CN116295046B - Method for measuring height of circuit board-mounted component in shape like Chinese character' hui - Google Patents
Method for measuring height of circuit board-mounted component in shape like Chinese character' hui Download PDFInfo
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- CN116295046B CN116295046B CN202310138024.2A CN202310138024A CN116295046B CN 116295046 B CN116295046 B CN 116295046B CN 202310138024 A CN202310138024 A CN 202310138024A CN 116295046 B CN116295046 B CN 116295046B
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 210000000746 body region Anatomy 0.000 claims abstract description 6
- 238000004364 calculation method Methods 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 11
- 238000001914 filtration Methods 0.000 claims description 6
- 238000004441 surface measurement Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 description 8
- 238000000691 measurement method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000013074 reference sample Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
A method for measuring the height of a circuit board on-board component includes setting a rectangular main body region of the circuit board on-board component to be tested in the three-dimensional top view of the circuit board to be tested, setting a rectangular base surface region to make the main body region fall in the base surface region, and defining the annular region surrounded by the four sides of the base surface region and the four sides of the main body region as a base surface reference region; then measuring the distance value between the circuit board block corresponding to the base surface reference area and the zero plane of the circuit board to be tested and the distance value between the circuit board block corresponding to the body area and the zero plane of the circuit board to be tested to obtain a base surface height value data set and a body height value data set; and then extracting effective data with noise filtered from the basal plane height value data set and the body height value data set, and calculating the actual height of the on-board component to be detected. The method provided by the invention is used for detecting the defects of the circuit board.
Description
Technical Field
The invention relates to a circuit board detection technology, in particular to a technology of a circuit board-mounted component back-shaped height measurement method.
Background
The 3DAOI detection equipment is equipment for detecting whether defects such as missing, rollover, multi-tin, pressing piece, pin tilting and the like exist in an on-board component on a circuit board by shooting a three-dimensional image of the circuit board.
As shown in fig. 3, when the 3DAOI detection device detects a circuit board, the structured light source 101 and the structured light camera 102 of the 3DAOI detection device are respectively disposed above the circuit board 104 to be detected, and the light emitting end of the structured light source 101 and the lens end of the structured light camera 102 are located on an equivalent plane 105; ideally, the value of the distance H0 between all points on the upper surface of the circuit board 104 to be tested (excluding the board-mounted components) and the equivalent plane 105 is the same, and the plane formed by all points on the upper surface of the circuit board 104 to be tested (excluding the board-mounted components) is referred to as the zero plane of the circuit board to be tested in this ideal case.
The existing 3DAOI detection equipment detects defects of components on a circuit board by adopting a four-point height measurement method, and the working principle is as follows: as shown in fig. 2, in the three-dimensional image of the circuit board captured by the 3DAOI detection device, the device to be detected is located in a rectangular body area 20, a rectangular reference area 21 with a smaller area is set at four corners of the body area 20, then the average height of each rectangular reference area 21 (the average height refers to the average distance between each point in the circuit board block corresponding to the rectangular reference area and the zero plane) is measured, the average heights of the four reference areas 21 are summed and divided by 4 to obtain the base surface height, then the average height of the body area 20 (the average height refers to the average distance between each point in the circuit board block corresponding to the body area and the zero plane) is measured, and then the average height of the body area 20 is subtracted by the base surface height to obtain the body height of the device to be detected.
The existing four-point height measurement method has the defects that:
1) The data acquisition of the base level is unreasonable, and the phenomenon of holes and pull tips exists in the three-dimensional image height data, that is to say, the image height data in the 4 rectangular reference areas are abnormal, and the base level is calculated by using the abnormal data, so that the base level result is misaligned.
2) The method has the advantages that the average value is calculated by directly taking the three-dimensional image height data of the body, outlier data can be brought into a calculation result, the finally calculated height data is inaccurate, and the stability is poor.
The defects cause relatively large height value errors of the on-board component body measured by the existing four-point height measurement method, so that the detection accuracy of the defects of the circuit board is affected.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the method for measuring the height of the circuit board-mounted component in a shape like a Chinese character 'Hui', which has small error of the measured value of the height of the body of the circuit board-mounted component and can improve the defect detection accuracy of the circuit board.
In order to solve the technical problems, the invention provides a method for measuring the height of a circuit board-mounted component in a Chinese character 'Hui' shape, which is characterized by comprising the following specific steps:
1) Shooting a three-dimensional top view of the circuit board to be tested by using a camera, and setting a zero plane of the circuit board to be tested;
2) Selecting a to-be-detected on-board component from a three-dimensional top view of the to-be-detected circuit board, and setting a rectangular body area so that the to-be-detected on-board component falls in the body area;
3) Setting a rectangular basal plane area in a three-dimensional top view of the circuit board to be tested, enabling the body area to fall into the basal plane area, enabling four sides of the basal plane area and four sides of the body area to form a character-returning pattern, and defining an annular area surrounded by the four sides of the basal plane area and the four sides of the body area as a basal plane reference area;
4) Measuring the distance value between each point in the circuit board block corresponding to each pixel point in the basal plane reference area and the zero plane of the circuit board to be tested, filtering invalid data, and forming a basal plane height value data set from the measured values;
measuring the distance value between each point in the circuit board block corresponding to each pixel point in the body region and the zero plane of the circuit board to be tested, filtering invalid data, and forming a body height value data set from the measured values;
5) Extracting data with the numerical value in a preset base surface effective data percentage range from the base surface height value data set as base surface height value effective data;
extracting data with the numerical value in a preset body effective data percentage range from the body height value data set as body height value effective data;
6) Calculating the average value of the effective data of the base level height value, and setting the calculation result as the base level measurement height;
calculating the average value of the effective data of the body height value, and setting the calculation result as the body measurement height;
7) The actual height of the selected on-board components to be detected is calculated, and a specific calculation formula is as follows:
A＝(B-C)×K
wherein A is the actual height of the selected on-board component to be detected, B is the body measurement height, C is the base surface measurement height, and K is a preset correction coefficient.
Further, the base surface effective data percentage range and the body effective data percentage range are set to be 30% -70%.
According to the method for measuring the height of the circuit board-mounted component, the annular area surrounding the body area is used as the basal plane reference area, the number of basal plane reference sample points is large, enough samples remain to participate in calculation after noise point data are removed, algorithm robustness is high, errors of measured values of the body height of the circuit board-mounted component are small, and accuracy of detecting defects of the circuit board can be improved.
Drawings
FIG. 1 is a schematic diagram of a method for measuring the height of a circuit board mounted component according to an embodiment of the present invention;
FIG. 2 is a measurement schematic diagram of a prior four-point altimetry method for a circuit board mounted component;
fig. 3 is a schematic diagram of a 3DAOI inspection apparatus inspection circuit board.
Detailed Description
The following description of the embodiments of the present invention is provided in detail, but the embodiments are not limited to the embodiments, and all the similar structures and similar variations using the present invention should be included in the protection scope of the present invention, and the reference numerals in the present invention indicate the relationships.
As shown in fig. 1, the method for measuring the height of the circuit board-mounted component according to the embodiment of the invention comprises the following specific steps:
1) Shooting a three-dimensional top view of the circuit board to be tested by using a camera, and setting a zero plane of the circuit board to be tested;
the method for setting the zero plane of the circuit board to be tested is the prior art, and is described in many patent documents, and the description of this embodiment is omitted.
2) Selecting a to-be-detected on-board component from a three-dimensional top view of a to-be-detected circuit board, and setting a rectangular body area 10 so that the to-be-detected on-board component falls in the body area 10;
3) In a three-dimensional top view of the circuit board to be tested, a rectangular base surface area 11 is set, so that the body area 10 falls in the base surface area 11, four sides of the base surface area 11 and four sides of the body area 10 form a back-shaped graph, and an annular area surrounded by the four sides of the base surface area 11 and the four sides of the body area 10 is defined as a base surface reference area 111;
4) Measuring the distance value between each point in the circuit board block corresponding to each pixel point in the basal plane reference area 111 and the zero plane of the circuit board to be tested, filtering invalid data (the invalid data refers to data of which the distance value cannot be measured), and then forming a basal plane height value data set by the measured values;
measuring the distance value between each point in the circuit board block corresponding to each pixel point in the body region 10 and the zero plane of the circuit board to be tested, filtering invalid data (the invalid data refers to data which cannot measure the distance value), and then forming a body height value data set by the measured values;
5) Extracting data with the numerical value in a preset base surface effective data percentage range from the base surface height value data set as base surface height value effective data;
extracting data with the numerical value in a preset body effective data percentage range from the body height value data set as body height value effective data;
the base surface effective data percentage range and the body effective data percentage range are all preset percentage ranges, the base surface effective data percentage range and the body effective data percentage range in the embodiment are all set to be 30% -70%, and the base surface effective data percentage range and the body effective data percentage range can be set to be other values in other embodiments;
the purpose of this step is to remove outliers, too high data, too low data.
6) Calculating the average value of the effective data of the base level height value, and setting the calculation result as the base level measurement height;
calculating the average value of the effective data of the body height value, and setting the calculation result as the body measurement height;
7) The actual height of the selected on-board components to be detected is calculated, and a specific calculation formula is as follows:
A＝(B-C)×K
wherein A is the actual height of the selected on-board component to be detected, B is the body measurement height, C is the base surface measurement height, K is a preset correction coefficient, and the value of K is a constant value obtained by machine debugging before measurement, so that the calculated actual height value of the on-board component is closer to the actual height of the on-board component.
Claims (2)
1. The method for measuring the height of the circuit board-mounted component in the shape of the Chinese character 'Hui', is characterized by comprising the following specific steps of:
1) Shooting a three-dimensional top view of the circuit board to be tested by using a camera, and setting a zero plane of the circuit board to be tested;
2) Selecting a to-be-detected on-board component from a three-dimensional top view of the to-be-detected circuit board, and setting a rectangular body area so that the to-be-detected on-board component falls in the body area;
3) Setting a rectangular basal plane area in a three-dimensional top view of the circuit board to be tested, enabling the body area to fall into the basal plane area, enabling four sides of the basal plane area and four sides of the body area to form a character-returning pattern, and defining an annular area surrounded by the four sides of the basal plane area and the four sides of the body area as a basal plane reference area;
4) Measuring the distance value between each point in the circuit board block corresponding to each pixel point in the basal plane reference area and the zero plane of the circuit board to be tested, filtering invalid data, and forming a basal plane height value data set from the measured values;
measuring the distance value between each point in the circuit board block corresponding to each pixel point in the body region and the zero plane of the circuit board to be tested, filtering invalid data, and forming a body height value data set from the measured values;
5) Extracting data with the numerical value in a preset base surface effective data percentage range from the base surface height value data set as base surface height value effective data;
extracting data with the numerical value in a preset body effective data percentage range from the body height value data set as body height value effective data;
6) Calculating the average value of the effective data of the base level height value, and setting the calculation result as the base level measurement height;
calculating the average value of the effective data of the body height value, and setting the calculation result as the body measurement height;
7) The actual height of the selected on-board components to be detected is calculated, and a specific calculation formula is as follows:
A＝(B-C)×K
wherein A is the actual height of the selected on-board component to be detected, B is the body measurement height, C is the base surface measurement height, and K is a preset correction coefficient.
2. The method for measuring the height of the circuit board-mounted component according to claim 1, wherein the method comprises the following steps:
the percentage range of the base surface effective data and the percentage range of the body effective data are set to be 30% -70%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310138024.2A CN116295046B (en) | 2023-02-20 | 2023-02-20 | Method for measuring height of circuit board-mounted component in shape like Chinese character' hui |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310138024.2A CN116295046B (en) | 2023-02-20 | 2023-02-20 | Method for measuring height of circuit board-mounted component in shape like Chinese character' hui |
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| Publication Number | Publication Date |
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| CN116295046A CN116295046A (en) | 2023-06-23 |
| CN116295046B true CN116295046B (en) | 2023-12-19 |
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| CN202310138024.2A Active CN116295046B (en) | 2023-02-20 | 2023-02-20 | Method for measuring height of circuit board-mounted component in shape like Chinese character' hui |
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| CN113916156A (en) * | 2021-12-13 | 2022-01-11 | 英特维科技(深圳)有限公司 | High-speed high-precision three-dimensional detection system and method |
| CN114494124A (en) * | 2021-12-20 | 2022-05-13 | 苏州镁伽科技有限公司 | Method and device for detecting height of device, storage medium and electronic equipment |
-
2023
- 2023-02-20 CN CN202310138024.2A patent/CN116295046B/en active Active
Patent Citations (11)
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| JP2002257516A (en) * | 2001-03-02 | 2002-09-11 | Nagoya Electric Works Co Ltd | Method and device for measuring height of solder |
| JP2007183239A (en) * | 2005-12-08 | 2007-07-19 | Fuji Mach Mfg Co Ltd | Method and device for measuring board surface height |
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| CN116295046A (en) | 2023-06-23 |
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