CN116194542B - 电剥离性粘合剂组合物、电剥离性粘合片及电剥离性粘合片的使用方法 - Google Patents

电剥离性粘合剂组合物、电剥离性粘合片及电剥离性粘合片的使用方法

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Publication number
CN116194542B
CN116194542B CN202180065203.7A CN202180065203A CN116194542B CN 116194542 B CN116194542 B CN 116194542B CN 202180065203 A CN202180065203 A CN 202180065203A CN 116194542 B CN116194542 B CN 116194542B
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CN
China
Prior art keywords
mass
component
adhesive composition
parts
electro
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Active
Application number
CN202180065203.7A
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English (en)
Chinese (zh)
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CN116194542A (zh
Inventor
高冈慎弥
西嶋健太
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Lintec Corp
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Lintec Corp
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Publication of CN116194542A publication Critical patent/CN116194542A/zh
Application granted granted Critical
Publication of CN116194542B publication Critical patent/CN116194542B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN202180065203.7A 2020-09-28 2021-09-27 电剥离性粘合剂组合物、电剥离性粘合片及电剥离性粘合片的使用方法 Active CN116194542B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020162420 2020-09-28
JP2020-162420 2020-09-28
PCT/JP2021/035369 WO2022065483A1 (ja) 2020-09-28 2021-09-27 電気剥離性粘着剤組成物、電気剥離性粘着シート、及び電気剥離性粘着シートの使用方法

Publications (2)

Publication Number Publication Date
CN116194542A CN116194542A (zh) 2023-05-30
CN116194542B true CN116194542B (zh) 2026-01-13

Family

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Family Applications (1)

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CN202180065203.7A Active CN116194542B (zh) 2020-09-28 2021-09-27 电剥离性粘合剂组合物、电剥离性粘合片及电剥离性粘合片的使用方法

Country Status (4)

Country Link
JP (1) JP7784382B2 (https=)
KR (1) KR20230073226A (https=)
CN (1) CN116194542B (https=)
WO (1) WO2022065483A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250059406A1 (en) * 2021-09-30 2025-02-20 Nitto Denko Corporation Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and bonded body
JPWO2023054480A1 (https=) * 2021-09-30 2023-04-06
JPWO2023054478A1 (https=) * 2021-09-30 2023-04-06
EP4474440A1 (en) 2023-06-06 2024-12-11 Henkel AG & Co. KGaA Debondable adhesive tape
WO2025141478A1 (en) * 2023-12-27 2025-07-03 3M Innovative Properties Company Electrically de-bondable, chemically resistant adhesives
EP4685204A1 (de) * 2024-07-25 2026-01-28 tesa SE Klebemasse, klebeband, verklebter verbund und verfahren zum elektrischen lösen des verklebten verbundes

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006342191A (ja) * 2005-06-07 2006-12-21 Nitto Denko Corp 粘着剤組成物および粘着シート類
JP2016222824A (ja) * 2015-06-01 2016-12-28 日立マクセル株式会社 粘着テープ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3386496B2 (ja) * 1992-09-11 2003-03-17 荒川化学工業株式会社 アクリル系感圧接着剤組成物
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
EP1914285A1 (en) * 2005-08-09 2008-04-23 The Yokohama Rubber Co., Ltd. Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive
JP5210078B2 (ja) * 2008-07-31 2013-06-12 ビッグテクノス株式会社 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法
US10604684B2 (en) * 2013-03-27 2020-03-31 Lintec Corporation Electrically peelable adhesive composition and electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet
JP6419626B2 (ja) * 2015-03-30 2018-11-07 日本カーバイド工業株式会社 粘着剤組成物及び粘着フィルム
KR20180110209A (ko) * 2015-10-16 2018-10-08 닛토덴코 가부시키가이샤 전기 박리용 점착제 조성물, 점착 시트 및 접합체
US20200002581A1 (en) * 2017-03-03 2020-01-02 Nitto Denko Corporation Electrically debondable adhesive composition, adhesive sheet, and adhered body
CN116536005A (zh) * 2018-09-03 2023-08-04 日东电工株式会社 粘合剂组合物、粘合片和接合体
JP2020083901A (ja) * 2018-11-15 2020-06-04 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤および粘着シート
JP2021138898A (ja) * 2020-03-09 2021-09-16 リンテック株式会社 電気剥離性粘着剤組成物、電気剥離性粘着シート、及び電気剥離性粘着シートの使用方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006342191A (ja) * 2005-06-07 2006-12-21 Nitto Denko Corp 粘着剤組成物および粘着シート類
JP2016222824A (ja) * 2015-06-01 2016-12-28 日立マクセル株式会社 粘着テープ

Also Published As

Publication number Publication date
TW202223029A (zh) 2022-06-16
JP7784382B2 (ja) 2025-12-11
CN116194542A (zh) 2023-05-30
JPWO2022065483A1 (https=) 2022-03-31
WO2022065483A1 (ja) 2022-03-31
KR20230073226A (ko) 2023-05-25

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