CN116190102A - Low-loss microwave broadband capacitor - Google Patents
Low-loss microwave broadband capacitor Download PDFInfo
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- CN116190102A CN116190102A CN202211594484.8A CN202211594484A CN116190102A CN 116190102 A CN116190102 A CN 116190102A CN 202211594484 A CN202211594484 A CN 202211594484A CN 116190102 A CN116190102 A CN 116190102A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 66
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 83
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 239000000725 suspension Substances 0.000 claims description 36
- 239000010410 layer Substances 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 13
- 239000002344 surface layer Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 3
- 238000003780 insertion Methods 0.000 abstract description 12
- 230000037431 insertion Effects 0.000 abstract description 12
- 238000004891 communication Methods 0.000 description 10
- 230000005684 electric field Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a low-loss microwave broadband capacitor, which comprises a ceramic body, wherein an inner electrode assembly is arranged in the ceramic body, and a first end electrode and a second end electrode are respectively sleeved at two ends outside the ceramic body; the inner electrode assembly comprises a first inner electrode and a second inner electrode which are arranged in parallel, one end of the first inner electrode extends out of the porcelain body, and a part of the first inner electrode extending out of the porcelain body is coated on the first end electrode; one end of the second inner electrode extends out of the porcelain body, and the second inner electrode part extending out of the porcelain body is coated on the second end electrode; the contact area of the first inner electrode and the first end electrode and the contact area of the second inner electrode and the second end electrode are increased, so that the contact resistance is reduced and the insertion loss of the capacitor is reduced on the premise of not increasing the number of the first inner electrode and the second inner electrode.
Description
Technical Field
The invention relates to a capacitor device, in particular to a low-loss microwave broadband capacitor.
Background
Along with the rapid development of microwave communication technology, the relationship between the microwave communication technology and electronic products in daily life is more and more intimate, the communication between the microwave communication technology and satellite is as large as that between the microwave communication technology and intelligent home, the devices can use capacitors, the communication technology is updated, the requirements on the frequency, the loss and the bandwidth of the capacitors are higher, the capacitors are used as basic elements of the circuit, the performance of a communication system is greatly influenced, and the wider the passband of the capacitors is, the wider the signal frequency coverage of the communication system is; the lower the loss of the capacitor, the higher the sensitivity of the communication system to receive signals. At present, satellite communication is mainly focused on a C wave band (4 GHz-8 GHz) and an X wave band (8 GHz-12 GHz), so that the demand for low-loss microwave broadband capacitors in the frequency band is increasing.
The existing wideband capacitor mainly comprises an ultra-wideband capacitor and a wideband chip capacitor, wherein the bandwidth of the ultra-wideband capacitor is wider and can reach 300 kHz-40 GHz generally, in order to realize low-frequency bandpass, the ultra-wideband capacitor adopts a dielectric material with high dielectric constant, the capacity density of the ultra-wideband capacitor is increased, and the dielectric constant and the Q value are contradictory indexes, so that the insertion loss of the ultra-wideband capacitor can only reach the level of minus 0.5 dB;
the broadband chip capacitor is led out from the upper and lower end electrodes, and the surface is generally made of a composite metal material composed of one or more of gold, platinum, tungsten and titanium. The capacitor with the structure is only suitable for a circuit welded by gold wires, and cannot meet the use requirement of a tin-lead welding or conductive adhesive bonding circuit.
Disclosure of Invention
The invention aims to solve the technical problem of reducing the insertion loss of a capacitor, and aims to provide a low-loss microwave broadband capacitor, which solves the problem of high insertion loss of the capacitor.
The invention is realized by the following technical scheme:
the low-loss microwave broadband capacitor comprises a porcelain body, wherein an inner electrode assembly is arranged in the porcelain body, and a first end electrode and a second end electrode are respectively sleeved at two ends outside the porcelain body;
the inner electrode assembly includes first and second inner electrodes arranged in parallel,
one end of the first inner electrode extends out of the porcelain body, and a part of the first inner electrode extending out of the porcelain body is coated on the first end electrode;
one end of the second inner electrode extends out of the porcelain body, and the second inner electrode part extending out of the porcelain body is coated on the second end electrode.
The first inner electrode part and the second inner electrode part extending out of the porcelain body are respectively covered by the first end electrode and the second end electrode, so that the contact area of the first inner electrode and the first end electrode and the contact area of the second inner electrode and the second end electrode are increased, the contact resistance is reduced on the premise of not increasing the number of the first inner electrode and the second inner electrode, and the insertion loss of the capacitor is reduced.
Further, the inner electrode assembly further comprises a first suspension electrode and a second suspension electrode, and the first suspension electrode, the first inner electrode, the second inner electrode and the second suspension electrode are sequentially arranged in parallel;
and gaps are reserved between the two ends of the first suspension electrode and the second suspension electrode and the first end electrode and the second end electrode.
The two ends of the first suspension electrode and the second suspension electrode are not connected with the first end electrode and the second end electrode, the field intensity acting between the first inner electrode and the second end electrode and between the second inner electrode and the first end electrode is dispersed to the middle position of the first suspension electrode by the end part of the first suspension electrode and the field intensity is dispersed to the middle position of the second suspension electrode by the end part of the second suspension electrode, so that the superposition of the field intensity and the action point of the surface electric field of the porcelain body is avoided, the distortion of the surface electric field of the capacitor is improved, the electric resistance intensity of the capacitor is improved, the effect of shielding the electric field is achieved, and the anti-interference capability of the capacitor is improved.
Further, the porcelain body is a rectangular component, and the inner electrode assembly is vertically arranged at the bottom of the porcelain body;
one end of the first inner electrode and one end of the second inner electrode extend out of the side part of the porcelain body, the height of the first inner electrode extending out of the side part of the porcelain body is the same as that of the porcelain body, and the height of the second inner electrode extending out of the side part of the porcelain body is the same as that of the porcelain body.
The first end electrode is sleeved with the side part of the porcelain body, the connection length of the first inner electrode and the first end electrode is consistent with the height of the porcelain body, namely the height of the first inner electrode part extending out of the side part of the porcelain body is the maximum width of the side part of the porcelain body, so that the contact area between the first inner electrode and the first end electrode is increased, the contact resistance is reduced on the premise that the number of the first inner electrode and the second inner electrode is not increased, and the insertion loss of a capacitor is reduced;
the second end electrode is sleeved on the other porcelain body side part which is opposite to the porcelain body side part, the connection length of the second inner electrode and the second end electrode is consistent with the height of the porcelain body, namely the height of the second inner electrode part extending out of the porcelain body side part is the maximum width of the other porcelain body side part, the contact area between the second inner electrode and the second end electrode is increased, the contact resistance is reduced on the premise that the number of the first inner electrode and the second inner electrode is not increased, and the insertion loss of the capacitor is reduced.
Further, the width of the porcelain body is larger than the height, and the bottom of the porcelain body is used for being in contact with the mounting surface.
The bottom of the porcelain body is contacted with the mounting surface, and the inner electrode assembly is vertically arranged at the bottom of the porcelain body, so that the inner electrode assembly is vertically arranged at the mounting surface, a first suspension electrode, a first inner electrode, a second inner electrode and a second suspension electrode in the inner electrode assembly are vertical to an electric signal transmission plane, the overlapping area of the electrode planes of the first suspension electrode, the first inner electrode, the second inner electrode and the second suspension electrode and the electromagnetic wave transmission plane is reduced, the equivalent inductance is reduced, the Q value is improved, the parallel resonance of the capacitor is eliminated, and the capacitor has broadband performance.
The width of the porcelain body is larger than the height, and the side-standing installation is prevented.
Further, the inner electrode assembly comprises 1-4 arbitrary first inner electrodes, and the first inner electrodes are parallel to each other;
the inner electrode assembly comprises 1-4 arbitrary second inner electrodes, and the second inner electrodes are parallel to each other.
The number of the electrodes in the inner electrode assembly is small, wherein only 2-8 inner electrodes in the inner electrode assembly are connected with the terminal electrodes, and the parasitic inductance of the capacitor is reduced by reducing the number of the first inner electrodes and/or the second inner electrodes, so that the resonance frequency of the capacitor is improved.
Furthermore, the first suspension electrode, the first inner electrode, the second inner electrode and the second suspension electrode are all provided with a distance of 10-20 μm, and the capacitance of the capacitor is adjusted by adjusting the distance between the electrodes, so that the performance of high Q value and low loss is obtained.
Further, the first end electrode and the second end electrode each comprise a metal bottom layer, a metal barrier layer and a metal surface layer, the metal bottom layers are sleeved on the metal barrier layers, the metal barrier layers are sleeved on the metal surface layers, and the metal bottom layers are sleeved on two ends of the porcelain body.
The first end electrode and the second end electrode are three-layer leading-out ends, the defect that the existing broadband chip capacitor is only suitable for gold wire welding and is limited in applicable environment is overcome, and the use requirements of different installations are met, for example: tin-lead welding, conductive adhesive bonding, gold wire welding, and the like.
Further, silver or copper is adopted to prepare the metal bottom layer; nickel or copper is adopted to manufacture the metal barrier layer; the metal surface layer is made of any one of gold, tin or tin-lead alloy.
Furthermore, the ceramic body is made of a ceramic material with low dielectric constant.
Further, the other ends of the first inner electrode and the second inner electrode are respectively spaced from the first end electrode and the second end electrode.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the first inner electrode part and the second inner electrode part extending out of the porcelain body are respectively covered by the first end electrode and the second end electrode, so that the contact area of the first inner electrode and the first end electrode and the contact area of the second inner electrode and the second end electrode are increased, the contact resistance is reduced on the premise of not increasing the number of the first inner electrode and the second inner electrode, and the insertion loss of the capacitor is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings that are needed in the examples will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and that other related drawings may be obtained from these drawings without inventive effort for a person skilled in the art. In the drawings:
FIG. 1 is a schematic diagram of the external structure of a capacitor;
FIG. 2 is a schematic cross-sectional view of A in FIG. 1;
FIG. 3 is a schematic cross-sectional view of B in FIG. 1;
FIG. 4 is a schematic view of the external structure of the porcelain body;
fig. 5 is a schematic view of an arrangement structure of the inner electrode assembly;
fig. 6 is a schematic structural view and a schematic structural disassembly view of the first terminal electrode and the second terminal electrode.
In the drawings, the reference numerals and corresponding part names:
10-porcelain body, 21-first inner electrode, 22-second inner electrode, 23-first suspension electrode, 24-second suspension electrode, 31-first end electrode, 32-second end electrode, 301-metal surface layer, 302-metal barrier layer, 303-metal bottom layer.
Detailed Description
For the purpose of making apparent the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present invention and the descriptions thereof are for illustrating the present invention only and are not to be construed as limiting the present invention.
The invention is mainly aimed at the application of C-band (4 GHz-8 GHz) and X-band (8 GHz-12 GHz) high-frequency circuits.
Example 1
The embodiment 1 provides a low-loss microwave wideband capacitor, as shown in fig. 1 and 3, which comprises a ceramic body 10, wherein an inner electrode assembly is arranged in the ceramic body 10, and a first end electrode 31 and a second end electrode 32 are respectively sleeved at two ends outside the ceramic body 10;
the above-described internal electrode assembly includes first and second internal electrodes 21 and 22 arranged in parallel,
one end of the first inner electrode 21 extends out of the porcelain body 10, and the first inner electrode 21 extending out of the porcelain body 10 is partially coated on the first end electrode 31;
one end of the second inner electrode 22 extends out of the porcelain body 10, and the second inner electrode 22 extending out of the porcelain body 10 is partially covered on the second end electrode 32.
The first inner electrode 21 and the second inner electrode 22 extending out of the porcelain body 10 are respectively covered by the first end electrode 31 and the second end electrode 32, so that the contact area between the first inner electrode 21 and the first end electrode 31 and the contact area between the second inner electrode 22 and the second end electrode 32 are increased, the contact resistance is reduced, and the insertion loss of the capacitor is reduced on the premise of not increasing the number of the first inner electrode 21 and the second inner electrode 22.
In a specific embodiment, the inner electrode assembly further includes a first floating electrode 23 and a second floating electrode 24, where the first floating electrode 23, the first inner electrode 21, the second inner electrode 22 and the second floating electrode 24 are sequentially arranged in parallel;
both ends of the first suspension electrode 23 and the second suspension electrode 24 are spaced apart from the first end electrode 31 and the second end electrode 32;
the other ends of the first and second internal electrodes 21 and 22 are spaced apart from the first and second terminal electrodes 31 and 32.
In the prior art, the end electrodes cover the two end parts of the main body, the two end parts of the inner electrode are in the covering range of the end electrodes, the distance between the end parts of the inner electrode and the end electrodes is short, the field intensity between the inner electrode and the end electrodes and the surface electric field of the capacitor act simultaneously, electric field distortion is formed at the edge of the main body covered by the end electrodes, and electric arcs are easy to generate;
according to the invention, the two ends of the first suspension electrode 23 and the second suspension electrode 24 are not connected with the first end electrode 31 and the second end electrode 32, the field intensity acting between the first inner electrode 21 and the second end electrode 32 and between the second inner electrode 22 and the first end electrode 31 is dispersed to the middle position of the first suspension electrode 23 by the end part of the first suspension electrode 23 and the field intensity is dispersed to the middle position of the second suspension electrode 24 by the end part of the second suspension electrode 24, so that the superposition of the field intensity and the action point of the surface electric field of the porcelain body 10 is avoided, the distortion of the surface electric field of the capacitor is improved, the electric resistance intensity of the capacitor is improved, the effect of shielding the electric field is played, and the anti-interference capability of the capacitor is improved.
Example 2
As shown in fig. 2 to 6, the porcelain body 10 is a rectangular member, and the internal electrode assembly is vertically arranged at the bottom of the porcelain body;
one ends of the first and second internal electrodes 21 and 22 extend out of the porcelain body side portion, and the height of the first internal electrode 21 extending out of the porcelain body side portion is the same as the height of the porcelain body 10, and the height of the second internal electrode 22 extending out of the porcelain body side portion is the same as the height of the porcelain body 10.
The first end electrode 31 is sleeved with the side part of the porcelain body, the connection length of the first inner electrode 21 and the first end electrode 31 is consistent with the height of the porcelain body 10, namely the height of the first inner electrode 21 extending out of the side part of the porcelain body is the maximum width of the side part of the porcelain body, so that the contact area between the first inner electrode 21 and the first end electrode 31 is increased, the contact resistance is reduced on the premise that the number of the first inner electrode 21 and the second inner electrode 22 is not increased, and the insertion loss of a capacitor is reduced;
the second end electrode 32 is sleeved on the other porcelain body side opposite to the porcelain body side, and the connection length of the second inner electrode 22 and the second end electrode 32 is identical to the height of the porcelain body 10, namely, the height of the second inner electrode 22 extending out of the porcelain body side is the maximum width of the other porcelain body side, so that the contact area between the second inner electrode 22 and the second end electrode 32 is increased, the contact resistance is reduced, and the insertion loss of the capacitor is reduced on the premise that the number of the first inner electrode 21 and the second inner electrode 22 is not increased.
In a specific embodiment, the width of the porcelain body 10 is greater than the height, and the bottom of the porcelain body is used to contact the mounting surface.
The bottom of the porcelain body is contacted with the mounting surface, and the inner electrode assembly is vertically arranged at the bottom of the porcelain body, so that the inner electrode assembly is vertically arranged at the mounting surface, the first suspension electrode 23, the first inner electrode 21, the second inner electrode 22 and the second suspension electrode 24 in the inner electrode assembly are vertical to the electric signal transmission plane, the overlapping area of the electrode planes of the first suspension electrode 23, the first inner electrode 21, the second inner electrode 22 and the second suspension electrode 24 and the electromagnetic wave transmission plane is reduced, the equivalent inductance is reduced, the Q value is improved, the parallel resonance of the capacitor is eliminated, and the capacitor has broadband performance.
The porcelain body 10 has a width greater than a height, and is prevented from being installed sideways.
In a specific embodiment, the first suspension electrode 23, the first inner electrode 21, the second inner electrode 22, and the second suspension electrode 24 are all spaced by 10 μm-20 μm, and the capacitance of the capacitor is adjusted by adjusting the spacing between the electrodes, so as to obtain the performance of high Q value and low loss.
In a specific embodiment, the first end electrode 31 and the second end electrode 32 each include a metal bottom layer 303, a metal barrier layer 302, and a metal surface layer 301, wherein the metal bottom layer 303 is sleeved on the metal barrier layer 302, the metal barrier layer 302 is sleeved on the metal surface layer 301, and the metal bottom layer 303 is sleeved on both ends of the porcelain body 10.
The first terminal electrode 31 and the second terminal electrode 32 are three-layer terminals, which overcomes the defect that the existing wideband chip capacitor is only suitable for gold wire welding and has limited applicable environment, and meets the use requirements of different installations, for example: tin-lead welding, conductive adhesive bonding, gold wire welding, and the like.
In a specific embodiment, silver or copper is used to make the metal underlayer 303; the metal barrier layer 302 is made of nickel or copper; the metal surface layer 301 is made of any one of gold, tin, and tin-lead alloy.
In particular embodiments, the ceramic body 10 is formed from a low dielectric constant ceramic material.
Because the ceramic material with high Q value is usually smaller in node constant and the ceramic material with large node constant is not high in Q value, in order to meet the performance of high Q value, the invention selects the dielectric material with the dielectric constant not more than 20, and the ceramic material with the dielectric constant not more than 20 can meet the requirement of high Q value that Q is more than 10000 GHz;
in order to realize lower insertion loss of 4 GHz-8 GHz of C wave band and 8 GHz-12 GHz of X wave band, the capacity of the capacitor is required to be 2 pF-10 pF, the overall dimension of the capacitor is 1mm multiplied by 0.6mm multiplied by 0.5mm, the distance between electrodes is 10 mu m-20 mu m, the dielectric constant epsilon is calculated according to the capacitance calculation formula C=epsilon S/4 pi kd, only the dielectric material with the dielectric constant epsilon not lower than 10 can be selected, and the magnesium titanate-based microwave dielectric ceramic with the dielectric constant of 12 is selected.
Example 3
The inner electrode assembly includes 4 first inner electrodes 21, and the first inner electrodes 21 are parallel to each other;
the internal electrode assembly includes 4 second internal electrodes 22, and the second internal electrodes 22 are parallel to each other.
In order to give consideration to the loss in the ultra-wide frequency band of 300 kHz-40 GHz, especially the low-frequency loss of 300 kHz-500 MHz, the capacity density is large, and large capacity cannot be realized if the number of electrode layers is too small, so that the design of the inner electrode of the ultra-wide band capacitor in the prior art is generally 30-500 layers, and the capacitance is generally 10 nF-100 nF. The invention is used for high-frequency circuits of 4 GHz-8 GHz of C wave band and 8 GHz-12 GHz of X wave band, the low-frequency loss is not needed to be considered, and the capacitance is only less than 10pF, so that the electrode in 4 layers-10 layers can be realized;
the number of the electrodes in the internal electrode assembly is small, wherein only 2-8 internal electrodes in the internal electrode assembly are connected with the terminal electrodes, and the parasitic inductance of the capacitor is reduced by reducing the number of the first internal electrodes 21 and/or the second internal electrodes 22, so that the resonance frequency of the capacitor is improved.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the scope of the invention, but to limit the invention to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. The low-loss microwave broadband capacitor is characterized by comprising a porcelain body (10), wherein an inner electrode assembly is arranged in the porcelain body (10), and a first end electrode (31) and a second end electrode (32) are respectively sleeved at two ends outside the porcelain body (10);
the inner electrode assembly includes a first inner electrode (21) and a second inner electrode (22) arranged in parallel,
one end of the first inner electrode (21) extends out of the porcelain body (10), and the first inner electrode (21) extending out of the porcelain body (10) is partially coated on the first end electrode (31);
one end of the second inner electrode (22) extends out of the porcelain body (10), and the second inner electrode (22) extending out of the porcelain body (10) is partially coated on the second end electrode (32).
2. A low-loss microwave wideband capacitor according to claim 1, wherein the inner electrode assembly further comprises a first suspended electrode (23) and a second suspended electrode (24), the first suspended electrode (23), the first inner electrode (21), the second inner electrode (22) and the second suspended electrode (24) being arranged in parallel in sequence;
both ends of the first suspension electrode (23) and the second suspension electrode (24) are respectively provided with a gap with the first end electrode (31) and the second end electrode (32).
3. A low-loss microwave wideband capacitor as claimed in claim 1, wherein said porcelain body (10) is a rectangular member, said inner electrode assembly being vertically arranged at the bottom of the porcelain body (10);
one ends of the first inner electrode (21) and the second inner electrode (22) extend out of the side part of the porcelain body, the height of the first inner electrode (21) extending out of the side part of the porcelain body is the same as that of the porcelain body (10), and the height of the second inner electrode (22) extending out of the side part of the porcelain body is the same as that of the porcelain body (10).
4. A low loss microwave wideband capacitor as claimed in claim 3, wherein the width of the porcelain body (10) is greater than the height, and the bottom of the porcelain body is adapted to contact the mounting surface.
5. A low-loss microwave wideband capacitor as claimed in claim 1, wherein said inner electrode assembly comprises 1-4 first inner electrodes (21), said first inner electrodes (21) being parallel to each other;
the inner electrode assembly comprises 1-4 arbitrary second inner electrodes (22), and the second inner electrodes (22) are parallel to each other.
6. A low-loss microwave broadband capacitor according to claim 2, wherein the first suspended electrode (23), the first internal electrode (21), the second internal electrode (22) and the second suspended electrode (24) are all spaced by a distance of 10 μm to 20 μm.
7. The low-loss microwave wideband capacitor of claim 1, wherein the first terminal electrode (31) and the second terminal electrode (32) each comprise a metal bottom layer (303), a metal barrier layer (302) and a metal surface layer (301), the metal bottom layer (303) is sleeved on the metal barrier layer (302), the metal barrier layer (302) is sleeved on the metal surface layer (301), and the metal bottom layer (303) is sleeved on two ends of the porcelain body (10).
8. A low-loss microwave wideband capacitor as claimed in claim 7, wherein said metal underlayer (303) is made of silver or copper; -forming the metal barrier layer (302) from nickel or copper; the metal surface layer (301) is made of any one of gold, tin or tin-lead alloy.
9. A low-loss microwave wideband capacitor as claimed in claim 1, characterized in that the ceramic body (10) is made of a ceramic material with a low dielectric constant.
10. A low-loss microwave wideband capacitor as claimed in claim 1, characterized in that the other ends of the first inner electrode (21) and the second inner electrode (22) are each spaced from the first end electrode (31) and the second end electrode (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211594484.8A CN116190102A (en) | 2022-12-13 | 2022-12-13 | Low-loss microwave broadband capacitor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211594484.8A CN116190102A (en) | 2022-12-13 | 2022-12-13 | Low-loss microwave broadband capacitor |
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| Publication Number | Publication Date |
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| CN116190102A true CN116190102A (en) | 2023-05-30 |
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| CN202211594484.8A Pending CN116190102A (en) | 2022-12-13 | 2022-12-13 | Low-loss microwave broadband capacitor |
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| CN (1) | CN116190102A (en) |
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| US5892415A (en) * | 1995-11-20 | 1999-04-06 | Murata Manufacturing Co., Ltd. | Laminated resonator and laminated band pass filter using same |
| JP2004296940A (en) * | 2003-03-27 | 2004-10-21 | Tdk Corp | Laminated capacitor |
| CN101145448A (en) * | 2006-09-12 | 2008-03-19 | Tdk株式会社 | Stacked capacitor and electronic device |
| CN102222564A (en) * | 2011-03-31 | 2011-10-19 | 亿曼丰科技（深圳）有限公司 | Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate |
| CN211654587U (en) * | 2019-12-03 | 2020-10-09 | 南京汇聚新材料科技有限公司 | High-frequency low equivalent series resistance high-frequency capacitor |
| CN111933451A (en) * | 2020-07-08 | 2020-11-13 | 四川华瓷科技有限公司 | Preparation method of radio frequency chip type multilayer ceramic capacitor |
| CN113053657A (en) * | 2019-12-26 | 2021-06-29 | 南京汇聚新材料科技有限公司 | Ultra-low loss high-frequency capacitor |
| US20220301772A1 (en) * | 2021-03-16 | 2022-09-22 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor, a method of manufacturing the same and a substrate arrangement |
| CN115315765A (en) * | 2020-02-11 | 2022-11-08 | 阿莫技术有限公司 | Wideband capacitor |
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2022
- 2022-12-13 CN CN202211594484.8A patent/CN116190102A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5892415A (en) * | 1995-11-20 | 1999-04-06 | Murata Manufacturing Co., Ltd. | Laminated resonator and laminated band pass filter using same |
| JP2004296940A (en) * | 2003-03-27 | 2004-10-21 | Tdk Corp | Laminated capacitor |
| CN101145448A (en) * | 2006-09-12 | 2008-03-19 | Tdk株式会社 | Stacked capacitor and electronic device |
| CN102222564A (en) * | 2011-03-31 | 2011-10-19 | 亿曼丰科技（深圳）有限公司 | Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate |
| CN211654587U (en) * | 2019-12-03 | 2020-10-09 | 南京汇聚新材料科技有限公司 | High-frequency low equivalent series resistance high-frequency capacitor |
| CN113053657A (en) * | 2019-12-26 | 2021-06-29 | 南京汇聚新材料科技有限公司 | Ultra-low loss high-frequency capacitor |
| CN115315765A (en) * | 2020-02-11 | 2022-11-08 | 阿莫技术有限公司 | Wideband capacitor |
| CN111933451A (en) * | 2020-07-08 | 2020-11-13 | 四川华瓷科技有限公司 | Preparation method of radio frequency chip type multilayer ceramic capacitor |
| US20220301772A1 (en) * | 2021-03-16 | 2022-09-22 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor, a method of manufacturing the same and a substrate arrangement |
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