CN116275532A - Ultrafast laser diamond polishing equipment and method - Google Patents

Abstract

The invention belongs to the technical field of diamond polishing equipment, and provides ultra-fast laser diamond polishing equipment and a method, wherein the ultra-fast laser diamond polishing equipment comprises a base, a bracket is fixedly connected to the base, and a workbench is vertically and slidably connected to the bracket; a laser generating part which is arranged on the bracket and is used for generating laser for polishing the diamond; the optical path integration transmitting unit is arranged on the bracket and the workbench and is used for adjusting and guiding the laser beam emitted by the ultrafast laser generating part to the surface of the diamond; the visual monitoring part is arranged on the workbench and is used for dynamically monitoring the polishing process; the movable clamping part is arranged on the base and used for fastening the diamond and moving the diamond position in the polishing process; and the upper computer is used for controlling the operation of the diamond polishing equipment. The diamond polishing device can be suitable for diamond polishing with various textures, can monitor the polishing process in real time and perform closed-loop feedback, and has high processing precision.

Description

Ultrafast laser diamond polishing equipment and method

Technical Field

The invention belongs to the technical field of diamond polishing equipment, and particularly relates to ultra-fast laser diamond polishing equipment and a method.

Background

Diamond is currently the hardest natural substance known in the world, and diamond can be used not only as jewelry but also industrially as an advanced cutting and grinding material. The cut diamond is required to be bordered and polished, wherein the polishing of the diamond is a very important step in the diamond processing, as the quality of the polishing effect of the waist line determines the size and fire grade of the diamond to a great extent. The conventional diamond polishing process of the ceramic diamond grinding wheel has high requirements on radial runout of the grinding wheel, sharpness and shape retention of the grinding wheel, meanwhile, the polishing time of each carat of diamond is 4-6 hours, and the efficiency is low. Polishing with techniques beyond laser precision machining can improve efficiency and also reduce the loss of diamond.

The diamond surface is in an uneven state under microscopic observation, a plurality of wave crests and wave troughs exist, and the current ultra-fast laser precision machining technology can destroy chemical bond energy of a material through single photon, remove wave crest parts of the material and realize ultra-precision machining. However, aiming at the ultra-high hard and brittle material of diamond, the current ultra-fast laser precision processing equipment cannot well control laser energy and laser pulse aiming at diamond with different textures, so that the surface processed by the diamond is easy to crack, recast, carbonize and other defects, meanwhile, the processing process of the diamond cannot be effectively monitored and controlled, and the processed size cannot meet the requirement of ultra-fine processing, so that the ultra-fast laser diamond polishing equipment and method which can be suitable for polishing diamond with various textures, can monitor the polishing process in real time and feed back in a closed loop, and have high processing precision are needed.

Disclosure of Invention

The invention aims to provide an ultrafast laser diamond polishing device and method, which solve the problems, and achieve the purposes of being applicable to diamond polishing with various textures, being capable of monitoring the polishing process in real time and carrying out closed-loop feedback, and having high processing precision.

In order to achieve the above object, the present invention provides the following solutions: an ultrafast laser polished diamond apparatus, comprising:

the base is fixedly connected with a bracket, a workbench is vertically and slidably connected to the bracket, and a height control assembly is arranged between the workbench and the bracket;

the laser generating part is arranged on the bracket and is used for generating laser for polishing the diamond;

the optical path integration transmitting unit is arranged on the bracket and the workbench and is used for adjusting the laser beam emitted by the ultrafast laser generating part and guiding the quenched and tempered laser beam to the surface of the polished diamond;

the visual monitoring part is arranged on the workbench and is used for dynamically monitoring the polishing process;

the movable clamping part is arranged on the base and used for fastening the diamond and moving the diamond position in the polishing process;

the upper computer is used for controlling the operation of the laser generating part, the light path integration transmitting unit, the visual monitoring part and the movable clamping part.

Preferably, the laser generating part comprises an ultrafast laser, the ultrafast laser is fixedly connected to the top of the support, the ultrafast laser is used for generating femtosecond-level ultranarrow pulse laser, and the laser emitting end of the ultrafast laser is communicated with the incident end of the optical path integration emitting unit.

Preferably, the optical path integration and emission unit comprises a first laser processing head and a second laser processing head which are fixedly connected to the bottom of the workbench, the emergent end of the first laser processing head and the emergent end of the second laser processing head are respectively and correspondingly arranged with the processed surface of the diamond, an optical path integration part is arranged between the ultrafast laser and the first laser processing head and between the ultrafast laser processing head and the second laser processing head, and the optical path integration part is used for adjusting the laser beam emitted by the ultrafast laser.

Preferably, the light path integrating part comprises a collimating lens, a beam expanding lens and a focusing lens which are fixedly connected to the workbench, wherein an incident end of the beam expanding lens is correspondingly arranged with an emergent end of the ultrafast laser and used for changing the diameter and the divergence angle of a laser beam emitted by the ultrafast laser, the incident end of the collimating lens is correspondingly arranged with the emergent end of the beam expanding lens and used for maintaining the collimation of the laser light speed, and the focusing lens is correspondingly arranged between the collimating lens and the first laser processing head and between the focusing lens and the second laser processing head and used for focusing laser on the surface of a diamond so as to realize laser energy aggregation.

Preferably, the visual monitoring part comprises a camera module fixedly connected to the bottom of the workbench, the camera module is arranged side by side with the first laser processing head and the second laser processing head, a positioning camera and an observing camera are arranged in the camera module, the positioning camera is used for carrying out dimension measurement and characteristic point coordinate recognition on the diamond, and the observing camera is used for observing the laser processing process in real time.

Preferably, the movable clamping part comprises a main guide rail arranged at the top of the base, the main guide rail is positioned at the bottom of the support, a bottom sliding table is connected to the main guide rail in a sliding manner, a first driving assembly is arranged between the bottom sliding table and the main guide rail, an auxiliary guide rail is arranged on the bottom sliding table, the extending direction of the auxiliary guide rail is perpendicular to that of the main guide rail, a transverse sliding table is connected to the auxiliary guide rail in a sliding manner, a second driving assembly is arranged between the transverse sliding table and the auxiliary guide rail, and a clamping assembly is arranged on the transverse sliding table.

Preferably, the clamping assembly comprises a polishing disc fixedly connected to the top of the horizontal sliding table, a movable claw and a fixed claw are arranged on the polishing disc, the movable claw is horizontally and slidably connected to the top of the polishing disc, the fixed claw is fixedly connected to the top of the polishing disc, one end of a screw rod is horizontally and rotatably connected to the fixed claw, and the screw rod penetrates through the movable claw and is in transmission connection with the claw.

An ultrafast laser diamond polishing method, preferably, comprises the following operation steps:

s1, setting cutting parameters, operating an upper computer, setting a polished surface of a diamond as a plurality of processing layers according to process requirements, and setting processing parameters of a laser generating part in each corresponding processing layer;

s2, correcting the vibrating mirror, operating the upper computer, setting correction parameters, correction area size, characterization size, maximum deviation value and light emitting parameters on the basis of the vibrating mirror delivery correction file, completing one-time scanning, generating a new correction file in the upper computer every time the scanning is completed, changing positions or materials on the basis of the new correction file, repeating the steps, and executing repeated generation application until the offset value reaches the requirement;

s3, clamping the diamond, and clamping the processed diamond in the movable clamping part;

s4, visual monitoring setting, namely extracting and understanding a three-dimensional image of the processed diamond by using an upper computer, scanning and detecting geometric dimensions, shapes and surface properties of the processed diamond by using a visual monitoring part, and monitoring and controlling the processing process by using the upper computer;

s5, diamond polishing, operating the upper computer to enable the light path integration transmitting unit to start polishing the diamond surface.

Compared with the prior art, the invention has the following advantages and technical effects: the workbench has the main functions of bearing the light path integration transmitting unit and the visual monitoring part, so that the relative position between the light path integration transmitting unit and the visual monitoring part is always kept stable; the main function of the laser generating part is to stably emit picosecond or femtosecond laser beams; the main function of the light path integration emission part is to integrate the laser emitted from the laser generation part and guide the laser to the processed surface of the diamond so as to realize polishing operation; the visual monitoring part is used for measuring the diamond size and monitoring the polished surface in real time in the polishing process; the main function of the movable clamping part is to clamp the processed diamond and move the position of the diamond in the polishing process, so that the surface of the target can be polished uniformly. In whole, the diamond polishing device can be suitable for diamond polishing work with various textures, has a wide application range, can monitor the polishing process in real time and perform closed-loop feedback, and ensures that the polishing surface of the diamond is precise and high in quality.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram showing the rear view structure of a diamond polishing apparatus according to the present invention;

FIG. 2 is a schematic diagram showing the front view of the diamond polishing apparatus of the present invention;

FIG. 3 is a front cross-sectional view of a clamping assembly according to a first embodiment of the invention;

FIG. 4 is a schematic diagram of a first drive assembly according to the present invention;

FIG. 5 is a schematic diagram of a second drive assembly according to the present invention;

FIG. 6 is a schematic view of a height control assembly of the present invention;

FIG. 7 is a top view of the visual inspection portion of the present invention;

FIG. 8 is a front cross-sectional view of a clamping assembly according to a second embodiment of the invention;

1, a base; 2. a bracket; 3. a work table; 4. an ultrafast laser; 5. a first laser processing head; 6. a second laser processing head; 7. a camera module; 8. positioning a camera; 9. an observation camera; 10. a main guide rail; 11. a bottom sliding table; 12. an auxiliary guide rail; 13. a transverse sliding table; 14. polishing disk; 15. a moving claw; 16. a water chamber; 17. a water channel; 18. a hose; 19. a constant temperature water tank; 20. an infrared temperature sensor; 21. a control circuit; 22. a flow valve; 23. a circulation pump; 24. an upper computer; 25. a collimator lens; 26. a beam expander; 27. a focusing mirror; 29. a fixed claw; 30. a screw rod; 31. a first rack; 32. a second rack; 33. a first motor; 34. a first gear; 35. a second motor; 36. a second gear; 37. a vertical sliding rail; 38. a third rack; 39. a third motor; 40. and a third gear.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

Embodiment one:

referring to FIGS. 1-7, the present invention provides an ultrafast laser polishing diamond apparatus, comprising:

the device comprises a base 1, wherein a bracket 2 is fixedly connected to the base 1, a workbench 3 is vertically and slidably connected to the bracket 2, and a height control assembly is arranged between the workbench 3 and the bracket 2;

a laser generating part which is arranged on the bracket 2 and is used for generating laser for polishing diamond;

the optical path integration transmitting unit is arranged on the bracket 2 and the workbench 3 and is used for adjusting the laser beam emitted by the ultrafast laser generating part and guiding the quenched and tempered laser beam to the surface of the polished diamond;

the visual monitoring part is arranged on the workbench 3 and is used for dynamically monitoring the polishing process;

the movable clamping part is arranged on the base 1 and is used for fastening the diamond and moving the diamond position in the polishing process;

the upper computer 24, the upper computer 24 is used for controlling the operation of laser generating part, light path integration transmitting unit, visual monitoring part and movable clamping part.

The workbench 3 has the main function of bearing the light path integration transmitting unit and the visual monitoring part, so that the relative position between the light path integration transmitting unit and the visual monitoring part is always kept stable; the main function of the laser generating part is to stably emit picosecond or femtosecond laser beams; the main function of the light path integration emission part is to integrate the laser emitted from the laser generation part and guide the laser to the processed surface of the diamond so as to realize polishing operation; the visual monitoring part is used for measuring the diamond size and monitoring the polished surface in real time in the polishing process; the main function of the movable clamping part is to clamp the processed diamond and move the position of the diamond in the polishing process, so that the surface of the target can be polished uniformly. In whole, the diamond polishing device can be suitable for diamond polishing work with various textures, has a wide application range, can monitor the polishing process in real time and perform closed-loop feedback, and ensures that the polishing surface of the diamond is precise and high in quality.

Further optimizing scheme, the height control assembly includes vertical slide rail 37 of fixed connection on support 2 lateral wall, and workstation 3 sliding connection is on vertical slide rail 37, and fixedly connected with third motor 39 on the workstation 3 lateral wall, vertical fixedly connected with third rack 38 on the lateral wall of support 2, coaxial fixed cover is equipped with third gear 40 on the output shaft of third motor 39, and third gear 40 meshes with third rack 38.

As shown in fig. 6, when the height of the workbench 3 needs to be adjusted, the upper computer 24 controls the third motor 39 to rotate, the third motor 39 rotates to drive the third gear 40 to rotate, and the third gear 40 drives the workbench 3 to adjust the height through meshing transmission with the third rack 38 when rotating.

Further optimizing scheme, the laser generating part includes ultrafast laser 4, and ultrafast laser 4 fixed connection is at the top of support 2, and ultrafast laser 4 is used for producing the ultranarrow pulse laser of femtosecond level, and the laser emission end and the light path of ultrafast laser 4 integrate the incident end intercommunication of transmitting unit.

The ultrafast laser 4 is an ultrafast femtosecond laser.

Further optimizing scheme, the light path integration transmitting unit includes first laser processing head 5 and second laser processing head 6 of fixed connection in workstation 3 bottom, and the exit end of first laser processing head 5 and the exit end of second laser processing head 6 correspond the setting with the diamond respectively by the machined surface, are provided with light path integration portion between ultrafast laser 4 and first laser processing head 5, second laser processing head 6, and light path integration portion is used for adjusting the laser beam that ultrafast laser 4 sent.

Further optimizing scheme, the light path integration portion includes collimating mirror 25, beam expander 26 and focusing mirror 27 of fixed connection on workstation 3, beam expander 26's incident end corresponds the setting with ultrafast laser 4 exit end for change diameter and the divergence angle of the laser beam that ultrafast laser 4 sent, the incident end of collimating mirror 25 corresponds the setting with beam expander 26's exit end, be used for maintaining the collimation of laser light velocity, focusing mirror 27 corresponds the setting at collimating mirror 25 and first laser processing head 5, between second laser processing head 6, focusing mirror 27 is used for forming the focus with laser at the diamond surface, realize laser energy gathering.

The first laser processing head 5 and the second laser processing head 6 form different laser spots with different focuses under the cooperation of the focusing mirror 27, so that diamond materials with different textures can be polished in a targeted manner. The laser beam emitted by the ultrafast laser 4 enters the beam expander 26, and as the laser beam emitted by the ultrafast laser 4 inevitably has divergence and bending phenomena in the propagation process, after passing through the beam expander 26, the divergence angle of the laser beam is changed, and meanwhile, the diffraction phenomenon can be suppressed, and the bending degree of the laser beam is reduced. The laser beam transmitted from the beam expander 26 enters the collimator lens 25, the collimator lens 25 is used for maintaining the collimation of the laser beam before entering the focusing lens 27, after the laser beam enters the focusing lens 27, the focusing lens 27 can focus the laser beam with different spot sizes, so that the laser beam forms focusing on the diamond surface after being emitted from the first laser processing head 5 or the second laser processing head 6, and the polishing of the laser beam on the diamond surface is realized.

Further optimizing scheme, visual monitoring portion includes camera module 7 of fixed connection in workstation 3 bottom, and camera module 7 sets up side by side with first laser processing head 5, second laser processing head 6, is provided with location camera 8 and observation camera 9 in the camera module 7, and location camera 8 is used for carrying out size measurement and feature point coordinate recognition to the diamond, and observation camera 9 is used for the real-time observation laser processing process.

As shown in fig. 7, the positioning camera 8 adopts a 500-ten-thousand-pixel digital CCD camera, and can measure the geometric dimension and shape of the diamond before and during the diamond processing, and identify the position coordinates of the feature points, so as to compare the dimension of the actual diamond with the three-dimensional image led into the upper computer 24, and adjust the processing parameters in real time. The measurement accuracy of the positioning camera 8 can reach 1um. The observation camera 9 is a 500 ten thousand pixel digital CCD camera, and can observe the laser processing process in real time in the diamond polishing process.

Further optimizing scheme, remove clamping part is including seting up the main guide rail 10 at base 1 top, main guide rail 10 is located the bottom of support 2, sliding connection has a bottom slip table 11 on the main guide rail 10, be provided with first drive assembly between bottom slip table 11 and the main guide rail 10, set up vice guide rail 12 on the bottom slip table 11, the extending direction of vice guide rail 12 is mutually perpendicular with the extending direction of main guide rail 10, sliding connection has horizontal slip table 13 on the vice guide rail 12, be provided with second drive assembly between horizontal slip table 13 and the vice guide rail 12, be provided with clamping assembly on the horizontal slip table 13.

Further preferably, the first driving assembly comprises a first motor 33 fixedly connected to the bottom of the bottom sliding table 11 and a first rack 31 fixedly connected to the top of the base 1, a first gear 34 is coaxially and fixedly sleeved on an output shaft of the first motor 33, and the first gear 34 is meshed with the first rack 31.

Further preferably, the second driving assembly comprises a second motor 35 fixedly connected to the bottom of the transverse sliding table 13 and a second rack 32 fixedly connected to the top of the bottom sliding table 11, a second gear 36 is coaxially and fixedly sleeved on an output shaft of the second motor 35, and the second gear 36 is meshed with the second rack 32.

As shown in fig. 4 and 5, in the process of polishing the diamond, the horizontal position of the transverse sliding table 13 is adjusted to drive the position of the polishing disk 14 to move, so as to adjust the polished surface of the diamond. When the horizontal position of the horizontal sliding table 13 needs to be adjusted, the upper computer 24 controls the first motor 33 to rotate, the first motor 33 rotates to drive the first gear 34 to rotate, and the first gear 34 drives the bottom sliding table 11 to drive the horizontal sliding table 13 to move along the X direction through meshing transmission with the first rack 31 during rotation. Similarly, the upper computer 24 controls the second motor 35 to rotate, and the second motor 35 moves the traverse table 13 along the Y direction through the transmission action between the second gear 36 and the second rack 32.

Further optimizing scheme, the clamping assembly includes the polishing dish 14 of fixed connection at the sideslip platform 13 top, is provided with movable jaw 15 and fixed jaw 29 on the polishing dish 14, and movable jaw 15 horizontal sliding connection is at the top of polishing dish 14, and fixed jaw 29 fixed connection is at the top of polishing dish 14, and the last horizontal rotation of fixed jaw 29 is connected with the one end of lead screw 30, and lead screw 30 runs through movable jaw 15 and is connected with movable jaw 15 transmission.

As shown in fig. 3, a hand wheel is fixedly connected to one end of the screw rod 30, which is far away from the fixed jaw 29, when a diamond is required to be clamped in the device, the hand wheel can be rotated to enable the screw rod 30 to rotate, and the screw rod 30 can drive the movable jaw 15 to move on the polishing disk 14 in a direction far away from the fixed jaw 29 through screw transmission, so that the distance between the movable jaw 15 and the fixed jaw 29 is increased. The diamond is placed between the movable jaw 15 and the fixed jaw 29, and the hand wheel is rotated reversely to move the movable jaw 15 in a direction approaching the fixed jaw 29, so that the diamond is clamped between the movable jaw 15 and the fixed jaw 29.

The ultra-fast laser diamond polishing method further optimizes the scheme and comprises the following operation steps:

s1, setting cutting parameters, operating an upper computer 24, setting a polished surface of a diamond into a plurality of processing layers according to process requirements, and setting processing parameters of a laser generating part in each corresponding processing layer;

the host computer 24 is operated to divide the three-dimensional patterned diamond surface to be processed into a plurality of processing layers in the system. In the control system, aiming at each layer, the laser energy, the light emitting frequency, the laser pulse width, the laser focus height compensation value, the repeated cutting times of single convex points, the alternate cutting times of all convex points, the scanning speed of a vibrating mirror, the jumping speed of the vibrating mirror, the jumping time delay of the vibrating mirror, the laser starting time delay and the laser closing time delay of the ultra-fast laser 4 are set.

S2, correcting the vibrating mirror, operating the upper computer 24, setting correction parameters, correction area size, characterization size, maximum deviation value and light emitting parameters on the basis of the vibrating mirror delivery correction file, completing one scanning, generating a new correction file in the upper computer 24 every time the scanning is completed, changing positions or materials on the basis of the new correction file, repeating the steps, and executing repeated generation application until the offset value reaches the requirement;

the upper computer 24 is operated to correct by array circles of 3×3, 5×5, 7×7, etc. Setting the size of the correction area, setting the value to be 45mm, setting the maximum deviation value, and automatically stopping scanning when the deviation value is smaller than or equal to the maximum deviation value when the galvanometer correction is automatically performed. The array circles are manually drawn below the first laser processing head 5 or the second laser processing head 6, the drawing positions can be selected in the upper computer 24, and the array circles can be drawn at the positions of the two laser processing heads or the array circles can be drawn at the zero positions. .

The first correction selects to describe 3 x 3 array circles, and operates the upper computer 24, and the diamond polishing equipment automatically operates to identify 9 points and generate a correction file; changing the depicting positions and materials, selecting 5×5 array circles, operating the upper computer 24 to refer to the newly generated correction files, automatically identifying 25 points, and generating new correction files again; and repeating the process, sequentially describing array circles such as 7 multiplied by 7, 11 multiplied by 11 and the like, and sequentially generating correction files until the displayed offset value meets the requirement.

S3, clamping the diamond, and clamping the processed diamond in the movable clamping part;

s4, visual monitoring setting, namely extracting and understanding a three-dimensional image of the processed diamond by using the upper computer 24, scanning and detecting geometric dimension, shape and surface attribute of the processed diamond by using the visual monitoring part, and monitoring and controlling the processing process by using the upper computer 24;

a three-dimensional image of the diamond is imported into the host computer 24, and the image is subjected to feature recognition. The diamond real object is subjected to work such as feature point coordinate recognition, size measurement and the like through the positioning camera 8, and the scanning image is compared with the three-dimensional image, so that the polishing process is conveniently monitored and recognized.

S5, diamond polishing, operating the upper computer 24 to enable the light path integration transmitting unit to start polishing the diamond surface.

In the polishing process, the upper computer 24 monitors the size of a polished surface in the polishing process in real time by controlling the positioning camera 8, compares the size with a three-dimensional image, and monitors the processing progress; the upper computer 24 monitors and observes the motion trail of the two laser processing heads and the diamond surface dynamically in real time in the polishing process by controlling the observation camera 9.

Example two

The difference between this embodiment and the first embodiment is that the water cavity 16 is formed in the polishing disc 14, the water channels 17 are respectively formed in the fixed claw 29 and the movable claw 15, the water channels 17 in the fixed claw 29 are directly communicated with the water cavity 16, the water channels 17 in the movable claw 15 are communicated with the water cavity 16 through the hose 18, one end of the water cavity 16 is communicated with the water inlet end of the constant temperature water tank 19 through a pipeline, the water outlet end of the constant temperature water tank 19 is communicated with the water inlet end of the circulation pump 23, the water outlet end of the circulation pump 23 is communicated with the other end of the water cavity 16 through the flow valve 22, the infrared temperature sensor 20 is arranged in the constant temperature water tank 19, and the infrared temperature sensor 20, the circulation pump 23 and the flow valve 22 are respectively connected with the control circuit 21 through wires.

As shown in fig. 8, since heat is generated during polishing, the jig is thermally expanded and deformed at too high a temperature, resulting in a decrease in polishing accuracy. Therefore, in polishing diamond, it is necessary to cool the reinforcing component. Specifically, in the diamond polishing process, the circulating pump 23 operates to circulate water in the constant-temperature water tank 19 among the circulating pump 23, the flow valve 22, the water cavity 16 and the two groups of water channels 17, heat on the polishing disc 14, the fixed claw 29 and the movable claw 15 is taken away by utilizing constant-temperature water and is dispersed in the constant-temperature water tank 19, the control circuit 21 controls the infrared temperature sensor 20 to monitor the temperatures of the polishing disc 14, the fixed claw 29 and the movable claw 15, and when the temperature is too high, the control circuit 21 controls the opening of the flow valve 22 to increase, and increases the flow speed of the constant-temperature water to accelerate the heat taking-away speed; when the infrared temperature sensor 20 detects that the temperature is lower, the control circuit 21 controls the opening of the flow valve 22 to be reduced so as to slow down the water flow speed, thereby slowing down the heat taking speed.

In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

The above embodiments are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solutions of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.

Claims (8)

1. An ultrafast laser polished diamond apparatus, comprising:

the device comprises a base (1), wherein a support (2) is fixedly connected to the base (1), a workbench (3) is vertically and slidably connected to the support (2), and a height control assembly is arranged between the workbench (3) and the support (2);

a laser generating part which is arranged on the bracket (2) and is used for generating laser for polishing diamond;

the optical path integration emission unit is arranged on the bracket (2) and the workbench (3) and is used for adjusting the laser beam emitted by the ultrafast laser generation part and guiding the quenched and tempered laser beam to the surface of the polished diamond;

the visual monitoring part is arranged on the workbench (3) and is used for dynamically monitoring the polishing process;

the movable clamping part is arranged on the base (1) and is used for fastening the diamond and moving the diamond position in the polishing process;

the upper computer (24) is used for controlling the operation of the laser generating part, the light path integration transmitting unit, the visual monitoring part and the movable clamping part.

2. An ultrafast laser polishing diamond apparatus according to claim 1, wherein: the laser generating part comprises an ultrafast laser (4), the ultrafast laser (4) is fixedly connected to the top of the support (2), the ultrafast laser (4) is used for generating femtosecond-level ultranarrow pulse laser, and the laser emitting end of the ultrafast laser (4) is communicated with the incident end of the optical path integration emitting unit.

3. An ultrafast laser polishing diamond apparatus according to claim 2, wherein: the optical path integration transmitting unit comprises a first laser processing head (5) and a second laser processing head (6) which are fixedly connected to the bottom of the workbench (3), the emergent end of the first laser processing head (5) and the emergent end of the second laser processing head (6) are respectively and correspondingly arranged with the processed surface of the diamond, an optical path integration part is arranged between the ultrafast laser (4) and the first laser processing head (5) and the second laser processing head (6), and the optical path integration part is used for adjusting the laser beam emitted by the ultrafast laser (4).

4. An ultrafast laser polishing diamond apparatus according to claim 3, wherein: the optical path integration part comprises a collimating lens (25), a beam expanding lens (26) and a focusing lens (27) which are fixedly connected to the workbench (3), wherein the incident end of the beam expanding lens (26) is correspondingly arranged with the emergent end of the ultrafast laser (4) and is used for changing the diameter and the divergence angle of a laser beam emitted by the ultrafast laser (4), the incident end of the collimating lens (25) is correspondingly arranged with the emergent end of the beam expanding lens (26) and is used for maintaining the collimation of the laser light speed, the focusing lens (27) is correspondingly arranged between the collimating lens (25) and the first laser processing head (5) and the second laser processing head (6), and the focusing lens (27) is used for focusing laser on the surface of a diamond and realizing laser energy aggregation.

5. An ultrafast laser polishing diamond apparatus according to claim 3, wherein: the visual monitoring part comprises a camera module (7) fixedly connected to the bottom of the workbench (3), the camera module (7) is arranged side by side with the first laser processing head (5) and the second laser processing head (6), a positioning camera (8) and an observing camera (9) are arranged in the camera module (7), the positioning camera (8) is used for carrying out dimension measurement and characteristic point coordinate identification on diamonds, and the observing camera (9) is used for observing the laser processing process in real time.

6. An ultrafast laser polishing diamond apparatus according to claim 1, wherein: the movable clamping part comprises a main guide rail (10) arranged at the top of the base (1), the main guide rail (10) is arranged at the bottom of the support (2), a bottom sliding table (11) is connected to the main guide rail (10) in a sliding manner, a first driving assembly is arranged between the bottom sliding table (11) and the main guide rail (10), an auxiliary guide rail (12) is arranged on the bottom sliding table (11), the extending direction of the auxiliary guide rail (12) is perpendicular to the extending direction of the main guide rail (10), a transverse sliding table (13) is connected to the auxiliary guide rail (12) in a sliding manner, a second driving assembly is arranged between the transverse sliding table (13) and the auxiliary guide rail (12), and a clamping assembly is arranged on the transverse sliding table (13).

7. The ultra-fast laser polished diamond apparatus according to claim 6, wherein: the clamping assembly comprises a polishing disc (14) fixedly connected to the top of the transverse sliding table (13), a movable claw (15) and a fixed claw (29) are arranged on the polishing disc (14), the movable claw (15) is horizontally and slidably connected to the top of the polishing disc (14), the fixed claw (29) is fixedly connected to the top of the polishing disc (14), one end of a screw rod (30) is horizontally and rotatably connected to the fixed claw (29), and the screw rod (30) penetrates through the movable claw (15) and is in transmission connection with the claw (15).

8. An ultrafast laser polishing diamond method, as recited in claim 1, wherein the operating steps include:

s1, setting cutting parameters, operating an upper computer (24), setting a polished surface of a diamond into a plurality of processing layers according to process requirements, and setting processing parameters of a laser generating part in each corresponding processing layer;

s2, correcting the vibrating mirror, operating an upper computer (24), setting correction parameters, correction area size, characterization size, maximum deviation value and light emitting parameters on the basis of the vibrating mirror delivery correction file, completing one scanning, generating a new correction file in the upper computer (16) every time the scanning is completed, changing positions or materials on the basis of the new correction file, repeating the steps, and executing repeated generation application until the deviation value reaches the requirement;

s3, clamping the diamond, and clamping the processed diamond in the movable clamping part;

s4, visual monitoring setting, namely extracting and understanding a three-dimensional image of the processed diamond by using an upper computer (16), scanning and detecting geometric dimension, shape and surface attribute of the processed diamond by using a visual monitoring part, and monitoring and controlling the processing process by using the upper computer (16);

s5, diamond polishing, and operating the upper computer (24) to enable the light path integration transmitting unit to start polishing the diamond surface.

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