CN116275532A - Ultrafast laser diamond polishing equipment and method - Google Patents

Abstract

The invention belongs to the technical field of diamond polishing equipment, and provides ultra-fast laser diamond polishing equipment and a method, wherein the ultra-fast laser diamond polishing equipment comprises a base, a bracket is fixedly connected to the base, and a workbench is vertically and slidably connected to the bracket; a laser generating part which is arranged on the bracket and is used for generating laser for polishing the diamond; the optical path integration transmitting unit is arranged on the bracket and the workbench and is used for adjusting and guiding the laser beam emitted by the ultrafast laser generating part to the surface of the diamond; the visual monitoring part is arranged on the workbench and is used for dynamically monitoring the polishing process; the movable clamping part is arranged on the base and used for fastening the diamond and moving the diamond position in the polishing process; and the upper computer is used for controlling the operation of the diamond polishing equipment. The diamond polishing device can be suitable for diamond polishing with various textures, can monitor the polishing process in real time and perform closed-loop feedback, and has high processing precision.

Description

A kind of ultrafast laser polishing diamond equipment and method

technical field

The invention belongs to the technical field of diamond polishing equipment, and in particular relates to an ultrafast laser polishing diamond equipment and method.

Background technique

Diamond is the hardest natural substance known in the world. Diamond can be used not only as jewelry, but also as advanced cutting and grinding materials in industry. The cut diamonds need to be edged and polished. Diamond polishing is a very important step in diamond processing, because the quality of the waistline polishing largely determines the size and fire grade of the diamond. The process of grinding diamonds with traditional vitrified diamond grinding wheels has high requirements on the radial runout of the grinding wheel, the sharpness and shape retention of the grinding wheel, and at the same time, it takes 4-6 hours to polish each carat of diamonds, and the efficiency is low. Polishing using more than laser precision machining technology can increase efficiency and reduce the loss of diamonds.

Under microscopic observation, the diamond surface is uneven, with many peaks and troughs. The current ultrafast laser precision machining technology can destroy the chemical bond energy of the material through single photons, remove the peak part of the material, and achieve ultra-finishing. However, for diamonds, which are ultra-hard and brittle materials, the current ultra-fast laser precision processing equipment cannot control laser energy and laser pulses well for diamonds of different textures, making the surface of diamonds processed easily cracks, recasting and carbonization At the same time, the diamond processing process cannot be effectively monitored and controlled, resulting in the processed size not meeting the requirements of superfinishing. Therefore, there is an urgent need for a diamond polishing that can be applied to a variety of textures. Real-time monitoring of the process and closed-loop feedback, and ultra-fast laser polishing diamond equipment and methods with high processing precision.

Contents of the invention

The purpose of the present invention is to provide a kind of ultra-fast laser polishing diamond equipment and method to solve the above problems, to achieve the purpose of polishing diamonds with various textures, real-time monitoring and closed-loop feedback of the polishing process, and high processing accuracy .

To achieve the above object, the present invention provides the following scheme: a kind of ultrafast laser polishing diamond equipment, comprising:

a base, a bracket is fixedly connected to the base, a workbench is vertically slidably connected to the support, and a height control component is arranged between the workbench and the bracket;

A laser generating part, the laser generating part is arranged on the bracket and is used to generate laser light for polishing diamonds;

An optical path integrated emission unit, the optical path integrated emission unit is arranged on the support and the workbench, and is used to adjust the laser beam emitted by the ultrafast laser generating part and guide the conditioned laser beam to the polished diamond surface;

a visual monitoring unit, the visual monitoring unit is arranged on the workbench for dynamic monitoring of the polishing process;

a mobile clamping part, the mobile clamping part is arranged on the base, and the mobile clamping part is used to fasten the diamond and move the position of the diamond during the polishing process;

A host computer, the host computer is used to control the operation of the laser generating part, the optical path integration emission unit, the visual monitoring part and the moving clamping part.

Preferably, the laser generating part includes an ultrafast laser, the ultrafast laser is fixedly connected to the top of the support, the ultrafast laser is used to generate femtosecond-level ultranarrow pulse laser, and the ultrafast laser is The laser emitting end communicates with the incident end of the optical path integration emitting unit.

Preferably, the optical path integration emission unit includes a first laser processing head and a second laser processing head fixedly connected to the bottom of the workbench, the output end of the first laser processing head and the second laser processing head The output ends are respectively arranged corresponding to the processed surface of the diamond, and an optical path integration part is arranged between the ultrafast laser and the first laser processing head and the second laser processing head, and the optical path integration part is used for the ultrafast The laser beam emitted by the laser is adjusted.

Preferably, the optical path integration part includes a collimating mirror, a beam expander and a focusing mirror fixedly connected to the workbench, and the incident end of the beam expander is arranged correspondingly to the output end of the ultrafast laser for Change the diameter and divergence angle of the laser beam emitted by the ultrafast laser, the incident end of the collimating mirror is set correspondingly to the outgoing end of the beam expander to maintain the collimation of the laser beam speed, and the focusing mirror Correspondingly arranged between the collimating mirror and the first laser processing head and the second laser processing head, the focusing mirror is used to focus the laser on the diamond surface to realize laser energy concentration.

Preferably, the visual monitoring part includes a camera module fixedly connected to the bottom of the workbench, the camera module is arranged side by side with the first laser processing head and the second laser processing head, and a positioning device is arranged in the camera module A camera and an observation camera, the positioning camera is used to measure the size of the diamond and identify the coordinates of the feature points, and the observation camera is used to observe the laser processing process in real time.

Preferably, the moving clamping part includes a main rail set on the top of the base, the main rail is located at the bottom of the bracket, and a bottom sliding platform is slidably connected to the main rail, and the bottom sliding platform is connected to the bottom sliding platform. A first drive assembly is arranged between the main rails, and a secondary guide rail is provided on the bottom slide table, the extension direction of the secondary guide rail is perpendicular to the extension direction of the main rail, and a horizontal rail is slidably connected to the secondary guide rail. A sliding table, a second driving assembly is arranged between the horizontal sliding table and the auxiliary guide rail, and a clamping assembly is arranged on the horizontal sliding table.

Preferably, the clamping assembly includes a polishing disc fixedly connected to the top of the slide table, the polishing disc is provided with a movable jaw and a fixed jaw, and the movable jaw is horizontally slidably connected to the polishing disc The top of the fixed claw is fixedly connected to the top of the polishing disc, and one end of the screw rod is horizontally connected to the fixed claw, and the screw rod passes through the movable claw and drives with the claw. connect.

A method for ultrafast laser polishing diamonds, preferably, the operation steps include:

S1. Setting of cutting parameters, operating the upper computer, setting the polishing surface of the diamond into several processing layers according to the process requirements, and setting the processing parameters of the laser generating part in each corresponding processing layer;

S2, galvanometer calibration, operate the host computer, set the calibration parameters, calibration area size, depiction size, maximum deviation value and light parameters on the basis of the calibration file of the galvanometer factory, and complete a scan. Generate a new calibration file in the machine, and then change the position or material on the basis of the new calibration file, repeat the above steps, and execute repeated generation applications until the offset value meets the requirements;

S3, clamping the diamond, clamping the processed diamond in the movable clamping part;

S4. Visual monitoring setting, use the host computer to extract and understand the three-dimensional image of the processed diamond, use the visual monitoring department to scan and detect the geometric size, shape and surface properties of the processed diamond, and use the host computer to monitor the processing process. monitoring and control;

S5. Diamond polishing. Operate the host computer to make the optical path integration emission unit start to polish the diamond surface.

Compared with the prior art, the present invention has the following advantages and technical effects: the main function of the workbench is to carry the optical path integrated emitting unit and the visual monitoring part, so that the relative position between the optical path integrated emitting unit and the visual monitoring part is always kept stable; The main function of the laser generator is to stably emit picosecond or femtosecond laser beams; the main function of the optical path integration transmitter is to integrate the laser emitted from the laser generator and guide the laser to the processed surface of the diamond to realize the smoothness of the polishing operation. The main function of the visual monitoring department is to measure the size of the diamond and monitor the polished surface in real time during the polishing process; the main function of the mobile clamping department is to clamp the processed diamond and move the diamond during the polishing process position so that the target surface can be polished evenly. On the whole, the present invention can be applied to diamond polishing work of various textures, and has a wide application range. At the same time, real-time monitoring and closed-loop feedback can be carried out on the polishing process, so that the polished surface of diamonds has high precision and good quality.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

Fig. 1 is the rear view structure schematic diagram of diamond polishing equipment of the present invention;

Fig. 2 is the front view structural representation of diamond polishing equipment of the present invention;

Fig. 3 is a front sectional view of the clamping assembly according to Embodiment 1 of the present invention;

4 is a schematic diagram of the first drive assembly of the present invention;

5 is a schematic diagram of a second drive assembly of the present invention;

Fig. 6 is the schematic diagram of height control assembly of the present invention;

Fig. 7 is a top view of the visual monitoring part of the present invention;

Fig. 8 is a front sectional view of the clamping assembly according to Embodiment 2 of the present invention;

Among them, 1. Base; 2. Bracket; 3. Workbench; 4. Ultrafast laser; 5. First laser processing head; 6. Second laser processing head; 7. Camera module; 8. Positioning camera; 9. Observation Camera; 10. Main guide rail; 11. Bottom slide table; 12. Sub guide rail; 13. Horizontal slide table; 14. Polishing disc; , constant temperature water tank; 20, infrared temperature sensor; 21, control circuit; 22, flow valve; 23, circulation pump; 24, host computer; 25, collimator mirror; 26, beam expander mirror; 27, focusing mirror; Claw; 30, screw mandrel; 31, the first rack; 32, the second rack; 33, the first motor; 34, the first gear; 35, the second motor; 36, the second gear; 37, vertical slide Rail; 38, the third rack; 39, the third motor; 40, the third gear.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Embodiment one:

Shown with reference to Fig. 1-7, the present invention provides a kind of ultrafast laser polishing diamond equipment, comprising:

A base 1, a support 2 is fixedly connected to the base 1, a workbench 3 is vertically slidably connected to the support 2, and a height control component is arranged on the workbench 3 and the support 2;

Laser generating part, the laser generating part is arranged on the bracket 2, and is used to generate laser for polishing diamonds;

The optical path integrated transmitting unit, which is arranged on the bracket 2 and the workbench 3, is used to adjust the laser beam emitted by the ultrafast laser generating part and guide the conditioned laser beam to the surface of the polished diamond;

Visual monitoring department, the visual monitoring department is arranged on the workbench 3, and is used for dynamic monitoring of the polishing process;

The mobile clamping part is arranged on the base 1, and the mobile clamping part is used to fasten the diamond and move the position of the diamond during the polishing process;

The upper computer 24 is used to control the operation of the laser generating part, the optical path integration emission unit, the visual monitoring part and the moving clamping part.

The main function of the workbench 3 is to carry the optical path integrated emission unit and the visual monitoring part, so that the relative position between the optical path integrated emission unit and the visual monitoring part is always stable; the main function of the laser generating part is to stably emit picosecond or femtosecond Laser beam; the main function of the optical path integration emission part is to integrate the laser emitted from the laser generating part, and guide the laser light to the processed surface of the diamond to realize the polishing operation; the main function of the visual monitoring part is to measure the size of the diamond, And during the polishing process, real-time image monitoring is carried out on the polished surface; the main function of the moving clamping part is to clamp the processed diamond, and move the position of the diamond during the polishing process, so that the target surface can be evenly polished. On the whole, the present invention can be applied to diamond polishing work of various textures, and has a wide application range. At the same time, real-time monitoring and closed-loop feedback can be carried out on the polishing process, so that the polished surface of diamonds has high precision and good quality.

To further optimize the scheme, the height control assembly includes a vertical slide rail 37 fixedly connected to the side wall of the support 2, the workbench 3 is slidably connected to the vertical slide rail 37, a third motor 39 is fixedly connected to the side wall of the workbench 3, and the support 2 A third rack 38 is vertically fixedly connected to the side wall of the third motor 39 , and a third gear 40 is fixedly sleeved on the output shaft of the third motor 39 , and the third gear 40 meshes with the third rack 38 .

As shown in Figure 6, when the height of the workbench 3 needs to be adjusted, the upper computer 24 controls the rotation of the third motor 39, and the rotation of the third motor 39 drives the rotation of the third gear 40, and the rotation of the third gear 40 passes through the rotation of the third rack. The meshing transmission of 38 drives the workbench 3 to adjust the height.

To further optimize the scheme, the laser generating part includes an ultrafast laser 4, which is fixedly connected to the top of the bracket 2, and the ultrafast laser 4 is used to generate femtosecond-level ultra-narrow pulse laser, and the laser emitting end of the ultrafast laser 4 is connected to the The incident end of the optical path integration emitting unit is connected.

The ultrafast laser 4 is an ultrafast femtosecond laser.

In a further optimization scheme, the optical path integrated emission unit includes a first laser processing head 5 and a second laser processing head 6 fixedly connected to the bottom of the workbench 3, the output end of the first laser processing head 5 and the output end of the second laser processing head 6 Corresponding to the processed surface of the diamond respectively, an optical path integration part is arranged between the ultrafast laser 4 and the first laser processing head 5 and the second laser processing head 6, and the optical path integration part is used for the laser light emitted by the ultrafast laser 4. beam to adjust.

To further optimize the scheme, the optical path integration part includes a collimator mirror 25, a beam expander mirror 26 and a focusing mirror 27 fixedly connected to the workbench 3, and the incident end of the beam expander mirror 26 is set correspondingly to the output end of the ultrafast laser 4 for changing The diameter and divergence angle of the laser beam that ultrafast laser 4 sends out, the incident end of collimator mirror 25 and the outgoing end of beam expander mirror 26 are arranged correspondingly, are used for maintaining the collimation property of laser light speed, and focusing mirror 27 is correspondingly arranged at collimation Between the mirror 25 and the first laser processing head 5 and the second laser processing head 6, the focusing mirror 27 is used to focus the laser on the surface of the diamond to realize laser energy concentration.

Under the cooperation of the first laser processing head 5 and the second laser processing head 6 with the focusing mirror 27 , the laser spots formed are focused differently, and can perform targeted polishing for diamond materials of different textures. The laser beam that ultrafast laser 4 sends enters in the beam expander 26, because the laser beam that ultrafast laser 4 sends has divergence and bending phenomenon unavoidably in the propagation process, after passing through beam expander 26, the laser beam The divergence angle is changed, while diffraction phenomena can be suppressed and the degree of bending of the beam reduced. The laser beam propagating from the beam expander 26 enters the collimating mirror 25, and the collimating mirror 25 is used to maintain the collimation before the beam enters the focusing mirror 27. After the laser beam enters the focusing mirror 27, the focusing mirror 27 The laser can be focused with different spot sizes, so that after the beam is emitted from the first laser processing head 5 or the second laser processing head 6 to the diamond surface, it forms a focus on the diamond surface, thereby realizing the polishing of the diamond surface by the laser.

To further optimize the solution, the visual monitoring part includes a camera module 7 fixedly connected to the bottom of the workbench 3. The camera module 7 is arranged side by side with the first laser processing head 5 and the second laser processing head 6. The camera module 7 is provided with a positioning camera 8 and The observation camera 9 and the positioning camera 8 are used to measure the size of the diamond and identify the coordinates of the feature points, and the observation camera 9 is used to observe the laser processing process in real time.

As shown in Figure 7, the positioning camera 8 adopts a 5 million pixel, digital CCD camera, which can measure the geometric size and shape of the diamond before and during the diamond processing, and identify the feature point position coordinates, so that The size of the actual diamond is compared with the three-dimensional image imported into the host computer 24, and the processing parameters are adjusted in real time. The measurement accuracy of the positioning camera 8 can reach 1um. The observation camera 9 is a 5 million pixel, digital CCD camera, which can observe the laser processing process in real time during the diamond polishing process.

Further optimization scheme, the mobile clamping part includes the main rail 10 set on the top of the base 1, the main rail 10 is located at the bottom of the bracket 2, the main rail 10 is slidably connected with the bottom slide 11, between the bottom slide 11 and the main rail 10 A first drive assembly is provided, and a secondary guide rail 12 is provided on the bottom slide table 11, the extending direction of the secondary guide rail 12 is perpendicular to the extending direction of the main guide rail 10, and a horizontal slide table 13 is slidably connected to the secondary guide rail 12, and the horizontal slide table 13 A second driving assembly is arranged between the auxiliary guide rail 12 and a clamping assembly is arranged on the slide table 13 .

In a further optimization solution, the first drive assembly includes a first motor 33 fixedly connected to the bottom of the bottom slide 11 and a first rack 31 fixedly connected to the top of the base 1, the output shaft of the first motor 33 is coaxial The fixed sleeve is provided with a first gear 34 , and the first gear 34 is meshed with the first rack 31 .

In a further optimization solution, the second drive assembly includes a second motor 35 fixedly connected to the bottom of the slide table 13 and a second rack 32 fixedly connected to the top of the bottom slide table 11, the output shaft of the second motor 35 is on the same The axis fixed sleeve is provided with a second gear 36 , and the second gear 36 meshes with the second rack 32 .

As shown in Fig. 4 and Fig. 5, in the process of polishing the diamond, by adjusting the horizontal position of the slide table 13, the position of the polishing disc 14 can be driven to move, thereby adjusting the polished surface of the diamond. When the horizontal position of the slide table 13 needs to be adjusted, the upper computer 24 controls the rotation of the first motor 33, and the rotation of the first motor 33 drives the rotation of the first gear 34. , driving the bottom sliding table 11 to drive the horizontal sliding table 13 to move along the X direction. Similarly, the host computer 24 controls the rotation of the second motor 35 , and the second motor 35 moves the slide table 13 along the Y direction through the transmission between the second gear 36 and the second rack 32 .

In a further optimization scheme, the clamping assembly includes a polishing disc 14 fixedly connected to the top of the slide table 13, the polishing disc 14 is provided with a movable jaw 15 and a fixed jaw 29, and the movable jaw 15 is horizontally slidably connected to the top of the polishing disc 14 , the fixed claw 29 is fixedly connected to the top of the polishing disc 14, and one end of the screw rod 30 is connected to the fixed claw 29 for horizontal rotation.

As shown in Figure 3, the end of the screw mandrel 30 away from the fixed claw 29 is fixedly connected with a hand wheel. The rotation can drive the movable jaw 15 to move away from the fixed jaw 29 on the polishing disc 14 through screw transmission, so that the distance between the movable jaw 15 and the fixed jaw 29 increases. Place the diamond between the movable jaw 15 and the fixed jaw 29, turn the hand wheel in the opposite direction, so that the movable jaw 15 moves toward the direction close to the fixed jaw 29, and clamp the diamond between the movable jaw 15 and the fixed jaw Between 29.

An ultrafast laser polishing diamond method, further optimizing the scheme, the operation steps include:

S1, cutting parameter setting, operate the upper computer 24, set the polished surface of the diamond into several processing layers according to the process requirements, and set the processing parameters of the laser generating part in each corresponding processing layer;

Operate the host computer 24 to divide the diamond surface to be processed in three-dimensional graphics into several processing layers in the system. For each layer in the control system, set the laser energy size of the ultrafast laser 4, the light output frequency, the pulse width of the laser, the laser focus height compensation value, the number of repeated cutting of a single bump, the number of turns of all bumps, Galvanometer scan speed, galvanometer jump speed, galvanometer jump delay, laser on delay and laser off delay.

S2, galvanometer calibration, operate the upper computer 24, on the basis of the galvanometer factory calibration file, set the calibration parameters, calibration area size, depiction size, maximum deviation and light parameters, and complete a scan. A new correction file is generated in the upper computer 24, and on the basis of the new correction file, the position or material is changed, the above steps are repeated, and the repeated generation application is executed until the offset value meets the requirements;

Operate the host computer 24 to make corrections through 3×3, 5×5, 7×7 and other array circles. Set the size of the correction area, the value is usually set to 45mm, set the maximum deviation value, and automatically stop scanning when the deviation value is less than or equal to the maximum deviation value during automatic galvanometer calibration. Manually draw the array circle under the first laser processing head 5 or the second laser processing head 6. The marking position can be selected in the host computer 24. It can be drawn at the position of the two laser processing heads, or it can be drawn back to the zero position. . .

For the first calibration, choose to describe a 3×3 array circle, operate the upper computer 24, and the diamond polishing equipment of the present invention will automatically run to identify 9 points, and generate a calibration file; change the position and material of the description, and choose to describe a 5×5 array Circle, operate the host computer 24 to refer to the newly generated calibration file, automatically identify 25 points, and generate a new calibration file again; repeat the above process, sequentially depict 7×7, 11×11 and other array circles, and generate calibration files in sequence, until the displayed offset value meets the requirement.

S3, clamping the diamond, clamping the processed diamond in the movable clamping part;

S4, visual monitoring setting, use the upper computer 24 to extract and understand the three-dimensional image of the processed diamond, use the visual monitoring department to scan and detect the geometric size, shape and surface properties of the processed diamond, and use the upper computer 24 to process process monitoring and control;

The three-dimensional image of the diamond is imported into the upper computer 24, and the image is subjected to feature recognition. Through the positioning camera 8, the feature point coordinate identification and size measurement of the diamond object are carried out, and the scanned image is compared with the three-dimensional image, which is convenient for monitoring and identification of the polishing process.

S5. Diamond polishing. Operate the host computer 24 to make the optical path integration emission unit start to polish the diamond surface.

During the polishing process, the upper computer 24 monitors the size of the polished surface in real time by controlling the positioning camera 8, and compares it with the three-dimensional image to monitor the processing progress; The trajectory of the laser processing head and the surface of the diamond are monitored and observed in real time.

Embodiment two

The difference between this embodiment and Embodiment 1 is that a water chamber 16 is provided in the polishing disc 14, a water channel 17 is respectively provided in the fixed jaw 29 and the movable jaw 15, and the water channel 17 and the water chamber 16 in the fixed jaw 29 Direct communication, the water channel 17 in the moving claw 15 is connected with the water chamber 16 through a hose 18, one end of the water chamber 16 is connected to the water inlet end of the constant temperature water tank 19 through a pipeline, and the water outlet end of the constant temperature water tank 19 is connected to a circulation The water inlet end of the pump 23 and the water outlet end of the circulating pump 23 communicate with the other end of the water chamber 16 through the flow valve 22. An infrared temperature sensor 20 is arranged in the constant temperature water tank 19. The infrared temperature sensor 20, the circulating pump 23 and the flow valve 22 are respectively The electric wire is connected with the control circuit 21 .

As shown in Fig. 8, due to the heat generated during the polishing process, if the temperature of the jig is too high, thermal expansion and deformation will result, resulting in a decrease in polishing accuracy. Therefore, when polishing diamonds, it is necessary to cool down the strengthening components. Concretely, during the diamond polishing process, the circulating pump 23 operates to circulate the water in the constant temperature water tank 19 between the circulating pump 23, the flow valve 22, the water cavity 16 and two groups of water channels 17, and the polishing disc 14, The heat on the fixed jaw 29 and the movable jaw 15 is taken away and dissipated in the constant temperature water tank 19, the control circuit 21 controls the infrared temperature sensor 20 to monitor the temperature of the polishing disc 14, the fixed jaw 29 and the movable jaw 15, When the temperature is too high, the control circuit 21 controls the opening of the flow valve 22 to increase, and increases the flow rate of the constant temperature water to accelerate the speed of heat removal; when the infrared temperature sensor 20 detects that the temperature is low, the control circuit 21 controls The opening degree of the flow valve 22 is reduced to slow down the water flow velocity, thereby slowing down the heat removal speed.

In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or It should not be construed as limiting the invention by implying that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation.

The above-mentioned embodiments are only to describe the preferred mode of the present invention, and are not intended to limit the scope of the present invention. Variations and improvements should fall within the scope of protection defined by the claims of the present invention.

Claims (8)

1. An ultrafast laser polished diamond apparatus, comprising:

the device comprises a base (1), wherein a support (2) is fixedly connected to the base (1), a workbench (3) is vertically and slidably connected to the support (2), and a height control assembly is arranged between the workbench (3) and the support (2);

a laser generating part which is arranged on the bracket (2) and is used for generating laser for polishing diamond;

the optical path integration emission unit is arranged on the bracket (2) and the workbench (3) and is used for adjusting the laser beam emitted by the ultrafast laser generation part and guiding the quenched and tempered laser beam to the surface of the polished diamond;

the visual monitoring part is arranged on the workbench (3) and is used for dynamically monitoring the polishing process;

the movable clamping part is arranged on the base (1) and is used for fastening the diamond and moving the diamond position in the polishing process;

the upper computer (24) is used for controlling the operation of the laser generating part, the light path integration transmitting unit, the visual monitoring part and the movable clamping part.

2. An ultrafast laser polishing diamond apparatus according to claim 1, wherein: the laser generating part comprises an ultrafast laser (4), the ultrafast laser (4) is fixedly connected to the top of the support (2), the ultrafast laser (4) is used for generating femtosecond-level ultranarrow pulse laser, and the laser emitting end of the ultrafast laser (4) is communicated with the incident end of the optical path integration emitting unit.

3. An ultrafast laser polishing diamond apparatus according to claim 2, wherein: the optical path integration transmitting unit comprises a first laser processing head (5) and a second laser processing head (6) which are fixedly connected to the bottom of the workbench (3), the emergent end of the first laser processing head (5) and the emergent end of the second laser processing head (6) are respectively and correspondingly arranged with the processed surface of the diamond, an optical path integration part is arranged between the ultrafast laser (4) and the first laser processing head (5) and the second laser processing head (6), and the optical path integration part is used for adjusting the laser beam emitted by the ultrafast laser (4).

4. An ultrafast laser polishing diamond apparatus according to claim 3, wherein: the optical path integration part comprises a collimating lens (25), a beam expanding lens (26) and a focusing lens (27) which are fixedly connected to the workbench (3), wherein the incident end of the beam expanding lens (26) is correspondingly arranged with the emergent end of the ultrafast laser (4) and is used for changing the diameter and the divergence angle of a laser beam emitted by the ultrafast laser (4), the incident end of the collimating lens (25) is correspondingly arranged with the emergent end of the beam expanding lens (26) and is used for maintaining the collimation of the laser light speed, the focusing lens (27) is correspondingly arranged between the collimating lens (25) and the first laser processing head (5) and the second laser processing head (6), and the focusing lens (27) is used for focusing laser on the surface of a diamond and realizing laser energy aggregation.

5. An ultrafast laser polishing diamond apparatus according to claim 3, wherein: the visual monitoring part comprises a camera module (7) fixedly connected to the bottom of the workbench (3), the camera module (7) is arranged side by side with the first laser processing head (5) and the second laser processing head (6), a positioning camera (8) and an observing camera (9) are arranged in the camera module (7), the positioning camera (8) is used for carrying out dimension measurement and characteristic point coordinate identification on diamonds, and the observing camera (9) is used for observing the laser processing process in real time.

6. An ultrafast laser polishing diamond apparatus according to claim 1, wherein: the movable clamping part comprises a main guide rail (10) arranged at the top of the base (1), the main guide rail (10) is arranged at the bottom of the support (2), a bottom sliding table (11) is connected to the main guide rail (10) in a sliding manner, a first driving assembly is arranged between the bottom sliding table (11) and the main guide rail (10), an auxiliary guide rail (12) is arranged on the bottom sliding table (11), the extending direction of the auxiliary guide rail (12) is perpendicular to the extending direction of the main guide rail (10), a transverse sliding table (13) is connected to the auxiliary guide rail (12) in a sliding manner, a second driving assembly is arranged between the transverse sliding table (13) and the auxiliary guide rail (12), and a clamping assembly is arranged on the transverse sliding table (13).

7. The ultra-fast laser polished diamond apparatus according to claim 6, wherein: the clamping assembly comprises a polishing disc (14) fixedly connected to the top of the transverse sliding table (13), a movable claw (15) and a fixed claw (29) are arranged on the polishing disc (14), the movable claw (15) is horizontally and slidably connected to the top of the polishing disc (14), the fixed claw (29) is fixedly connected to the top of the polishing disc (14), one end of a screw rod (30) is horizontally and rotatably connected to the fixed claw (29), and the screw rod (30) penetrates through the movable claw (15) and is in transmission connection with the claw (15).

8. An ultrafast laser polishing diamond method, as recited in claim 1, wherein the operating steps include:

s1, setting cutting parameters, operating an upper computer (24), setting a polished surface of a diamond into a plurality of processing layers according to process requirements, and setting processing parameters of a laser generating part in each corresponding processing layer;

s2, correcting the vibrating mirror, operating an upper computer (24), setting correction parameters, correction area size, characterization size, maximum deviation value and light emitting parameters on the basis of the vibrating mirror delivery correction file, completing one scanning, generating a new correction file in the upper computer (16) every time the scanning is completed, changing positions or materials on the basis of the new correction file, repeating the steps, and executing repeated generation application until the deviation value reaches the requirement;

s3, clamping the diamond, and clamping the processed diamond in the movable clamping part;

s4, visual monitoring setting, namely extracting and understanding a three-dimensional image of the processed diamond by using an upper computer (16), scanning and detecting geometric dimension, shape and surface attribute of the processed diamond by using a visual monitoring part, and monitoring and controlling the processing process by using the upper computer (16);

s5, diamond polishing, and operating the upper computer (24) to enable the light path integration transmitting unit to start polishing the diamond surface.

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