JP2007317811A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
JP2007317811A
JP2007317811A JP2006144791A JP2006144791A JP2007317811A JP 2007317811 A JP2007317811 A JP 2007317811A JP 2006144791 A JP2006144791 A JP 2006144791A JP 2006144791 A JP2006144791 A JP 2006144791A JP 2007317811 A JP2007317811 A JP 2007317811A
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Prior art keywords
emitting device
resin
phosphor sheet
light
recess
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JP2006144791A
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Kazunari Kuzuhara
一功 葛原
Takanori Akeda
孝典 明田
Shigenari Takami
茂成 高見
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Priority to JP2006144791A priority Critical patent/JP2007317811A/en
Publication of JP2007317811A publication Critical patent/JP2007317811A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device for preventing emission characteristics from deteriorating due to the sagging or crawling of resin. <P>SOLUTION: The light-emitting device has a package 1 having a recess 11 that is open in a rectangular shape on a surface, wherein an LED chip 2 is mounted into the recess 11 and a phosphor sheet 3 is provided so that the recess 11 is covered. In the light-emitting device, a step part 12 is provided at the open edge of the recess 11, the peripheral part of the phosphor sheet 3 is placed on the bottom surface of the step part 12 and is stuck via resin, and a reservoir 13 for accumulating the surplus of resin is provided at the corner of the rectangular section while the step part 12 is expanded outward. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本願発明は、パッケージにLEDチップ及び蛍光体が搭載された発光装置に関するものである。   The present invention relates to a light emitting device in which an LED chip and a phosphor are mounted on a package.

従来から、特開2005−244075号公報(特許文献1)に示されるように、パッケージにLEDチップ及び蛍光体シートが搭載された発光装置は知られている。この発光装置は図4に示すように、パッケージ91の凹部93底面にはLEDチップ92が搭載されており、凹部93周縁には段部94が設けられている。この段部94には固着樹脂を介して蛍光体シート95が固着されている。   Conventionally, as disclosed in Japanese Patent Application Laid-Open No. 2005-244075 (Patent Document 1), a light emitting device in which an LED chip and a phosphor sheet are mounted on a package is known. As shown in FIG. 4, the LED 91 is mounted on the bottom surface of the recess 93 of the package 91, and a step 94 is provided on the periphery of the recess 93. A phosphor sheet 95 is fixed to the stepped portion 94 via a fixing resin.

したがって、蛍光体シート95は、段部94に載置された状態で段部94の側面に保持されるため、ずれることなく段部94に固着される。
特開2005−244075号公報
Therefore, since the phosphor sheet 95 is held on the side surface of the step portion 94 while being placed on the step portion 94, the phosphor sheet 95 is fixed to the step portion 94 without being displaced.
JP-A-2005-244075

一方、最近、LEDチップ92の高輝度化に伴う大型化が進んでおり、大型化したチップへの応力の緩和のため、封止樹脂は比較的粘度の低いものを用いる必要がある。ただし、固着樹脂においても、封止樹脂と同じ粘度の低い樹脂を用いる場合は、固着力が充分ではないため、固着樹脂の塗布量を多くする必要がある。   On the other hand, the LED chip 92 has recently been increased in size with the increase in luminance, and it is necessary to use a sealing resin having a relatively low viscosity in order to relieve stress on the enlarged chip. However, also in the fixing resin, when a resin having the same viscosity as that of the sealing resin is used, the fixing force is not sufficient, so that it is necessary to increase the application amount of the fixing resin.

しかしながら、上記従来例である発光装置にあっては、特に、低粘度で多量の樹脂を段部に塗布した場合は、蛍光体シート95を載置することで、段部94に塗布された固着樹脂が、段部94から凹部93底面側へと垂れたり、段部94から凹部93の外側や蛍光体シート95の上面へと這い上がったりし、発光装置の発光特性が劣化するという問題が生じる。   However, in the conventional light emitting device, in particular, when a large amount of resin having a low viscosity is applied to the stepped portion, the phosphor sheet 95 is placed so that the fixing applied to the stepped portion 94 is performed. The resin hangs down from the step portion 94 to the bottom surface side of the recess 93, or rises from the step portion 94 to the outside of the recess portion 93 or the upper surface of the phosphor sheet 95, causing a problem that the light emission characteristics of the light emitting device deteriorate.

本願発明は、上記背景技術に鑑みて発明されたものであり、その課題は、樹脂の垂れや這い上がりによる発光特性の劣化を防いだ発光装置を提供することである。   The present invention has been invented in view of the above-described background art, and an object thereof is to provide a light-emitting device that prevents deterioration of light-emitting characteristics due to dripping or creeping up of a resin.

上記課題を解決するために、本願請求項1記載の発明では、表面に矩形に開口した凹部を有するパッケージを備え、凹部内にはLEDチップが搭載され、凹部を覆うように蛍光体シートが設けられた発光装置であって、凹部の開口縁には段部が設けられており、蛍光体シートは、その周縁部分が樹脂を介して段部の底面に載置されて固着されており、前記矩形の角部分には、段部が外方へ膨らんだ形状で前記樹脂の余剰分が溜まる溜まり部が設けられていることを特徴としている。   In order to solve the above-mentioned problems, the invention according to claim 1 of the present application includes a package having a concave portion opened in a rectangular shape on the surface, an LED chip is mounted in the concave portion, and a phosphor sheet is provided so as to cover the concave portion. A step portion is provided at the opening edge of the concave portion, and the phosphor sheet has its peripheral portion placed on and fixed to the bottom surface of the step portion via resin, The corner portion of the rectangle is characterized in that a reservoir portion is provided in which the step portion swells outward and the excess of the resin is accumulated.

又、本願請求項2記載の発明では、上記請求項1記載の検知器において、蛍光体シートの周縁部分が載置される段部の底面は、凹部の中心側から外方に向かって段部が深くなるように傾いていることを特徴としている。   Further, in the invention according to claim 2 of the present application, in the detector according to claim 1, the bottom surface of the step portion on which the peripheral portion of the phosphor sheet is placed has a step portion outward from the center side of the recess. It is characterized by being inclined to become deeper.

本願請求項1記載の発光装置においては、矩形に開口した凹部の周縁において最も樹脂の溜まり易い角部分に溜まり部が設けられている。したがって、段部に塗布された余剰分の樹脂は溜まり部へと逃げるため、段部から凹部底面側へと垂れたり、段部から凹部の外側や蛍光体シートの上面へと這い上がったりして、発光装置の発光特性が劣化するのを防ぐことができる。又、溜まり部は、矩形の角部分に設けられており、蛍光体シートは段部の底面に載置して固着されるため、蛍光体シートは段部の側面に規制させることで保持され、ずれることなく固着させることができる。   In the light emitting device according to the first aspect of the present invention, the reservoir portion is provided at the corner portion where the resin is most likely to accumulate at the periphery of the rectangular recess. Therefore, because the excess resin applied to the stepped part escapes to the pooled part, it hangs down from the stepped part to the bottom of the concave part, or crawls up from the stepped part to the outside of the concave part or the top surface of the phosphor sheet, It is possible to prevent the light emission characteristics of the light emitting device from deteriorating. In addition, the reservoir portion is provided at the corner of the rectangle, and the phosphor sheet is mounted and fixed on the bottom surface of the stepped portion, so that the phosphor sheet is held by restricting the side surface of the stepped portion, It can be fixed without shifting.

又、本願請求項2記載の発光装置においては、段部の底面は凹部の中心側から外方に向かって段部が深くなるように傾いているため、段部に塗布された樹脂は段部の外方側に集まり易くなる。したがって、余剰分の樹脂は、より段部から垂れにくくなると共に、溜まり部へと逃がし易くすることができる。   In the light emitting device according to claim 2, since the bottom surface of the step portion is inclined so that the step portion becomes deeper outward from the center side of the recess portion, the resin applied to the step portion is the step portion. It will be easier to gather on the outside side of. Therefore, the excess resin is more difficult to sag from the stepped portion and can be easily released to the pooled portion.

図1、2は、本願請求項1、2に対応した一実施形態である発光装置を示している。この発光装置は、表面に矩形に開口した凹部11を有するパッケージ1を備え、凹部11内にはLEDチップ2が搭載され、凹部11を覆うように蛍光体シート3が設けられた発光装置であって、凹部11の開口縁には段部12が設けられており、蛍光体シート3は、その周縁部分が固着樹脂5を介して段部12の底面に載置されて固着されており、凹部11の角部分には、段部12が外方へ膨らんだ形状で固着樹脂5の余剰分が溜まる溜まり部13が設けられている。又、蛍光体シート3の周縁部分が載置される段部12の底面は、凹部11の中心側から外方に向かって段部12が深くなるように傾いている。   1 and 2 show a light emitting device according to an embodiment corresponding to claims 1 and 2 of the present application. This light-emitting device is a light-emitting device including a package 1 having a concave portion 11 having a rectangular opening on the surface, an LED chip 2 mounted in the concave portion 11, and a phosphor sheet 3 provided so as to cover the concave portion 11. A step portion 12 is provided at the opening edge of the concave portion 11, and the phosphor sheet 3 has its peripheral portion mounted on and fixed to the bottom surface of the step portion 12 via the fixing resin 5. The corner portion 11 is provided with a reservoir portion 13 in which the stepped portion 12 bulges outward and the excess of the fixing resin 5 is accumulated. Further, the bottom surface of the step portion 12 on which the peripheral portion of the phosphor sheet 3 is placed is inclined so that the step portion 12 becomes deeper outward from the center side of the concave portion 11.

以下、この実施形態の発光装置を、より具体的詳細に説明する。図1、2に示すように、この発光装置のパッケージ1は、セラミックス等からなる5〜8mm角程度の直方体形状であり、矩形に開口した凹部11を有している。この凹部11の周縁には段部12が形成されており、凹部11の四つの角部分には段部12が外方へ膨らんだ形状で樹脂の余剰分が溜まる溜まり部13が設けられている。又、段部12は中心側から外方に向かって深くなるように段部12底面が傾いて設けられている。なお、図2は図1のA−A断面図であり、溜まり部の断面図は示していないが、溜まり部においても外方に向かって深くなるように底面が傾いていてもよい。又、凹部11の中心側は、段部12からさらに深く円形に開口しており、下方に向かうほどこの開口が狭くなっている。   Hereinafter, the light-emitting device of this embodiment will be described in more detail. As shown in FIGS. 1 and 2, the package 1 of the light emitting device has a rectangular parallelepiped shape of about 5 to 8 mm square made of ceramics or the like, and has a concave portion 11 opened in a rectangular shape. Steps 12 are formed at the peripheral edge of the recess 11, and reservoirs 13 are provided at the four corners of the recess 11 in which the step 12 is swelled outward and where excess resin is stored. . Further, the bottom surface of the step portion 12 is inclined so that the step portion 12 becomes deeper outward from the center side. 2 is a cross-sectional view taken along the line AA of FIG. 1 and does not show a cross-sectional view of the pool portion, but the bottom surface of the pool portion may be inclined so as to become deeper outward. Moreover, the center side of the recessed part 11 is opened in a circular shape deeper than the step part 12, and this opening becomes narrower as it goes downward.

凹部11の底面は、チップ接続用電極等が設けられた実装面14となっており、この実装面14にLEDチップ2が実装されている。LEDチップ2は、例えば青色光を照射する窒化ガリウム系の半導体化合物材料(GaN、InGaN)により形成されており、実装面14には、このようなLEDチップ2を複数設けていてもよい。又、実装されるLEDチップ2は、エポキシ樹脂やシリコーン樹脂等の低粘度で透明な封止樹脂4で封止されている。   The bottom surface of the recess 11 is a mounting surface 14 provided with chip connection electrodes and the like, and the LED chip 2 is mounted on the mounting surface 14. The LED chip 2 is formed of, for example, a gallium nitride-based semiconductor compound material (GaN, InGaN) that emits blue light, and a plurality of such LED chips 2 may be provided on the mounting surface 14. The LED chip 2 to be mounted is sealed with a low-viscosity transparent sealing resin 4 such as an epoxy resin or a silicone resin.

又、この発光装置は、蛍光体粒子が混合された樹脂やガラス基板等で形成された蛍光体シート3を備えており、例えば、LEDチップ2から出射される青色光の一部が蛍光体シート3によって黄色光に変換されることで、発光装置からは白色光が照射される。この蛍光体シート3の裏面31は凹凸加工されており、裏面31における周縁部分が、あらかじめ固着樹脂5が塗布された段部12底面に載置されるように固着される。又、ここで用いられる蛍光体シート3の厚みは0.5mm程度であるが、特にこの厚さに限定されるものではない。なお、固着樹脂5は封止樹脂4と同じ材料からなる低粘度の樹脂を用いている。   The light emitting device also includes a phosphor sheet 3 formed of a resin mixed with phosphor particles, a glass substrate, or the like. For example, a part of blue light emitted from the LED chip 2 is phosphor sheet. By being converted into yellow light by 3, white light is emitted from the light emitting device. The back surface 31 of the phosphor sheet 3 is processed to be uneven, and the peripheral portion of the back surface 31 is fixed so as to be placed on the bottom surface of the step portion 12 to which the fixing resin 5 has been applied in advance. Moreover, although the thickness of the fluorescent substance sheet 3 used here is about 0.5 mm, it is not specifically limited to this thickness. The fixing resin 5 is a low-viscosity resin made of the same material as the sealing resin 4.

次に、この発光装置の製造工程について説明する。まず、LEDチップ2を実装面14に設けられたチップ接続用電極等と接続させることで実装面14に実装する。そして、実装したLEDチップ2を封止樹脂4で封止すると共に、段部12の底面に固着樹脂5を塗布する。なお、固着樹脂5は封止樹脂4と同じ材料かなる低粘度の樹脂であるため、固着力を補うため多量に塗布される。最後に、固着樹脂5が塗布された段部12に、蛍光体シート3を載置させ、固着樹脂5及び封止樹脂4を熱硬化させる。なお、蛍光体シート3を載置する際、固着樹脂5の余剰分は、蛍光体シート3に押し出されて、凹部11の角部分に設けられた溜まり部13に溜まるようになっている。   Next, the manufacturing process of this light emitting device will be described. First, the LED chip 2 is mounted on the mounting surface 14 by being connected to a chip connection electrode or the like provided on the mounting surface 14. Then, the mounted LED chip 2 is sealed with the sealing resin 4, and the fixing resin 5 is applied to the bottom surface of the stepped portion 12. Since the fixing resin 5 is a low-viscosity resin made of the same material as the sealing resin 4, it is applied in a large amount to supplement the fixing force. Finally, the phosphor sheet 3 is placed on the step portion 12 to which the fixing resin 5 is applied, and the fixing resin 5 and the sealing resin 4 are thermally cured. When the phosphor sheet 3 is placed, the surplus of the fixing resin 5 is pushed out by the phosphor sheet 3 and accumulated in the reservoir portion 13 provided at the corner portion of the recess 11.

したがって、この実施形態の発光装置においては、矩形に開口した凹部11の周縁において最も固着樹脂5の溜まり易い角部分に溜まり部13が設けられている。よって、段部12に多量の固着樹脂5が塗布されたとしても、余剰分の固着樹脂5は溜まり部13へと逃げるため、段部12から凹部11底面側へと垂れたり、段部12から凹部11の外側や蛍光体シート3の上面へと這い上がったりして、発光装置の発光特性が劣化するのを防ぐことができる。   Therefore, in the light emitting device of this embodiment, the reservoir portion 13 is provided at the corner portion where the fixing resin 5 is most likely to accumulate at the periphery of the concave portion 11 opened in a rectangular shape. Therefore, even if a large amount of the fixing resin 5 is applied to the step portion 12, the surplus fixing resin 5 escapes to the pool portion 13, so that it drops from the step portion 12 toward the bottom surface of the recess 11, or from the step portion 12. It is possible to prevent the light emission characteristics of the light emitting device from being deteriorated by climbing to the outside of the recess 11 or the upper surface of the phosphor sheet 3.

又、段部12の底面は凹部11の中心側から外方に向かって段部12が深くなるように傾いているため、段部12に塗布された固着樹脂5は段部12の外方側に集まり易くなる。したがって、余剰分の固着樹脂5は、より段部12から垂れにくくなると共に、溜まり部13へと逃がし易くすることができる。   Further, since the bottom surface of the step portion 12 is inclined so that the step portion 12 becomes deeper outward from the center side of the concave portion 11, the fixing resin 5 applied to the step portion 12 is on the outer side of the step portion 12. It's easy to get together. Therefore, the excess fixing resin 5 is more difficult to drip from the stepped portion 12 and can be easily released to the pool portion 13.

又、溜まり部13は、矩形の角部分に設けられており、蛍光体シート3は段部12の底面に載置して固着されるため、蛍光体シート3は段部12の側面に規制されることで保持され、ずれることなく固着させることができる。又、蛍光体シート3の裏面31には凹凸加工が施されているため、蛍光体シート3の接着面積が増え、より強く段部12に固着させることができる。   Further, the reservoir portion 13 is provided at the corner of the rectangle, and the phosphor sheet 3 is placed and fixed on the bottom surface of the step portion 12, so that the phosphor sheet 3 is restricted to the side surface of the step portion 12. And can be fixed without shifting. Moreover, since the uneven | corrugated process is given to the back surface 31 of the fluorescent substance sheet 3, the adhesion area of the fluorescent substance sheet 3 increases and it can adhere to the step part 12 more strongly.

又、封止樹脂4は低粘度な樹脂を用いているため、LEDチップ2への応力の影響を抑えることができる。したがって、比較的大型のLEDチップ2を封止する場合においても、LEDチップ2が剥れるといった問題が生じることなく有効に封止することができる。更に、固着樹脂5は封止樹脂4と同じ材料の樹脂を用いているため、封止樹脂4と同工程で塗布することができ、生産工程を短縮することができる。   Moreover, since the sealing resin 4 uses a low-viscosity resin, the influence of stress on the LED chip 2 can be suppressed. Therefore, even when a relatively large LED chip 2 is sealed, the LED chip 2 can be effectively sealed without causing a problem that the LED chip 2 is peeled off. Furthermore, since the fixing resin 5 is made of the same material as that of the sealing resin 4, it can be applied in the same process as the sealing resin 4, and the production process can be shortened.

なお、図3に示す別の実施形態である発光装置は、封止樹脂の代わりに、LEDチップ2と蛍光体シート3との間に集光用のレンズ6が設けられている。   In addition, the light-emitting device which is another embodiment shown in FIG. 3 is provided with the condensing lens 6 between the LED chip 2 and the phosphor sheet 3 instead of the sealing resin.

本願発明の第一の実施形態である発光装置を示す上面図。The top view which shows the light-emitting device which is 1st embodiment of this invention. 同発光装置を示す断面図。Sectional drawing which shows the light-emitting device. 別の実施形態である発光装置を示す断面図。Sectional drawing which shows the light-emitting device which is another embodiment. 従来例である発光装置を示す断面図。Sectional drawing which shows the light-emitting device which is a prior art example.

符号の説明Explanation of symbols

1 パッケージ
・ 凹部
・ 段部
・ 溜まり部
2 LEDチップ
3 蛍光体シート
1 Package, Recess, Step, Reservoir 2 LED chip 3 Phosphor sheet

Claims (2)

表面に矩形に開口した凹部を有するパッケージを備え、凹部内にはLEDチップが搭載され、凹部を覆うように蛍光体シートが設けられた発光装置であって、凹部の開口縁には段部が設けられており、蛍光体シートは、その周縁部分が樹脂を介して段部の底面に載置されて固着されており、前記矩形の角部分には、段部が外方へ膨らんだ形状で前記樹脂の余剰分が溜まる溜まり部が設けられていることを特徴とする発光装置。   A light-emitting device that includes a package having a rectangular opening on the surface, in which an LED chip is mounted and a phosphor sheet is provided so as to cover the depression, and a step is provided at the opening edge of the depression The phosphor sheet has a peripheral portion placed on and fixed to the bottom surface of the step portion via resin, and the rectangular corner portion has a shape in which the step portion bulges outward. A light emitting device characterized in that a reservoir for storing an excess of the resin is provided. 蛍光体シートの周縁部分が載置される段部の底面は、凹部の中心側から外方に向かって段部が深くなるように傾いていることを特徴とする請求項1記載の発光装置。   The light emitting device according to claim 1, wherein the bottom surface of the step portion on which the peripheral portion of the phosphor sheet is placed is inclined so that the step portion becomes deeper outward from the center side of the recess.
JP2006144791A 2006-05-25 2006-05-25 Light-emitting device Pending JP2007317811A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
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CN102097573A (en) * 2010-12-03 2011-06-15 东莞市胤腾光电科技有限公司 High-power light emitting diode (LED) bracket and method for packaging LEDs by using same
JP2016212148A (en) * 2015-04-30 2016-12-15 三和電気工業株式会社 Optical connector ferrule
JP2017201688A (en) * 2016-04-28 2017-11-09 日亜化学工業株式会社 Light emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2016212148A (en) * 2015-04-30 2016-12-15 三和電気工業株式会社 Optical connector ferrule
JP2017201688A (en) * 2016-04-28 2017-11-09 日亜化学工業株式会社 Light emitting device

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