CN116347917A - Display panel, preparation method thereof and display device - Google Patents

Abstract

The embodiment of the disclosure discloses a display panel, a preparation method thereof and a display device. In one embodiment, the display panel includes a display region, an opening region, and an isolation region between the display region and the opening region, the isolation region including: a substrate; an insulating layer on the substrate; the metal isolation column is positioned on the insulating layer, and a groove penetrating through the metal isolation column from one side surface far away from the insulating layer to one side surface close to the insulating layer is formed in the metal isolation column; and the light-emitting layer and the cathode layer are sequentially stacked on the metal isolation column and the exposed insulating layer, and the light-emitting layer and the cathode layer are respectively disconnected at the end part of the metal isolation column, which is close to and/or far from the open pore region. According to the embodiment, the current channel of the cathode layer of the isolation region can be cut off on the basis that the light-emitting layer of the isolation region is cut off to block the water oxygen invasion channel, so that the black spot defect is improved, and the display effect is improved.

Description

Display panel, preparation method thereof and display device

Technical Field

The present disclosure relates to the field of display technology. And more particularly, to a display panel, a method of manufacturing the same, and a display device.

Background

In the conventional Organic Light-Emitting Diode (OLED) display device, a hole (Hole in Active Area, HIAA) is often formed on a screen to accommodate devices such as a camera and a sensor, but the hole is easy to expose a film layer of the OLED on the screen, and a spacer is required to be provided to block a water-oxygen invasion channel formed by an Electro-Luminescence (EL) layer. The inventors found that the above-described existing structure may suffer from black specks (Growing Dark Spot at HIAA, GDSH).

Disclosure of Invention

The disclosure provides a display panel, a manufacturing method thereof and a display device, which are used for solving at least one of the problems existing in the prior art.

In order to achieve the above purpose, the present disclosure adopts the following technical scheme:

a first aspect of the present disclosure provides a display panel including a display region, an open region, and an isolation region between the display region and the open region, the isolation region including:

a substrate;

an insulating layer on the substrate;

the metal isolation column is positioned on the insulating layer, and a groove penetrating through the metal isolation column from one side surface far away from the insulating layer to one side surface close to the insulating layer is formed in the metal isolation column;

and the light-emitting layer and the cathode layer are sequentially stacked on the metal isolation column and the exposed insulating layer, and the light-emitting layer and the cathode layer are respectively disconnected at the end part of the metal isolation column, which is close to and/or far from the open pore region.

Optionally, the metal spacer surrounds the open area and the recess surrounds the open area.

Optionally, the length of the groove in the first direction is 2 μm-10 μm, and the first direction is the direction in which the open hole area points to the display area.

Optionally, the groove is disposed at a central position of the metal isolation column in a first direction, where the first direction is a direction in which the opening area points to the display area.

Optionally, the metal isolation column comprises a first metal layer, a second metal layer and a third metal layer which are sequentially stacked, and one side surface, close to and/or far from the open hole area, of the second metal layer is recessed inwards.

Optionally, the display area includes a substrate, a driving circuit layer located on the substrate, and a flat layer located on the driving circuit layer, and the insulating layer is disposed on the same layer as the flat layer.

Optionally, the display area further includes an anode electrode on the flat layer, the driving circuit layer includes a source-drain metal layer, and at least one of the first metal layer, the second metal layer, and the third metal layer is disposed in the same layer as the source-drain metal layer.

Optionally, the isolation region further includes an encapsulation layer on the cathode layer.

A second aspect of the present disclosure provides a display device including the display panel provided in the first aspect of the present disclosure.

A third aspect of the present disclosure provides a method for manufacturing a display panel including a display region, an opening region, and an isolation region between the display region and the opening region, the method comprising:

providing a substrate;

forming an insulating layer on the substrate;

forming a metal isolation column on the insulating layer;

forming a groove penetrating through the metal isolation column from one side surface far away from the insulating layer to one side surface close to the insulating layer on the metal isolation column;

and sequentially forming a light-emitting layer and a cathode layer on the metal isolation column and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are disconnected at the end part of the metal isolation column, which is close to and/or far from the open pore region, respectively.

The beneficial effects of the present disclosure are as follows:

according to the technical scheme, the current channel of the cathode layer of the isolation region can be cut off on the basis that the light-emitting layer of the isolation region is cut off to block the water oxygen invasion channel, so that poor black spots are improved, and the display effect is improved.

Drawings

The following describes in further detail the specific embodiments of the present disclosure with reference to the drawings.

Fig. 1 shows a top view of a conventional display panel.

Fig. 2 shows a schematic cross-sectional view of an isolation region of a conventional display panel.

Fig. 3 illustrates a top view of a display panel provided by an embodiment of the present disclosure.

Fig. 4 illustrates a schematic cross-sectional view of an isolation region of a display panel provided by an embodiment of the present disclosure.

Fig. 5 to 9 are schematic cross-sectional views of corresponding stages in a preparation process of an array substrate according to an embodiment of the disclosure.

Detailed Description

As used in this disclosure, "formed on … …," "formed on … …," and "disposed on … …" may mean that one layer is formed directly on or disposed on another layer, or that one layer is formed indirectly on or disposed on another layer, i.e., that other layers are present between the two layers.

It should be noted that although the terms "first," "second," etc. may be used herein to describe various elements, components, elements, regions, layers and/or sections, these elements, components, elements, regions, layers and/or sections should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer and/or section from another. Thus, for example, a first component, a first member, a first element, a first region, a first layer, and/or a first portion discussed below may be referred to as a second component, a second member, a second element, a second region, a second layer, and/or a second portion without departing from the teachings of the present disclosure.

In this disclosure, unless otherwise indicated, the term "co-layer disposed" is used to mean that two layers, components, members, elements, or portions may be formed by the same manufacturing process (e.g., patterning process, etc.), and that the two layers, components, members, elements, or portions are generally formed of the same material. For example, the two or more functional layers are arranged in the same layer, meaning that the functional layers arranged in the same layer may be formed using the same material layer and the same manufacturing process, so that the manufacturing process of the display substrate may be simplified.

In the present disclosure, unless otherwise indicated, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one patterning process" means a process of forming a patterned layer, feature, component, etc. using a single mask.

In the existing OLED display device with the HIAA structure, as the holes on the screen are easy to expose the film layer of the OLED, isolation columns are needed to block the water oxygen invasion channel formed by the light-emitting layer. The display panel 100 shown in fig. 1, for example, includes a display region 110, an opening region 130, and an isolation region 120 between the display region 110 and the opening region 130. Referring to fig. 2, fig. 2 is a B-B cross-sectional view of fig. 1, and the isolation region 120 includes:

a substrate 101, wherein, for example, the isolation region 120 shares the same substrate 101 as the display region 110;

an insulating layer 102 on the substrate 101;

a metal isolation column 103 on the insulating layer 102;

the light emitting layer 104 and the cathode layer 105 are sequentially stacked on the metal isolation posts 103 and the exposed insulating layer 102, and the light emitting layer 104 and the cathode layer 105 are disconnected at the ends of the metal isolation posts 103 near and far from the opening regions 130, respectively.

In the display panel 100, in order to prevent intrusion of water and oxygen from the open area 130 to the display area 110, a water and oxygen intrusion path is cut off by providing a metal isolation column 103 in the isolation area 120. In order to achieve that the light emitting layer 104 and the cathode layer 105 are respectively disconnected at the end portions of the metal isolation column 103, which are close to and far from the open hole region 130, for example, as shown in fig. 2, the metal isolation column 103 includes a first metal layer 1031, a second metal layer 1032 and a third metal layer 1033 which are sequentially stacked, and the material of the first metal layer 1031 and the third metal layer 1033 is titanium (Ti), the material of the second metal layer 1032 is aluminum (Al), and one side surface of the second metal layer 1032, which is close to the open hole region 130, and one side surface (i.e., left and right side surfaces in fig. 2) which is far from the open hole region 130 are respectively recessed inwards. Thus, based on the metal isolation pillars 103 shown in fig. 2, when the light emitting layer 104 is formed, for example, by using an evaporation process, the light emitting layer 104 may be disconnected at the ends of the metal isolation pillars 103 near and far from the open hole regions 130, so that the light emitting layer 104 is blocked by the metal isolation pillars 103 to block the water oxygen invasion channel.

Similar to the light emitting layer 104, the cathode layer 105 is also broken at the ends of the metal separator 103 near and far from the open hole region 130, for example, the cathode layer 105 is made of silver (Ag), aluminum (Al), magnesium-silver alloy (Mg-Ag), calcium (Ca), or the like.

The inventor found that the above-mentioned conventional structure may cause black spot defect, and found that the black spot defect occurs because, since the display panel 100 needs to be designed to be antistatic, the openings of the opening regions 130 are generally filled with conductive paste for discharging static electricity and grounded, and thus, the contact of the conductive paste with the metal spacers 103 and/or the cathode layer 105 of the metal spacers 103 on the side close to the opening regions 130 may cause a voltage difference (for example, a voltage of 0v for the conductive paste and a voltage of-4.6 v for the cathode layer 105 when the display panel 100 is lighted) between the cathode layer 105 and the conductive paste. In the conventional display panel 100, the cathode layer 105 is disconnected at the end of the metal isolation column 103 near to and far from the opening region 130, but since the cathode layer 105 and the metal isolation column 103 are both made of metal or alloy materials, the cathode layer 105 and the metal isolation column 103 can be electrically connected to form a current channel, and when the display panel 100 is lighted, a voltage difference formed between the cathode layer 105 and the conductive paste generates a current, so that metal ions such as silver (Ag) migrate, causing water oxygen invasion and package failure, and causing black specks.

In view of the foregoing, an embodiment of the disclosure provides a display panel, such as an OLED display panel, for example, as shown in fig. 3, the display panel 300 provided in the present embodiment includes a display area 310, an opening area 330, and an isolation area 320 between the display area 310 and the opening area 330. Referring to fig. 4, fig. 4 is a C-C cross-sectional view of fig. 3, and as shown in fig. 4, the isolation region 320 in the display panel 300 includes:

a substrate 301, wherein, for example, the isolation region 320 shares the same substrate 301 as the display region 310;

an insulating layer 302 on the substrate 301;

a metal isolation column 303 on the insulating layer 302, wherein the metal isolation column 303 is provided with a groove penetrating the metal isolation column 303 from a side surface far from the insulating layer 302 to a side surface near the insulating layer 302, i.e., in fig. 4, the groove penetrates the metal isolation column 303 from top to bottom;

the light emitting layer 304 and the cathode layer 305, which are sequentially stacked on the metal isolation post 303 and the exposed insulating layer 302, are disconnected at the ends of the metal isolation post 303 near and far from the opening region 330, respectively, of the light emitting layer 304 and the cathode layer 305.

In the display panel 300 provided in this embodiment, on the basis that the light emitting layer 304 is disconnected at the end portion of the metal isolation column 303, which is close to and far from the opening region 330, so as to block the light emitting layer 304 by the metal isolation column 303 to block the water oxygen invasion channel, by forming a groove penetrating through the metal isolation column 303, for example, over-etching the metal isolation column 303 to the insulating layer 302 or etching the metal isolation column 303 to form a groove exposing the insulating layer 302, the metal isolation column 303 is disconnected in the direction (for example, the first direction X in fig. 4) in which the opening region 330 points to the display region 310, so that under the condition that the metal isolation column 303 is disconnected, even if the cathode layer 305 can be electrically connected with both side portions of the metal isolation column 303, the current channel of the cathode layer 305 is blocked due to the fact that the metal isolation column 303 is disconnected, the voltage difference formed between the cathode layer 305 and the conductive adhesive during the lighting of the display panel 300 cannot generate current, so that black spot defect can be effectively improved, and the display effect is improved.

It should be noted that, since the groove penetrates through the metal isolation column 303, the metal isolation column 303 may be understood to include two portions separated by the groove, such as a first portion near the open hole region 330 on the left side and a second portion far from the open hole region 330 on the right side as shown in fig. 4.

In one possible implementation, the metal isolation pillars 303 surround the open area 330 and the recesses surround the open area 330.

In a specific example, as shown in fig. 3, the opening area 330 is circular, and the isolation area 320 between the display area 310 and the opening area 330 is annular around the opening area 330, so as to ensure the effect of blocking the water oxygen invasion channel and the current channel, the metal isolation column 303 is annular around the opening area 330, and the groove is annular around the opening area 330. It will be appreciated that the direction in which the open area 330 points to the display area 310 in fig. 4, i.e., the first direction X shown in fig. 4, is a left-to-right direction in fig. 3, and is also a left-to-right direction in fig. 3, because fig. 4 is a C-C cross-sectional view of fig. 3, taken is the right-side middle position of the annular isolation area 320 in fig. 3, and the direction in which the open area 330 points to the display area 310 is different for different positions of the annular isolation area 320 in fig. 3, e.g., the direction in which the open area 330 points to the display area 310 (first direction) is a right-to-left direction in fig. 3 and the direction (first direction) in which the open area 330 points to the display area 310 is a bottom-to-up direction in fig. 3 for the upper middle position of the annular isolation area 320 in fig. 3.

In one possible implementation, the length of the grooves in the first direction is 2 μm-10 μm. Thereby, a blocking effect of the current path to the cathode layer 305 can be ensured.

In fig. 4, the cross section of the groove is inverted trapezoid, but the present embodiment is not limited thereto, and the cross section of the groove may be rectangular or other shapes, as long as the metal isolation column can be broken in the direction of the opening area to the display area.

In one possible implementation, as shown in fig. 4, the groove is opened at a central position of the metal isolation column 303 in the first direction.

In one possible implementation, as shown in fig. 4, the metal isolation pillar 303 includes a first metal layer 3031, a second metal layer 3032, and a third metal layer 3033 that are sequentially stacked, and both side surfaces of the second metal layer 3032, which are adjacent to and far from the open hole region 330, are recessed inward.

In order to achieve that the light emitting layer 304 and the cathode layer 305 are separated at the end of the metal isolation column 303, which is close to and far from the open hole area 330, as shown in fig. 4, the metal isolation column 303 includes a first metal layer 3031, a second metal layer 3032 and a third metal layer 3033 which are sequentially stacked, and the material of the first metal layer 3031 and the third metal layer 3033 is titanium (Ti), the material of the second metal layer 3032 is aluminum (Al), that is, the metal isolation column 303 is in a Ti-Al-Ti structure, and one side surface of the second metal layer 3032, which is close to the open hole area 330, and one side surface of the second metal layer 3032, which is far from the open hole area 330 (i.e., the left and right side surfaces in fig. 4), are respectively recessed, and the structure can be achieved by side etching, for example, the second metal layer 3032, which is an intermediate metal layer, can be partially etched by an etching process using a mixed chemical solution of nitric acid, acetic acid and phosphoric acid, which has an etching effect only on aluminum (Al), and no etching effect on titanium (Ti). Thus, based on the metal isolation pillars 303 shown in fig. 3, when the light emitting layer 304 is formed, for example, by using an evaporation process, the light emitting layer 304 may be disconnected at the ends of the metal isolation pillars 103 close to and far from the open hole regions 130, so that the light emitting layer 304 is blocked by the metal isolation pillars 303 to block the water oxygen invasion channel.

In one specific example, the thicknesses of the first metal layer 3031 and the third metal layer 3033, e.g., of titanium (Ti), are

The thickness of the second metal layer 3032, for example, of aluminum (Al) is +.>

It should be noted that the thickness of each film in the isolation region 320 shown in fig. 4 is merely illustrative, and does not represent a true thickness value or a relative proportion.

It is understood that, as the second metal layer of the intermediate metal layer, only the surface of one side close to the open pore region is formed inward with a recess or only the surface of one side far from the open pore region is formed inward with a recess, and the light emitting layer can be disconnected at the end of the metal isolation column close to or far from the open pore region, so that the light emitting layer can be isolated by the metal isolation column to block the water oxygen invasion channel.

In one possible implementation, the display region 310 includes a substrate 301, a driving circuit layer on the substrate 301, and a planarization layer on the driving circuit layer, and the insulating layer 302 is disposed in the same layer as the planarization layer. Thus, the manufacturing process of the display panel can be simplified.

In one possible implementation, the driving circuit layer includes a source-drain metal layer, and at least one of the first metal layer 3031, the second metal layer 3032, and the third metal layer 3033 is disposed in the same layer as the source-drain metal layer. Thus, the manufacturing process of the display panel can be simplified.

In a specific example, the substrate 301 may be glass, quartz, or the like, and the display panel 300 provided in this embodiment further includes a Barrier layer (Buffer) between the substrate 301 and the driving circuit layer. For example, the barrier layer and the buffer layer may be formed entirely on the substrate 301. For example, the barrier layer may be made of an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride, and the buffer layer may be made of an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. The barrier layer facilitates blocking water, oxygen from the bottom into the OLED formed after entry. The buffer layer is beneficial to the subsequent material deposition quality.

The driving circuit layer may also be referred to as a Thin Film Transistor (TFT) layer including an Active layer (Active) formed on the buffer layer by a patterning process, a Gate insulating layer (GI) formed on the Active layer by deposition or the like, a Gate electrode (Gate) of the thin film transistor formed on the Gate insulating layer by a patterning process, a dielectric layer (ILD) formed on the Gate electrode by deposition or the like, and a Source-Drain metal layer formed on the dielectric layer, the Source-Drain metal layer forming a Source electrode (Source) and a Drain electrode (Drain) of the thin film transistor, for example, the Source electrode being electrically connected to the Active layer through a dielectric layer via. The active layer may be made of polysilicon, metal oxide, or other materials, the gate insulating layer may be made of inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride, and the dielectric layer may be made of inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. The gate material includes a metal or alloy material such as aluminum, titanium, cobalt, etc.

The Planar Layer (PLN) and the insulating layer 302 (the insulating layer 302 may be regarded as a portion where the planar layer extends to the isolation region 320) provided on the same layer are made of, for example, a material having a thickness of, for example, about 1 μm to 3 μm, and a via hole is formed in the insulating layer, and an Anode (inode) made of, for example, a metal oxide such as ITO or IZO, or a metal or an alloy thereof such as Ag, al, mo, or the like is electrically connected to the drain electrode through the planar layer via hole.

For example, the display region further includes a light emitting layer and a Cathode (Cathode), the light emitting layer 304 of the isolation region 320 is disposed in the same layer as the light emitting layer of the display region, and the Cathode layer 305 of the isolation region 320 is disposed in the same layer as the Cathode of the display region.

In one possible implementation, as shown in fig. 4, isolation region 320 further includes an encapsulation layer (TFE) 306 located over cathode layer 305.

Further, as shown in fig. 4, the encapsulation layer 306 includes, for example, a first inorganic encapsulation layer 3061, an organic encapsulation layer 3062, and a second inorganic encapsulation layer 3063, which are sequentially stacked.

For example, the first inorganic encapsulation layer 3061 and the second inorganic encapsulation layer 3062 are formed by deposition or the like, the first inorganic encapsulation layer 3061 may be referred to as CVD1, and the second inorganic encapsulation layer 3062 may be referred to as CVD2. The organic encapsulation layer 3062 is formed by means of inkjet printing, and the organic encapsulation layer 3062 may be referred to as IJP.

For example, the first inorganic encapsulation layer 3061 and the second inorganic encapsulation layer 3062 may be formed using an inorganic material such as silicon nitride, silicon oxide, or silicon oxynitride, and the organic encapsulation layer 3062 may be formed using an organic material such as Polyimide (PI) or epoxy. Thus, the first inorganic encapsulation layer 3061, the organic encapsulation layer 3062, and the second inorganic encapsulation layer 3063 are formed as a composite encapsulation layer 306, and the composite encapsulation layer 306 can form multiple protections to the functional structure of the display panel 300, thereby having a better encapsulation effect.

It is understood that in the display panel 300, the encapsulation layer 306 extends to the display region 310, or the encapsulation layer 306 covers the display region 310 and the isolation region 320.

In addition, the display panel 300 provided in this embodiment may further include a touch layer and other film layers such as a transparent cover plate disposed on a side of the encapsulation layer away from the substrate, which will not be described in detail herein.

Another embodiment of the present disclosure provides a method for manufacturing a display panel including a display region, an opening region, and an isolation region between the display region and the opening region, the method including:

providing a substrate;

forming an insulating layer on the substrate;

forming a metal isolation column on the insulating layer;

forming a groove penetrating through the metal isolation column from one side surface far away from the insulating layer to one side surface close to the insulating layer on the metal isolation column;

and sequentially forming a light-emitting layer and a cathode layer on the metal isolation column and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are disconnected at the end part of the metal isolation column, which is close to and/or far from the open pore region, respectively.

Taking the example of the display panel 300 shown in fig. 3 as a preparation example, for the display panel 300, the isolation region 320 shown in fig. 4 is prepared by the following steps:

forming an insulating layer 302 on a substrate 301 using, for example, a deposition process, resulting in the structure shown in fig. 5;

forming a metal isolation pillar body on the insulating layer 302 by using a patterning process, so as to obtain a structure shown in fig. 6;

forming a groove penetrating through the metal isolation column body on the metal isolation column body to form a metal isolation column 303 provided with the groove, thereby obtaining a structure shown in fig. 7;

forming the light emitting layer 304 by, for example, an evaporation process, to obtain a structure as shown in fig. 8, wherein the light emitting layer 304 is broken at the ends of the metal isolation pillars 303 near and far from the open hole regions 330;

forming the cathode layer 305 using, for example, a deposition process, resulting in the structure shown in fig. 9, wherein the cathode layer 305 is broken at the ends of the metal isolation pillars 303 near and far from the open hole regions 330, and the cathode layer 305 in the grooves is blocked by the light emitting layer 304 from electrically connecting the metal isolation pillars 303;

the encapsulation layer 306 is formed resulting in the structure shown in fig. 4.

Another embodiment of the present disclosure provides a display device including the display panel provided in the above embodiment. The display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc., which is not limited in this embodiment.

It should be apparent that the foregoing examples of the present disclosure are merely illustrative of the present disclosure and not limiting of the embodiments of the present disclosure, and that various other changes and modifications may be made by one of ordinary skill in the art based on the foregoing description, and it is not intended to be exhaustive of all embodiments, and all obvious changes and modifications that come within the scope of the present disclosure are intended to be embraced by the technical solution of the present disclosure.

Claims (10)

1. A display panel comprising a display region, an aperture region, and an isolation region between the display region and the aperture region, the isolation region comprising:

a substrate;

an insulating layer on the substrate;

the metal isolation column is positioned on the insulating layer, and a groove penetrating through the metal isolation column from one side surface far away from the insulating layer to one side surface close to the insulating layer is formed in the metal isolation column;

and the light-emitting layer and the cathode layer are sequentially stacked on the metal isolation column and the exposed insulating layer, and the light-emitting layer and the cathode layer are respectively disconnected at the end part of the metal isolation column, which is close to and/or far from the open pore region.

2. The display panel of claim 1, wherein the metal spacer surrounds the open area and the recess surrounds the open area.

3. The display panel of claim 1, wherein the length of the groove in a first direction, the first direction being a direction in which the open area points toward the display area, is 2 μm-10 μm.

4. The display panel of claim 1, wherein the recess is formed at a center of the metal isolation column in a first direction, the first direction being a direction in which the opening region points to the display region.

5. The display panel according to claim 1, wherein the metal spacer includes a first metal layer, a second metal layer, and a third metal layer which are sequentially stacked, and a side surface of the second metal layer near and/or far from the opening region is recessed inward.

6. The display panel according to claim 5, wherein the display region includes a substrate, a driving circuit layer on the substrate, and a planarization layer on the driving circuit layer, and the insulating layer is provided in the same layer as the planarization layer.

7. The display panel according to claim 6, wherein the driving circuit layer includes a source-drain metal layer, and wherein at least one of the first metal layer, the second metal layer, and the third metal layer is provided in the same layer as the source-drain metal layer.

8. The display panel of claim 1, wherein the isolation region further comprises an encapsulation layer on the cathode layer.

9. A display device comprising the display panel according to any one of claims 1-8.

10. A method of manufacturing a display panel, the display panel comprising a display region, an open cell region, and an isolation region between the display region and the open cell region, the method comprising:

providing a substrate;

forming an insulating layer on the substrate;

forming a metal isolation column on the insulating layer;

forming a groove penetrating through the metal isolation column from one side surface far away from the insulating layer to one side surface close to the insulating layer on the metal isolation column;

and sequentially forming a light-emitting layer and a cathode layer on the metal isolation column and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are disconnected at the end part of the metal isolation column, which is close to and/or far from the open pore region, respectively.

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