CN116393846B - Laser cutting method and system for optical device - Google Patents
Laser cutting method and system for optical device Download PDFInfo
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- CN116393846B CN116393846B CN202310673069.XA CN202310673069A CN116393846B CN 116393846 B CN116393846 B CN 116393846B CN 202310673069 A CN202310673069 A CN 202310673069A CN 116393846 B CN116393846 B CN 116393846B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 178
- 238000003698 laser cutting Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000005520 cutting process Methods 0.000 claims abstract description 150
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- 239000002609 medium Substances 0.000 description 97
- 206010041662 Splinter Diseases 0.000 description 8
- 230000008569 process Effects 0.000 description 6
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention provides a laser cutting method and a laser cutting system for an optical device, and relates to the technical field of optical device processing. The laser cutting method comprises the following steps: immersing an optical device to be cut in a cutting auxiliary medium, wherein the difference between the refractive index of the cutting auxiliary medium and the refractive index of the optical device is not more than 5%; reducing the temperature of the cutting auxiliary medium to reduce the fluidity of the cutting auxiliary medium; applying laser to the optical device and cutting along a preset cutting path to form a modified region on the optical device; raising the temperature of the cutting auxiliary medium; the optical device is removed. And immersing the optical device to be cut into a cutting auxiliary medium for laser cutting, so that the laser forms a light wire inside the optical device, and the curved surface cutting of the optical device is realized. After the cutting is finished, the temperature of the cutting auxiliary medium is increased, the temperature of the optical device is changed from low to high, high-quality crack extension and splitting of the optical device can be realized, and the film layer on the surface of the optical device is not easy to damage.
Description
Technical Field
The invention relates to the technical field of optical device processing, in particular to a laser cutting method and a laser cutting system for an optical device.
Background
Optical lenses often require secondary processing to meet size and shape requirements due to manufacturing imperfections and diversified usage requirements. At present, a core extractor and an edge grinder are adopted in industry to carry out secondary processing on the optical lens so as to remove redundant materials of the optical lens, the processing efficiency is extremely low, the operation is complex, and the mass processing is difficult to carry out efficiently. In addition, in the polishing process, abrasive particles are directly in mechanical contact with the optical lens material, micro cracks exist on the surface layer of the optical lens after the polishing process is completed, and when the optical lens is used in extreme environments such as large temperature difference and frequent vibration, the optical lens has great potential safety hazard.
The laser wire-cutting glass is an extremely popular field at present, ultra-fast laser is mostly adopted as a light source, a lens group is utilized for modulating a light path, and multi-focus cutting, long deep focus cutting and the like are realized on the surface or inside of the glass. At present, in order to compress the total length of an optical system or realize a more excellent imaging effect, a lens is often designed into a hyperboloid shape (such as a biconvex lens) with curvature on both surfaces, and the application of laser wire cutting in the field of optical devices has a main difficulty in that an optical curved surface of the optical lens deflects laser wire, so that laser light cannot propagate along an original path after passing through the optical curved surface of the optical lens, and is difficult to form a light wire inside the optical lens.
Secondly, after the optical lens is cut by using laser wire-forming, residual stress exists in the optical lens, so that the optical lens cannot be separated along a joint after the cutting is finished, and mechanical external forces such as knocking and bending or high-power CO are required to be applied 2 The laser beam carries out auxiliary measures such as local high-temperature heating or whole hot bath along the cutting track, so that cracks at the cutting joint are unfolded, and the splinter is realized. However, when mechanical stress is applied to assist the splitting, edge breakage occurs at the edge of the cut surface, the thermal expansion coefficient of the optical lens is deformed by adopting high-temperature heating to assist the splitting, the film layer on the optical lens is easy to damage, and if the temperature control of the assist splitting is not good, edge breakage occurs at the edge of the cut surface, and even the whole glass breaks.
Therefore, how to avoid the influence of the lens on the laser wire forming, realize the cutting of the curved surface and realize the high-quality crack extension without damaging the lens film layer is the technical problem to be solved by the invention.
The matters in the background section are only those known to the inventors and do not, of course, represent prior art in the field.
Disclosure of Invention
In view of one or more of the drawbacks of the prior art, the present invention provides a laser cutting method for an optical device, comprising:
immersing an optical device to be diced in a dicing aid medium, wherein the refractive index of the dicing aid medium differs from the refractive index of the optical device by no more than 5%;
reducing the temperature of the cutting auxiliary medium to reduce the flowability of the cutting auxiliary medium;
applying laser to the optical device and cutting along a preset cutting path to form a modified region on the optical device;
raising the temperature of the cutting auxiliary medium; and
and taking out the optical device.
According to one aspect of the invention, the step of immersing the optical device to be cut in a cutting auxiliary medium comprises:
injecting the cutting auxiliary medium into a vessel;
placing the optical device to be cut into the vessel;
the dicing aid medium is trimmed so that it passes over the optical device to be diced.
According to one aspect of the invention, the step of reducing the temperature of the cutting auxiliary medium is performed by a freezing jig.
According to one aspect of the invention, the step of reducing the temperature of the cutting auxiliary medium is performed after the cutting auxiliary medium forms a natural horizontal plane.
According to one aspect of the invention, the step of immersing the optical device to be cut in a cutting auxiliary medium comprises: such that the surface of the cutting auxiliary medium is no more than 1mm above the distance of the optical device.
According to one aspect of the invention, the step of reducing the temperature of the cutting auxiliary medium comprises: the temperature of the cutting auxiliary medium is reduced to between the pour point and the congealing point or the temperature of the cutting auxiliary medium is reduced below the congealing point.
According to one aspect of the invention, the step of applying laser light to the optical device and cutting along a predetermined cutting path comprises:
forming a light wire inside the optical device by ultra-fast laser generated by a laser;
the laser is moved or the optics are moved to cut along a preset cutting path.
According to one aspect of the invention, the modified region includes a plurality of modified micro-channels located on the cutting path with micro-cracks therebetween.
According to one aspect of the invention, the laser cutting method further comprises modulating the cutting auxiliary medium such that the refractive index of the cutting auxiliary medium coincides with the refractive index of the optical device.
According to one aspect of the invention, the optical device is a hyperboloid optical lens.
According to one aspect of the invention, the vessel is a metal vessel.
The present invention also provides a laser cutting system for an optical device, comprising:
a vessel adapted to hold an optical device to be cut and a cutting auxiliary medium;
the laser cutting device is configured to generate ultrafast laser according to preset parameters, and when the ultrafast laser acts on the optical device, the ultrafast laser forms a modified area on the optical device; and
a temperature adjustment device configured to adjust a temperature of the cutting assistance medium in the vessel.
According to one aspect of the invention, the vessel is a metal vessel.
According to one aspect of the invention, the temperature regulating device comprises a freezing fixture configured to reduce the temperature of the cutting auxiliary medium to between the pour point and the congealing point or below the congealing point.
According to one aspect of the invention, the optical device is a hyperboloid optical lens.
According to one aspect of the invention, the laser cutting system is configured for implementing a laser cutting method as described above.
Compared with the prior art, the embodiment of the invention provides a laser cutting method and a laser cutting system for an optical device. The optical device to be cut is immersed in the auxiliary cutting medium for laser cutting, and the refractive index of the auxiliary cutting medium is consistent with that of the optical device, so that laser does not deviate when entering the optical device from the auxiliary cutting medium (namely, the laser propagates along the original path), and further the laser can form a light wire inside the optical device so as to form a modified area on the optical device, and curved surface cutting of the optical device can be realized. By reducing the temperature of the cutting auxiliary medium, the fluidity of the cutting auxiliary medium can be reduced, not only the optical device to be cut can be effectively fixed, but also the surface of the cutting auxiliary medium can be prevented from changing (waving) during the laser cutting process. The initial temperature of the optical device splinter can be reduced by reducing the temperature of the cutting auxiliary medium, the splinter temperature difference is increased, the temperature of the cutting auxiliary medium is increased after the cutting is finished, the temperature of the optical device is changed from low to high, the high-quality crack extension and splinter of the optical device can be realized, the edge of the section of the optical device is not easy to generate edge breakage, and the film layer on the surface of the optical device is not easy to damage.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 shows a flow chart of a laser cutting method of an optical device according to one embodiment of the invention;
FIG. 2 shows a schematic view of a vessel according to one embodiment of the invention;
FIG. 3 shows a schematic diagram of cutting optics by laser according to one embodiment of the invention;
FIG. 4 shows a schematic diagram of stress distribution near modified micro-channels in a laser cut optical device, according to one embodiment of the invention.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, and may be mechanically connected, electrically connected, or may communicate with each other, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The embodiments of the present invention will be described below with reference to the accompanying drawings, and it should be understood that the embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Fig. 1 shows a flowchart of a laser cutting method 100 of an optical device according to an embodiment of the present invention, and the laser cutting method 100 includes the following steps, which are described in detail below, respectively.
In step S110: the optical device to be cut is immersed in the cutting auxiliary medium.
The optical device may be an optical lens, which may be a hyperboloid optical lens (a lens having two curved surfaces, such as a biconvex lens, a biconcave lens, a meniscus lens, or the like), or a single-curved optical lens (a lens having one curved surface, such as a plano-concave lens, a plano-convex lens, or the like). In other embodiments, the optical device may also be other transparent devices (e.g., a prism).
The auxiliary cutting medium has fluidity at normal temperature, and the surface of the auxiliary cutting medium can form a natural horizontal plane after standing, so that when laser is incident into the auxiliary cutting medium, the laser cannot deviate and still propagate along the original path. The refractive index of the cutting auxiliary medium is basically consistent with that of the optical device, so that when laser is incident into the optical device from the cutting auxiliary medium, no matter the surface of the optical device is a curved surface or a plane, the laser cannot deflect, but propagates along the original path, and the ultrafast laser is beneficial to forming optical filaments in the optical device. The refractive index of the dicing aid preferably coincides with the refractive index of the optical device, but in practical applications, there may be a certain deviation of the refractive index of the dicing aid from the refractive index of the optical device, the allowable deviation range depending on the radius of curvature of the curved surface of the optical device to be diced, the smaller the radius of curvature of the curved surface of the optical device, the smaller the allowable deviation range, the larger the radius of curvature of the curved surface of the optical device, and the larger the allowable deviation range. According to one embodiment of the invention, the refractive index of the dicing aid medium differs from the refractive index of the optical device by no more than 5% (calculated as (refractive index of dicing aid medium-refractive index of optical device)/refractive index of optical device), preferably no more than 1%.
Fig. 2 shows a schematic view of a vessel 210 according to an embodiment of the invention, as shown in fig. 2, the vessel 210 being used for loading a cutting aid 400 and an optical device 300 to be cut, an opening being provided at the top of the vessel 210 for facilitating the picking and placing of the optical device. Preferably, the vessel 210 is a metal vessel so that the vessel 210 has good thermal conductivity.
In particular embodiments, as shown in fig. 2, the dicing aid 400 and the optical device 300 to be diced may be placed in the vessel 210, and then the dicing aid 400 is trimmed so that the dicing aid 400 is clear of the optical device 300 to be diced. Wherein the cutting auxiliary medium 400 may be injected into the vessel 210 first, and then the optical device 300 to be cut is put into the vessel 210; the optical device 300 to be cut may be placed in the vessel 210, and then the cutting auxiliary medium 400 may be injected into the vessel 210; the cutting assistance medium 400 and the optical device 300 to be cut may also be placed in the vessel 210 at the same time; the order in which the cutting assistance medium 400 and the optical device 300 to be cut are placed in the vessel 210 is not particularly limited in the present invention.
As shown in fig. 2, by fine-tuning the dicing auxiliary medium 400 so that the dicing auxiliary medium 400 is beyond the optical device 300 to be diced, the laser light can be made to enter the optical device 300 without being deflected, which is advantageous for the laser light to form a light filament inside the optical device 300. However, if the dicing aid 400 is too much over the optical device 300, the dicing aid 400 absorbs more laser energy during the laser dicing process, which is detrimental to the laser dicing optical device 300, and thus the height of the dicing aid 400 that is over the optical device 300 may be limited. Preferably, the surface of the dicing aid 400 is not more than 1mm above the optical device 300 to be diced. In trimming the cutting assistance medium 400, if the cutting assistance medium 400 has not yet passed the optics 300 to be cut, a pipetting tool (e.g., pipette, syringe, etc.) may be used to add the cutting assistance medium 400 to the vessel 210 so that the cutting assistance medium 400 has passed the optics 300 to be cut. If the surface of the cutting assistance medium 400 is too high above the optics 300 to be cut (e.g., more than 1 mm), a pipetting tool may be used to remove a portion of the cutting assistance medium 400 from the vessel 210.
In step S120: the temperature of the cutting auxiliary medium is reduced to reduce the fluidity of the cutting auxiliary medium.
The cutting auxiliary medium may be an oil product having a pour point and a congealing point, and is at least at a temperature above the congealing pointWhen the laser processing device is in a transparent state, the visible condition of laser processing can be met. The pour point and the condensation point are indexes of low-temperature fluidity of the oil product, the pour point is the lowest temperature at which the oil product can flow, the condensation point is the highest temperature at which the oil product loses fluidity, the pour point and the condensation point of the same oil product are not completely equal, and the pour point is higher than the condensation point under the general condition. In the present embodiment, the main component of the cleavage auxiliary medium is hydrogenated terphenyl (C 18 H 22 Also called as hydrogenated triphenyl), hydrogenated terphenyl is a heat carrier used in high temperature liquid phase, is a product of partial hydrogenation of terphenyl, has excellent heat conductivity and high temperature resistance, and can still keep lower surface tension at high temperature.
In a specific embodiment, the temperature of the cutting auxiliary medium may be reduced by using a freezing jig, which is one type of temperature adjusting device, and the cooling principle of the freezing jig may be compressed air cooling (temperature adjustment), or gas-liquid phase cooling (temperature adjustment) by using a refrigerant. In other embodiments, other temperature regulating devices may be used to reduce the temperature of the cutting assistance medium. When the temperature of the cutting auxiliary medium is lowered, the temperature of the cutting auxiliary medium may be lowered to a temperature between the pour point and the freezing point, or the temperature of the cutting auxiliary medium which is still in a transparent state at a temperature below the freezing point may be lowered to a temperature below the freezing point. Preferably, the temperature of the cutting auxiliary medium may be reduced after the cutting auxiliary medium forms a natural horizontal plane, so that the surface of the cutting auxiliary medium is a natural horizontal plane after losing fluidity, and deflection of the laser by the non-horizontal surface is avoided. Preferably, before the temperature of the cutting auxiliary medium is reduced, it may be checked whether the liquid level of the cutting auxiliary medium has passed the optics, in particular by manual checking or by using an instrument.
The cutting aid medium may be substantially lost in fluidity and maintained in a transparent state by reducing the temperature of the cutting aid medium to between the pour point and the congealing point, or by reducing the temperature of the cutting aid medium below the congealing point. The cutting auxiliary medium losing fluidity not only can play a role in fixing an optical device, but also can avoid the phenomenon that liquid loses the horizontal plane due to shaking caused by inertia due to acceleration and deceleration, rapid movement or machine vibration of a working platform in the subsequent laser cutting process.
In step S130, the optical device is acted on by laser light and cut along a preset cutting path to form a modified region on the optical device.
Fig. 3 shows a schematic diagram through laser cutting optics, as shown in fig. 3, where the laser may be generated by a laser cutting device 220, where the laser cutting device 220 may include a table 221, a laser 222, and a console (not shown in the figures), according to one embodiment of the invention. Wherein the laser 222 may be used to generate ultra-fast laser light, the stage may be used to manipulate the laser cutting apparatus 220, and the stage 221 may be used to mount a workpiece (optics) to be cut. In this embodiment, as shown in fig. 3, the freezing fixture 230 is fixedly disposed on the table 221 of the laser cutting apparatus 220, the vessel 210 may be fixed on the table 221 by the freezing fixture 230, and in particular, before the temperature of the cutting auxiliary medium 400 is lowered using the freezing fixture 230, the freezing medium 500 (e.g., water) may be disposed on the surface of the freezing fixture 230, so that the freezing fixture 230 solidifies (e.g., freezes) the freezing medium 500 when the temperature of the cutting auxiliary medium 400 is lowered, thereby fixing the vessel 210 on the table 221. In other embodiments, a freezing fixture may also be provided outside of the laser cutting apparatus 220, and after the temperature of the cutting auxiliary medium 400 is reduced below the pour point using the freezing fixture, the vessel 210 containing the cutting auxiliary medium 400 and the optics 300 may be transferred onto the table 221 and secured using the corresponding fixture.
As shown in fig. 3, a light wire may be formed inside the optical device 300 by the ultrafast laser generated by the laser 222, and cutting may be performed along a preset cutting path by moving the laser 222 or the optical device 300. Specifically, relevant parameters (such as power, frequency, speed, etc. of the laser) may be set at a laser control end (such as an operation console) of the laser cutting apparatus 220, so that the laser 222 generates and emits ultra-fast laser according to the relevant parameters, and a light wire is formed on a section of an optical path of the ultra-fast laser. By adjusting the height of the laser 222, the optical filaments can be transmitted through the optical device 300 to cover the entire thickness of the optical device 300, and laser cutting of the optical device 300 can be performed. The cutting path may be drawn at the laser control end of the cutting apparatus according to the processing requirements by moving the laser 222 or the stage 221 to cause the optical filament to traverse the cutting path to form a modified region on the optical device 300.
Fig. 4 shows a schematic diagram of stress distribution near modified micro-channels 310 in a laser cut optical device 300 according to one embodiment of the present invention, as shown in fig. 4, the optical device 300 leaves a modified region formed by a plurality of modified micro-channels 310 along the cutting path on the optical device 300 after the laser cutting, the modified micro-channels 310 are columnar holes with a caliber of about several micrometers covering the entire thickness of the optical device 300, compressive stress is formed around the modified micro-channels 310, and micro-cracks 320 are formed by the material located between the modified micro-channels 310 due to induced tensile stress (the induced tensile stress is caused by temperature changes on the optical device 300 when the optical device 300 is cut by the laser). When the laser cutting is performed, the center temperature of the optical fiber is as high as thousands of degrees, the optical fiber not only enables the optical device 300 to form the modified micro-channel 310, but also can accumulate a great amount of heat around the modified micro-channel 310, and the optical device 300 is in a low-temperature environment before the laser cutting, so that the heat and the cold meet, and the microcracks 320 generated by cutting in the low-temperature environment are deeper and more thorough than the microcracks 320 generated in the room-temperature environment, and are more beneficial to splitting.
In step S140, the temperature of the cutting auxiliary medium is increased.
In step S150, the optical device is taken out.
By increasing the temperature of the cutting auxiliary medium, the fluidity of the cutting auxiliary medium can be restored, and microcracks in the optical device can be further extended to realize splinters. In a specific embodiment, the temperature of the cutting auxiliary medium can be increased by using the freezing fixture, for example, the temperature of the freezing fixture is adjusted to room temperature, and the freezing fixture can be increased to room temperature in tens of seconds, so that the cutting auxiliary medium which is the heat conducting medium can quickly transfer the temperature to the optical device, and as the induced tensile stress exists near the modified micro-channel of the optical device, the residual stress of the modified area of the optical device is further expanded due to the temperature difference between the room temperature environment and the optical device, microcracks are further expanded, and the optical device splits are realized. It should be noted that, the expansion coefficient of the glass of the optical device becomes smaller along with the decrease of the temperature, so that the optical device is cracked and deformed in a low-temperature environment, the edge of the section of the optical device is not easy to collapse, and the film layer on the surface of the optical device is not easy to be damaged. In other embodiments, the temperature of the freezing fixture may be adjusted to other temperatures (e.g., 15 ℃, 40 ℃, 50 ℃, etc.) as long as the fluidity of the cutting auxiliary medium may be restored and/or the optics allowed to fracture. In some embodiments, other temperature regulating devices may or may not be used to raise the temperature of the cutting assistance medium, allowing the cutting assistance medium to naturally warm in a room temperature environment.
According to one embodiment of the invention, the laser cutting method 100 may further include modulating the cutting auxiliary medium such that the refractive index of the cutting auxiliary medium is consistent with the refractive index of the optical device. The main component of the auxiliary cutting medium is hydrogenated terphenyl, and the refractive index value of the auxiliary cutting medium can be changed by adjusting the content and/or the type of the trace component in the auxiliary cutting medium, so that the refractive index of the auxiliary cutting medium is consistent or basically consistent with that of the optical device, which is already a mature technology in the related art, and the embodiment will not be repeated.
The present invention also provides a laser cutting system for an optical device that can be used to implement the laser cutting method 100 described above. The laser cutting system includes a vessel 210, a laser cutting apparatus 220, and a temperature regulating device. Wherein, as shown in fig. 3, the vessel 210 is adapted to hold an optical device to be cut, which may be a hyperboloid optical lens, a single-curve optical lens, etc., and a cutting auxiliary medium; the refractive index of the dicing aid medium is substantially identical to the refractive index of the optical device. The laser cutting apparatus 220 is configured to generate an ultrafast laser according to preset parameters, and when the ultrafast laser acts on an optical device, a modified region can be formed on the optical device. The temperature adjustment device is configured to adjust the temperature of the cutting assistance medium in the vessel 210.
According to one embodiment of the present invention, as shown in FIG. 3, vessel 210 is a metal vessel that has good thermal conductivity and allows for faster cooling or heating of the cutting auxiliary medium therein.
According to one embodiment of the invention, as shown in fig. 3, the temperature regulating device comprises a freezing fixture 230, the freezing fixture 230 being configured to reduce the temperature of the cutting auxiliary medium to between the pour point and the congealing point or to below the congealing point. The freezing jig 230 may be cooled by compressed air or may be cooled by liquid-vapor phase change of a refrigerant.
Compared with the prior art, the embodiment of the invention provides a laser cutting method and a laser cutting system for an optical device. The optical device to be cut is immersed in the cutting auxiliary medium to carry out laser cutting, so that laser can form a light wire inside the optical device, and the curved surface cutting of the optical device can be realized. By reducing the temperature of the cutting auxiliary medium, the fluidity of the cutting auxiliary medium can be reduced, not only the optical device to be cut can be effectively fixed, but also the surface of the cutting auxiliary medium can be prevented from changing (waving) during the laser cutting process. The temperature of the auxiliary medium for cutting is reduced, the initial temperature of the optical device splinter is also reduced, the splinter temperature difference is increased, the temperature of the auxiliary medium for cutting is increased after the cutting is finished, the temperature of the optical device is reduced from low to high, the high-quality crack extension and splinter of the optical device can be realized, the edge of the section of the optical device is not easy to generate edge breakage, and the film layer on the surface of the optical device is not easy to be damaged.
Finally, it should be noted that: the foregoing description is only illustrative of the present invention and is not intended to be limiting, and although the present invention has been described in detail with reference to the foregoing illustrative embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. A method of laser dicing an optical device, comprising:
immersing an optical device to be diced in a dicing aid medium, wherein the refractive index of the dicing aid medium differs from the refractive index of the optical device by no more than 5%;
reducing the temperature of the cutting auxiliary medium to reduce the flowability of the cutting auxiliary medium;
applying laser to the optical device and cutting along a preset cutting path to form a modified region on the optical device, wherein the modified region comprises a plurality of modified micro-channels positioned on the cutting path, and microcracks are arranged among the modified micro-channels;
raising the temperature of the cutting auxiliary medium to further extend the microcracks; and
removing the optical device;
wherein the step of applying laser to the optical device and cutting along a predetermined cutting path includes:
forming a light wire inside the optical device by ultra-fast laser generated by a laser;
the laser is moved or the optics are moved to cut along a preset cutting path.
2. The laser cutting method according to claim 1, wherein the immersing the optical device to be cut in the cutting auxiliary medium comprises:
injecting the cutting auxiliary medium into a vessel;
placing the optical device to be cut into the vessel;
the dicing aid medium is trimmed so that it passes over the optical device to be diced.
3. The laser cutting method according to claim 1, wherein the step of lowering the temperature of the cutting auxiliary medium is performed by a freezing jig.
4. The laser cutting method according to claim 1, wherein the step of lowering the temperature of the cutting auxiliary medium is performed after the cutting auxiliary medium forms a natural horizontal plane.
5. The laser cutting method according to any one of claims 1-4, wherein the step of immersing the optical device to be cut in a cutting auxiliary medium comprises: such that the surface of the cutting auxiliary medium is no more than 1mm above the distance of the optical device.
6. The laser cutting method according to any one of claims 1-4, wherein the step of reducing the temperature of the cutting auxiliary medium comprises: the temperature of the cutting auxiliary medium is reduced to between the pour point and the congealing point or the temperature of the cutting auxiliary medium is reduced below the congealing point.
7. The laser cutting method of any of claims 1-4, wherein the laser cutting method further comprises modulating the cutting auxiliary medium such that a refractive index of the cutting auxiliary medium is consistent with a refractive index of the optical device.
8. The laser cutting method of any of claims 1-4, wherein the optical device is a hyperboloid optical lens.
9. The laser cutting method of claim 2, wherein the vessel is a metal vessel.
10. A laser cutting system for an optical device for performing the laser cutting method according to any one of claims 1-9, the laser cutting system comprising:
a vessel adapted to hold an optical device to be cut and a cutting auxiliary medium;
the laser cutting device is configured to generate ultrafast laser according to preset parameters, and when the ultrafast laser acts on the optical device, the ultrafast laser forms a modified area on the optical device; and
a temperature adjustment device configured to adjust a temperature of the cutting assistance medium in the vessel.
11. The laser cutting system of claim 10, wherein the vessel is a metal vessel.
12. The laser cutting system of claim 10, wherein the temperature adjustment device comprises a freezing fixture configured to reduce the temperature of the cutting auxiliary medium to between a pour point and a congeal point or below a congeal point.
13. The laser cutting system of claim 10, wherein the optic is a hyperboloid optic lens.
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