CN107271445B - Defect detection method and device - Google Patents
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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Abstract
The invention discloses a defect detection method, which comprises the following steps: driving a camera to shoot N projected images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB; n is more than 1; obtaining an equal-height map corresponding to each projection image one by one according to the N projection images; comparing the height of the area to be measured of the PCB with a predetermined standard height according to the equal height map; and judging whether the area to be detected has height defects or not according to the height comparison result. Correspondingly, the invention also discloses a defect detection device. The invention can detect the height of the area to be detected on the PCB board, and has low cost, high speed and high precision; and the problem that the extraction of structured light information is influenced by a shadow area caused by the dense elements on the PCB is solved, and the detection precision is further improved.
Description
Technical Field
The invention relates to the field of automatic optical detection, in particular to a defect detection method and device.
Background
AOI (Automatic optical Inspection) is based on an optical principle to detect common defects encountered in workpiece production, can replace manual work to search various appearance defects and element assembly errors of a PCB, and can play roles of high efficiency, accuracy, trouble saving, cost saving and the like. When the system works, the image of the PCB is collected through the camera, and the image is compared with qualified parameters in the database after being processed, so that the defects on the PCB are detected.
However, the conventional camera and image sensor can only acquire two-dimensional images, and lack depth information, which greatly limits perception and understanding of real objects. In the AOI of the current stage, data are mainly acquired by a camera, so that only plane two-dimensional information can be acquired, and some defects requiring height information cannot be well inspected, such as errors of component floating height, soldering defects and the like.
In recent decades, with the continuous development of high-definition and high-speed image sensors and computing power, three-dimensional surface imaging technology has achieved significant results in research, engineering and commerce. Some AOI products use laser, binocular, etc. techniques to obtain three-dimensional images of the PCB, and utilize height information to inspect the PCB for defects. However, the system using the technologies needs the board card to be placed on a specific tray during detection, so that the deployment and use difficulty is increased; on the other hand, these systems are difficult to popularize on a large scale in terms of accuracy, speed and cost.
Disclosure of Invention
The invention provides a defect detection method and device, which have the advantages of simple deployment, low cost and high precision.
In order to solve the foregoing technical problem, an aspect of an embodiment of the present invention provides a defect detection method, including:
driving a camera to shoot N projected images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB; n is more than 1;
obtaining an equal-height map corresponding to each projection image one by one according to the N projection images;
comparing the height of the area to be measured with a predetermined standard height according to the equal height map;
and judging whether the area to be detected of the PCB has height defects or not according to the height comparison result.
The embodiment of the invention has the following beneficial effects:
according to the defect detection method provided by the embodiment of the invention, the projector is used for projecting specific optical information (namely specific texture images) to the PCB, and the camera is used for collecting projection images. The structure of the PCB board can cause the optical signal to change, the information such as the position and the height of an object is calculated according to the change, and then the whole three-dimensional space is restored. The camera and the camera system can be deployed on a production line, and a single PCB is taken out when detection is not needed, so that the system has the advantages of simplicity in deployment and high efficiency; and a plurality of projectors are adopted for projection, so that the PCB is projected at different angles, the problem that the extraction of structured light information is influenced by a shadow area caused by the dense elements on the PCB is solved, and the detection precision is further improved.
Further, the defect detection method further includes:
driving a camera to shoot a plane image of the PCB;
comparing the image characteristic information of the region to be detected with the pre-determined standard image characteristic information according to the plane image;
and judging whether the area to be detected has appearance defects or not according to the comparison result of the image characteristic information.
Further, the obtaining, according to the N projection images, an equal height map corresponding to each projection image one to one specifically includes:
and respectively calculating the height distribution of the PCB by using a structured light three-dimensional imaging algorithm for each projection image to obtain an equal-height map corresponding to each projection image one by one.
Further, the comparing the height of the region to be measured with a predetermined standard height according to the equal height map specifically includes:
acquiring N height information of each pixel from the N equal height images;
averaging the N pieces of height information to obtain the average height of each pixel;
obtaining an average height map according to the average height of each pixel;
identifying a region to be detected from the average height map, and obtaining the height of the region to be detected;
and comparing the height of the area to be measured with the standard height determined in advance.
Another aspect of the embodiments of the present invention provides a defect detection apparatus, including:
the projection image shooting module is used for driving the camera to shoot N projection images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB respectively; n is more than 1;
the equal-height map acquisition module is used for acquiring an equal-height map corresponding to each projection image one by one according to the N projection images;
the height comparison module is used for comparing the height of the area to be measured of the PCB with a predetermined standard height according to the equal height map;
and the height judgment module is used for judging whether the area to be detected has height defects or not according to the height comparison result.
According to the defect detection device provided by the embodiment of the invention, the projector is used for projecting specific optical information (namely specific texture images) to the PCB, and the camera is used for collecting projection images. The structure of the PCB board can cause the optical signal to change, the information such as the position and the height of an object is calculated according to the change, and then the whole three-dimensional space is restored. The camera and the camera system can be deployed on a production line, and a single PCB is taken out when detection is not needed, so that the system has the advantages of simplicity in deployment and high efficiency; and a plurality of projectors are adopted for projection, so that the PCB is projected at different angles, the problem that the extraction of structured light information is influenced by a shadow area caused by the dense elements on the PCB is solved, and the detection precision is further improved.
Further, the defect detecting apparatus further includes:
the plane image shooting module is used for driving a camera to shoot a plane image of the PCB;
the characteristic comparison module is used for comparing the image characteristic information of the area to be measured with the standard image characteristic information which is measured in advance according to the plane image;
and the appearance judging module is used for judging whether the area to be detected has appearance defects or not according to the comparison result of the image characteristic information.
Further, the contour map obtaining module is specifically configured to:
and respectively calculating the height distribution of the PCB by using a structured light three-dimensional imaging algorithm for each projection image to obtain an equal-height map corresponding to each projection image one by one.
Further, the height alignment module comprises:
a pixel height acquisition unit for acquiring N pieces of height information of each pixel from the N equal height images;
the average height evaluation unit is used for averaging the N height information to obtain the average height of each pixel;
the image generation unit is used for obtaining an average height map according to the average height of each pixel;
the height acquisition unit to be measured is used for identifying a region to be measured from the average height map and acquiring the height of the region to be measured;
and the comparison unit is used for comparing the height of the area to be measured with the standard height determined in advance.
Drawings
FIG. 1 is a flowchart of a defect detection method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a projector and a camera in a first embodiment of the invention;
fig. 3 is a block diagram of a defect detection apparatus according to a second embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, which is a flowchart of a defect detection method according to a first embodiment of the present invention, the first embodiment of the present invention provides a defect detection method, including:
s11, driving a camera to shoot N projected images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB; n is more than 1;
s12, obtaining an equal-height map corresponding to each projection image one by one according to the N projection images;
s13, comparing the height of the area to be measured of the PCB with a predetermined standard height according to the equal height map;
and S14, judging whether the area to be detected has height defects or not according to the height comparison result.
Further, the defect detection method further includes:
s15, driving a camera to shoot a plane image of the PCB;
s16, comparing the image characteristic information of the to-be-detected area of the PCB with the pre-determined standard image characteristic information according to the plane image;
and S17, judging whether the area to be detected has appearance defects or not according to the comparison result of the image characteristic information.
In the embodiment, on one hand, a projector is used for projecting specific light information (namely a specific texture image) to the PCB, and a camera is used for collecting a projection image. Because the structure of the PCB can cause the change of optical signals, the position, the height and other information of an object can be calculated according to the change, and then the whole three-dimensional space is restored to obtain the height information of the PCB; and on the other hand, the plane image of the PCB is directly shot. And judging whether the area to be detected has defects from two aspects of a plane image and the height by comparing the parameters of the area to be detected on the PCB with the standard parameters determined in advance. The method has the advantages of simple deployment, high efficiency, high precision and the like.
Specifically, referring to fig. 2, which is a schematic deployment diagram of projectors and cameras in the first embodiment of the present invention, the N projectors include a first projector 22, a second projector 23, and a third projector 24. The PCB 25 is arranged on the production line, and the three projectors are arranged above the production line and correspond to the PCB and respectively project specific texture images onto the PCB. And the angle of projection of each projector is different. The camera 21 is arranged right above the PCB board card and used for collecting relevant images of the PCB board card. Because PCB board components are dense, and the component variety is many, and the height is inconsistent, can cause many shadow areas, only from using a projecting apparatus to throw, obtain the projection image, the height information that obtains has the error probably, consequently, adopt a plurality of projecting apparatuses to throw from different angles and obtain a plurality of projection images, carry out further processing to the data of a plurality of projection images, for example weight average etc. can eliminate the influence of shadow to a certain extent, improve detection accuracy.
Step S12 "obtaining an equal height map corresponding to each projection image one by one according to the N projection images", specifically:
and respectively calculating the height distribution of the PCB by using a structured light three-dimensional imaging algorithm for each projection image to obtain an equal-height map corresponding to each projection image one by one.
Structured light three-dimensional imaging is a method for establishing a high-resolution full-pair object three-dimensional model in a non-contact mode, and is suitable for application in applications with certain requirements on imaging area and precision. In general, the structured light three-dimensional imaging method projects a specific texture image, usually a sinusoidal grating pattern, onto the surface of the object to be measured, and obtains the height information of the object to be measured through phase processing.
The structured light three-dimensional imaging algorithm in the embodiment comprises the following steps:
s121, recording a grating image of the PCB, which is phase-modulated by the specific texture image, namely the projection image;
and S122, extracting a phase from the projection image by utilizing a grating analysis technology.
S123, obtaining continuous phase distribution which changes in proportion to the height of the object to be detected by using a phase unwrapping algorithm;
and S124, mapping the expanded phase distribution to a three-dimensional coordinate system of the real world to obtain the height distribution of the PCB.
Step S13, "comparing the height of the region to be measured with a predetermined standard height according to the equal height map", specifically includes:
s131, acquiring N pieces of height information of each pixel from the N equal-height images;
s132, averaging the N pieces of height information to obtain the average height of each pixel;
s133, obtaining an average height map according to the average height of each pixel;
s134, identifying a region to be detected from the average height map, and obtaining the height of the region to be detected;
and S135, comparing the height of the region to be detected with a predetermined standard height.
In a further scheme, an average height map is obtained by adopting an averaging method, and the average height map is used as a final measurement result. In other embodiments, the heights of the regions to be measured in the N equal height maps may be extracted, and the average of the extracted N height values is taken as the height of the region to be measured.
Specifically, the steps of obtaining the equal-height map, the average height map and the plane image are performed on the standard edition card, so that the related image of the standard edition card can be obtained. Marking positioning points on the plane image and the equal-height map of the standard board card, representing the position of the area to be measured by the positioning points, and storing the height and the image characteristic information of the positioning points as standard height and standard image characteristic information. Or, the standard height and standard image characteristic information may also be height and image characteristic information of the components soldered on the PCB board obtained by the design developer through an algorithm after the components are selected in the development stage.
Specifically, the image characteristic information may include RGB values, hue, saturation, brightness, lightness, and the like.
According to the defect detection method provided by the embodiment of the invention, the projector is used for projecting specific optical information (namely specific texture images) to the PCB, and the camera is used for collecting projection images. The structure of the PCB board can cause the optical signal to change, the information such as the position and the height of an object is calculated according to the change, and then the whole three-dimensional space is restored. The camera and the camera system can be deployed on a production line, and a single PCB is taken out when detection is not needed, so that the system has the advantages of simplicity in deployment and high efficiency; and a plurality of projectors are adopted for projection, so that the PCB is projected at different angles, the problem that the extraction of structured light information is influenced by a shadow area caused by the dense elements on the PCB is solved, and the detection precision is further improved.
Fig. 3 is a block diagram of a defect detection apparatus according to a second embodiment of the present invention. A defect detection apparatus comprising:
a projection image shooting module 31 for driving the camera to shoot N projection images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB respectively; n is more than 1;
an equal-height map obtaining module 32, configured to obtain, according to the N projection images, an equal-height map corresponding to each projection image one to one;
a height comparison module 33, configured to compare the height of the to-be-detected region of the PCB with a predetermined standard height according to the equal height map;
and the height judging module 34 is configured to judge whether the area to be detected has a height defect according to the height comparison result.
Further, the defect detecting apparatus further includes:
the plane image shooting module is used for driving a camera to shoot a plane image of the PCB;
the characteristic comparison module is used for comparing the image characteristic information of the area to be measured with the standard image characteristic information which is measured in advance according to the plane image;
and the appearance judging module is used for judging whether the area to be detected has appearance defects or not according to the comparison result of the image characteristic information.
Further, the contour map obtaining module is specifically configured to:
and respectively calculating the height distribution of the PCB by using a structured light three-dimensional imaging algorithm for each projection image to obtain an equal-height map corresponding to each projection image one by one.
Further, the height alignment module comprises:
a pixel height acquisition unit for acquiring N pieces of height information of each pixel from the N equal height images;
the average height evaluation unit is used for averaging the N height information to obtain the average height of each pixel;
the image generation unit is used for obtaining an average height map according to the average height of each pixel;
the height acquisition unit to be measured is used for identifying a region to be measured from the average height map and acquiring the height of the region to be measured;
and the comparison unit is used for comparing the height of the area to be measured with the standard height determined in advance.
According to the defect detection device provided by the embodiment of the invention, the projector is used for projecting specific optical information (namely specific texture images) to the PCB, and the camera is used for collecting projection images. The structure of the PCB board can cause the optical signal to change, the information such as the position and the height of an object is calculated according to the change, and then the whole three-dimensional space is restored. The camera and the camera system can be deployed on a production line, and a single PCB is taken out when detection is not needed, so that the system has the advantages of simplicity in deployment and high efficiency; and a plurality of projectors are adopted for projection, so that the PCB is projected at different angles, the problem that the extraction of structured light information is influenced by a shadow area caused by the dense elements on the PCB is solved, and the detection precision is further improved.
The foregoing is a preferred embodiment of the present invention, and it should be noted that modifications and variations can be made by those skilled in the art without departing from the principle of the present invention, and these modifications and variations are also considered as the protection scope of the present invention.
Claims (4)
1. A method of defect detection, comprising:
driving a camera to shoot N projected images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB; n is more than 1;
obtaining an equal-height map corresponding to each projection image one by one according to the N projection images;
comparing the height of the area to be measured of the PCB with a predetermined standard height according to the equal height map;
judging whether the area to be detected has height defects or not according to the height comparison result;
wherein, according to the equal altitude graph, comparing the height of the region to be measured with a predetermined standard height, specifically comprises:
acquiring N height information of each pixel from the N equal height images;
averaging the N pieces of height information to obtain the average height of each pixel;
obtaining an average height map according to the average height of each pixel;
identifying a region to be detected from the average height map, and obtaining the height of the region to be detected;
comparing the height of the area to be measured with a predetermined standard height;
wherein the defect detection method further comprises:
driving a camera to shoot a plane image of the PCB;
comparing the image characteristic information of the region to be detected with the pre-determined standard image characteristic information according to the plane image;
and judging whether the area to be detected has appearance defects or not according to the comparison result of the image characteristic information.
2. The defect detection method of claim 1, wherein the obtaining, according to the N projection images, an equal height map corresponding to each projection image one to one, specifically:
and respectively calculating the height distribution of the PCB by using a structured light three-dimensional imaging algorithm for each projection image to obtain an equal-height map corresponding to each projection image one by one.
3. A defect detection apparatus, comprising:
the projection image shooting module is used for driving the camera to shoot N projection images of the PCB; the N projection images are two-dimensional images displayed on the PCB when the N projectors project specific texture images to the PCB respectively, and the N projectors correspond to the PCB; n is more than 1;
the equal-height map acquisition module is used for acquiring an equal-height map corresponding to each projection image one by one according to the N projection images;
the height comparison module is used for comparing the height of the area to be measured of the PCB with a predetermined standard height according to the equal height map;
the height judging module is used for judging whether the area to be detected has height defects or not according to the height comparison result;
wherein, the height comparison module comprises:
a pixel height acquisition unit for acquiring N pieces of height information of each pixel from the N equal height images;
the average height evaluation unit is used for averaging the N height information to obtain the average height of each pixel;
the image generation unit is used for obtaining an average height map according to the average height of each pixel;
the height acquisition unit to be measured is used for identifying a region to be measured from the average height map and acquiring the height of the region to be measured;
the comparison unit is used for comparing the height of the area to be measured with a predetermined standard height;
wherein the defect detecting apparatus further comprises:
the plane image shooting module is used for driving a camera to shoot a plane image of the PCB;
the characteristic comparison module is used for comparing the image characteristic information of the area to be measured with the standard image characteristic information which is measured in advance according to the plane image;
and the appearance judging module is used for judging whether the area to be detected has appearance defects or not according to the comparison result of the image characteristic information.
4. The defect detection apparatus of claim 3, wherein the contour map acquisition module is specifically configured to:
and respectively calculating the height distribution of the PCB by using a structured light three-dimensional imaging algorithm for each projection image to obtain an equal-height map corresponding to each projection image one by one.
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| CN112444490B (en) * | 2021-02-01 | 2021-04-16 | 深圳宜美智科技股份有限公司 | Hole plugging defect detection method based on image detection and hole plugging defect detection equipment |
| CN113628176A (en) * | 2021-07-28 | 2021-11-09 | 生益电子股份有限公司 | Conductive medium detection method, device, equipment and storage medium of PCB |
| CN116295046B (en) * | 2023-02-20 | 2023-12-19 | 上海赫立智能机器有限公司 | Method for measuring height of circuit board-mounted component in shape like Chinese character' hui |
| CN117871538A (en) * | 2024-03-07 | 2024-04-12 | 江苏时代新能源科技有限公司 | Defect detection system, defect detection method and related equipment |
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