedly connected with the first side of the lower panel 201, the first side of the second side panel 204 is fixedly connected with the second side of the upper panel 202, and the second side of the second side panel 204 is fixedly connected with the second side of the lower panel 201.
The first side of the first side panel 203 is opposite to the second side of the first side panel 203, the first side of the second side panel 204 is opposite to the second side of the second side panel 204, the first side of the upper panel 202 is opposite to the second side of the upper panel 202, and the first side of the lower panel 201 is opposite to the second side of the lower panel 201.
As shown in fig. 2, silicon wafer placement grooves are provided at a plurality of preset positions of the first side panel 203, silicon wafer placement grooves 207 are provided at positions of the second side panel 204 aligned with the plurality of preset positions of the first side panel 203, and a plurality of silicon wafers 205 are placed in a plurality of slots formed between the plurality of placement grooves of the first side panel 203 and the plurality of placement grooves 207 of the second side panel 204, respectively.
The spacing between the preset positions of the first side panel 203 is a standard spacing value, and the spacing between the preset positions of the second side panel 204 is a standard spacing value.
Thus, when the silicon wafer box moves the silicon wafers, the silicon wafers are placed in the slots of the silicon wafer box, and before the silicon wafers are transported to the photoetching equipment for exposure, the storage state of the silicon wafers in the silicon wafer box can be determined by detecting the position of each silicon wafer in the silicon wafer box.
The controller is connected with the motor to control the motor to move through the controller.
Specifically, when determining the storage state of the silicon wafer in the silicon wafer box, the placing table needs to be controlled to move at a preset speed and in a preset moving direction so as to ensure the accuracy of the position detection of the silicon wafer.
For example, referring to fig. 3, fig. 3 is a flowchart of a controller for controlling a motor according to an embodiment of the present application. As shown in fig. 3, a flowchart for controlling a motor by a controller provided in an embodiment of the present application includes:
and S301, controlling the motor to rotate so as to enable the placing table to move to the first height.
In this step, the placing table may be controlled to move to the first height by controlling the motor to run at a predetermined speed for a predetermined time or by setting a stopper for detection or the like.
S302, controlling the motor to rotate at a preset rotation speed and a preset rotation direction, and driving the moving part to control the placing table to move along the vertical direction at a preset speed.
For example, the predetermined rotation speed may be 150 rotations per minute, and the predetermined rotation direction may be normal rotation, so as to drive the movable member to control the value placing table to move in the vertical direction from top to bottom at a speed of five millimeters per second.
S303, judging whether the placing table moves to a second height.
In this step, whether the placing table is moved to the second height may be determined according to a rotation time of the motor, a stopper provided at the second height, or the like.
And S304, if the placing table moves to the second height, controlling the motor to stop rotating.
Thus, the controller can control the motor to rotate to drive the moving part to move along the preset vertical direction at the preset speed.
In the process that the controller controls the motor to rotate to drive the moving part to control the placing table to move along the vertical direction, the signal transmitter continuously transmits signals, the signal receiver continuously receives signals, and the controller determines the placing condition of each silicon chip in the silicon chip box according to the detection time corresponding to the signal receiver.
Specifically, referring to fig. 4, fig. 4 is a flowchart of a controller provided in an embodiment of the present application to determine a placement condition of each silicon wafer in a silicon wafer box. As shown in fig. 4, a flowchart for determining a placement condition of each silicon wafer in a silicon wafer box by using a controller provided in an embodiment of the present application includes:
s401, judging whether an effective signal detection time period is included in each silicon wafer detection time period.
The detection time includes a plurality of valid signal detection time periods and a plurality of invalid signal detection time periods, wherein the valid signal detection time periods are used for indicating that the silicon wafer passes through the movable space in the time periods, and the invalid signal detection time periods are used for indicating that no silicon wafer passes through the movable space in the time periods.
The silicon wafer detection time period is determined according to the moving speed of the placing table and the distance between preset positions of each slot.
For example, referring to fig. 5, fig. 5 is a schematic view of a silicon wafer position in a silicon wafer box according to an embodiment of the present application. As shown in fig. 5, a schematic diagram of a silicon wafer position in a silicon wafer box according to an embodiment of the present application includes: silicon wafer 501, silicon wafer 502, silicon wafer 503, silicon wafer 504, silicon wafer 505, position A, position B, position C, position D, position E, position F.
Here, each silicon wafer is placed in the slot of the silicon wafer box, and the distance between each adjacent silicon wafer is the distance between the preset positions of each adjacent silicon wafer placing slot.
It should be noted that, when the placement table moves to the first height, the position a in the silicon wafer box is between the signal transmitter and the signal receiver, and the distance between the position a and the position B is the distance value between a plurality of preset positions, namely, the standard distance value; the distance between the position B and the position C is a standard interval value; the distance between the position C and the position D is a standard interval value; the distance between the position D and the position E is a standard interval value; the distance between position E and position F is the standard pitch value.
Thus, when the controller controls the placement stage to move from the first height to the second height at the preset speed, the detection time period for the silicon wafer 501 is the time period for the placement stage to move by the standard pitch value at the preset speed, for example, the time for the placement stage to move by the standard pitch value at the preset speed is 1 second, the silicon wafer detection time period for the silicon wafer 501 is 0-1 second, the silicon wafer detection time period for the silicon wafer 502 is 1-2 seconds, the silicon wafer detection time period for the silicon wafer 503 is 2-3 seconds, the silicon wafer detection time period for the silicon wafer 504 is 3-4 seconds, and the silicon wafer detection time period for the silicon wafer 505 is 4-5 seconds.
For each silicon wafer detection time period, if the silicon wafer detection time period does not include the valid signal detection time period, step S402 is executed to determine a position of a silicon wafer slot corresponding to the silicon wafer detection time period according to the silicon wafer detection time period, and determine that the silicon wafer slot at the position is an empty slot.
For each silicon wafer detection time period, if the silicon wafer detection time period includes an effective signal detection time period, executing step S403, calculating the time length of the effective signal detection time period, and judging whether the time length of the effective signal detection time period exceeds a reference time length;
for each silicon wafer detection time period, if the time length of the effective signal detection time period exceeds the reference time length, step S404 is executed to determine the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determine that the silicon wafers in the silicon wafer slot at the position are stacked.
For each silicon wafer detection time period, if the time length of the effective signal detection time period does not exceed the reference time length, step S405 is executed to determine whether the effective signal detection time period is included in the reference time period in the silicon wafer detection time period.
If the effective signal detection time period includes a reference time period within the silicon wafer detection time period, executing step S407 to determine a position of a silicon wafer slot corresponding to the silicon wafer detection time period, and determining that a silicon wafer in the silicon wafer slot at the position is normally placed;
if the valid signal detection time period does not include the reference time period in the silicon wafer detection time period, step S406 is executed to determine the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determine that the silicon wafer in the silicon wafer slot at the position is placed in a wrong slot.
The silicon wafer position detection device can enable silicon wafers in the silicon wafer box to pass through a movable space between the signal emitter and the signal receiver by controlling the movement of the placing table, and determine the placing condition of the silicon wafers in the silicon wafer box according to the detection time of the signal receiver received by the controller. The method solves the problems that the performance of laser reflection in the prior art is greatly influenced by the surface state of the side edge of the wafer, when the finish degree and the shape deviation of the side surface of the wafer are large, the laser reflection intensity is large along with the deviation, and the detection precision of the sensor is greatly influenced, so that the detection of the state of the silicon wafer is inaccurate, and the effect of accurately detecting the placement condition of the silicon wafer in the silicon wafer box is achieved.
The embodiment of the present application further provides a computer readable storage medium, where a computer program is stored on the computer readable storage medium, and when the computer program is executed by a processor, the computer program may perform the control steps performed by the controller in the method embodiments shown in the foregoing fig. 3 and fig. 4, and the specific implementation manner may refer to the method embodiments and will not be described herein.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.
In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer readable storage medium executable by a processor. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Finally, it should be noted that: the foregoing examples are merely specific embodiments of the present application, and are not intended to limit the scope of the present application, but the present application is not limited thereto, and those skilled in the art will appreciate that while the foregoing examples are described in detail, the present application is not limited thereto. Any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or make equivalent substitutions for some of the technical features within the technical scope of the disclosure of the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A silicon wafer position detection device is characterized by comprising a base, a vertical bracket, a moving part arranged on the vertical bracket, a placing table, a motor, a signal transmitter, a signal receiver and a controller,
one end of the vertical support is fixedly connected with the base, the other end of the vertical support is respectively fixed with a signal emitter and a signal receiver, the signal emitter and the signal receiver are aligned, a movable space is formed between the signal emitter and the signal receiver,
the placing table is used for carrying a silicon wafer box, a plurality of silicon wafers are placed in the silicon wafer box, the placing table is connected with the moving piece, and the moving piece is driven to move under the rotation of the motor to control the placing table to move along the vertical direction, so that the silicon wafers in the silicon wafer box sequentially pass through the movable space;
and the controller determines the placement condition of the silicon chips in the silicon chip box according to the detection time corresponding to the signal receiver.
2. The apparatus of claim 1, wherein the silicon wafer cassette comprises an upper panel, a lower panel, a first side panel and a second side panel, the first side of the first side panel is fixedly connected to the first side of the upper panel, the second side of the first side panel is fixedly connected to the first side of the lower panel, the first side of the second side panel is fixedly connected to the second side of the upper panel, the second side of the second side panel is fixedly connected to the second side of the lower panel,
wherein the first side edge of the first side panel and the second side edge of the first side panel are two opposite sides, the first side edge of the second side panel and the second side edge of the second side panel are two opposite sides, the first side edge of the upper panel and the second side edge of the upper panel are two opposite sides, the first side edge of the lower panel and the second side edge of the lower panel are two opposite sides,
the silicon wafer placing grooves are formed in the preset positions of the first side panel, the silicon wafer placing grooves are formed in the positions, aligned with the preset positions of the first side panel, of the second side panel, and the silicon wafers are placed in the slots formed between the placing grooves of the first side panel and the placing grooves of the second side panel respectively.
3. The device of claim 2, wherein the spacing between the plurality of predetermined locations of the first side panel is a standard spacing value and the spacing between the plurality of predetermined locations of the second side panel is a standard spacing value.
4. The apparatus of claim 1, wherein the controller is coupled to the motor,
the controller controls the motor to rotate to drive the moving part to control the placing table to move along the vertical direction by controlling the motor to rotate in the following mode:
controlling the motor to rotate so as to enable the placing table to move to a first height;
the motor is controlled to rotate at a preset rotation speed and a preset rotation direction, and the moving part is driven to control the placing table to move at a preset speed along the vertical direction;
judging whether the placing table moves to a second height;
and if the placing table moves to the second height, controlling the motor to stop rotating.
5. The apparatus of claim 1, wherein the detection time comprises a plurality of active signal detection periods and a plurality of inactive signal detection periods,
the active signal detection time period is used for indicating that the silicon wafer passes through the movable space in the time period, and the inactive signal detection time period is used for indicating that the silicon wafer does not pass through the movable space in the time period.
6. The apparatus of claim 5, wherein the controller determines the placement of each silicon wafer within the wafer cassette based on the corresponding detection time of the signal receiver by:
judging whether a valid signal detection time period is included in each silicon wafer detection time period;
for each silicon wafer detection time period, if the silicon wafer detection time period does not comprise the effective signal detection time period, determining the position of a silicon wafer slot corresponding to the silicon wafer detection time period according to the silicon wafer detection time period, and determining that the silicon wafer slot at the position is an empty slot.
7. The apparatus of claim 6, wherein the controller further performs the steps of:
for each silicon wafer detection time period, if the silicon wafer detection time period comprises an effective signal detection time period, calculating the time length of the effective signal detection time period, and judging whether the time length of the effective signal detection time period exceeds a reference time length;
and for each silicon wafer detection time period, if the time length of the effective signal detection time period exceeds the reference time length, determining the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determining that the silicon wafers in the silicon wafer slot at the position are stacked.
8. The apparatus of claim 7, wherein the controller further performs the steps of:
for each silicon wafer detection time period, if the time length of the effective signal detection time period does not exceed the reference time length, judging whether the effective signal detection time period is included in the reference time period in the silicon wafer detection time period;
if the effective signal detection time period is included in the reference time period in the silicon wafer detection time period, determining the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determining that the silicon wafer in the silicon wafer slot at the position is normally placed;
if the effective signal detection time period is not included in the reference time period in the silicon wafer detection time period, determining the position of the silicon wafer slot corresponding to the silicon wafer detection time period, and determining that the silicon wafer in the silicon wafer slot at the position is placed in a staggered slot.
9. The apparatus of claim 3 or 6, wherein the controller determines each silicon wafer inspection time period by:
determining the moving speed of the placing table according to the preset rotating speed of the motor;
determining the time length of a silicon wafer detection time period according to the moving speed of the placing table and the standard interval value;
and determining each silicon wafer detection time period according to the position of each slot, the time length of the silicon wafer detection time period, the first height and the second height.
10. The apparatus of claim 8, wherein the controller further performs the steps of:
judging whether the silicon chips in the position of each silicon chip slot in the silicon chip box are normally placed or not;
if the silicon wafer in the position of each silicon wafer slot in the silicon wafer box is not placed normally, determining the silicon wafer box as an abnormal silicon wafer box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310506841.9A CN116466548A (en) | 2023-05-06 | 2023-05-06 | Silicon wafer position detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310506841.9A CN116466548A (en) | 2023-05-06 | 2023-05-06 | Silicon wafer position detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116466548A true CN116466548A (en) | 2023-07-21 |
Family
ID=87178892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310506841.9A Pending CN116466548A (en) | 2023-05-06 | 2023-05-06 | Silicon wafer position detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116466548A (en) |
-
2023
- 2023-05-06 CN CN202310506841.9A patent/CN116466548A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5906469A (en) | Apparatus and method for detecting and conveying substrates in cassette | |
| JP3074313B2 (en) | Wafer positioning device | |
| JP3222334B2 (en) | Method and apparatus for adjusting height of recognition nozzle in surface mounter | |
| KR100676240B1 (en) | Substrate processing apparatus | |
| EP1463106A1 (en) | Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus | |
| KR20230175319A (en) | Method, system and computer storage media for V-shaped notch center positioning of wafer | |
| CN110622294B (en) | Substrate carrying-out method | |
| CN115083942B (en) | Wafer state detection method, system, storage medium and detection device | |
| CN113053773A (en) | Wafer state online identification detection method, device and system | |
| JP2002246304A (en) | Device and method for scanning projection alignment, and method of manufacturing the device | |
| CN116466548A (en) | Silicon wafer position detection device | |
| US20110043776A1 (en) | Exposure control apparatus, manufacturing method of semiconductor device, and exposure apparatus | |
| CN116819907A (en) | Method and system for calibrating position of photomask of exposure machine | |
| JPH09148404A (en) | Substrate carrier | |
| JP2003084425A (en) | Measuring device and measuring method for reticule pattern position accuracy | |
| CN111613552B (en) | Tray state adjusting method and semiconductor processing equipment | |
| KR102139612B1 (en) | Apparatus for treating substrate having apparatus for transferring substrate and method for teaching of apparatus for transferring substrate | |
| JP3157751B2 (en) | Dicing method for semiconductor substrate | |
| KR101300852B1 (en) | Method for appointing orientation flat, apparatus for detecting orientation flat, and recording medium having program for appointing orientation flat recorded therein | |
| KR20060125150A (en) | Apparatus for aligning flat zone of a wafer | |
| KR20080008443A (en) | Equipment for detecting wafer flat zone of semiconductor coating device | |
| CN111668131A (en) | System and method for detecting position deviation of mechanical arm and wafer | |
| JPH05166702A (en) | Semiconductor wafer alignment device | |
| JPH03280447A (en) | Detection of substrate | |
| CN116053156A (en) | Device and method for detecting wafer notch position and computer storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |