CN116442405A - Multi-wire cutting device - Google Patents

Multi-wire cutting device Download PDF

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Publication number
CN116442405A
CN116442405A CN202310447292.2A CN202310447292A CN116442405A CN 116442405 A CN116442405 A CN 116442405A CN 202310447292 A CN202310447292 A CN 202310447292A CN 116442405 A CN116442405 A CN 116442405A
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CN
China
Prior art keywords
workpiece
unit
cutting
vertical direction
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310447292.2A
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Chinese (zh)
Inventor
贺云鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Material Technology Co Ltd
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Filing date
Publication date
Application filed by Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Material Technology Co Ltd
Priority to CN202310447292.2A priority Critical patent/CN116442405A/en
Publication of CN116442405A publication Critical patent/CN116442405A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

The invention provides a multi-wire cutting device, comprising: the cutting line assembly comprises a cutting line, a driving groove shaft and a driven groove shaft which are arranged at intervals, and the cutting line is wound between the driving groove shaft and the driven groove shaft and forms an upper cutting line net and a lower cutting line net; the processing table is positioned above the upper cutting line net in the vertical direction and can move along the vertical direction so that the cutting line cuts the workpiece; a gesture definition assembly, comprising: a work support unit; the linear slide rail unit extends along the vertical direction, and the workpiece support unit is slidably arranged on the linear slide rail unit; the control unit is connected with the linear slide rail unit and used for controlling sliding parameters of the workpiece supporting unit along the linear slide rail unit so that the workpiece supporting unit supports a workpiece in a workpiece cutting process and keeps the workpiece in a preset posture. The multi-wire cutting device provided by the invention can solve the problem of wire breakage risk or wire mark defect caused by contact or extrusion of the silicon chips on the cutting wires.

Description

Multi-wire cutting device
Technical Field
The invention relates to the technical field of display, in particular to a multi-wire cutting device.
Background
The silicon wafer processing technology mainly adopts multi-wire cutting, the cutting effect of multi-wire cutting is good, and the application is wider. The multi-wire cutting is an advanced slicing processing technology, and the principle is that cutting wires are formed into steel wire meshes with different intervals through a group of grooved wheels, abrasive materials are brought into a processing area of a material to be cut for cutting through high-speed reciprocating motion of the cutting wires, and a workpiece to be cut is fed in the vertical direction through lifting of a processing table, so that the workpiece is cut into a plurality of thin slices with required size and shape.
In the multi-wire cutting process, when the steel wire reciprocates at a high speed, the silicon rod is slowly lowered by the processing table to be contacted with the wire for cutting. In the related art, a multi-wire saw is configured to perform a multi-wire cutting process by fixing a silicon rod to a striking work table and lowering the work table without changing the horizontal position. In order to improve the production benefit, the groove spacing on the grooved pulley can be reduced by selecting smaller line diameter and mortar particle diameter, so that more silicon wafers can be produced under the same input silicon rod length.
However, when the slot pitch is reduced, the distance between the silicon wafers is reduced synchronously, and the distance between the silicon wafers is reduced, so that the gap through which the steel wire can pass is reduced, in addition, when the silicon rod is processed to a position closer to the end, the connecting point between the silicon wafers is further and further away from the starting position, the swinging range of the silicon wafers is larger and larger relative to the silicon wafers, so that the gap between the silicon wafers is possibly extremely small, the relative contact probability and the contact area between the steel wire and the silicon wafers are increased while the gap is reduced, the resistance when the steel wire advances is relatively increased, and the probability of wire breakage is increased, namely, the resistance is increased.
In addition, the steel wire needs to be pulled out of the workpiece after the cutting process is finished, and if gaps among silicon wafers are too small during pulling, the defect that the wire mark exists in the cutting effect of the steel wire can be caused. In addition, during the machining process, if the adhesion angle of the two sides of the workpiece conforms to the lattice structure, the workpiece is easily broken, and therefore, when the mortar is brought into the workpiece by the steel wire during cutting, the impact generated may cause the two sides of the material to be easily broken.
Disclosure of Invention
The embodiment of the invention provides a multi-wire cutting device which can solve the problem that a cutting wire in the related art is broken at risk or is defective due to contact or extrusion of silicon wafers.
The technical scheme provided by the embodiment of the invention is as follows:
a multi-wire cutting apparatus comprising:
the cutting line assembly comprises a cutting line, a driving groove shaft and a driven groove shaft which are arranged at intervals, wherein the cutting line is wound between the driving groove shaft and the driven groove shaft and forms an upper cutting line net and a lower cutting line net;
a processing table for loading a workpiece, the processing table being located above the upper wire grid in a vertical direction and the processing table being movable in the vertical direction to cause the wire to cut the workpiece;
a pose defining assembly for defining a pose of the workpiece during cutting of the workpiece, the pose defining assembly comprising:
a workpiece support unit for supporting the workpiece;
the linear slide rail unit extends along the vertical direction, and the workpiece support unit is slidably arranged on the linear slide rail unit; a kind of electronic device with high-pressure air-conditioning system
The control unit is connected with the linear slide rail unit and is used for controlling sliding parameters of the workpiece supporting unit along the linear slide rail unit so that the workpiece supporting unit supports the workpiece in the workpiece cutting process and keeps the workpiece in a preset posture.
Illustratively, the workpiece support unit includes: the first support roller and the second support roller are arranged at intervals in the horizontal direction, are positioned between the driving groove shaft and the driven groove shaft in the horizontal direction, and can be respectively supported on two opposite sides of the workpiece in the horizontal direction.
Illustratively, the axial direction of the first support roller and the second support roller is consistent with the axial direction of the driving groove shaft and the driven groove shaft, and the lengths of the workpiece in the axial direction of the first support roller and the second support roller are less than or equal to the axial lengths of the first support roller and the second support roller.
Illustratively, the linear slide unit includes: the first sliding rail and the second sliding rail are arranged at intervals in the horizontal direction, the first sliding rail and the second sliding rail are parallel to each other and extend along the vertical direction, the first supporting roller is slidably arranged on the first sliding rail, and the second supporting roller is slidably arranged on the second sliding rail.
Illustratively, the distance D between the first slide rail and the second slide rail in the horizontal direction satisfies the following relationship:
D≤1/4R V wherein R is V Is the width of the workpiece in the horizontal direction.
The workpiece support unit includes an initial position and an end position in the vertical direction, the initial position is a position of the workpiece support unit when the workpiece is at a cutting start position, the end position is a position of the workpiece support unit when the workpiece is at a cutting end position, a distance between the initial position and the upper cutting wire mesh in the vertical direction is H, and a value range of H is (0-1/4×rh), wherein Rh is a height of the workpiece in the vertical direction.
Illustratively, the control unit includes:
the pressure sensor is arranged on the workpiece supporting unit and is used for sensing the current supporting force provided by the workpiece supporting unit to the workpiece; a kind of electronic device with high-pressure air-conditioning system
And the controller is electrically connected with the pressure sensor and is used for controlling the sliding parameters of the workpiece supporting unit along the linear slide rail unit according to the current supporting force so that the workpiece supporting unit supports the workpiece with a preset supporting force in the workpiece cutting process, wherein the sliding parameters comprise at least one of a sliding direction and a sliding speed.
The controller is specifically configured to determine whether a relative distance Y1 between a current position of the workpiece support unit and the initial position in the vertical direction is greater than 0;
if yes, setting the current motion parameter of the processing table as the sliding parameter of the workpiece supporting unit when the current supporting force value is within the threshold value of the preset supporting force; when the current supporting force value exceeds the threshold value of the preset supporting force, according to the difference value between the current supporting force and the preset supporting force, calculating a sliding speed compensation value, and obtaining the sliding parameter according to the speed compensation value and the current motion parameter of the processing table;
if not, the workpiece supporting unit is controlled to be in the initial position and kept fixed and not to move.
Illustratively, the relative distance Y1 satisfies the following relationship: y1=y-H, where Y is the distance in the vertical direction between the upper wire cutting net and the end position, and H is the distance in the vertical direction between the initial position and the upper wire cutting net.
Illustratively, the pressure sensor is disposed at a connection position of the workpiece support unit and the linear slide unit.
The embodiment of the invention has the following beneficial effects:
in the above scheme, the gesture limiting assembly is arranged in the multi-wire cutting device to limit the gesture of the workpiece in the cutting process, specifically, the control unit and the linear sliding rail unit can enable the workpiece supporting unit to move along with the workpiece in the vertical direction, so that the workpiece can be effectively supported in the whole workpiece cutting process, the workpiece is kept in the preset gesture, the distance between the silicon wafers in the whole cutting process can be kept unchanged, line mark defects and line breakage phenomena caused by the extrusion cutting line of the silicon wafers can be reduced, meanwhile, the breakage phenomenon caused by the impact of mortar on two sides of the workpiece can be reduced, and the stability of the quality of the cut silicon wafers is improved.
Drawings
Fig. 1 shows a side view of a multi-wire cutting apparatus according to an embodiment of the present invention;
fig. 2 is a front view of a structure of a multi-wire saw according to an embodiment of the present invention;
fig. 3 is a front view of a structure of a multi-wire cutting apparatus according to an embodiment of the present invention;
fig. 4 shows a front view of a structure of a multi-wire saw according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present invention fall within the protection scope of the present invention.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Before describing in detail the multi-wire saw apparatus provided by the embodiments of the present invention, the following description is necessary for the related art:
in the related art, in order to improve production benefits, the groove spacing on the grooved pulley is reduced by selecting smaller wire diameter and mortar particle size in the multi-wire cutting device, so that more silicon wafers can be produced under the same length of the input silicon rod. However, after the groove distance is reduced, the distance between the silicon wafers is synchronously reduced, and then the cutting lines are in line breakage risk or line mark defect generation due to contact or extrusion of the silicon wafers.
However, the reduced slot pitch results in synchronous reduction of the distance between the silicon wafers, and the reduced distance between the silicon wafers results in smaller gap through which the steel wire can pass. In addition, when the silicon rod is processed to a position closer to the end, the joint point between the silicon wafers is farther from the starting position, the swingable range of the relative silicon wafers is larger, so that the gap between the silicon wafers is possibly extremely small, the relative contact probability of the steel wire and the silicon wafers is improved while the gap is reduced, the contact area is also improved, the resistance when the steel wire advances is relatively improved, and the probability of broken wires is improved due to the increase of the resistance. In addition, the steel wire needs to be pulled out of the workpiece after the cutting process is finished, and if gaps among silicon wafers are too small during pulling, the defect that the wire mark exists in the cutting effect of the steel wire can be caused. In addition, during the machining process, if the adhesion angle of the two sides of the workpiece conforms to the lattice structure, the workpiece is easily broken, and therefore, when the mortar is brought into the workpiece by the steel wire during cutting, the impact generated may cause the two sides of the material to be easily broken.
In order to solve the above problems, an embodiment of the present invention provides a multi-wire cutting device, which can solve the problem in the related art that a cutting wire is at risk of breaking or is defective due to contact or extrusion of silicon wafers.
As shown in fig. 1 to 3, the multi-wire cutting apparatus provided by the embodiment of the present invention includes:
a cutting wire assembly comprising a cutting wire 100, and a driving slot shaft 110 and a driven slot shaft 120 which are arranged at intervals, wherein the cutting wire 100 is wound between the driving slot shaft 110 and the driven slot shaft 120, and forms an upper cutting wire net 100a and a lower cutting wire net 100b;
a processing table 200 for loading a workpiece 10, the processing table 200 being located above the upper wire cutting net 100a in a vertical direction, and the processing table 200 being movable in the vertical direction Y so that the wire cutting line 100 cuts the workpiece 10;
an attitude defining assembly 300 for defining an attitude of the workpiece 10 during cutting of the workpiece 10;
wherein the attitude defining assembly 300 includes:
a workpiece support unit 310 for supporting the workpiece 10;
a linear slide unit 320, the linear slide unit 320 extending in the vertical direction Y, the workpiece support unit 310 being slidably disposed on the linear slide unit 320; a kind of electronic device with high-pressure air-conditioning system
And a control unit 330 connected to the linear guide unit 320, for controlling sliding parameters of the workpiece support unit 310 along the linear guide unit 320, so that the workpiece support unit 310 supports the workpiece 10 and maintains the workpiece 10 in a predetermined posture during the cutting of the workpiece 10.
In the above scheme, the gesture limiting assembly 300 is arranged in the multi-wire cutting device to limit the gesture of the workpiece 10 in the cutting process, so as to keep the workpiece 10 in a preset gesture, so that the distance between the silicon wafers in the whole cutting process can be kept unchanged between the workpiece 10 and the completion of cutting, thereby reducing the line mark defect and the line breakage phenomenon caused by the extrusion of the silicon wafers by the cutting line 100, reducing the breakage phenomenon caused by the impact of mortar on two sides of the workpiece 10, and further improving the stability of the quality of the cut silicon wafers.
Specifically, the control unit and the linear slide unit 320 may cause the workpiece support unit 310 to move as the workpiece 10 travels in the vertical direction Y, and thus may function to effectively support the workpiece 10 throughout the cutting process of the workpiece 10 to maintain the workpiece 10 in the predetermined posture.
As illustrated in fig. 1 to 2, the processing table 200 includes a feed shaft 210, a work plate 220, and the like, wherein the feed shaft 210 is used to drive the work plate 220 to move in the vertical direction Y, and a workpiece 10 may be loaded under the work plate 220.
In some exemplary embodiments, as shown in fig. 1 to 3, the workpiece support unit 310 includes: the first support roller 311 and the second support roller 312 are disposed at intervals in the horizontal direction X, and the first support roller 311 and the second support roller 312 are located between the driving slot shaft 110 and the driven slot shaft 120 in the horizontal direction X and can be respectively supported on opposite sides of the workpiece 10 in the horizontal direction X.
In the above-mentioned aspect, the workpiece support unit 310 may be composed of two support rollers disposed in parallel at a spaced interval, and the two support rollers may be supported at opposite sides of the workpiece 10, respectively, as shown in fig. 1 to 3, since the lower side edge of the workpiece 10 first contacts the cutting line 100 to complete the cutting, the first support roller 311 and the second support roller 312 may be supported at opposite side positions of the lower side edge below the workpiece 10. The support effect is stable, the workpiece 10 can be effectively supported, and the cutting operation is not affected.
It should be understood that the specific structure of the workpiece support unit 310 is not limited thereto, and the workpiece support unit 310 may be formed of one support or more than two supports, for example.
Further, in some exemplary embodiments, as shown in fig. 1 to 3, the axial directions of the first support roller 311 and the second support roller 312 coincide with the axial directions of the driving groove shaft 110 and the driven groove shaft 120, and the lengths of the workpiece 10 in the axial directions of the first support roller 311 and the second support roller 312 are less than or equal to the axial lengths of the first support roller 311 and the second support roller 312.
The axial directions of the driving slot shaft 110 and the driven slot shaft 120 are perpendicular to the vertical direction Y and the horizontal direction X.
Since the workpiece 10 includes a start end and an end in the axial direction, when the workpiece 10 is cut, for example, a silicon rod, and the silicon rod is processed to be closer to the end, the joint point between the silicon wafers is further from the start position, the swingable range of the silicon wafers is larger and larger, so that the gap between the silicon wafers is possibly extremely small, the contact probability between the cutting line 100 and the silicon wafers is improved while the gap is reduced, the contact area is also improved, the resistance of the steel wire when advancing is improved, and the probability of broken wire is improved due to the increase of the resistance.
Therefore, in the above-mentioned solution, the axial directions of the first support roller 311 and the second support roller 312 are consistent with the axial directions of the driving slot shaft 110 and the driven slot shaft 120, and the axial lengths of the first support roller 311 and the second support roller 312 are greater than or equal to the axial length of the workpiece 10, so that the workpiece support unit 310 can completely support the workpiece 10 in the axial direction, thereby avoiding the occurrence of the problems such as swinging of the workpiece 10, and further avoiding the phenomena of wire breakage and wire mark caused by too small gaps between silicon wafers.
Further, in some exemplary embodiments, as shown in fig. 1 to 3, the linear guide unit 320 includes: the first sliding rail 321 and the second sliding rail 322 are arranged at intervals in the horizontal direction X, the first sliding rail 321 and the second sliding rail 322 are parallel to each other and extend along the vertical direction Y, the first supporting roller 311 is slidably arranged on the first sliding rail 321, and the second supporting roller 312 is slidably arranged on the second sliding rail 322.
In the above-mentioned scheme, the specific structures of the first sliding rail 321 and the second sliding rail 322 are not limited, as long as the first supporting roller 311 and the second supporting roller 312 slide on the corresponding sliding rails, respectively.
Further, in some exemplary embodiments, as shown in fig. 4, the distance D between the first sliding rail 321 and the second sliding rail 322 in the horizontal direction X satisfies the following relationship: d is less than or equal to 1/4R V Wherein R is V Is the width of the workpiece 10 in the horizontal direction X.
By adopting the above scheme, the workpiece supporting unit 310 can effectively support the workpiece 10, and the cutting operation of the workpiece 10 is not affected.
Further, in some exemplary embodiments, as shown in fig. 3 and 4, the top end position of the moving track of the linear slide assembly may be a position where the upper wire cutting net 100a is located, and the bottom end position may be a position where Rh mm is moved downward in the vertical direction Y, where Rh is a height of the workpiece 10 in the vertical direction Y.
The workpiece supporting unit 310 includes an initial position and an end position in the vertical direction Y, where the initial position is a position of the workpiece supporting unit 310 when the workpiece 10 is at a cutting start position, and the end position is a position of the workpiece supporting unit 310 when the workpiece 10 is at a cutting end position, where in the vertical direction Y, a distance between the initial position and the upper cutting wire net 100a is H, and a value range of H is (0-1/4×rh) mm, where Rh is a height of the workpiece 10 in the vertical direction Y.
Further, as illustrated in fig. 1 and 2, the control unit includes:
a pressure sensor 331 disposed on the workpiece support unit 310, for sensing a current supporting force provided by the workpiece support unit 310 to the workpiece 10; a kind of electronic device with high-pressure air-conditioning system
And a controller electrically connected to the pressure sensor 331, for controlling a sliding parameter of the workpiece support unit 310 along the linear guide unit 320 according to the current supporting force, so that the workpiece support unit 310 supports the workpiece 10 with a predetermined supporting force during the cutting of the workpiece 10, wherein the sliding parameter includes at least one of a sliding direction and a sliding speed.
Illustratively, the controller is specifically configured to determine whether a relative distance Y1 between the current position of the workpiece support unit 310 and the initial position in the vertical direction Y is greater than 0;
if yes, setting the current motion parameter of the processing table 200 as the sliding parameter of the workpiece supporting unit 310 when the current supporting force value is within the threshold value of the predetermined supporting force; when the current supporting force value exceeds the threshold value of the preset supporting force, calculating a sliding speed compensation value according to the difference value of the current supporting force and the preset supporting force, and obtaining the sliding parameter according to the speed compensation value and the current motion parameter of the processing table 200;
if not, the workpiece support unit 310 is controlled to be at the initial position and kept fixed.
Illustratively, the relative distance Y1 satisfies the following relationship: y1=y-H, where Y is the distance in the vertical direction Y between the upper wire cutting net 100a and the end position, and H is the distance in the vertical direction Y between the initial position and the upper wire cutting net.
In the above-mentioned scheme, the horizontal position where the upper wire cutting net 100a is located is taken as zero point, and the downward striking distance of the workpiece 10 is Y, when the workpiece 10 moves to a certain cutting position, the distance y1=y-H between the workpiece supporting unit 310 and the upper wire cutting net 100a in the vertical direction is obtained, so when Y1 is greater than zero point, the workpiece supporting unit 310 may move downward according to the moving speed set by the striking axis of the processing table 200, and when Y1 is less than zero point, the workpiece supporting unit 310 may be fixed at the initial position where H is from the upper wire cutting net 100 a.
Illustratively, the pressure sensor 331 is disposed at a connection position of the workpiece support unit 310 and the linear guide unit 320.
Further, in some embodiments, the first support roller 311 and the second support roller 312 may be configured to include: the metal inner core and the rubber layer wrapping the surface of the metal inner core.
The following points need to be described:
(1) The drawings of the embodiments of the present invention relate only to the structures related to the embodiments of the present invention, and other structures may refer to the general designs.
(2) In the drawings for describing embodiments of the present invention, the thickness of layers or regions is exaggerated or reduced for clarity, i.e., the drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) The embodiments of the invention and the features of the embodiments can be combined with each other to give new embodiments without conflict.
The present invention is not limited to the above embodiments, but the scope of the invention is defined by the claims.

Claims (10)

1. A multi-wire cutting apparatus comprising:
the cutting line assembly comprises a cutting line, a driving groove shaft and a driven groove shaft which are arranged at intervals, wherein the cutting line is wound between the driving groove shaft and the driven groove shaft and forms an upper cutting line net and a lower cutting line net;
a processing table for loading a workpiece, the processing table being located above the upper wire grid in a vertical direction and the processing table being movable in the vertical direction to cause the wire to cut the workpiece; the multi-wire cutting device is characterized by further comprising:
a pose defining assembly for defining a pose of the workpiece during cutting of the workpiece, the pose defining assembly comprising:
a workpiece support unit for supporting the workpiece;
the linear slide rail unit extends along the vertical direction, and the workpiece support unit is slidably arranged on the linear slide rail unit; a kind of electronic device with high-pressure air-conditioning system
The control unit is connected with the linear slide rail unit and is used for controlling sliding parameters of the workpiece supporting unit along the linear slide rail unit so that the workpiece supporting unit supports the workpiece in the workpiece cutting process and keeps the workpiece in a preset posture.
2. The multi-wire cutting apparatus of claim 1 wherein,
the work support unit includes: the first support roller and the second support roller are arranged at intervals in the horizontal direction, are positioned between the driving groove shaft and the driven groove shaft in the horizontal direction, and can be respectively supported on two opposite sides of the workpiece in the horizontal direction.
3. The multi-wire cutting apparatus of claim 2 wherein,
the axial directions of the first support roller and the second support roller are consistent with the axial directions of the driving groove shaft and the driven groove shaft, and the lengths of the workpiece in the axial directions of the first support roller and the second support roller are smaller than or equal to the axial lengths of the first support roller and the second support roller.
4. The multi-wire cutting apparatus of claim 2 wherein,
the linear slide rail unit includes: the first sliding rail and the second sliding rail are arranged at intervals in the horizontal direction, the first sliding rail and the second sliding rail are parallel to each other and extend along the vertical direction, the first supporting roller is slidably arranged on the first sliding rail, and the second supporting roller is slidably arranged on the second sliding rail.
5. The multi-wire cutting apparatus of claim 4 wherein,
the distance D between the first sliding rail and the second sliding rail in the horizontal direction meets the following relationship:
D≤1/4R V wherein R is V Is the width of the workpiece in the horizontal direction.
6. The multi-wire cutting apparatus of claim 4 wherein,
the workpiece supporting unit comprises an initial position and a tail end position in the vertical direction, wherein the initial position is the position of the workpiece supporting unit when the workpiece is at a cutting initial position, the tail end position is the position of the workpiece supporting unit when the workpiece is at a cutting end position, the distance between the initial position and the upper cutting wire net in the vertical direction is H, the value range of H is (0-1/4 x Rh), and Rh is the height of the workpiece in the vertical direction.
7. The multi-wire cutting apparatus of claim 6 wherein,
the control unit includes:
the pressure sensor is arranged on the workpiece supporting unit and is used for sensing the current supporting force provided by the workpiece supporting unit to the workpiece; a kind of electronic device with high-pressure air-conditioning system
And the controller is electrically connected with the pressure sensor and is used for controlling the sliding parameters of the workpiece supporting unit along the linear slide rail unit according to the current supporting force so that the workpiece supporting unit supports the workpiece with a preset supporting force in the workpiece cutting process, wherein the sliding parameters comprise at least one of a sliding direction and a sliding speed.
8. The multi-wire cutting apparatus of claim 7 wherein,
the controller is specifically configured to determine whether a relative distance Y1 between a current position of the workpiece support unit and the initial position in the vertical direction is greater than 0;
if yes, setting the current motion parameter of the processing table as the sliding parameter of the workpiece supporting unit when the current supporting force value is within the threshold value of the preset supporting force; when the current supporting force value exceeds the threshold value of the preset supporting force, calculating a sliding speed compensation value according to the difference value of the current supporting force and the preset supporting force, and obtaining the sliding parameter according to the speed compensation value and the current motion parameter of the processing table;
if not, the workpiece supporting unit is controlled to be in the initial position and kept fixed and not to move.
9. The multi-wire cutting apparatus of claim 7 wherein,
the relative distance Y1 satisfies the following relationship: y1=y-H, where Y is a distance in the vertical direction between the upper wire cutting net and the end position of the workpiece support unit, and H is a distance in the vertical direction between the initial position and the upper wire cutting net.
10. The multi-wire cutting apparatus of claim 7 wherein,
the pressure sensor is arranged at the connecting position of the workpiece supporting unit and the linear slide rail unit.
CN202310447292.2A 2023-04-24 2023-04-24 Multi-wire cutting device Pending CN116442405A (en)

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CN202310447292.2A CN116442405A (en) 2023-04-24 2023-04-24 Multi-wire cutting device

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Application Number Priority Date Filing Date Title
CN202310447292.2A CN116442405A (en) 2023-04-24 2023-04-24 Multi-wire cutting device

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CN116442405A true CN116442405A (en) 2023-07-18

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