CN116262307A - 波长光束耦合装置、直接二极管激光装置、以及激光加工机 - Google Patents

波长光束耦合装置、直接二极管激光装置、以及激光加工机 Download PDF

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Publication number
CN116262307A
CN116262307A CN202211612959.1A CN202211612959A CN116262307A CN 116262307 A CN116262307 A CN 116262307A CN 202211612959 A CN202211612959 A CN 202211612959A CN 116262307 A CN116262307 A CN 116262307A
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CN
China
Prior art keywords
wavelength
beams
polarized
polarization
laser
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Pending
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CN202211612959.1A
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English (en)
Chinese (zh)
Inventor
出岛范宏
大森雅树
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Nichia Corp
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Nichia Corp
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Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN116262307A publication Critical patent/CN116262307A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1086—Beam splitting or combining systems operating by diffraction only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/144—Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1866—Transmission gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lasers (AREA)
  • Semiconductor Lasers (AREA)
  • Laser Beam Processing (AREA)
CN202211612959.1A 2021-12-15 2022-12-15 波长光束耦合装置、直接二极管激光装置、以及激光加工机 Pending CN116262307A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-203147 2021-12-15
JP2021203147A JP7747961B2 (ja) 2021-12-15 2021-12-15 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Publications (1)

Publication Number Publication Date
CN116262307A true CN116262307A (zh) 2023-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211612959.1A Pending CN116262307A (zh) 2021-12-15 2022-12-15 波长光束耦合装置、直接二极管激光装置、以及激光加工机

Country Status (4)

Country Link
US (1) US12562551B2 (https=)
EP (1) EP4198614B1 (https=)
JP (2) JP7747961B2 (https=)
CN (1) CN116262307A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117139828B (zh) * 2023-09-19 2025-06-27 长沙麓邦光电科技有限公司 飞秒激光加工纳米泡结构的参数筛选方法
DE102024115357A1 (de) * 2024-06-03 2025-12-04 Precitec Gmbh & Co. Kg Vorrichtung zum Erzeugen eines nicht-diffraktiven Laserstrahls sowie Laserbearbeitungskopf mit derselben
CN120491328B (zh) * 2025-06-30 2026-02-13 剑芯光电(苏州)有限公司 一种基于分区调制与定制偏振元件的光斑整形装置及方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004139074A (ja) 1996-07-04 2004-05-13 Sanyo Electric Co Ltd カラー液晶表示装置およびカラーフィルター
US6192062B1 (en) 1998-09-08 2001-02-20 Massachusetts Institute Of Technology Beam combining of diode laser array elements for high brightness and power
FR2789767B1 (fr) 1999-02-15 2001-04-27 Photonetics Systeme optique retroreflechissant auto-aligne de filtrage en longueur d'onde, monochromateur et laser incorporant un tel systeme
AU4503300A (en) * 1999-05-07 2000-11-21 Digilens Inc. Image generating system
JP2002267951A (ja) 2001-03-09 2002-09-18 Ando Electric Co Ltd チューナブルフィルタ
JP2003114402A (ja) 2001-10-02 2003-04-18 Sumitomo Electric Ind Ltd 光合分波器およびその調整方法
JP2003149497A (ja) 2001-11-14 2003-05-21 Sumitomo Electric Ind Ltd 光信号処理部品
JP3951881B2 (ja) 2002-10-10 2007-08-01 住友電気工業株式会社 光部品
US20040080823A1 (en) 2002-10-10 2004-04-29 Sumitomo Electric Industries, Ltd. Optical element
US7233442B1 (en) * 2005-01-26 2007-06-19 Aculight Corporation Method and apparatus for spectral-beam combining of high-power fiber lasers
US9310560B2 (en) 2014-02-26 2016-04-12 TeraDiode, Inc. Systems and methods for multiple-beam laser arrangements with variable beam parameter product
US20180205197A1 (en) 2014-10-23 2018-07-19 TRUMPF Laser GmbH (TLS) Open-loop wavelength selective external resonator and beam combining system
KR102617183B1 (ko) 2017-11-01 2023-12-21 누부루 인크. 다중 kW 급 청색 레이저 시스템
CN112119549B (zh) 2018-05-18 2024-07-19 松下知识产权经营株式会社 直接二极管激光方式的激光振荡装置以及激光振荡装置的故障诊断方法
CN109490201B (zh) * 2018-11-06 2020-05-19 浙江大学 一种基于光束整形的结构光生成装置和方法

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Publication number Publication date
EP4198614B1 (en) 2024-03-13
JP2025172183A (ja) 2025-11-20
JP2023088438A (ja) 2023-06-27
JP7747961B2 (ja) 2025-10-02
US20230187907A1 (en) 2023-06-15
EP4198614A1 (en) 2023-06-21
US12562551B2 (en) 2026-02-24

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