CN207888077U - A kind of infrared picosecond laser diamond cut equipment of 1064nm - Google Patents
A kind of infrared picosecond laser diamond cut equipment of 1064nm Download PDFInfo
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- CN207888077U CN207888077U CN201721651993.4U CN201721651993U CN207888077U CN 207888077 U CN207888077 U CN 207888077U CN 201721651993 U CN201721651993 U CN 201721651993U CN 207888077 U CN207888077 U CN 207888077U
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- laser
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- control system
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- picosecond laser
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Abstract
The utility model discloses a kind of infrared picosecond laser diamond cut equipment of 1064nm, including rack, power supply, optical transmission system, Machinery Control System, imaging system, dust collecting system, temperature system and control system；On power frame；Optical transmission system includes Laser Power Devices, laser, beam expanding lens, 45 degree of speculums, cutting heads；Machinery Control System includes lifting platform, fixture, two-dimentional work bench；Laser uses infrared picosecond laser；The optical transmission system, Machinery Control System, imaging system, dust collecting system, temperature system, power supply are electrically connected with control system.The utility model realizes the cold working of material using ultrafast, very high peak power picosecond laser, carries out atom level processing by the internuclear generation Coulomb force of atom, does not generate fusant, carbonization, oxidation or other complex compounds, section is totally concordant, non-microcracked.
Description
Technical field
This patent is related to the fields such as laser processing technology, more particularly to a kind of infrared picosecond laser diamond cuts of 1064nm are set
It is standby.
Background technology
Diamond is diamond original stone only by being formed after cutting and process, therefore, for diamond cut and plus
Work mode influences the brilliance and quality of diamond, and cut and process in also need to keep the maximum weight of diamond as possible
Amount, and reduce flaw.Include in the prior art designing, mark, cut, roughly grind and polishing several steps for the process of diamond
Suddenly.For the step for cutting, currently used method is the cutting of turntable piece, and diamond is by being adhered to other brills of turntable on piece
Stone or diamond powder are machined, and in process-part diamond becomes diamond powder.And traditional processing side
Method, machining accuracy is poor, and spillage of material is big, complicated for operation, can not obtain desired proportions sum number purpose diamond, needs to consider diamond sheet
The mechanical performance of the direction of growth and diamond of body in process.
Laser processing is maximum project in domestic and international laser application, and to the important means of Transform of Traditional Industrial Equipment, main
Realize cutting, welding, cladding, punching, engraving and the heat treatment etc. to a variety of materials.Laser processing is used as to be developed nearly ten years
The multi-crossed disciplines application technology got up, in computer technology, material science, laser technology, Numeric Control Technology and detection technique
On the basis of fully developed, the material processing method of development.Due to the brittleness of diamond material itself, infrared laser it is prolonged
Thermal stress caused by irradiation is easy that diamond material is made to generate irregular crackle.355nm ultraviolet lights also are difficult to make because of power limited
The chemical bond of quartz material is broken.And ultrafast laser, there is higher peak power and pulse frequency, be diamond cut light
The good selection in source.Existing laser cutting technique major part cutting speed is slow and time-consuming, and cannot meet volume production demand
Problem, and that also there are finish the surface that is cut into through laser beam is bad, these problems be those skilled in the art urgently
It solves.
Utility model content
In view of this, the utility model is directed to a kind of infrared picosecond laser diamond cut equipment of 1064nm, this practicality
It is novel using ultrafast, very high peak power picosecond laser realize material cold working, by the internuclear generation Coulomb force of atom into
Row atom level is processed, and does not generate fusant, carbonization, oxidation or other complex compounds, section is totally concordant, non-microcracked.
The infrared picosecond laser diamond cut equipment of a kind of 1064nm in the utility model, specifically includes rack, power supply, light
Learn Transmission system, Machinery Control System, imaging system, dust collecting system, temperature system and control system；In power supply (3) rack；Light
It includes Laser Power Devices (4), laser (7), beam expanding lens (8), 45 degree of speculums (11), cutting head (13) to learn Transmission system；Machinery
Control system includes lifting platform (12), fixture (14), two-dimentional work bench (15)；Laser (7) uses infrared picosecond laser；Institute
Optical transmission system, Machinery Control System, imaging system, dust collecting system, temperature system, power supply is stated to be electrically connected with control system.
Further, rack (17) is provided with upper layer and lower layer, and rack upper layer is provided with the through-hole knot that can be used for work piece cut
Structure.
Further, Laser Power Devices (4) are set to rack upper layer, and Laser Power Devices (4) are electrically connected with laser (7)；Laser
Device (7) is set to the upper layer of rack, and laser (7) front end is equipped with beam expanding lens (8)；45 degree of speculums (11) are arranged by holder
In in rack, laser (7), beam expanding lens (8) and 45 degree of speculums (11) are set in same horizontal line.
Further, two-dimentional work bench (15) is set to the lower layer of rack (17), and two-dimentional work bench is equipped with folder on (15)
Tool, fixture are set to the underface of through-hole structure；Cutting head (13) is installed on the upper layer of rack by lifting platform (12).
Further, imaging system includes CCD (9), CCD camera lenses (10), and imaging system is installed on by holder in rack
Layer, and above through-hole structure.
Further, dust collecting system includes that dust catcher (2) and pipe of giving a dinner of welcome (6), dust catcher are set to the lower layer of rack, give a dinner of welcome
The lower end of pipe is connected with dust catcher, and the upper end for pipe of giving a dinner of welcome is extended at work piece cut station.
Further, control system includes computer (1) and control box (5), and computer (1) and control box (5) are installed on
In rack；Computer (1) is equipped with the software being cut by laser applied to diamond；Control box (5) include control card, High Speed I/O mouthfuls,
Industrial personal computer.
Further, laser (7) uses 1064nm as fundamental frequency light, using 1064nm as fundamental frequency light, by two times
Take place frequently out the laser of 1064nm wavelength.
A kind of above-mentioned infrared picosecond laser diamond cut equipment progress added diamonds of 1064nm are utilized the present invention also provides a kind of
The method of work, includes the following steps：The diamond cut is folded in fixture (14), cutting head (7) sends out laser,
What light beam passed through beam expanding lens successively expands effect, the reflex of 45 degree of speculums and the focussing force of cutting head (13) so that
The hot spot of high-energy density is in incision site always；Control system is controlled and is moved in X, Y-direction on two-dimentional work bench (15), directly
To the processing for completing diamond.
The advantages of 1064nm provided by the utility model infrared picosecond laser diamond cut equipment, is：
Compared with opposite conventional diamond cutting equipment and infrared laser cutting equipment, the utility model is used based on software
Infrared picosecond laser cutting equipment is cut instead of traditional turntable piece, is connect instead of traditional machinery with contactless processing method
It touches, to diamond without directly impacting in process, acts on workpiece without " cutting force ", therefore without mechanically deform, bored without considering
The mechanical performance of the direction of growth of stone crystal, diamond is also nothing serious, this allows for the polycrystalline that cannot be completed before can cutting
Diamond.It is worn simultaneously without " cutter " in process, reduces processing cost, maintenance cost is cheap.
The utility model realizes that the cold working of material, ultrashort pulse exist using ultrafast, very high peak power picosecond laser
Release energy decomposing material in the picosecond time, realizes the hot melt Physical Processing neither after common infrared laser light heating, again
Instead of nanosecond ultraviolet laser does not destroy the molecular level processing of molecular structure by photochemical reaction, and bombardment electronics makes the internuclear production of atom
The atom level processing of raw Coulomb force material removal, it is clean not generate fusant, carbonization, oxidation or other complex compounds, section
Concordantly, the problem of non-microcracked, remelting recrystallizes.Especially for the retrofit of the hard brittleness difficult-to-machine material such as diamond, tool
Whether there is or not heat affected area, without the advantages such as dross, non-microcracked.
Using the integral material loss ratio conventional method during diamond cut made from the technical solution of the utility model
Low close to 8 times, weight loss is few, the higher that diamond value is kept.Remnants are answered after fuel factor that process is subject to and cutting
Power is small, and cut surface is more straight, taper smaller, and joint-cutting is narrow, trimming is straight, while fuel factor is small, rupture probability is low, cutting surfaces
Smoothly；Workpiece will not generate big deformation because of processing, and the diamond accurate cutting high to hardness, brittleness is big can reduce incision
Tensile stress reduces crackle generation.Therefore workpiece will not generate big deformation because of processing, the diamond high to hardness, brittleness is big essence
Incision tensile stress can be reduced, reduce crackle generation by cutting closely.
Imaging system in the utility model uses high pixel industrial CCD camera, can to the profile of cutting object into
Row high quality is shot, and is amplified, clearly diamond picture, guiding user select cut surface number and percentage according to impurity situation
Than most preferably utilizing diamond, realizing optimal cutling processing, loss in weight is minimized, diamond is accurately cut in realization.
The device user interface of control system in the utility model is friendly, easy to operate, reduces the requirement to skilled worker,
Human error can be dropped to almost nil, qualification rate is high, will substantially increase the processing quality and efficiency of diamond.
Machinery Control System in the utility model uses high-precision flat moving stage system, and workpiece fortune is driven by servo motor
It is dynamic, there is high precision machining, machining reproducibility is good, high in machining efficiency, is suitble to modern allegro production requirement；Using multistation
Special fixture can process multiple diamonds simultaneously, save process time, improve production efficiency；Marble platform conduct is used simultaneously
Laser reference for installation and damping machine tool cushion block have enough intensity and rigidity, can under various operating modes and environment
Quickly, high-precision, the operation stablized.
Description of the drawings
Fig. 1 is the infrared picosecond laser diamond cut device structure schematic diagrams of 1064nm.
Specific implementation mode
The utility model is more specifically described in detail with reference to specific embodiment and Figure of description.
The infrared picosecond laser diamond cut equipment of 1064nm as shown in Figure 1, including rack, power supply, optical transmission system,
Machinery Control System, imaging system, dust collecting system, temperature system and control system.
Rack (17) is provided with upper layer and lower layer, for placing laser cutting device.Rack upper layer is provided with work piece cut work
Position, the through-hole structure that work piece cut station can have any shape, for realizing rack superstructure and rack understructure
Light path connects.In power supply (3) rack, reliable and stable power supply is provided for laser diamond blocking cutting equipment.Machine in the present embodiment
For frame using marble platform as laser reference for installation, rack leg is rebasing using damping machine tool cushion block.Rack can be laser
Cutting equipment provides intensity and rigidity, ensures that each parts are stablized in rack, it is ensured that equipment under various operating modes and environment quickly,
In high precision, the operation stablized.
Optical transmission system includes Laser Power Devices (4), laser (7), beam expanding lens (8), 45 degree of speculums (11), cutting heads
(13).Laser Power Devices (4) are the driving power needed for laser (7) provides.Laser Power Devices (4) are set to rack upper layer, laser
Power supply (4) is electrically connected with laser (7).Laser (7) is set to the upper layer of rack, and laser (7) front end is equipped with beam expanding lens
(8)；45 degree of speculums (11) are set to by holder in rack, and laser (7), beam expanding lens (8) and 45 degree of speculums (11) set
It is placed in same horizontal line.The laser that laser (7) is sent out is by beam expanding lens (8), 45 degree of speculums (11), cutting head (13) structure
At optical transmission system, respectively pass through collimator and extender, reflection, focusing, workpiece surface is directed to, for cutting diamond.This
In embodiment, laser (7) use uses full-solid-state red outer picosecond laser, sends out wavelength and is 1064nm, pulsewidth 15ps, is averaged
The laser of power 15W.Beam expanding lens (8), which is used to the laser of 1064 wavelength being transformed into, meets the laser light that diamond laser processing needs
Shape of spot, while laser is collimated, reduce the angle of divergence of laser beam so that the hot spot after focusing has smaller focusing light
Spot, higher power density.45 degree of speculums (11) transmit the laser reflection of horizontal transport at vertical, with horizontal positioned brill
Stone keeps approximately perpendicular relationship.The light beam that cutting head (13) will pass through beam expanding lens (8) collimation passes through lens focus, forms high energy
The hot spot of metric density so that focal point power density highest is processed for diamond.It is cut in addition, can be selected according to processing request
The different focal length of head (13), the focal length of lens is longer, and focus spot is bigger, and power density is lower, meanwhile, focal length depth of focus is big, effectively
Cut coverage is big, and operation permission is big.
Machinery Control System includes lifting platform (12), fixture (14), two-dimentional work bench (15).The two-dimentional work bench (15)
Be set to the lower layer of rack, fixture be installed on two-dimentional work bench (15), fixture be set to the underface of work piece cut station and
Fixture can adjust the position of its horizontal direction by two-dimentional work bench.Lifting platform is installed on the work piece cut station on the upper layer of rack
Place, cutting head (13) are installed on the upper layer of rack by lifting platform (12), and lifting platform can be used for adjusting the vertical side of cutting head
To position.The fixture (14) for driving clamping to have diamond by the servo motor of workbench is moved in X, Y-direction；And the fortune of fixture
It is dynamic that laser is allow to process preset processing route on diamond.
Imaging system includes CCD (9), CCD camera lenses (10), and imaging system is installed on rack upper layer by holder, and is located at
In rack above work piece cut station so that imaging system can carry out high quality shooting to the profile of cutting object, be put
Greatly, clearly diamond picture.Control system guides user to select cut surface number and hundred according to impurity situation according to the picture of shooting
Divide ratio, most preferably utilize diamond, realizes optimal cutling processing, loss in weight is minimized, realize and diamond is accurately cut
It cuts.
Dust collecting system includes dust catcher (2), pipe of giving a dinner of welcome (6), and dust catcher is set to the lower layer of rack, the lower end for pipe of giving a dinner of welcome with
Dust catcher is connected, and the upper end for pipe of giving a dinner of welcome is extended at work piece cut station.During dust collecting system is for diamond cut
Dust, the smog of generation are adsorbed and are filtered, and are reduced the harm to operating personnel, are prevented the pollution of the environment.
Temperature control system includes cooling-water machine (16), and cooling-water machine is set to the lower layer of rack, and is located at two-dimentional work bench
(15) underface.The circulating cooling system of cooling-water machine (16) distributes big calorimetric for absorbing laser in energy conversion process
Amount makes crystalline material in laser, resonant cavity holding work in the normal temperature range, while ensureing device efficient rate and steady
Fixed operation.
Control system includes computer (1) and control box (5), and computer (1) and control box (5) are installed in rack.Meter
Calculation machine (1) is equipped with the software being cut by laser applied to diamond, which has document analysis, motion control, laser controlling, benefit
Repay the functions such as correction.Simultaneous computer is the primary window and means using digital control system, while being responsible for the devices such as control card
Communication, keeps function integrated, the final processing for realizing figure.Control box (5) includes various control cards, High Speed I/O mouthfuls, work
Control machine etc. is used for laser switch, energy hole and motion control, realizes high speed, efficient, high-precision cutting processing.
Operation principle in the utility model is：The diamond cut is folded in fixture (14), cutting head
(7) laser is sent out, laser is mapped to by laser and beam expanding lens level on 45 degree of speculums, and speculum reflects the laser light to cutting
In head (13), while control system control lifting platform (12) drives cutting head (13) to move up and down, the collimation after adjustment focusing
The position of light beam so that the hot spot of high-energy density is in incision site always, carries out diamond processing；Control system control simultaneously
It is moved in X, Y-direction on two-dimentional work bench (15), drives fixture (14) to be moved according to preset processing route, the movement of fixture makes
Preset processing route can be processed on diamond by obtaining laser；Processing until completing diamond.
The embodiment of the utility model is without being limited thereto, according to the above of the utility model, utilizes the general of this field
Logical technological know-how and customary means, under the premise of not departing from the utility model above-mentioned basic fundamental thought, the utility model may be used also
To make the modification, replacement or change of other diversified forms, all fall within the utility model rights protection scope.
Claims (8)
1. a kind of infrared picosecond laser diamond cut equipment of 1064nm, it is characterised in that：The equipment includes rack, power supply, optics
Transmission system, Machinery Control System, imaging system, dust collecting system, temperature system and control system；In power supply (3) rack；Optics
Transmission system includes Laser Power Devices (4), laser (7), beam expanding lens (8), 45 degree of speculums (11), cutting head (13)；Machinery control
System processed includes lifting platform (12), fixture (14), two-dimentional work bench (15)；Laser (7) uses infrared picosecond laser；It is described
Optical transmission system, Machinery Control System, imaging system, dust collecting system, temperature system, power supply are electrically connected with control system.
2. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Rack
(17) it is provided with upper layer and lower layer, rack upper layer is provided with the through-hole structure that can be used for work piece cut.
3. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Laser electricity
Source (4) is set to rack upper layer, and Laser Power Devices (4) are electrically connected with laser (7)；Laser (7) is set to the upper layer of rack, swashs
Light device (7) front end is equipped with beam expanding lens (8)；45 degree of speculums (11) are set to by holder in rack, and laser (7) expands
Mirror (8) and 45 degree of speculums (11) are set in same horizontal line.
4. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 2, it is characterised in that：Two-dimentional work
Make the lower layer that platform (15) is set to rack (17), fixture is installed on two-dimentional work bench (15), fixture is set to through-hole structure
Underface；Cutting head (13) is installed on the upper layer of rack by lifting platform (12).
5. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 2, it is characterised in that：Imaging system
System includes CCD (9), CCD camera lenses (10), and imaging system is installed on rack upper layer by holder, and above through-hole structure.
6. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Dust suction system
System includes that dust catcher (2) and pipe of giving a dinner of welcome (6), dust catcher are set to the lower layer of rack, and the lower end for pipe of giving a dinner of welcome is connected with dust catcher,
The give a dinner of welcome upper end of pipe is extended at work piece cut station.
7. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Control system
System includes computer (1) and control box (5), and computer (1) and control box (5) are installed in rack；Computer (1), which is equipped with, answers
Software for diamond laser cutting；Control box (5) includes control card, High Speed I/O mouthfuls, industrial personal computer.
8. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Laser
The laser sent out is 1064nm, pulsewidth 15ps, mean power 15W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721651993.4U CN207888077U (en) | 2017-12-01 | 2017-12-01 | A kind of infrared picosecond laser diamond cut equipment of 1064nm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721651993.4U CN207888077U (en) | 2017-12-01 | 2017-12-01 | A kind of infrared picosecond laser diamond cut equipment of 1064nm |
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| CN207888077U true CN207888077U (en) | 2018-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721651993.4U Active CN207888077U (en) | 2017-12-01 | 2017-12-01 | A kind of infrared picosecond laser diamond cut equipment of 1064nm |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111843237A (en) * | 2020-07-24 | 2020-10-30 | 广州三义激光科技有限公司 | Artificial diamond laser cutting process |
| CN111992897A (en) * | 2019-11-08 | 2020-11-27 | 济南金威刻科技发展有限公司 | Ultrafast femto second laser cutting machine |
-
2017
- 2017-12-01 CN CN201721651993.4U patent/CN207888077U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111992897A (en) * | 2019-11-08 | 2020-11-27 | 济南金威刻科技发展有限公司 | Ultrafast femto second laser cutting machine |
| CN111843237A (en) * | 2020-07-24 | 2020-10-30 | 广州三义激光科技有限公司 | Artificial diamond laser cutting process |
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