CN207888077U - A kind of infrared picosecond laser diamond cut equipment of 1064nm - Google Patents

Abstract

The utility model discloses a 1064nm infrared picosecond laser diamond cutting device, which comprises a frame, a power supply, an optical transmission system, a mechanical control system, an imaging system, a dust collection system, a temperature system and a control system; the power supply frame; the optical transmission system Including laser power supply, laser, beam expander, 45-degree mirror, cutting head; mechanical control system includes lifting table, fixture, two-dimensional workbench; laser adopts infrared picosecond laser; the optical transmission system, mechanical control system, imaging System, vacuum system, temperature system, power supply and control system are electrically connected. The utility model adopts ultra-fast and extremely high peak power picosecond laser to realize the cold processing of materials, and carries out atomic-level processing through Coulomb force generated between atomic nuclei, without producing melt, carbonization, oxidation or other complex compounds, and the cutting surface is clean and even, without microcracks.

Description

A 1064nm infrared picosecond laser diamond cutting equipment

technical field

This patent relates to the fields of laser processing technology and the like, in particular to a 1064nm infrared picosecond laser diamond cutting equipment.

Background technique

Diamonds are only formed after cutting and processing rough diamonds. Therefore, the cutting and processing methods of diamonds affect the brilliance and quality of diamonds, and it is necessary to maintain the maximum weight of diamonds during the cutting and processing process. , and reduce blemishes. The processing process for diamonds in the prior art includes several steps of designing, marking, cutting, rough grinding and polishing. As far as the cutting step is concerned, the currently commonly used method is turntable cutting. Diamonds are machined from other diamonds or diamond powder adhering to the turntable. During the processing, some diamonds become diamond powder. However, the traditional processing method has poor processing accuracy, large material loss, complicated operation, and cannot obtain the ideal proportion and number of diamonds. It is necessary to consider the growth direction of the diamond itself and the mechanical properties of the diamond during processing.

Laser processing is the largest project in laser applications at home and abroad, and it is also an important means of transforming traditional industries. It mainly realizes cutting, welding, cladding, drilling, engraving and heat treatment of various materials. As a multidisciplinary interdisciplinary application technology developed in the past ten years, laser processing is a material processing method developed on the basis of computer technology, material science, laser technology, numerical control technology and detection technology. Due to the brittleness of the diamond material itself, the thermal stress generated by the long-term irradiation of the infrared laser is likely to cause irregular cracks in the diamond material. The 355nm ultraviolet light is also difficult to break the chemical bonds of the quartz material due to the limited power. Ultrafast lasers, with their higher peak power and pulse frequency, are a good choice of light source for diamond cutting. Most of the existing laser cutting technologies are slow and time-consuming, and cannot meet the needs of mass production, and the surface cut by the laser beam also has poor finish. These problems are urgently to be solved by those skilled in the art .

Utility model content

In view of this, the utility model aims to propose a 1064nm infrared picosecond laser diamond cutting equipment. The utility model adopts an ultra-fast and extremely high peak power picosecond laser to realize cold processing of materials, and performs atomic-level cutting through the Coulomb force generated between atomic nuclei. Processing, without melting, carbonization, oxidation or other complex compounds, the cut surface is clean and even, without micro-cracks.

A 1064nm infrared picosecond laser diamond cutting device in the utility model specifically includes a frame, a power supply, an optical transmission system, a mechanical control system, an imaging system, a dust collection system, a temperature system and a control system; the power supply (3) frame Above; the optical transmission system includes a laser power supply (4), a laser (7), a beam expander (8), a 45-degree reflector (11), and a cutting head (13); the mechanical control system includes an elevating table (12), a fixture ( 14), the two-dimensional workbench (15); the laser (7) adopts an infrared picosecond laser; the optical transmission system, mechanical control system, imaging system, dust collection system, temperature system, power supply and control system are electrically connected.

Further, the frame (17) is provided with upper and lower layers, and the upper layer of the frame is provided with a through-hole structure that can be used for workpiece cutting.

Further, the laser power supply (4) is arranged on the upper layer of the frame, and the laser power supply (4) is electrically connected to the laser (7); the laser (7) is arranged on the upper layer of the frame, and a beam expander (8) is installed on the front end of the laser (7) ); the 45-degree reflector (11) is arranged on the frame through the bracket, and the laser (7), the beam expander (8) and the 45-degree reflector (11) are arranged on the same horizontal line.

Further, the two-dimensional workbench (15) is arranged on the lower floor of the frame (17), the two-dimensional workbench (15) is equipped with clamps, and the clamps are arranged directly below the through-hole structure; the cutting head (13) passes through the lifting platform (12) Installed on the upper layer of the rack.

Further, the imaging system includes a CCD (9) and a CCD lens (10), and the imaging system is installed on the upper layer of the frame through a bracket, and is located above the through-hole structure.

Further, the dust collection system includes a vacuum cleaner (2) and a dust cleaning pipe (6). The vacuum cleaner is arranged on the lower layer of the frame, the lower end of the dust cleaning pipe is connected with the vacuum cleaner, and the upper end of the dust cleaning pipe is extended to be arranged at the workpiece cutting station.

Further, the control system includes a computer (1) and a control box (5), and the computer (1) and the control box (5) are installed on the frame; the computer (1) is equipped with software applied to diamond laser cutting; the control box ( 5) Including control card, high-speed I/O port, industrial computer.

Further, the laser (7) adopts 1064nm as the fundamental frequency light, adopts 1064nm as the fundamental frequency light, and emits laser light with a wavelength of 1064nm after frequency doubling.

The present invention also provides a method for diamond processing using the above-mentioned 1064nm infrared picosecond laser diamond cutting equipment, comprising the following steps: clamping the diamond to be cut in the fixture (14), and the cutting head (7) emits laser light , the light beam sequentially passes through the beam expanding effect of the beam expander, the reflection effect of the 45-degree mirror, and the focusing effect of the cutting head (13), so that the high-energy-density light spot is always at the incision position; the control system controls the two-dimensional workbench (15 ) in the X and Y directions until the diamond processing is completed.

The advantages of the 1064nm infrared picosecond laser diamond cutting equipment provided by the utility model are:

Compared with traditional diamond cutting equipment and infrared laser cutting equipment, the utility model adopts software-based infrared picosecond laser cutting equipment to replace traditional turntable cutting, and replaces traditional mechanical contact with non-contact processing methods. There is no direct impact on the diamond, no "cutting force" on the workpiece, and therefore no mechanical deformation, no regard for the direction of diamond crystal growth, and no importance for the mechanical properties of the diamond, allowing the cutting of polycrystalline diamonds which could not have been done before. At the same time, there is no "knife" wear during the processing, which reduces the processing cost and the maintenance cost is low.

The utility model adopts ultra-fast and extremely high peak power picosecond laser to realize the cold processing of materials, and the ultrashort pulse releases energy to decompose the material within the time of picosecond level, so as to realize the physical processing of hot melt after ordinary infrared laser light heats up, It is not the molecular-level processing that nanosecond ultraviolet laser destroys the molecular structure by photochemical reaction, but the atomic-level processing that bombards electrons to generate Coulomb force between atomic nuclei to remove materials. It does not produce melt, carbonization, oxidation or other complex compounds, and the cut surface is clean and flat. Qi, no micro-cracks, remelting and recrystallization problems. Especially for the fine machining of hard and brittle difficult-to-machine materials such as diamonds, it has the advantages of no heat-affected zone, no dross, and no micro-cracks.

The overall material loss in the diamond cutting process obtained by adopting the technical solution of the utility model is nearly 8 times lower than that of the traditional method, the weight loss is small, and the diamond value is kept higher. The thermal effect during processing and the residual stress after cutting are small, the cutting surface is straighter, the taper is smaller, the slit is narrow, the cutting edge is straight, and the thermal effect is small, the probability of cracking is low, and the cutting surface is smooth; the workpiece will not be produced due to processing. Large deformation, precision cutting of diamonds with high hardness and high brittleness can reduce the tensile stress at the incision and reduce the occurrence of cracks. Therefore, the workpiece will not be greatly deformed due to processing, and the precision cutting of diamonds with high hardness and high brittleness can reduce the tensile stress at the incision and reduce the occurrence of cracks.

The imaging system in the utility model adopts a high-pixel industrial CCD camera, which can take high-quality pictures of the outline of the cutting object, obtain enlarged and clear diamond pictures, guide users to select the number and percentage of cutting surfaces according to the impurities, and make the best use of diamonds , to achieve optimal cutting processing, minimize weight loss, and achieve precise cutting of diamonds.

The equipment of the control system in the utility model has a friendly user interface and simple operation, which reduces the requirements for technicians, reduces human errors to almost zero, and has a high pass rate, which will greatly improve the diamond processing quality and efficiency.

The mechanical control system in the utility model adopts a high-precision translation platform system, and drives the workpiece to move through a servo motor. It has high processing precision, good processing repeatability, high processing efficiency, and is suitable for modern fast-paced production requirements; it adopts multi-station special fixtures , can process multiple diamonds at the same time, saving processing time and improving production efficiency; at the same time, the marble platform is used as the laser installation reference, and the shock-absorbing machine tool pad has sufficient strength and rigidity, and can be used in various working conditions and environments. It can run fast, high-precision and stable.

Description of drawings

Figure 1 is a schematic diagram of the structure of 1064nm infrared picosecond laser diamond cutting equipment.

Detailed ways

Below in conjunction with specific embodiment and accompanying drawing, the utility model is described in further detail.

The 1064nm infrared picosecond laser diamond cutting equipment shown in Figure 1 includes a frame, a power supply, an optical transmission system, a mechanical control system, an imaging system, a vacuum system, a temperature system and a control system.

The frame (17) is provided with upper and lower layers for placing laser cutting equipment. The upper layer of the frame is provided with a workpiece cutting station, and the workpiece cutting station can be a through-hole structure of any shape, which is used to realize the optical path connection between the upper layer structure of the frame and the lower layer structure of the frame. The power supply (3) on the frame is used for laser diamond cutting equipment to provide stable and reliable power supply. The frame in this embodiment uses a marble platform as the laser installation reference, and the legs of the frame use shock-absorbing machine tool pads for the bottom. The frame can provide strength and rigidity for the laser cutting equipment, ensure the stability of each component on the frame, and ensure the rapid, high-precision and stable operation of the equipment under various working conditions and environments.

The optical transmission system includes a laser power supply (4), a laser (7), a beam expander (8), a 45-degree reflector (11), and a cutting head (13). The laser power supply (4) provides the required driving power for the laser (7). The laser power supply (4) is arranged on the upper layer of the frame, and the laser power supply (4) is electrically connected to the laser (7). The laser (7) is arranged on the upper layer of the frame, and the front end of the laser (7) is equipped with a beam expander (8); the 45-degree reflector (11) is arranged on the frame by a bracket, and the laser (7), the beam expander (8 ) and the 45-degree reflector (11) are arranged on the same horizontal line. The laser light emitted by the laser (7) passes through the optical transmission system composed of the beam expander (8), the 45-degree mirror (11), and the cutting head (13), and is guided to the surface of the workpiece through collimation, beam expansion, reflection, and focusing respectively. , for cutting diamonds. In this embodiment, the laser (7) adopts an all-solid-state infrared picosecond laser, which emits laser light with a wavelength of 1064 nm, a pulse width of 15 ps, and an average power of 15 W. The beam expander (8) is used to transform the 1064 wavelength laser into a laser spot shape that meets the needs of diamond laser processing, and at the same time collimate the laser to reduce the divergence angle of the laser beam, so that the focused spot has a smaller focus Spot, higher power density. The 45-degree reflector (11) reflects the horizontally transmitted laser light into vertical transmission, and maintains an approximately vertical relationship with the horizontally placed diamonds. The cutting head (13) focuses the beam collimated by the beam expander (8) through a lens to form a high-energy-density spot, making the power density at the focal point the highest for diamond processing. In addition, different focal lengths of the cutting head (13) can be selected according to processing requirements. The longer the focal length of the lens, the larger the focal spot and the lower the power density. At the same time, the focal length and focal depth are large, the effective cutting range is large, and the operation tolerance is large.

The mechanical control system includes a lift table (12), a fixture (14), and a two-dimensional workbench (15). The two-dimensional workbench (15) is arranged on the lower floor of the frame, and a fixture is installed on the two-dimensional workbench (15). The fixture is arranged directly below the workpiece cutting station and the horizontal direction of the fixture can be adjusted by the two-dimensional workbench. s position. Lifting platform is installed in the workpiece cutting station place of the upper floor of frame, and cutting head (13) is installed in the upper floor of frame by lifting platform (12), and lifting platform can be used for adjusting the vertical position of cutting head. The servo motor of the worktable drives the jig (14) with diamonds to move in the X and Y directions; and the movement of the jig enables the laser to process a preset processing route on the diamond.

The imaging system includes a CCD (9) and a CCD lens (10). The imaging system is installed on the upper layer of the frame through a bracket, and is located above the workpiece cutting station on the frame, so that the imaging system can take high-quality images of the outline of the cutting object and obtain Enlarged, clear image of a diamond. According to the pictures taken, the control system guides the user to select the number and percentage of cutting facets according to the impurities, so as to make the best use of diamonds, realize optimal cutting processing, minimize weight loss, and realize precise cutting of diamonds.

The dust collection system includes a vacuum cleaner (2) and a dust cleaning pipe (6). The dust collector is arranged on the lower layer of the frame, the lower end of the dust cleaning pipe is connected with the vacuum cleaner, and the upper end of the dust cleaning pipe is extended and arranged at the workpiece cutting station. The dust suction system absorbs and filters the dust and smoke generated during the diamond cutting process, reducing the harm to operators and preventing environmental pollution.

The temperature control system includes a water chiller (16), and the water chiller is arranged on the lower floor of the frame and directly below the two-dimensional workbench (15). The circulating cooling system of the chiller (16) is used to absorb a large amount of heat emitted by the laser during energy conversion, so that the crystal material and the resonant cavity in the laser can be maintained within a normal temperature range, while ensuring high-efficiency and stable operation of the device.

The control system includes a computer (1) and a control box (5), and the computer (1) and the control box (5) are installed on the frame. The computer (1) is installed with software for diamond laser cutting, and the software has functions such as file analysis, motion control, laser control, and compensation correction. At the same time, the computer is the main window and means of using the numerical control system, and is also responsible for the communication of devices such as control cards, so as to integrate functions and finally realize the processing and processing of graphics. The control box (5) includes various control cards, high-speed I/O ports, industrial computer, etc., and is used for laser switching, energy control, and motion control to realize high-speed, high-efficiency, and high-precision cutting processing.

The working principle of the utility model is as follows: the diamond that needs to be cut is clamped in the fixture (14), the cutting head (7) emits laser light, and the laser beam is horizontally shot on the 45-degree reflector through the laser device and the beam expander, and the reflector Reflect the laser light into the cutting head (13), and at the same time, the control system controls the lifting table (12) to drive the cutting head (13) to move up and down, and adjust the position of the focused and collimated beam so that the high-energy-density light spot is always at the incision position , carry out diamond processing; at the same time, the control system controls the movement of the two-dimensional worktable (15) in the X and Y directions, and drives the fixture (14) to move according to the preset processing route. The movement of the fixture enables the laser to process preset diamonds on the diamond The processing route; until the processing of diamonds is completed.

The implementation of the utility model is not limited thereto. According to the above content of the utility model, the utility model can also make other Various forms of modification, replacement or change all fall within the protection scope of the utility model.

Claims (8)

1. a kind of infrared picosecond laser diamond cut equipment of 1064nm, it is characterised in that：The equipment includes rack, power supply, optics Transmission system, Machinery Control System, imaging system, dust collecting system, temperature system and control system；In power supply (3) rack；Optics Transmission system includes Laser Power Devices (4), laser (7), beam expanding lens (8), 45 degree of speculums (11), cutting head (13)；Machinery control System processed includes lifting platform (12), fixture (14), two-dimentional work bench (15)；Laser (7) uses infrared picosecond laser；It is described Optical transmission system, Machinery Control System, imaging system, dust collecting system, temperature system, power supply are electrically connected with control system.

2. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Rack (17) it is provided with upper layer and lower layer, rack upper layer is provided with the through-hole structure that can be used for work piece cut.

3. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Laser electricity Source (4) is set to rack upper layer, and Laser Power Devices (4) are electrically connected with laser (7)；Laser (7) is set to the upper layer of rack, swashs Light device (7) front end is equipped with beam expanding lens (8)；45 degree of speculums (11) are set to by holder in rack, and laser (7) expands Mirror (8) and 45 degree of speculums (11) are set in same horizontal line.

4. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 2, it is characterised in that：Two-dimentional work Make the lower layer that platform (15) is set to rack (17), fixture is installed on two-dimentional work bench (15), fixture is set to through-hole structure Underface；Cutting head (13) is installed on the upper layer of rack by lifting platform (12).

5. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 2, it is characterised in that：Imaging system System includes CCD (9), CCD camera lenses (10), and imaging system is installed on rack upper layer by holder, and above through-hole structure.

6. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Dust suction system System includes that dust catcher (2) and pipe of giving a dinner of welcome (6), dust catcher are set to the lower layer of rack, and the lower end for pipe of giving a dinner of welcome is connected with dust catcher, The give a dinner of welcome upper end of pipe is extended at work piece cut station.

7. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Control system System includes computer (1) and control box (5), and computer (1) and control box (5) are installed in rack；Computer (1), which is equipped with, answers Software for diamond laser cutting；Control box (5) includes control card, High Speed I/O mouthfuls, industrial personal computer.

8. the infrared picosecond laser diamond cut equipment of a kind of 1064nm according to claim 1, it is characterised in that：Laser The laser sent out is 1064nm, pulsewidth 15ps, mean power 15W.