CN116367415A - PCB with reverse radium perforation structure and manufacturing method thereof - Google Patents
PCB with reverse radium perforation structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN116367415A CN116367415A CN202310323552.5A CN202310323552A CN116367415A CN 116367415 A CN116367415 A CN 116367415A CN 202310323552 A CN202310323552 A CN 202310323552A CN 116367415 A CN116367415 A CN 116367415A
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- China
- Prior art keywords
- board
- laser
- pcb
- daughter board
- copper layer
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Links
- 229910052705 radium Inorganic materials 0.000 title claims abstract description 25
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 83
- 229910052802 copper Inorganic materials 0.000 claims abstract description 57
- 239000010949 copper Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000011889 copper foil Substances 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 39
- 239000007788 liquid Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical group [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Abstract
The invention discloses a PCB with a reverse radium perforation structure and a manufacturing method thereof, and relates to the technical field of circuit boards, wherein the PCB comprises a sub-board, and the sub-board comprises a curing sheet and substrate copper layers connected to two sides of the curing sheet; the laser holes are arranged on the daughter board and penetrate through the copper layer and the curing sheet of the substrate at one side of the laser holes; an electroplated copper layer is arranged on the daughter board positioned at one side of the radium perforation; the circuit is etched on the electroplated copper layer; and a prepreg copper foil is connected to one side surface of the daughter board, which is positioned on the electroplated copper layer, in a pressing manner. The reverse laser hole structure of this application design need not radium perforation hole filling and electroplates, guarantees the thickness of electroplated layer and then has guaranteed to etch out meticulous circuit, has guaranteed PCB board quality.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a PCB with a reverse laser hole structure and a manufacturing method thereof.
Background
In recent years, the circuit board is developed towards a small and dense direction, and the through holes on the corresponding circuit board are also smaller and smaller, so that the high-density interconnection circuit board, namely the HDI board, is developed, most remarkable characteristics are that most mechanical drilling holes are replaced by laser drilling, but when laser perforation holes or laser holes of the multi-stage HDI board are formed on a BGA area bonding pad, hole filling electroplating is needed, and the laser perforation holes are filled with copper to smoothly perform hole stacking or prevent tin blowing during welding on the BGA bonding pad. Laser Kong Tiankong plating has limitations in that large and deep laser holes cannot be filled in the industry, and hole filling plating results in thick copper plating on the surface, and thicker copper plating cannot produce fine lines.
Disclosure of Invention
The invention aims to provide a PCB with a reverse radium perforation structure and a manufacturing method thereof, which are used for solving the problem that the manufacture of the PCB is affected due to the large thickness of an electroplated layer caused by laser Kong Tiankong electroplating in the prior art.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme:
a PCB board with a reverse radium perforation structure, comprising:
the daughter board comprises a curing sheet and substrate copper layers connected to two sides of the curing sheet;
the laser holes are arranged on the daughter board and penetrate through the copper layer of the substrate and the curing sheet at one side of the laser holes;
a copper electroplating layer is arranged on the daughter board positioned at one side of the laser hole; the circuit is etched on the electroplated copper layer;
and a prepreg copper foil is connected to one side surface of the daughter board, which is positioned on the electroplated copper layer, in a pressing manner.
Further, one end of the prepreg copper foil is a solidified sheet, the other end of the prepreg copper foil is a substrate copper layer, and the daughter board is positioned on one side surface of the electroplated copper layer and is connected with the solidified sheet in the prepreg copper foil in a pressing mode.
Further, the prepreg copper foil comprises a plurality of layers of solidified sheets, copper foil is pressed between two adjacent layers of solidified sheets, and the outer side face of the solidified sheet at the top end or the bottom end is connected with a substrate copper layer in a pressed mode.
Further, coaxial through holes are further formed in the prepreg copper foil, the electroplated copper layer and the daughter board.
In a second aspect, the invention discloses a method for manufacturing a PCB with a reverse laser hole structure, which comprises the following steps:
manufacturing a sub-board with two sides being substrate copper layers;
carrying out laser perforation on the sub-board to obtain a sub-board with laser perforation;
electroplating and etching a circuit on one side surface of the daughter board with the radium holes to obtain the daughter board with the circuit;
pressing the daughter board with the circuit and the prepreg copper foil to obtain a mother board; the pressing surface of the daughter board is a side surface with laser holes.
Further, the manufacturing of the daughter board with both sides being the copper layer of the substrate specifically comprises: and pressing the copper layers of the substrate on the two sides of the curing sheet to obtain the daughter board.
Further, electroplating on a side of the daughter board having radium holes comprises the following steps:
using a dry film to fully cover a substrate copper layer on one side of the cover plate without laser holes;
electroplating is performed on one side of the daughter board with the radium holes.
Further, the method comprises the step of browning or blacking the sub-board before laser punching on the sub-board.
Further, conventional drilling is performed on the motherboard; obtaining a through hole mother board; electroplating through holes of the mother board or electroplating the mother board.
According to the technical scheme, the invention has the beneficial effects that:
according to the PCB provided by the invention, the designed reverse laser hole structure does not need radium perforation hole filling electroplating, so that the thickness of an electroplated layer is ensured, fine circuits can be etched, and the quality of the PCB is ensured.
Firstly, manufacturing a sub-board with two sides being substrate copper layers, and carrying out laser perforation on the sub-board to obtain the sub-board with laser perforation; electroplating and etching a circuit on one side surface of the daughter board with the radium holes to obtain the daughter board with the circuit; and finally, pressing the daughter board with the circuit and the prepreg copper foil to obtain a mother board, wherein the method can obtain a flat board surface without laser Kong Tiankong electroplating, is convenient for subsequent processing of the mother board, does not need radium perforation hole filling operation, can not increase the thickness of an electroplated layer on one side surface of the radium perforation of the daughter board, ensures that fine circuits can be etched, and ensures the quality of the PCB.
Drawings
Fig. 1 is a schematic structural view of a PCB according to the present invention;
FIG. 2 is a schematic block diagram of the PCB fabrication of the present invention;
FIG. 3 is a flow chart of PCB manufacture in accordance with the present invention;
wherein: 1. a substrate copper layer; 2. solidifying the sheet; 3. copper foil; 4. electroplating a copper layer; 5. and (5) perforating.
Description of the embodiments
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
It should be noted that, in the description of the present invention, the directions or positional relationships indicated by the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. The terms "front", "back", "left", "right", "upper", "lower" as used in the description of the present invention refer to directions in the drawings, and the terms "inner", "outer" refer to directions toward or away from the geometric center of a particular component, respectively.
After the conventional HDI circuit board laser holes are punched, pits with laser holes exist on the surface of the board, and hole filling electroplating is needed to fill holes which cannot be formed in multi-step laser holes or cannot be designed on BGA pads. However, the limitation of hole filling electroplating exists, and the prior art in the industry cannot fill large and deep laser holes (for example, the aperture of the laser holes is more than 6mil, and the depth of the laser holes is more than 5 mil), so that forced hole filling can result in the fact that the thickness of copper plating is extremely thick, and fine circuits cannot be manufactured, which leads to the limitation of PCB design ideas. The invention provides a reverse lamination laser hole structure which can obtain a flat and uniform plate surface without hole filling electroplating.
Examples
As shown in fig. 1, the invention provides a PCB board with a reverse laser perforation structure, the PCB board comprises a sub-board and laser holes 5 arranged on the sub-board, the sub-board comprises a curing sheet 2 and a substrate copper layer 1 connected on two sides of the curing sheet 2; the radium perforation 5 penetrates through the substrate copper layer 1 and the curing sheet 2 at one side; the daughter board positioned at one side of the radium perforation 5 is provided with an electroplated copper layer 4; the circuit is etched on the electroplated copper layer 4; the prepreg copper foil is connected to one side surface of the daughter board, which is positioned on the electroplated copper layer 4, in a pressing mode.
The reverse laser hole structure designed by the PCB of the invention does not need radium perforation hole filling electroplating, ensures the thickness of an electroplated layer, further ensures that fine circuits can be etched, and ensures the quality of the PCB.
In the application, the top end of the prepreg copper foil is the curing sheet 2, the bottom end of the prepreg copper foil is the substrate copper layer 1, and the daughter board is positioned on one side surface of the electroplated copper layer 4 and is in press fit connection with the curing sheet 2 in the prepreg copper foil.
In some further embodiments, the prepreg copper foil comprises a plurality of layers of cured sheets 2, wherein copper foil 3 is pressed between two adjacent layers of cured sheets 2, and the bottom surface of the cured sheet at the bottom end is connected with a substrate copper layer 1 in a pressed manner.
In some embodiments, the prepreg copper foil, electroplated copper layer and daughter board are also provided with coaxial vias. I.e. a through hole is provided through the PCB board. An electroplated copper layer 4 can be arranged in the through hole, or a substrate copper layer can be arranged on the top surface or the bottom surface of the PCB.
The method can enable the PCB to obtain a flat plate surface without laser Kong Tiankong electroplating, and enables the surface layer of the PCB to be only a substrate copper layer and to be easier to process.
Examples
As shown in fig. 2 and 3, in order to realize the production of the PCB board in embodiment 1, this embodiment provides a manufacturing method to manufacture the PCB board in embodiment 1.
The method comprises the following steps:
and step 10, manufacturing a daughter board with both sides being the copper layers of the substrate.
And 20, carrying out laser perforation on the daughter board to obtain the daughter board with the laser perforation.
Step 30, electroplating and etching the circuit on one side surface of the daughter board with the radium holes to obtain the daughter board with the circuit.
Step 40, pressing the daughter board with the circuit and the prepreg copper foil to obtain a mother board; the pressing surface of the daughter board is a side surface with laser holes.
Reverse overlapping design of radium perforation of this application: and after the daughter board is punched with the laser holes, the laser holes are pressed downwards, and the surface of the produced PCB cannot see the laser holes. And (3) carrying out single-sided electroplating through special electroplating parameters, plating only one side of the laser hole, and then carrying out single-sided etching to manufacture only one side of the line of the laser hole.
In some further embodiments, the specific process of step 10 is: and pressing the copper layers of the substrate on the two sides of the curing sheet to obtain the daughter board.
In step 30, electroplating on a side of the daughter board having radium perforations comprises the steps of:
the dry film is used to fully cover the substrate copper layer on the side without laser holes of the sub-board, namely the surface L1 of the sub-board is covered with the dry film.
Electroplating is performed on one side of the daughter board with the radium holes.
The process comprises the following steps: and covering a dry film on the L1 surface of the daughter board, performing full-face exposure, curing the full-face dry film on the L1 surface, and then performing full-face electroplating on the daughter board, wherein during electroplating, a rectifier only opens the current of the L2 surface, namely, electroplating copper is only performed on the L2 surface. And the jet flow is set at 50Hz or the flow rate of each nozzle is 1L/min during electroplating.
The L1 surface is covered and protected by the dry film, so that the L1 surface is not plated with copper during electroplating. And after the electroplating is finished, removing the dry film on the L1 surface by using a film removing liquid, wherein the L1 surface is only the substrate copper, and carrying out the next manufacturing.
The dry film is a common dry film in the PCB industry, manufacturers have Hitachi, duPont and the like, the film removing liquid is a common film removing liquid in the PCB industry, the main component is sodium carbonate, and the main manufacturers have Banming technology and the like.
The PCB adopts a vertical continuous plating line (VCP plating line) in the plating process, and the rectifier of the plating line can independently set current on two sides.
Also included between step 10 and step 20 is step 15: the sub-boards are browned or blackened. The step can improve the laser absorption brightness and ensure the laser punching quality.
In some further embodiments, further comprising step 50, performing conventional drilling on the motherboard; obtaining a through hole mother board; electroplating through holes of the mother board or electroplating the mother board.
By the method, the PCB with the surface being only the substrate copper can be obtained.
It will be appreciated by those skilled in the art that the present invention can be carried out in other embodiments without departing from the spirit or essential characteristics thereof. Accordingly, the above disclosed embodiments are illustrative in all respects, and not exclusive. All changes that come within the scope of the invention or equivalents thereto are intended to be embraced therein.
Claims (9)
1. PCB board with reverse radium perforation structure, its characterized in that includes:
the daughter board comprises a curing sheet and substrate copper layers connected to two sides of the curing sheet;
the laser holes are arranged on the daughter board and penetrate through the copper layer of the substrate and the curing sheet at one side of the laser holes;
a copper electroplating layer is arranged on the daughter board positioned at one side of the laser hole; the circuit is etched on the electroplated copper layer;
and a prepreg copper foil is connected to one side surface of the daughter board, which is positioned on the electroplated copper layer, in a pressing manner.
2. The PCB of claim 1, wherein one end of the prepreg copper foil is a cured sheet and the other end is a base copper layer, and the daughter board is located on one side of the electroplated copper layer and is press-fit with the cured sheet in the prepreg copper foil.
3. The PCB of claim 1, wherein the prepreg copper foil comprises a plurality of layers of cured sheets, wherein copper foil is laminated between two adjacent layers of cured sheets, and the outer side of the top or bottom cured sheet is laminated and connected with a substrate copper layer.
4. The PCB of claim 1, wherein the prepreg copper foil, electroplated copper layer and daughter board are further provided with coaxial vias.
5. The manufacturing method of the PCB with the reverse radium perforation structure is characterized by comprising the following steps:
manufacturing a sub-board with two sides being substrate copper layers;
carrying out laser perforation on the sub-board to obtain a sub-board with laser perforation;
electroplating and etching a circuit on one side surface of the daughter board with the radium holes to obtain the daughter board with the circuit;
pressing the daughter board with the circuit and the prepreg copper foil to obtain a mother board; the pressing surface of the daughter board is a side surface with laser holes.
6. The method for manufacturing a PCB with a back laser hole structure according to claim 5, wherein the manufacturing a sub-board with both sides being a copper layer of the substrate specifically comprises: and pressing the copper layers of the substrate on the two sides of the curing sheet to obtain the daughter board.
7. The method of manufacturing a PCB with a back laser hole structure according to claim 5, wherein the plating on the side of the sub-board with the laser holes comprises the steps of:
using a dry film to fully cover a substrate copper layer on one side of the cover plate without laser holes;
electroplating is performed on one side of the daughter board with the radium holes.
8. The method of claim 5, further comprising browning or blackening the sub-board before laser drilling the sub-board.
9. The method of claim 5, further comprising performing conventional drilling on the motherboard; obtaining a through hole mother board; electroplating through holes of the mother board or electroplating the mother board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310323552.5A CN116367415A (en) | 2023-03-30 | 2023-03-30 | PCB with reverse radium perforation structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310323552.5A CN116367415A (en) | 2023-03-30 | 2023-03-30 | PCB with reverse radium perforation structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116367415A true CN116367415A (en) | 2023-06-30 |
Family
ID=86929985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310323552.5A Pending CN116367415A (en) | 2023-03-30 | 2023-03-30 | PCB with reverse radium perforation structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116367415A (en) |
-
2023
- 2023-03-30 CN CN202310323552.5A patent/CN116367415A/en active Pending
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