CN116457927A - Removing method, removing tool and semiconductor element - Google Patents
Removing method, removing tool and semiconductor element Download PDFInfo
- Publication number
- CN116457927A CN116457927A CN202180074440.XA CN202180074440A CN116457927A CN 116457927 A CN116457927 A CN 116457927A CN 202180074440 A CN202180074440 A CN 202180074440A CN 116457927 A CN116457927 A CN 116457927A
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- protective film
- upper side
- semiconductor element
- removal tool
- removal
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 52
- 230000001681 protective effect Effects 0.000 claims abstract description 139
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 230000005693 optoelectronics Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 3
- 230000001154 acute effect Effects 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 238000007790 scraping Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 117
- 230000000875 corresponding effect Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
In at least one embodiment, a method is for removing a protective film (2) from a semiconductor element (1) (e.g., a light emitting diode), and the method comprises the steps of: a) Providing a semiconductor element (1) so as to have a protective film (2) on an upper side (10) of the element; and B) removing the protective film (2) using a removal tool (4) having a removal opening (44), in step A) the protective film (2) protrudes beyond the upper side (10) of the element on the longitudinal side (11) as seen from the extension of the upper side (10) of the element, and step B) comprises the following sub-steps: b1 Guiding the removal tool (4) on the protective film (2) in a scraping manner along the longitudinal side (11) adjacent to the semiconductor element (1) such that the protective film (2) is bent by the removal tool (4) towards the side (12) of the semiconductor element (1); and B2) pulling back the removal tool (4) such that the protective film (2) is captured in the removal opening (44) and the protective film (4) is detached from the upper side (10) of the element.
Description
A method of removing a protective film from a semiconductor element is provided. Furthermore, a removal tool and a semiconductor component for such a method are provided.
An object to be achieved is to provide a method capable of effectively removing a protective film from a semiconductor element (e.g., a light emitting diode).
Furthermore, this object is achieved by a method having the features of patent claim 1. The other claims relate to preferred improvements.
According to at least one embodiment, the semiconductor element is an optoelectronic semiconductor element. For example, the semiconductor element is a light emitting diode or an LED lamp.
According to at least one embodiment, the method comprises the step of providing a semiconductor element. In this case, the protective film is located on the element upper side of the semiconductor element. The protective film is particularly suitable for protecting an optoelectronic semiconductor chip (e.g., a light emitting diode chip) of a semiconductor element during transportation and mounting. For example, the protective film is a transparent or translucent film that is adhered to the upper side of the element.
According to at least one embodiment, the method comprises the step of separating the protective film from the upper side of the component. The separation is performed with at least one removal tool having one or more removal openings. Preferably, exactly one removal tool is used.
According to at least one embodiment, the protective film protrudes beyond the element upper side at the longitudinal side, as seen from the extension of the element upper side. That is, the protective film depends from the upper side of the element at the longitudinal sides.
According to at least one embodiment, the separation of the protective film comprises guiding the removal tool along the longitudinal side close to the semiconductor element in a direction transverse to the upper side of the element, in particular in a direction perpendicular to the upper side of the element. In other words, the removal tool is moved transversely, preferably perpendicularly or approximately perpendicularly, to the upper side of the element. In this case, the removal tool is preferably located close to a plane defined by the element underside of the semiconductor element. In this case, the element underside is opposite to the element upper side. The removal tool may be directed to the plane.
According to at least one embodiment, the removal tool is guided along the protective film while acting on the protective film such that the protective film is bent by the removal tool in a direction toward the side and/or in a direction toward the element underside of the semiconductor element. In this case, the removal tool preferably does not contact the semiconductor element, in particular in the stem region of the removal tool, but only the protective film.
According to at least one embodiment, the separating includes retracting the removal tool. This retraction is preferably performed in the opposite direction to the previous guiding of the removal tool. That is, reversal of the moving direction of the removal tool may occur. In this way, the protective film is caught in the removal opening, and the protective film is detached from the element upper side. The capture may be passive, i.e. due to the geometry of the removal openings only and to the nature of the protective film, or active, in particular by changing the configuration of the removal openings.
It is also possible that the removal tool also performs at least partially a horizontal or inclined direction of movement, as long as the available space on the protective film allows. That is, the direction of movement is preferably oriented predominantly perpendicularly to the element upper side, but it need not extend completely perpendicularly to the element upper side.
In at least one embodiment, a method of removing a protective film from a semiconductor element includes the steps (particularly in a specified order) of:
a) Providing a semiconductor element having a protective film on an upper side of the element, and
b) The protective film is separated from the upper side of the element by a removal tool having a removal opening,
in step A), the protective film protrudes beyond the element upper side at the longitudinal side as seen from the extension of the element upper side, and
step B) comprises the following sub-steps, preferably in the order specified:
b1 Guiding the removal tool along the longitudinal side near the semiconductor element in a direction transverse to the upper side of the element while the removal tool acts on the protective film such that the protective film is bent by the removal tool in a direction toward the side of the semiconductor element, and
b2 Retracting the removal tool such that the protective film is captured in the removal opening and the protective film is detached from the element upper side.
The methods described herein are particularly directed to SMT components having protective films. In this context, SMT refers to surface mount technology. Even under narrow space conditions, the protective film can be separated by this method. In particular, the method may be performed automatically with a removal tool or in an automated manner.
It is generally desirable for LED-based light sources to have a protective film on the light emitting face. In this case, there may be many different parameters, in particular, parameters in terms of the arrangement of the protective film (for example, the shape thereof, the distance the protective film protrudes beyond the semiconductor element, or the arrangement of the adhesive face for fastening the protective film). For example, after soldering and mounting additional components on a circuit board (e.g., a printed circuit board, abbreviated as PCB), the requirements for a method intended to re-separate the protective film may be relatively high.
The protective film is typically manually separated. This is impractical for large volumes or under confined space conditions.
By means of the method described herein, the protective film is separated by a suitable removal tool. For example, the removal tool is configured similar to a chisel and has a slot or notch near the lower end as the removal opening. The opening extends obliquely downward and the lower edge of the removal opening may be a sharp edge or configured with teeth or spikes.
In particular, the removal tool is thus guided downwards towards the semiconductor component in the direction of the circuit board, on which the semiconductor component is preferably fastened in advance. In this case, the tab or overhang of the cover film is resiliently pressed down and slid along the stem (e.g., chisel stem) of the removal tool. When the removal tool is lifted back, the protective film penetrates into the removal opening of the removal tool and catches or catches there (e.g., on the sharp or spiked edges) and is lifted and separated from the semiconductor element.
Furthermore, the clamping action of the removal tool on the protective film can be actively achieved by: the stem of the removal tool is configured in multiple parts (in particular in two parts) and the slot or notch that can form the removal opening narrows after the protective film has been inserted.
According to at least one embodiment, in step a), the protective film is fastened to the semiconductor element by means of an adhesive. Preferably, the adhesive is applied only locally between the protective film and the semiconductor element, although the adhesive can alternatively be present over the entire surface.
According to at least one embodiment, the adhesive is applied only along two mutually opposite lateral sides of the upper side of the element. In this case, the two lateral sides are oriented transversely, preferably perpendicularly, to the longitudinal sides, seen in a top view of the upper side of the element. The lateral sides may each be longer than the longitudinal sides.
According to at least one embodiment, the removal opening is formed by a slot or a slit. The removal opening extends partially or completely along the longitudinal sides. That is, the removal opening may be elongated and as wide as or wider than the protective film along the longitudinal sides. Alternatively, the removal opening may be relatively narrow and extend along only a portion of the longitudinal side, for example up to 60% or 40% of the longitudinal side. The removal opening may be trapezoidal or parallelogram shaped as viewed in cross section. If the removal opening extends completely along the longitudinal side, the removal tool preferably comprises a frame lying beside the protective film as seen from the longitudinal side.
According to at least one embodiment, the removal opening extends at an angle away from the element upper side and towards the element lower side, which angle is at least 0 ° or at least 30 ° or at least 40 ° and/or at most 70 ° or at most 60 ° or at most 50 °. That is to say that the removal opening preferably extends relatively steeply, almost perpendicularly to the element upper side.
According to at least one embodiment, there is an acute angle at the lower edge of the removal opening. In this case, the lower edge faces the bottom end of the removal tool. The bottom end is the end of the removal tool that is moved forward in step B1).
According to at least one embodiment, the lower edge is provided with one or more catch structures. At least one trapping structure is adapted to penetrate into and/or trap the protective film in step B2). For example, the capture structures are formed from spikes, hooks, barbs, and/or teeth.
According to at least one embodiment, the removal tool comprises a rod. The stem is preferably the only component of the removal tool that contacts the protective film and is therefore proximate to the semiconductor element. A removal opening or a plurality of removal openings are located in the rod.
According to at least one embodiment, the stem of the removal tool is configured as one piece. That is, the lever is formed of a single piece and is preferably stationary.
According to at least one embodiment, the rod is mechanically rigid. That is, the rod does not deform or deform significantly during the intended use.
According to at least one embodiment, the stem of the removal tool comprises a plurality of parts, in particular exactly two parts. The components may be formed of the same material or different materials. The components may have different thicknesses from each other.
According to at least one embodiment, the parts of the rod are displaceable relative to each other. Thus, the configuration of the removal opening can be altered by a relative movement of the parts with respect to each other and the removable film clamped in step B2).
According to at least one embodiment, at least in step B1), the removal opening extends through the part of the rod in a direction away from the upper side of the element. That is, in step B1), the removable film may be guided through the entire rod. Therefore, only in step B2), the protective film can be effectively clamped between the components.
According to at least one embodiment, in step B1), the removal opening is formed by the distance between the components, in particular by a distance parallel to the direction of movement of the removal tool. In particular, for this reason, one of the parts, or even both parts, has no through hole for removing the opening. In other words, the removal opening extends only partially through the rod. In step B2), the protective film may then be clamped between the components, in particular in the case of protective films which do not pass through the rod.
According to at least one embodiment, in step a), the protective film protrudes beyond the element upper side only at the longitudinal sides. Thus, the protective film may be receded relative to or flush with the element upper side at one, a few or all other sides of the element upper side as seen in top view.
According to at least one embodiment, the protective film is composed of or comprises at least one of the following materials: polyamides, polyacrylates, polycarbonates.
According to at least one embodiment, the protective film has an adhesion of at least 1N/cm and/or at most 10N/cm with respect to the upper side of the element, that is to say an adhesion of for example 2.5N per cm of the length of the protective film. For example, the width of the adhesive (e.g., in the form of a strip) that achieves such adhesion is at least 0.5mm and/or at most 5mm. Preferably, there are a plurality (in particular two) of such adhesives in the form of a tape. For example, silica gel is used as the adhesive. The protective film (optionally together with the adhesive) can withstand temperatures up to 180 ℃ and can withstand temperatures of 350 ℃ for a short period of time (in particular up to 10 seconds or 30 seconds).
According to at least one embodiment, the material of the protective film (and thus preferably the protective film itself) has an elastic modulus of at least 1GPa or at least 2.5GPa at 300K. Alternatively or additionally, the value is at most 8Gpa or at most 4Gpa. At 300K, the tensile strength of the protective film may be at least 0.1GPa or at least 0.15GPa and/or at most 0.8GPa or at most 0.4GPa.
According to at least one embodiment, the ratio of the height of the removal opening to the thickness of the protective film is at least 1.1 or at least 1.2 or at least 1.5. Alternatively or additionally, the ratio is at most 6 or at most 4 or at most 3. In particular, the height of the removal opening is determined in a direction perpendicular to the upper side of the element and along the direction of movement of the rod in step B2).
According to at least one embodiment, the ratio of the overhang of the protective film beyond the longitudinal side to the thickness of the semiconductor element is at least 0.2 or at least 0.5 or at least 0.8. Alternatively or additionally, the ratio is at most 5 or at most 2 or at most 1.2. Preferably, the overhang is determined when the protective film has not been deformed by the tool, i.e. in particular in step a.
According to at least one embodiment, the ratio of the thickness of the overhang to the thickness of the protective film is at least 5 or at least 10 or at least 20. Alternatively or additionally, the ratio is at most 100 or at most 50 or at most 35.
According to at least one embodiment, in step a), the semiconductor element is provided in a manner mounted on a carrier, such as a circuit board. Only one or more semiconductor elements may be present on the carrier.
According to at least one embodiment, there is at least one carrier frame on the carrier, which forms one or more grooves. In this case, the semiconductor element is preferably arranged in the recess. In particular, there is a one-to-one correspondence between at least one recess and at least one semiconductor element.
According to at least one embodiment, the distance between the semiconductor element and the carrier frame, in particular at the height of the upper side of the element, at the longitudinal side, is at least 0.5mm or at least 1mm or at least 2mm. Alternatively or additionally, the distance is at most 10mm or at most 5mm or at most 2.5mm. In this case, the distance may be at most 10% or at most 5% and/or at least 1% of the diagonal length of the upper side of the element. That is, the distance may be small compared to the diagonal length of the upper side of the element.
According to at least one embodiment, in step B), a removal tool is guided into the recess between the semiconductor element and the carrier frame. Thus, with the removal tool described herein, the protective film can be separated in an automatic manner despite the small lateral space beside the semiconductor element.
Furthermore, a removal tool is provided for use in the method described in one or more of the above embodiments. Thus, for the method, features of the removal tool are also disclosed, and vice versa.
In at least one embodiment, the removal tool comprises a rod in which one or more removal openings are present. The removal opening extends, for example, to the bottom end of the rod at an angle of at least 20 ° and/or at most 70 °, in particular from 50 ° to 60 °. Preferably, the length of the stem is at least 10 times or 20 times or 30 times greater than the distance of the removal opening from the bottom end. Preferably, the distance is determined on the outside of the rod, seen from the outside, which does not refer to the distance of the removal opening from the bottom end of the rod interior.
Furthermore, a semiconductor element is provided for use in the method described in one or more of the above embodiments. Thus, for the method, features of the semiconductor element are also disclosed, and vice versa.
In at least one embodiment, the semiconductor element comprises one or more semiconductor chips, particularly preferably at least one optoelectronic semiconductor chip (e.g. a light-emitting diode chip, a laser diode chip, a CCD chip or a photodiode chip). The semiconductor component further comprises a frame which extends circumferentially around, preferably completely around, the at least one semiconductor chip, seen in a top view of the upper side of the component. The protective film fastened at least or only to the frame is preferably arranged at a distance from the optoelectronic semiconductor chips such that the protective film does not contact at least one semiconductor chip. The protective film protrudes beyond the element upper side at the longitudinal side of the element upper side, seen from the extension of the element upper side, such that the semiconductor element or the combination of the semiconductor element and the protective film is delimited by the protective film at the longitudinal side, seen from a top view of the element upper side.
According to at least one embodiment, at least one optoelectronic semiconductor chip has a plurality of pixels. Preferably, these pixels or groups of pixels are photo-electrically driven independently of each other. For example, there are at least 100 or 10 3 Or 10 4 And/or at most 10 6 Or at most 10 5 And each pixel.
According to at least one embodiment, at least one optoelectronic semiconductor chip is adapted to generate light. For example, semiconductor chips are intended to emit white or colored light during operation. The light to be emitted may have a fixed spectral composition or may be tuned by, for example, the presence of pixels emitting white light at different correlated color temperatures or pixels emitting different colors.
Hereinafter, the method, the removal tool and the semiconductor element described herein will be explained in more detail with the aid of exemplary embodiments with reference to the accompanying drawings. Like reference symbols in the various drawings indicate like elements. However, the relationship shown is not true to scale, but rather individual elements may be exaggerated for better understanding.
Fig. 1 to 5 show schematic cross-sectional representations of method steps of an exemplary embodiment of a method for completing a semiconductor element described herein.
Figure 6 shows a schematic top view of an exemplary embodiment of a semiconductor element as described herein,
figure 7 shows a schematic cross-sectional representation of the semiconductor element of figure 6,
FIGS. 8-11 show schematic cross-sectional representations of exemplary embodiments of a removal tool for use in the methods described herein, an
Fig. 12 and 13 show schematic side views of an exemplary embodiment of a removal tool for use in the methods described herein.
Fig. 1 to 5 illustrate a method of removing the protective film 2 from the semiconductor element 1. Fig. 1 shows that a semiconductor element 1, which is preferably an optoelectronic semiconductor element for emitting light, is mounted on a carrier 51, for example by soldering, on the carrier 51.
On the carrier 51 there is a carrier frame 53 defining a recess 52. The semiconductor element 1 is attached in the recess 52, the distance D between the carrier frame 53 and the semiconductor element 1 being relatively small and for example approximately 2mm. For example, the distance D is at least twice and at most six times the mounting tolerance when the semiconductor element 1 is placed on the carrier 51. For example, the mounting tolerance is 0.5mm. For simplicity of representation, the carrier 51 and the carrier frame 53 will not be shown later.
As a variant of the one shown in fig. 1, it is also possible to mount a plurality of semiconductor elements 1 on a carrier 51.
The protective film 2 is fastened to the upper side 10 of the semiconductor element 1. The protective film 2 is preferably adhesive. In this case, the protective film 2 may be spaced apart from the semiconductor chip of the semiconductor element 1. At the longitudinal side 11, the protective film 2 protrudes beyond the element upper side 10. In this case, the protective film 2 is oriented parallel to the element upper side 10 and is shaped flat.
For example, the protective film 2 is a Kapton film or a polyimide film, such as manufactured by DETAKTA manufacturer from Norderstedt, germanyK92/>Films of this type have a thickness of 0.064mm.
In order to separate the protective film 2, a removal tool 4 is used. The removal tool 2 has a narrow (e.g. chisel-shaped) stem 40 such that it fits into the gap between the carrier frame 53 and the semiconductor element 1. At the bottom end 46 facing the semiconductor element 1 and the carrier 51, the stem 40 has a removal opening 44. For example, the removal opening 44 is configured in the form of a slot. According to fig. 1, the direction of movement M of the removal tool 4 is perpendicular to the element upper side 10 and faces the carrier 51.
Fig. 2 shows that the removal tool 4 is placed on the protective film 2 laterally next to the semiconductor element 1 and the protective film 2 is pressed down towards a side 12 of the semiconductor element 1, which connects the element upper side 10 to the opposite element lower side 14. The protective film 2 is thus creased at the longitudinal sides 11 of the element upper side 10. Preferably, the protective film 2 is not thus detached from the element upper side 10. That is, at this stage, the removal tool 2 acts downward toward the carrier 51 laterally past the protective film 2 and bends the protective film 2.
The method steps of fig. 3 show that the removal tool 4 has been moved further over the protective film 2. In this case, the removal tool 4 is slid along the protective film 2 until the film edge snaps into the removal opening 44. In this case, the removal tool 4 can continue to move until the carrier 51 or stop at a distance from the carrier 51.
In the method step of fig. 4, the direction of movement M has been reversed, so that the removal tool 4 is again moved away from the carrier 51 in a direction perpendicular to the component upper side 10 and returned along the same path. In this case, the protective film 2 is slid further into the removal opening 44 and wedged therein. Due to the shape of the removal opening 44 and the relatively significant rigidity of the protective film 2, the protective film 2 is thus held in the removal opening 44.
If the removal tool 4 is moved further, see fig. 5, the protective film 2 is pulled continuously upwards away from the element upper side 10. The removal tool 4 is preferably moved away from the element upper side 10 until the protective film 2 is lifted completely from the element upper side 10. After detachment of the protective film 2 from the component upper side 10, the protective film 2 can continue to be fixed on the removal tool 4 or the protective film 2 can be removed in another way, for example by means of an air flow (not shown).
This method allows efficient, safe, reliable and automated detachment and separation of the protective film 2.
Fig. 6 and 7 show an exemplary embodiment of a semiconductor element 1 with a protective film 2. The semiconductor element 1 includes an optoelectronic semiconductor chip 3 having a plurality of pixels 33. At least one semiconductor chip 3 is circumferentially surrounded by a frame 33, as shown in top view. The frame 33 is formed, for example, directly on the semiconductor chip 3 and is manufactured, for example, by casting or injection molding or pressing. The semiconductor chip 3 preferably does not reach the component upper side 10, so that the component upper side 10 can be formed only by the frame 33.
For example, the protective film 2 is fastened to the element upper side 10 only at the two lateral sides 13 perpendicular to the longitudinal sides 11 by means of a strip-shaped adhesive 21. The length L of the longitudinal side 11 may be less than the length Q of the transverse side 13. For example, the length L is at least 5mm and/or at most 50mm. For example, the length Q is at least 8mm and/or at most 80mm. For example, the thickness B of the semiconductor component 1 between the component upper side 10 and the component lower side 14 is at least 0.5mm and/or at most 5mm, in particular 1mm to 2mm (inclusive).
The protective film 2 protrudes beyond the element upper side 10 only at the longitudinal sides 11 and is in addition set back relative to the element upper side 10, for example by at least 0.1mm and/or at most 1mm. At the longitudinal sides 11, the protective film 2 may be shaped as a symmetrical or asymmetrical trapezoid.
For example, the thickness T of the protective film 2 is at least 20 μm and/or at most 0.2mm, in particular 45 μm to 95 μm (inclusive). For example, the protective film 2 is made of polyamide. The overhang P of the protective film 2 beyond the element upper side 10 at the longitudinal side 11 is for example at least 0.4mm and/or at most 4mm. For example, the overhang P is equal to the thickness B of the semiconductor element, with a tolerance of at most 1.5 times or 1.2 times. Alternatively or additionally, the overhang P is equal to at least 2% or at least 5% and/or at most 25% or at most 15% of the length Q. The thickness of the adhesive 21 is, for example, at least 2 μm and/or at most 0.1mm.
The values mentioned in the preceding three paragraphs may be used alone, together or in any desired combination.
As shown in fig. 6 and 7, such a semiconductor element 1 together with a protective film 2 can be used in all other exemplary embodiments, in particular in the methods of fig. 1 to 5.
Fig. 8 to 13 show various configuration possibilities for the removal tool 4, which can be used in all exemplary embodiments.
Unlike the method of fig. 1 to 5, the removal tool 4 of fig. 8 to 13 is configured in each case as a plurality of parts, in particular as two parts. That is, the lever 44 is made up of, inter alia, a first part 43 and a second part 42, the parts 43, 42 being movable relative to each other. In this case, the first members 43 are respectively intended to face the protective film 2 to be removed.
According to fig. 8, the parts 43, 42 may be free of holes. As shown in cross-section, the second member 42 is configured in the form of a hook and defines the overall thickness of the rod 40. The second member 42 forms a lower edge 45 of the removal opening 44 and a bottom end 46 of the lever 40. The removal opening 44 forms an acute angle a of about 45 ° with the front side of the second part 42 at the lower edge 45, which front side is flush or approximately flush with the first part 43.
The first part 43 is movable parallel to the second part 42 in the intended direction of movement of the lever 40 in the method. In the method steps corresponding to fig. 1 to 3, the height H of the removal opening 44 is preferably at least 1.5 times and/or at most 3 times the thickness T of the protective film 2 for which the removal tool 4 is intended. This may also apply to all other exemplary embodiments.
In the method steps corresponding to fig. 4 and 5, the first part 43 is moved towards the lower edge 45, so that the protective film 2 to be removed is sandwiched between the parts 43, 42. In this case, the lower edge 45 is preferably a sharp edge to improve wedging or hooking of the protective film 2 with the rod 40.
In the exemplary embodiment of fig. 9, the removal opening 44 extends through both parts 43, 42, so that in the method steps corresponding to fig. 1 to 3 a continuous channel for the removal opening 44 is formed. In the method steps corresponding to fig. 4 and 5, the parts 43, 42 are displaced relative to each other, so that the protective film 2 can be clamped. In this case, an additional retaining effect can be achieved by the sharp edge of the second part 42 facing the bottom end 46 over the removal opening 44, which sharp edge is close to the first part 43.
Fig. 10 shows that the second part 42 can have a circular contour in the region of the removal opening 44. The risk of shearing off the protective film 2 due to the relative movement of the parts 42, 43 with respect to each other can thereby be reduced.
Fig. 10 also shows that the removal opening 44 may have two areas, in particular in the first part 43: the removal opening 44 extends steeper on the side facing the protective film 2 to be removed and becomes gentler toward the second member 42. This makes it possible to make the distance between the bottom end 46 and the removal opening 44 smaller on the side of the first member 43 facing the protective film 2 to be removed, compared to the removal opening 44 having a constant slope. This applies to all other exemplary embodiments.
Fig. 11 shows that the removal opening 44 may be wedge-shaped such that the removal opening 44 tapers in a direction towards the second part 42. Such a configuration is also possible in all other exemplary embodiments.
Fig. 11 also shows that in the open state of the removal tool 4 (i.e. in the method steps corresponding to fig. 1 to 3), the parts 42, 43 do not need to be flush at the bottom end 46. For example, the second member 42 protrudes beyond the first member 43 towards the bottom end 46 and vice versa. Such a displacement of the parts 42, 43 relative to each other may result in the protective film 2 automatically remaining in the removal opening 44 when the rod 40 is placed on the carrier 51 (not shown). Such a configuration is also possible in all other exemplary embodiments.
According to fig. 12, the second part 42 has a larger width than the first part 43, seen from a top view along the longitudinal side 11. This applies in particular to the configuration of the removal tool 4 according to fig. 9 to 11. In contrast, according to fig. 13, the parts 42, 43 are equally wide. This may be applied, for example, to a removal tool according to fig. 8. Thus, the removal opening 44 may extend entirely or primarily transversely across the components 42, 43.
Fig. 12 also shows that there may be one or more catch structures 41, in particular on the lower edge 46 of the removal opening 44. For example, the at least one capture structure 41 is formed by spikes or barbs. Such a configuration is also possible in all other exemplary embodiments.
The components shown in the figures preferably follow one another in the order shown, in particular directly following one another, unless otherwise specified. The non-contacting components in the figures are preferably at a distance from each other. When the lines shown are parallel to each other, the associated faces are preferably also oriented parallel to each other. Furthermore, unless otherwise indicated, the drawings are believed to properly reproduce the relative positions of the illustrated components with respect to one another.
The invention described herein is not limited by the description of the exemplary embodiments. Rather, the invention comprises any novel feature and any combination of features, which in particular comprises any combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or in the exemplary embodiments.
This patent application claims priority from german patent application 10 2020 129 064.0, the disclosure of which is incorporated herein by reference.
Description of the reference numerals
1. Semiconductor device with a semiconductor element having a plurality of electrodes
10. Upper side of element
11. Longitudinal side of the upper side of the element
12. Side of semiconductor element
13. Lateral sides of semiconductor element
14. The underside of the element
2. Protective film
21. Adhesive agent
3. Optoelectronic semiconductor chip
31. Pixel arrangement
33. Frame
4. Removal tool
40. Rod
41. Capturing structure
42. Second part of the lever
43. First part of the rod
44. Removing the opening
45. Lower edge of
46. Bottom end of the rod
51. Carrier body
52. Groove
53. Carrier frame
A angle of removal opening relative to semiconductor element
Thickness of semiconductor element without protective film
D distance of semiconductor element from carrier frame
H height of removal opening
Length of L semiconductor element on longitudinal side
Direction of movement of M removal tool
Overhang portion of P protective film
Length of Q semiconductor element on lateral side
Thickness of T-shaped protective film
Claims (15)
1. A method of removing a protective film (2) from a semiconductor element (1), the method having the steps of:
a) Providing the semiconductor element (1), the semiconductor element (1) having the protective film (2) on an element upper side (10), and
b) Separating the protective film (2) from the element upper side (10) by means of a removal tool (4) having a removal opening (44),
wherein, in step A), the protective film (2) protrudes beyond the element upper side (10) at the longitudinal side (11) as seen from the extension of the element upper side (10), and
wherein step B) comprises the sub-steps of:
b1 Guiding the removal tool (4) along the longitudinal side (11) adjacent to the semiconductor element (1) in a direction transverse to the element upper side (10) while the removal tool acts on the protective film (2) such that the protective film (2) is bent by the removal tool (4) in a direction towards the side (12) of the semiconductor element (1), and
b2 -retracting the removal tool (4) such that the protective film (2) is captured in the removal opening (44) and the protective film (2) is detached from the element upper side (10).
2. The method according to the preceding claim,
wherein in step A), the protective film (2) is fastened to the semiconductor element (1) by means of an adhesive (21), and
wherein the adhesive (21) is applied only along two mutually opposite lateral sides (13) of the element upper side (10).
3. The method according to any of the preceding claims,
wherein the removal opening (44) is formed by a groove extending along the longitudinal side (11), and
wherein the groove extends away from the element upper side (10) and towards the element lower side (14) at an angle of at least 30 ° and at most 60 °.
4. The method according to any of the preceding claims,
wherein an acute angle is present at a lower edge (45) of the removal opening (44), which lower edge is provided with at least one catch structure (41) adapted to penetrate into the protective film (2) in step B2).
5. The method according to any of the preceding claims,
wherein the stem (40) of the removal tool (4) is configured as one piece and mechanically rigid, the removal opening (44) being located in the stem.
6. A method according to any one of claims 1 to 4,
wherein the lever (40) of the removal tool (4) comprises two parts (42, 43) displaceable relative to each other,
wherein, in step B1), the removal opening (44) extends through both parts (42, 43) in a direction away from the element upper side (10), such that, in step B2), the protective film (2) is sandwiched between the parts (42, 43).
7. A method according to any one of claims 1 to 4,
wherein the lever (40) of the removal tool (4) comprises two parts (42, 43) displaceable relative to each other,
wherein in step B1) the removal opening (44) is formed by a distance between the parts (42, 43) parallel to the direction of movement (M) of the removal tool (4) in step B), and the removal opening (44) extends only partially through the rod (40), such that in step B2) the protective film (2) is sandwiched between the two parts (42, 43).
8. The method according to any of the preceding claims,
wherein in step a), seen in top view, the protective film (2) protrudes beyond the element upper side (10) only at the longitudinal sides (12), and is receded relative to the element upper side (10) at all other sides of the element upper side (10).
9. The method according to any of the preceding claims,
wherein the protective film (2) is composed of or comprises at least one of the following materials: polyamides, polyacrylates, polycarbonates.
10. The method according to any of the preceding claims,
wherein the ratio of the height (H) of the removal opening (44) to the thickness (T) of the protective film (2) is 1.2 to 4, inclusive.
11. The method according to any of the preceding claims,
wherein the ratio of the overhang (P) of the protective film (2) beyond the longitudinal side (11) to the thickness (B) of the semiconductor element (2) is 0.5 to 2 inclusive and/or the ratio of the overhang (P) to the thickness (T) of the protective film (2) is 10 to 50 inclusive.
12. The method according to one of the preceding claims, wherein
In step A), the semiconductor component (1) is provided in a manner mounted on a carrier (51) and a carrier frame (53) forming a recess (52) is positioned on the carrier (51),
-arranging the semiconductor element (1) in the recess (52), at the longitudinal side (11) at the height of the element upper side (10), a distance (D) between the semiconductor element (1) and the carrier frame (53) of 0.5mm to 5mm, inclusive, and
-in step B), guiding the removal tool (4) into the recess (52) between the semiconductor element (1) and the carrier frame (53).
13. A removal tool (4) for use in the method of one of the preceding claims, having a stem (40) in which the removal opening (44) is located, wherein
-the removal opening (44) extends to a bottom end (46) of the lever (40), and
-the length of the lever (40) is at least 20 times greater than the distance of the removal opening (44) from the bottom end (46).
14. A semiconductor component (1) for a method as claimed in one of claims 1 to 12, having
An optoelectronic semiconductor chip (3),
-a frame (53) extending completely circumferentially around the optoelectronic semiconductor chip (3) from a top view of the element upper side (10), and
-said protective film (2) fastened to said frame (33) and spaced apart from said optoelectronic semiconductor chip (3),
wherein, seen from the extension of the element upper side (10), the protective film (2) protrudes beyond the element upper side (10) at a longitudinal side (11), so that, seen from a top view of the element upper side (10), the semiconductor element (1) is delimited by the protective film (2) at the longitudinal side (11).
15. Semiconductor element (1) according to the preceding claim,
wherein the optoelectronic semiconductor chip (3) has a plurality of pixel (31) elements and is adapted to generate light.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102020129064.0 | 2020-11-04 | ||
| DE102020129064.0A DE102020129064B4 (en) | 2020-11-04 | 2020-11-04 | PULLING METHOD AND PULLING TOOL |
| PCT/EP2021/077384 WO2022096209A1 (en) | 2020-11-04 | 2021-10-05 | Removal method, removal tool and semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116457927A true CN116457927A (en) | 2023-07-18 |
Family
ID=78080339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180074440.XA Pending CN116457927A (en) | 2020-11-04 | 2021-10-05 | Removing method, removing tool and semiconductor element |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230402300A1 (en) |
| JP (1) | JP2023547046A (en) |
| CN (1) | CN116457927A (en) |
| DE (1) | DE102020129064B4 (en) |
| WO (1) | WO2022096209A1 (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3532553C1 (en) | 1985-09-12 | 1987-03-12 | Loehr & Herrmann Gmbh | Method and device for removing the protective film from a printed circuit board coated with exposed photoresist |
| JP2001345368A (en) | 2000-05-31 | 2001-12-14 | Fujitsu Ltd | Method and apparatus for releasing and conveying semiconductor chip |
| KR100383265B1 (en) * | 2001-01-17 | 2003-05-09 | 삼성전자주식회사 | Semiconductor processing apparatus to remove wafer protection tape |
| JP4266106B2 (en) * | 2001-09-27 | 2009-05-20 | 株式会社東芝 | Adhesive tape peeling device, adhesive tape peeling method, semiconductor chip pickup device, semiconductor chip pickup method, and semiconductor device manufacturing method |
| DE10230034B4 (en) | 2002-07-04 | 2006-10-12 | Daimlerchrysler Ag | Method and device for the automated application of paint film on body parts and automated designed paint film composite |
| JP4326519B2 (en) * | 2005-03-31 | 2009-09-09 | 日東電工株式会社 | Protective tape peeling method and apparatus using the same |
| JP5305604B2 (en) | 2007-03-16 | 2013-10-02 | 株式会社東芝 | Adhesive film peeling apparatus and liquid crystal panel manufacturing method |
| US20090208725A1 (en) | 2008-01-25 | 2009-08-20 | Bailey Robert J | Layer transfer for large area inorganic foils |
| JP4740297B2 (en) * | 2008-09-04 | 2011-08-03 | リンテック株式会社 | MOUNTING DEVICE AND MOUNTING METHOD |
| ITBO20120581A1 (en) | 2012-10-25 | 2014-04-26 | Marchesini Group Spa | METHOD TO REMOVE THE SEALING FILM FROM A CONTAINER AND A DEVICE THAT ACTIVATES THIS METHOD |
| WO2014083695A1 (en) | 2012-11-30 | 2014-06-05 | 株式会社安川電機 | Robotic system |
| US20140238617A1 (en) * | 2013-02-28 | 2014-08-28 | General Electric Company | System and method for removal of a layer |
| JP2019041051A (en) | 2017-08-28 | 2019-03-14 | 日東電工株式会社 | Adhesive tape peeling method and adhesive tape peeling device |
-
2020
- 2020-11-04 DE DE102020129064.0A patent/DE102020129064B4/en active Active
-
2021
- 2021-10-05 WO PCT/EP2021/077384 patent/WO2022096209A1/en active Application Filing
- 2021-10-05 CN CN202180074440.XA patent/CN116457927A/en active Pending
- 2021-10-05 JP JP2023521150A patent/JP2023547046A/en active Pending
- 2021-10-05 US US18/033,651 patent/US20230402300A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023547046A (en) | 2023-11-09 |
| DE102020129064A1 (en) | 2022-05-05 |
| US20230402300A1 (en) | 2023-12-14 |
| DE102020129064B4 (en) | 2023-10-12 |
| WO2022096209A1 (en) | 2022-05-12 |
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