CN107271445A - A kind of defect inspection method and device - Google Patents
A kind of defect inspection method and device Download PDFInfo
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- CN107271445A CN107271445A CN201710342962.9A CN201710342962A CN107271445A CN 107271445 A CN107271445 A CN 107271445A CN 201710342962 A CN201710342962 A CN 201710342962A CN 107271445 A CN107271445 A CN 107271445A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
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Abstract
The invention discloses a kind of defect inspection method, including：Camera is driven to shoot N number of projected image of pcb board；Wherein, N number of projected image is the two dimensional image presented when N number of projecting apparatus projects particular texture image to the pcb board respectively on the pcb board, and N number of projecting apparatus is all corresponding with the pcb board；N ＞ 1；According to N number of projected image, obtain and the one-to-one circle of equal altitudes of each projected image；According to the circle of equal altitudes, the height and the calibrated altitude of measured in advance in the region to be measured of the pcb board are compared；According to height comparison result, judge that the region to be measured whether there is height defect.Correspondingly, invention additionally discloses a kind of defect detecting device.The present invention can detect the height in region to be measured on pcb board, and cost is low and speed is fast, precision is high；And overcome due to the problem of the intensive shadow region caused of element influences structure light information extraction on pcb board, further improving accuracy of detection.
Description
Technical field
The present invention relates to automatic optics inspection field, in particular it relates to a kind of defect inspection method and device.
Background technology
AOI (Automatic Optic Inspection, automatic optics inspection) is come to workpiece life based on optical principle
The common deficiency run into production is detected, can replace the artificial various open defects and element assembly defect for searching pcb board, energy
Enough play it is efficient, accurate, save trouble and the effect such as cost-effective.When system works, pcb board image is gathered by camera, passed through
It is compared after image procossing with the qualified parameter in database, checks the defect on pcb board.
However, traditional video camera and imaging sensor can only obtain the image of two dimension, lack the information of depth, this is to sense
Know and understand real object and cause great limitation.AOI at this stage mainly uses camera gathered data, so can only
The information of planar is obtained, the defect inspection of elevation information is needed for some, it is impossible to inspection is made well, such as element is floated
Height, the mistake such as scolding tin defect.
And nearest decades, with continuing to develop for high definition, high speed imaging sensor and computing capability, three-dimensional surface imaging
Technology is in research, engineering and commercial all achieves significant achievement.Some AOI products use laser, the technology such as binocular, obtain
The 3-D view of pcb board, the defect of pcb board is checked using elevation information.But the system for using these technologies, on the one hand
Need board to be placed in detection on specific pallet, add deployment, the difficulty used；On the other hand, these systems exist
In precision, speed and cost, system is all caused to be difficult to a wide range of popularization.
The content of the invention
The present invention provides a kind of defect inspection method and device, has the advantages that deployment is simple, cost is low and precision is high.
In order to solve the above-mentioned technical problem, on the one hand the embodiment of the present invention provides a kind of defect inspection method, including：
Camera is driven to shoot N number of projected image of pcb board；Wherein, N number of projected image is distinguished for N number of projecting apparatus
The two dimensional image that is presented on pcb board when projecting particular texture image to the pcb board, N number of projecting apparatus all with institute
State pcb board corresponding；N ＞ 1；
According to N number of projected image, obtain and the one-to-one circle of equal altitudes of each projected image；
According to the circle of equal altitudes, the height in the region to be measured and the calibrated altitude of measured in advance are compared；
According to height comparison result, judge that the region to be measured of the pcb board whether there is height defect.
Implement the embodiment of the present invention, have the advantages that：
Defect inspection method provided in an embodiment of the present invention, with the specific optical information of projector projects (i.e. specific texture
Image) pcb board is arrived, by camera acquired projections image.The construction of pcb board can cause optical signal to change, according to these changes
The information such as the position for changing to calculate object and height, and then restore whole three dimensions, compared to laser is used, the technology such as binocular is clapped
Take the photograph 3-D view, this method cost is low and speed faster, precision it is higher.Because camera and camera system can be deployed in flowing water production
On line, it is not necessary to take out single pcb board when detecting, therefore have the advantages that to dispose simple, efficiency high；And using multiple
Projector projects, project pcb board, to overcome due to the intensive shadow region caused of element on pcb board to realize in different angles
The problem of influenceing structure light information extraction, further improves accuracy of detection.
Further, the defect inspection method also includes：
Camera is driven to shoot the plane picture of the pcb board；
According to the plane picture, the image feature information in the region to be measured and the standard picture spy of measured in advance are compared
Reference ceases；
According to the comparison result of described image characteristic information, judge that the region to be measured whether there is open defect.
Further, it is described according to N number of projected image, obtain and the one-to-one circle of equal altitudes of each projected image,
Specially：
The height that each projected image calculates the pcb board using structured light three-dimensional imaging algorithm is distributed respectively, obtained
Obtain and the one-to-one circle of equal altitudes of each projected image.
Further, it is described according to the circle of equal altitudes, compare the height in the region to be measured and the standard height of measured in advance
Degree, is specifically included：
N number of elevation information of each pixel is obtained from N number of circle of equal altitudes；
N number of elevation information is averaged, the average height of each pixel is obtained；
According to the average height of each pixel, average height figure is obtained；
Region to be measured is identified from the average height figure, the height in the region to be measured is obtained；
Compare the height in the region to be measured and the calibrated altitude of measured in advance.
The another aspect of the embodiment of the present invention provides a kind of defect detecting device, including：
Projected image taking module, for driving camera to shoot N number of projected image of pcb board；Wherein, N number of throwing
Shadow image is the X-Y scheme presented when N number of projecting apparatus projects particular texture image to the pcb board respectively on the pcb board
Picture, N number of projecting apparatus is corresponding with the pcb board respectively；N ＞ 1；
Circle of equal altitudes acquisition module, it is one-to-one etc. with each projected image for according to N number of projected image, obtaining
Gao Tu；
Height comparing module, for according to the circle of equal altitudes, comparing the height in the region to be measured of the pcb board and survey in advance
Fixed calibrated altitude；
Height judge module, for according to height comparison result, judging that the region to be measured whether there is height defect.
Defect detecting device provided in an embodiment of the present invention, with the specific optical information of projector projects (i.e. specific texture
Image) pcb board is arrived, by camera acquired projections image.The construction of pcb board can cause optical signal to change, according to these changes
The information such as the position for changing to calculate object and height, and then restore whole three dimensions, compared to laser is used, the technology such as binocular is clapped
Take the photograph 3-D view, this method cost is low and speed faster, precision it is higher.Because camera and camera system can be deployed in flowing water production
On line, it is not necessary to take out single pcb board when detecting, therefore have the advantages that to dispose simple, efficiency high；And using multiple
Projector projects, project pcb board, to overcome due to the intensive shadow region caused of element on pcb board to realize in different angles
The problem of influenceing structure light information extraction, further improves accuracy of detection.
Further, the defect detecting device also includes：
Plane picture taking module, for driving camera to shoot the plane picture of the pcb board；
Feature comparing module, for according to the plane picture, comparing the image feature information in the region to be measured and pre-
The standard picture characteristic information first determined；
Whether outward appearance judge module, for the comparison result according to described image characteristic information, judge the region to be measured
There is open defect.
Further, the circle of equal altitudes acquisition module specifically for：
The height that each projected image calculates the pcb board using structured light three-dimensional imaging algorithm is distributed respectively, obtained
Obtain and the one-to-one circle of equal altitudes of each projected image.
Further, the height comparing module includes：
Pixels tall acquiring unit, N number of elevation information for obtaining each pixel from N number of circle of equal altitudes；
Average height evaluation unit, for being averaged to N number of elevation information, obtains the average height of each pixel；
Image generation unit, for the average height according to each pixel, obtains average height figure；
Height acquiring unit to be measured, for identifying region to be measured from the average height figure, obtains the area to be measured
The height in domain；
Comparing unit, for comparing the height in the region to be measured and the calibrated altitude of measured in advance.
Brief description of the drawings
Fig. 1 is the flow chart for the defect inspection method that the embodiment of the present invention one is provided；
Fig. 2 is the deployment schematic diagram of projecting apparatus and camera in the embodiment of the present invention one；
Fig. 3 is the structured flowchart for the defect detecting device that the embodiment of the present invention two is provided.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
It is the flow chart for the defect inspection method that the embodiment of the present invention one is provided referring to Fig. 1, the embodiment of the present invention one is provided
A kind of defect inspection method, including：
S11, driving camera shoot N number of projected image of pcb board；Wherein, N number of projected image is N number of projecting apparatus
The two dimensional image presented when projecting particular texture image to the pcb board respectively on the pcb board, N number of projecting apparatus is all
It is corresponding with the pcb board；N ＞ 1；
S12, according to N number of projected image, obtain and the one-to-one circle of equal altitudes of each projected image；
S13, according to the circle of equal altitudes, compare the height and the calibrated altitude of measured in advance in the region to be measured of the pcb board；
S14, according to height comparison result, judge the region to be measured whether there is height defect.
Further, the defect inspection method also includes：
S15, driving camera shoot the plane picture of the pcb board；
S16, according to the plane picture, compare the image feature information and measured in advance in the region to be measured of the pcb board
Standard picture characteristic information；
S17, the comparison result according to described image characteristic information, judge that the region to be measured whether there is open defect.
On the one hand the present embodiment arrives pcb board with the specific optical information of projector projects (i.e. particular texture image), by imaging
Head acquired projections image.Because the construction of pcb board can cause optical signal to change, object can be calculated according to these changes
The information such as position and height, and then whole three dimensions is restored, obtain the elevation information of pcb board；On the other hand PCB is directly shot
The plane picture of plate.By comparing the parameter and the canonical parameter of measured in advance in the region to be measured on pcb board, from plane picture and
Highly two aspects judge that region to be measured whether there is defect.Have the advantages that simple deployment, efficiency high, precision are high.
Specifically, it is the deployment schematic diagram of projecting apparatus and camera in the embodiment of the present invention one, N number of projecting apparatus bag referring to Fig. 2
Include the first projecting apparatus 22, the second projecting apparatus 23 and the 3rd projecting apparatus 24.Pcb board 25 is placed on streamline, and three projecting apparatus are located at
It is corresponding with pcb board above streamline, particular texture image is projected respectively to pcb board.And the angle of each projector
It is different from.Camera 21 is placed in the surface of pcb board card, gathers the associated picture of pcb board card.Because pcb board element is intensive,
It is highly inconsistent and component kind is more, many shadow regions can be caused, only from a projector projects, projected image are obtained,
Obtained elevation information there may be error, therefore, is projected from different perspectives using multiple projecting apparatus and obtains multiple projected images,
Data to multiple projected images are further processed, such as weighting is averaged, and shade can be eliminated to a certain extent
Influence, improves accuracy of detection.
Step S12 " according to N number of projected image, is obtained and the one-to-one circle of equal altitudes of each projected image ", specifically
For：
The height that each projected image calculates the pcb board using structured light three-dimensional imaging algorithm is distributed respectively, obtained
Obtain and the one-to-one circle of equal altitudes of each projected image.
Structured light three-dimensional imaging be it is a kind of high-resolution is set up by non-contacting mode, full object dimensional model
Method, is appropriate to and is used in the application that had certain requirements to imaging area, precision.Usually, structured light three-dimensional imaging method
A particular texture image is projected, usually sinusoidal grating pattern obtains determinand to object under test surface by Phase Processing
The elevation information of body.
Structured light three-dimensional imaging algorithm is comprised the steps of in the present embodiment：
S121, the pcb board is recorded by the raster image of particular texture image institute phase-modulation, i.e., described perspective view
Picture；
S122, using grating analysis technology from the projected image extract phase.
S123, the continuous phase distribution for using phase-unwrapping algorithm, acquisition and the change of object under test height equal proportion；
S124, the phase distribution expanded is mapped in the three-dimensional system of coordinate of real world, obtains the height of the pcb board
Degree distribution.
Step S13 " according to the circle of equal altitudes, compares the height in the region to be measured and the calibrated altitude of measured in advance ", tool
Body includes：
S131, the N number of elevation information for obtaining from N number of circle of equal altitudes each pixel；
S132, N number of elevation information is averaged, obtain the average height of each pixel；
S133, the average height according to each pixel, obtain average height figure；
S134, identify region to be measured from the average height figure, obtain the height in the region to be measured；
S135, the height for comparing the region to be measured and measured in advance calibrated altitude.
In further scheme, average height figure is obtained using the method averaged, using average height figure as last
Measurement result.The present embodiment is first averaging height map, then extracts the height and calibrated altitude in region to be measured in average height figure
Compare, in other embodiments, the height in the region to be measured in N number of circle of equal altitudes can also be extracted, it is N number of high to what is extracted
The height that angle value is averaged as region to be measured.
Specifically, the step of performing above-mentioned acquisition circle of equal altitudes, average height figure and plane picture to standard edition card can be obtained
Obtain the associated picture of standard board.Anchor point is marked on plane picture, circle of equal altitudes in standard board, represents to treat with anchor point
The position in region is surveyed, the height and image feature information of anchor point are saved as into calibrated altitude and standard picture characteristic information.Or
Person, calibrated altitude and standard picture characteristic information can also be the person of designing and developing after the development phase is to Component selection by algorithm
The element of acquisition is welded on height and image feature information on pcb board.
Specifically, image feature information may include, rgb value, hue, saturation, intensity and lightness etc..
Defect inspection method provided in an embodiment of the present invention, with the specific optical information of projector projects (i.e. specific texture
Image) pcb board is arrived, by camera acquired projections image.The construction of pcb board can cause optical signal to change, according to these changes
The information such as the position for changing to calculate object and height, and then restore whole three dimensions, compared to laser is used, the technology such as binocular is clapped
Take the photograph 3-D view, this method cost is low and speed faster, precision it is higher.Because camera and camera system can be deployed in flowing water production
On line, it is not necessary to take out single pcb board when detecting, therefore have the advantages that to dispose simple, efficiency high；And using multiple
Projector projects, project pcb board, to overcome due to the intensive shadow region caused of element on pcb board to realize in different angles
The problem of influenceing structure light information extraction, further improves accuracy of detection.
It is the structured flowchart for the defect detecting device that the embodiment of the present invention two is provided referring to Fig. 3.Defect detecting device, bag
Include：
Projected image taking module 31, for driving camera to shoot N number of projected image of pcb board；Wherein, it is described N number of
Projected image is the X-Y scheme presented when N number of projecting apparatus projects particular texture image to the pcb board respectively on the pcb board
Picture, N number of projecting apparatus is corresponding with the pcb board respectively；N ＞ 1；
Circle of equal altitudes acquisition module 32, for according to N number of projected image, obtaining one-to-one with each projected image
Circle of equal altitudes；
Height comparing module 33, for according to the circle of equal altitudes, compare the pcb board region to be measured height with advance
The calibrated altitude of measure；
Height judge module 34, for according to height comparison result, judging that the region to be measured whether there is height defect.
Further, the defect detecting device also includes：
Plane picture taking module, for driving camera to shoot the plane picture of the pcb board；
Feature comparing module, for according to the plane picture, comparing the image feature information in the region to be measured and pre-
The standard picture characteristic information first determined；
Whether outward appearance judge module, for the comparison result according to described image characteristic information, judge the region to be measured
There is open defect.
Further, the circle of equal altitudes acquisition module specifically for：
The height that each projected image calculates the pcb board using structured light three-dimensional imaging algorithm is distributed respectively, obtained
Obtain and the one-to-one circle of equal altitudes of each projected image.
Further, the height comparing module includes：
Pixels tall acquiring unit, N number of elevation information for obtaining each pixel from N number of circle of equal altitudes；
Average height evaluation unit, for being averaged to N number of elevation information, obtains the average height of each pixel；
Image generation unit, for the average height according to each pixel, obtains average height figure；
Height acquiring unit to be measured, for identifying region to be measured from the average height figure, obtains the area to be measured
The height in domain；
Comparing unit, for comparing the height in the region to be measured and the calibrated altitude of measured in advance.
Defect detecting device provided in an embodiment of the present invention, with the specific optical information of projector projects (i.e. specific texture
Image) pcb board is arrived, by camera acquired projections image.The construction of pcb board can cause optical signal to change, according to these changes
The information such as the position for changing to calculate object and height, and then restore whole three dimensions, compared to laser is used, the technology such as binocular is clapped
Take the photograph 3-D view, this method cost is low and speed faster, precision it is higher.Because camera and camera system can be deployed in flowing water production
On line, it is not necessary to take out single pcb board when detecting, therefore have the advantages that to dispose simple, efficiency high；And using multiple
Projector projects, project pcb board, to overcome due to the intensive shadow region caused of element on pcb board to realize in different angles
The problem of influenceing structure light information extraction, further improves accuracy of detection.
Above is the preferred embodiment of the present invention, it is noted that for those skilled in the art,
Under the premise without departing from the principles of the invention, some improvement and deformation can also be made, these are improved and deformation is also considered as this hair
Bright protection domain.
Claims (8)
1. a kind of defect inspection method, it is characterised in that including：
Camera is driven to shoot N number of projected image of pcb board；Wherein, N number of projected image is N number of projecting apparatus respectively to institute
The two dimensional image that is presented on pcb board when stating pcb board projection particular texture image, N number of projecting apparatus all with the PCB
Plate is corresponding；N ＞ 1；
According to N number of projected image, obtain and the one-to-one circle of equal altitudes of each projected image；
According to the circle of equal altitudes, the height and the calibrated altitude of measured in advance in the region to be measured of the pcb board are compared；
According to height comparison result, judge that the region to be measured whether there is height defect.
2. defect inspection method as claimed in claim 1, it is characterised in that the defect inspection method also includes：
Camera is driven to shoot the plane picture of the pcb board；
According to the plane picture, the image feature information in the region to be measured and the standard picture feature letter of measured in advance are compared
Breath；
According to the comparison result of described image characteristic information, judge that the region to be measured whether there is open defect.
3. defect inspection method as claimed in claim 1 or 2, it is characterised in that described according to N number of projected image, is obtained
Must be specially with the one-to-one circle of equal altitudes of each projected image：
Respectively to each projected image using structured light three-dimensional imaging algorithm calculate the pcb board height be distributed, obtain with
Each one-to-one circle of equal altitudes of projected image.
4. defect inspection method as claimed in claim 1 or 2, it is characterised in that described according to the circle of equal altitudes, is compared described
The height in region to be measured and the calibrated altitude of measured in advance, are specifically included：
N number of elevation information of each pixel is obtained from N number of circle of equal altitudes；
N number of elevation information is averaged, the average height of each pixel is obtained；
According to the average height of each pixel, average height figure is obtained；
Region to be measured is identified from the average height figure, the height in the region to be measured is obtained；
Compare the height in the region to be measured and the calibrated altitude of measured in advance.
5. a kind of defect detecting device, it is characterised in that including：
Projected image taking module, for driving camera to shoot N number of projected image of pcb board；Wherein, N number of perspective view
As the two dimensional image presented when projecting particular texture image to the pcb board respectively for N number of projecting apparatus on the pcb board, institute
State N number of projecting apparatus all corresponding with the pcb board；N ＞ 1；
Circle of equal altitudes acquisition module, for according to N number of projected image, obtaining contour correspondingly with each projected image
Figure；
Height comparing module, height and measured in advance for according to the circle of equal altitudes, comparing the region to be measured of the pcb board
Calibrated altitude；
Height judge module, for according to height comparison result, judging that the region to be measured whether there is height defect.
6. defect detecting device as claimed in claim 5, it is characterised in that the defect detecting device also includes：
Plane picture taking module, for driving camera to shoot the plane picture of the pcb board；
Feature comparing module, for according to the plane picture, comparing the image feature information in the region to be measured and survey in advance
Fixed standard picture characteristic information；
Outward appearance judge module, for the comparison result according to described image characteristic information, judges that the region to be measured whether there is
Open defect.
7. the defect detecting device as described in claim 5 or 6, it is characterised in that the circle of equal altitudes acquisition module specifically for：
Respectively to each projected image using structured light three-dimensional imaging algorithm calculate the pcb board height be distributed, obtain with
Each one-to-one circle of equal altitudes of projected image.
8. the defect detecting device as described in claim 5 or 6, it is characterised in that the height comparing module includes：
Pixels tall acquiring unit, N number of elevation information for obtaining each pixel from N number of circle of equal altitudes；
Average height evaluation unit, for being averaged to N number of elevation information, obtains the average height of each pixel；
Image generation unit, for the average height according to each pixel, obtains average height figure；
Height acquiring unit to be measured, for identifying region to be measured from the average height figure, obtains the region to be measured
Highly；
Comparing unit, for comparing the height in the region to be measured and the calibrated altitude of measured in advance.
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| CN113628176A (en) * | 2021-07-28 | 2021-11-09 | 生益电子股份有限公司 | Conductive medium detection method, device, equipment and storage medium of PCB |
| CN116295046A (en) * | 2023-02-20 | 2023-06-23 | 上海赫立智能机器有限公司 | Method for measuring height of circuit board-mounted component in shape like Chinese character' hui |
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