CN115432920A - Wetting splitting method for glass laser cutting - Google Patents
Wetting splitting method for glass laser cutting Download PDFInfo
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- CN115432920A CN115432920A CN202211310344.3A CN202211310344A CN115432920A CN 115432920 A CN115432920 A CN 115432920A CN 202211310344 A CN202211310344 A CN 202211310344A CN 115432920 A CN115432920 A CN 115432920A
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- Prior art keywords
- glass
- expansion
- laser
- cutting
- glass substrate
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
Abstract
The invention relates to the technical field of glass processing, in particular to a wetting splitting method for glass laser cutting. The method comprises the following steps: s1, laser cutting: planning a plurality of cutting tracks on a glass substrate, and cutting the glass substrate along the tracks by laser to obtain the glass substrate containing the quality-change kerfs; s2, soaking ultrasonic vibration: immersing the glass substrate containing the materialized kerf into expansion liquid, starting ultrasonic vibration to enable the glass waste outside the kerf to fall off, and meanwhile, enabling the expansion liquid to permeate into the kerf in the vibration; s3, heating expansion and splitting: and irradiating the joint seam in the expansion again by laser to ensure that the expansion liquid is heated and expanded in volume, and extruding the glass waste to cut the joint seam of the glass substrate to finish the splitting. For the small-expansion-coefficient glass cut by the laser, the liquid with the expansion coefficient larger than that of the small-expansion-coefficient glass is used for soaking the cutting seams, and the cutting seams of the glass base material are opened by means of the expansion of the liquid, so that the problem that the small-expansion-coefficient glass material is difficult to crack under the laser cutting is solved.
Description
Technical Field
The invention relates to the technical field of glass processing, in particular to a wetting splitting method for glass laser cutting.
Background
With the continuous promotion of glass processing technology, glass products gradually develop towards fine processing, and the applied field is wider and wider. Because the glass products need different glass shapes, and the semi-finished glass generally used for processing is in a whole block shape, the whole block of glass needs to be cut to be divided into glasses with different sizes and different shapes.
At present, the laser cutting process can reduce the damage to the cut surface of the glass, so the application of the laser to the glass cutting process is more and more. For ordinary glass, because the expansion coefficient is large, after laser irradiation cutting, a cutting seam is easy to expand rapidly to break, and the splitting operation is completed. However, in the case of glass having a small thermal expansion coefficient, such as quartz glass and high borosilicate glass, it is impossible to directly split the glass by a laser splitting machine after laser cutting, and therefore, how to solve the problem of splitting of the glass having a small thermal expansion coefficient after laser cutting has been studied.
Disclosure of Invention
The invention provides a wetting splitting method for glass laser cutting, and aims to solve the splitting problem of glass with small expansion coefficient.
The invention provides a wetting splitting method for glass laser cutting, which comprises the following steps:
s1, laser cutting: planning a plurality of cutting tracks on a glass substrate, and cutting the glass substrate along the tracks by laser to obtain the glass substrate containing the quality-change kerfs;
s2, soaking ultrasonic vibration: immersing the glass substrate containing the materialized kerf into expansion liquid, starting ultrasonic vibration to enable the glass waste outside the kerf to fall off, and meanwhile, enabling the expansion liquid to permeate into the kerf in the vibration;
s3, heating expansion and splitting: and irradiating the joint seam in the expansion again by laser to ensure that the expansion liquid is heated and expanded in volume, and extruding the glass waste to cut the joint seam of the glass substrate to finish the splitting.
As a further improvement of the invention, 1064nm infrared picosecond laser is adopted as the laser.
As a further improvement of the invention, the expansion liquid has a higher coefficient of thermal expansion than the glass substrate being processed.
As a further improvement of the invention, the glass substrate is quartz glass, high borosilicate glass or silica glass.
The beneficial effects of the invention are: for the small expansion coefficient glass cut by the laser, the joint cutting is soaked by the liquid with the expansion coefficient larger than that of the small expansion coefficient glass, the heated volume of the liquid is increased in the further laser irradiation, and the joint cutting of the glass base material is opened by means of the expansion of the liquid, so that the glass is separated, and the problem that the small expansion coefficient glass material is difficult to crack under the laser cutting is solved.
Drawings
FIG. 1 is a flow chart of a glass laser cutting wet splitting method of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the wetting splinter method for glass laser cutting of the invention comprises the following steps:
s1, laser cutting: a plurality of cutting tracks are planned on a glass substrate, and the glass substrate is cut along the tracks by laser to obtain the glass substrate containing the quality-change cutting seams.
In the track design process, the cutting track can be drawn on the corresponding drawing firstly, then the corresponding drawing is covered on the surface of the glass substrate, the laser travels on the glass substrate according to the track by capturing the cutting track on the drawing, and is focused in the glass through the pulse laser to generate 'explosion' to vitrify the glass and break down the glass substrate on the cutting track, so that all the glass substrates at the cutting track are vitrified, namely the intermolecular structure of the glass substrate at the cutting joint is changed.
S2, soaking ultrasonic vibration: and (3) immersing the glass substrate containing the joint seams into expansion liquid, starting ultrasonic vibration to enable the glass waste outside the joint seams to fall off, and meanwhile, enabling the expansion liquid to permeate into the joint seams in the vibration.
The whole soaking of glass substrate after the cutting is in the inflation liquid, because intermolecular force is little in the joint-cutting of materialization, the structure clearance between the molecule is also bigger than other regional glass substrate that are not materialized by the laser, consequently soak in-process inflation liquid and permeate into the joint-cutting more easily, in addition ultrasonic vibration effect, can let the inflation liquid molecule permeate the joint-cutting more fast, through can also bring out the glass waste in partial joint-cutting through vibrations, reach the effect of preliminary lobe of a leaf.
S3, heating expansion and splitting: and (3) irradiating the joint cutting in the expansion again by laser so as to heat the expansion liquid and expand the volume, extruding the glass waste material to cut the joint cutting of the glass substrate to finish the splitting. By utilizing the characteristic that the expansion liquid is easier to expand than the glass base material, under the same laser irradiation heating condition, the expansion liquid is easier to expand to increase the volume, and the expansion liquid acts on the glass cutting seam and applies force spreading to the periphery to the cutting seam, so that the cutting seam expands to form a crack, and the effect of splitting is achieved.
The laser used was a 1064nm infrared picosecond laser. The infrared picosecond laser with the wave band of 1064nm is adopted to cut the glass, so that the cutting efficiency is improved and the cost is reduced while the glass substrate is not damaged. If the laser with the wave band higher than 1064nm is adopted, the glass substrate is easy to be directly burnt and cracked, and the glass substrate cannot be cut; if the laser with the wave band lower than 1064nm, such as green light, ultraviolet laser, etc., is adopted, the cutting efficiency is very low, and the cost is high.
The expansion fluid has a coefficient of thermal expansion greater than that of the glass substrate being processed. The expansion liquid can be liquid containing water, the water can permeate into the cutting seams, the volume of the water is easier to increase than that of the glass when the water is heated, and even the water is a process of increasing the volume when the water is gasified.
The glass substrate is quartz glass, high borosilicate glass or silica glass. The process mainly aims at glass materials with small expansion coefficients, such as quartz glass and high borosilicate glass, and certainly common silica glass can be cracked by using the method, and the process can be realized by only selecting liquid with expansion coefficients larger than that of the silica glass.
The technological process includes soaking the glass base material with small expansion coefficient in water to make water penetrate into the cutting seam under the vibration of ultrasonic wave, and separating the glass with the water with expansion coefficient higher than that of the glass to be processed. The operation process is simple, the used materials are easy to obtain, the cost is low, and the problems that the laser cutting process is difficult to act and the expansion coefficient of the glass substrate is small are solved.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (4)
1. A wetting splinter method for glass laser cutting is characterized by comprising the following steps:
s1, laser cutting: planning a plurality of cutting tracks on a glass substrate, and cutting the glass substrate along the tracks by laser to obtain the glass substrate containing the quality-change kerfs;
s2, soaking ultrasonic vibration: immersing the glass substrate containing the materialized kerf into expansion liquid, starting ultrasonic vibration to enable the glass waste outside the kerf to fall off, and meanwhile, enabling the expansion liquid to permeate into the kerf in the vibration;
s3, heating expansion and splitting: and irradiating the joint seam in the expansion again by laser to ensure that the expansion liquid is heated and expanded in volume, and extruding the glass waste to cut the joint seam of the glass substrate to finish the splitting.
2. The glass laser cutting wet break method of claim 1, wherein the laser is a 1064nm infrared picosecond laser.
3. The glass laser cut wet break method of claim 1, wherein the expansion fluid has a coefficient of thermal expansion greater than the glass substrate being processed.
4. The glass laser cutting wetted split method of claim 1, wherein the glass substrate is quartz glass, borosilicate glass, or silica glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211310344.3A CN115432920A (en) | 2022-10-25 | 2022-10-25 | Wetting splitting method for glass laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211310344.3A CN115432920A (en) | 2022-10-25 | 2022-10-25 | Wetting splitting method for glass laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115432920A true CN115432920A (en) | 2022-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211310344.3A Pending CN115432920A (en) | 2022-10-25 | 2022-10-25 | Wetting splitting method for glass laser cutting |
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| CN (1) | CN115432920A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116393846A (en) * | 2023-06-08 | 2023-07-07 | 江西联创电子有限公司 | Laser cutting method and system for optical device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05185270A (en) * | 1992-01-16 | 1993-07-27 | Kosaka Kenkyusho:Kk | Cutting method for glass panel |
| CN1978121A (en) * | 2005-12-09 | 2007-06-13 | 富士迈半导体精密工业（上海）有限公司 | Laser cutting apparatus |
| CN101585655A (en) * | 2003-01-29 | 2009-11-25 | 三星宝石工业株式会社 | Substrate dividing apparatus and method for dividing substrate |
| CN111393019A (en) * | 2020-03-26 | 2020-07-10 | 深圳市青虹激光科技有限公司 | Glass cutting and splitting processing method and device |
| US20200381303A1 (en) * | 2019-05-31 | 2020-12-03 | Disco Corporation | Method of processing a workpiece and system for processing a workpiece |
| CN114163118A (en) * | 2021-12-01 | 2022-03-11 | 成都晶华光电科技股份有限公司 | Secondary laser splitting device for cutting optical glass |
-
2022
- 2022-10-25 CN CN202211310344.3A patent/CN115432920A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05185270A (en) * | 1992-01-16 | 1993-07-27 | Kosaka Kenkyusho:Kk | Cutting method for glass panel |
| CN101585655A (en) * | 2003-01-29 | 2009-11-25 | 三星宝石工业株式会社 | Substrate dividing apparatus and method for dividing substrate |
| CN1978121A (en) * | 2005-12-09 | 2007-06-13 | 富士迈半导体精密工业（上海）有限公司 | Laser cutting apparatus |
| US20200381303A1 (en) * | 2019-05-31 | 2020-12-03 | Disco Corporation | Method of processing a workpiece and system for processing a workpiece |
| CN111393019A (en) * | 2020-03-26 | 2020-07-10 | 深圳市青虹激光科技有限公司 | Glass cutting and splitting processing method and device |
| CN114163118A (en) * | 2021-12-01 | 2022-03-11 | 成都晶华光电科技股份有限公司 | Secondary laser splitting device for cutting optical glass |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116393846A (en) * | 2023-06-08 | 2023-07-07 | 江西联创电子有限公司 | Laser cutting method and system for optical device |
| CN116393846B (en) * | 2023-06-08 | 2023-10-03 | 江西联创电子有限公司 | Laser cutting method and system for optical device |
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