JP7747961B2 - 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機 - Google Patents

波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Info

Publication number
JP7747961B2
JP7747961B2 JP2021203147A JP2021203147A JP7747961B2 JP 7747961 B2 JP7747961 B2 JP 7747961B2 JP 2021203147 A JP2021203147 A JP 2021203147A JP 2021203147 A JP2021203147 A JP 2021203147A JP 7747961 B2 JP7747961 B2 JP 7747961B2
Authority
JP
Japan
Prior art keywords
wavelength
polarized
beams
laser
diffraction grating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021203147A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023088438A5 (https=
JP2023088438A (ja
Inventor
範宏 出島
雅樹 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2021203147A priority Critical patent/JP7747961B2/ja
Priority to EP22212116.2A priority patent/EP4198614B1/en
Priority to US18/063,815 priority patent/US12562551B2/en
Priority to CN202211612959.1A priority patent/CN116262307A/zh
Publication of JP2023088438A publication Critical patent/JP2023088438A/ja
Publication of JP2023088438A5 publication Critical patent/JP2023088438A5/ja
Priority to JP2025154481A priority patent/JP2025172183A/ja
Application granted granted Critical
Publication of JP7747961B2 publication Critical patent/JP7747961B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1086—Beam splitting or combining systems operating by diffraction only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/144—Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1866—Transmission gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lasers (AREA)
  • Semiconductor Lasers (AREA)
  • Laser Beam Processing (AREA)
JP2021203147A 2021-12-15 2021-12-15 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機 Active JP7747961B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021203147A JP7747961B2 (ja) 2021-12-15 2021-12-15 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機
EP22212116.2A EP4198614B1 (en) 2021-12-15 2022-12-08 Wavelength beam combining device, direct diode laser device, and laser processing machine
US18/063,815 US12562551B2 (en) 2021-12-15 2022-12-09 Wavelength beam combining device, direct diode laser device, and laser processing machine
CN202211612959.1A CN116262307A (zh) 2021-12-15 2022-12-15 波长光束耦合装置、直接二极管激光装置、以及激光加工机
JP2025154481A JP2025172183A (ja) 2021-12-15 2025-09-17 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021203147A JP7747961B2 (ja) 2021-12-15 2021-12-15 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025154481A Division JP2025172183A (ja) 2021-12-15 2025-09-17 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Publications (3)

Publication Number Publication Date
JP2023088438A JP2023088438A (ja) 2023-06-27
JP2023088438A5 JP2023088438A5 (https=) 2024-11-25
JP7747961B2 true JP7747961B2 (ja) 2025-10-02

Family

ID=84463119

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021203147A Active JP7747961B2 (ja) 2021-12-15 2021-12-15 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機
JP2025154481A Pending JP2025172183A (ja) 2021-12-15 2025-09-17 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025154481A Pending JP2025172183A (ja) 2021-12-15 2025-09-17 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機

Country Status (4)

Country Link
US (1) US12562551B2 (https=)
EP (1) EP4198614B1 (https=)
JP (2) JP7747961B2 (https=)
CN (1) CN116262307A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117139828B (zh) * 2023-09-19 2025-06-27 长沙麓邦光电科技有限公司 飞秒激光加工纳米泡结构的参数筛选方法
DE102024115357A1 (de) * 2024-06-03 2025-12-04 Precitec Gmbh & Co. Kg Vorrichtung zum Erzeugen eines nicht-diffraktiven Laserstrahls sowie Laserbearbeitungskopf mit derselben
CN120491328B (zh) * 2025-06-30 2026-02-13 剑芯光电(苏州)有限公司 一种基于分区调制与定制偏振元件的光斑整形装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299521A (ja) 1999-02-15 2000-10-24 Photonetics Sa 波長のフィルタリング用の単一方向の自動整合した後方反射光学系
JP2017506769A (ja) 2014-02-26 2017-03-09 ビエン チャン， 可変ビームパラメータ積を有するマルチビームレーザ配列のためのシステムおよび方法
US20180205197A1 (en) 2014-10-23 2018-07-19 TRUMPF Laser GmbH (TLS) Open-loop wavelength selective external resonator and beam combining system
WO2019220832A1 (ja) 2018-05-18 2019-11-21 パナソニックＩｐマネジメント株式会社 ダイレクトダイオードレーザ方式のレーザ発振装置、および、レーザ発振装置の故障診断方法
JP2021506100A (ja) 2017-11-01 2021-02-18 ヌブル インク マルチｋＷクラスの青色レーザーシステム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004139074A (ja) 1996-07-04 2004-05-13 Sanyo Electric Co Ltd カラー液晶表示装置およびカラーフィルター
US6192062B1 (en) 1998-09-08 2001-02-20 Massachusetts Institute Of Technology Beam combining of diode laser array elements for high brightness and power
AU4503300A (en) * 1999-05-07 2000-11-21 Digilens Inc. Image generating system
JP2002267951A (ja) 2001-03-09 2002-09-18 Ando Electric Co Ltd チューナブルフィルタ
JP2003114402A (ja) 2001-10-02 2003-04-18 Sumitomo Electric Ind Ltd 光合分波器およびその調整方法
JP2003149497A (ja) 2001-11-14 2003-05-21 Sumitomo Electric Ind Ltd 光信号処理部品
JP3951881B2 (ja) 2002-10-10 2007-08-01 住友電気工業株式会社 光部品
US20040080823A1 (en) 2002-10-10 2004-04-29 Sumitomo Electric Industries, Ltd. Optical element
US7233442B1 (en) * 2005-01-26 2007-06-19 Aculight Corporation Method and apparatus for spectral-beam combining of high-power fiber lasers
CN109490201B (zh) * 2018-11-06 2020-05-19 浙江大学 一种基于光束整形的结构光生成装置和方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299521A (ja) 1999-02-15 2000-10-24 Photonetics Sa 波長のフィルタリング用の単一方向の自動整合した後方反射光学系
JP2017506769A (ja) 2014-02-26 2017-03-09 ビエン チャン， 可変ビームパラメータ積を有するマルチビームレーザ配列のためのシステムおよび方法
US20180205197A1 (en) 2014-10-23 2018-07-19 TRUMPF Laser GmbH (TLS) Open-loop wavelength selective external resonator and beam combining system
JP2021506100A (ja) 2017-11-01 2021-02-18 ヌブル インク マルチｋＷクラスの青色レーザーシステム
WO2019220832A1 (ja) 2018-05-18 2019-11-21 パナソニックＩｐマネジメント株式会社 ダイレクトダイオードレーザ方式のレーザ発振装置、および、レーザ発振装置の故障診断方法

Also Published As

Publication number Publication date
EP4198614B1 (en) 2024-03-13
CN116262307A (zh) 2023-06-16
JP2025172183A (ja) 2025-11-20
JP2023088438A (ja) 2023-06-27
US20230187907A1 (en) 2023-06-15
EP4198614A1 (en) 2023-06-21
US12562551B2 (en) 2026-02-24

Similar Documents

Publication Publication Date Title
JP2025172183A (ja) 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機
JP7277716B2 (ja) 光源装置、ダイレクトダイオードレーザ装置、および光結合器
JP6847050B2 (ja) 可変フィードバック制御をともなう稠密波長ビーム結合
US20200379248A1 (en) Optical resonator and laser processing machine
JP6293385B1 (ja) レーザ発振装置
JP7212274B2 (ja) 光源装置、ダイレクトダイオードレーザ装置
JP7323774B2 (ja) 光源装置および外部共振器型レーザモジュール
JP6522166B2 (ja) レーザ装置
JP7280498B2 (ja) 光源装置
US10864600B2 (en) Laser machining device
JP2009283531A (ja) 波長可変光源
JP2026010890A (ja) 波長ビーム結合装置、ダイレクトダイオードレーザ装置、およびレーザ加工機
US20260024959A1 (en) Wavelength beam combining device, direct diode laser device, and laser processing machine
US20240399496A1 (en) Wavelength beam combining device, direct diode laser device, and laser processing machine
JP7589259B2 (ja) スペクトル分割装置
EP3929652B1 (en) Optical converter, optical coupler, optical device, and method for generating polarized radiation
JP2026006742A (ja) レーザ発振器及びそれを備えたレーザ加工装置
WO2025139483A1 (zh) 激光器和激光设备
CN120280784A (zh) 一种多波长半导体激光器耦合封装结构
JP2006313609A (ja) 光路補正装置、及び光ピックアップ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241115

TRDD Decision of grant or rejection written
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20250813

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250819

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250901

R150 Certificate of patent or registration of utility model

Ref document number: 7747961

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150