CN102222564A - Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate - Google Patents
Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate Download PDFInfo
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- CN102222564A CN102222564A CN 201110081136 CN201110081136A CN102222564A CN 102222564 A CN102222564 A CN 102222564A CN 201110081136 CN201110081136 CN 201110081136 CN 201110081136 A CN201110081136 A CN 201110081136A CN 102222564 A CN102222564 A CN 102222564A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 40
- 239000003990 capacitor Substances 0.000 title claims abstract description 25
- 239000012528 membrane Substances 0.000 title claims abstract description 20
- 239000002003 electrode paste Substances 0.000 title abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000005245 sintering Methods 0.000 claims abstract description 15
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 9
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 9
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 8
- 239000001293 FEMA 3089 Substances 0.000 claims description 8
- 229910002113 barium titanate Inorganic materials 0.000 claims description 8
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- 241000779819 Syncarpia glomulifera Species 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 239000001739 pinus spp. Substances 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 229940036248 turpentine Drugs 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- MTZOKGSUOABQEO-UHFFFAOYSA-L barium(2+);phthalate Chemical compound [Ba+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O MTZOKGSUOABQEO-UHFFFAOYSA-L 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011267 electrode slurry Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Abstract
The invention relates to an electronic element, in particular to a multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate. The MLCC comprises an internal electrode, a medium layer which is alternately overlapped with the internal electrode, and an end electrode which is wrapped outside the internal electrode, wherein the end electrode comprises an end electrode bottom layer which is connected with the internal electrode, an end electrode outmost layer which is connected with an external circuit, and an end electrode baffling layer which is positioned between the end electrode bottom layer and the end electrode outmost layer; and the internal electrode is prepared by silk-screening and sintering the internal electrode paste which is prepared by uniformly mixing 25 to 68 mass percent of nickel powder, 5 to 10 mass percent of ethyl cellulose, 10 to 15 mass percent of turpentine, 5 to 12 mass percent of acetic acid and 5 to 15 mass percent of shrinkage inhibitor, wherein the sintering temperature is 1,000 to 1,200 DEG C and the grain size of the nickel powder is 20 to 70nm. The excellent properties of an MLCC product are kept and the service life of the MLCC product is prolonged.
Description
Technical field
The present invention relates to a kind of electronic component, especially based on the MLCC capacitor of counter electrode entoplasm and ceramic membrane shrinkage.
Background technology
MLCC (multilayer ceramic capacitor) is the novel capacitor that is widely adopted along with electronic product digitlization subminaturization, and it has highly reliable, high accuracy, high integrated, high-frequency, the big capacity of low-power, miniaturization, low cost and other advantages.But MLCC can produce some failure phenomenon respectively or simultaneously after a period of time of working under working stress and the environmental stress comprehensive function.The common failure phenomenon of capacitor has: dielectric breakdown open circuit, electrical quantity change (the capacitance loss tangent increases, insulation resistance decline or leakage, electric current rising etc.) leakage, lead-in wire corrosion or fracture, insulator breaks or capacitor breakdown open circuit wire breaking such as surperficial arcing etc., and insulator breaks etc. and to make lose the job the fully inefficacy of ability of capacitor belong to critical failure, and all the other some inefficacies can make electric capacity can not satisfy instructions for use and influence the reliability of system gradually to the catastrophic failure transition.Cause that the MLCC failure reasons is varied, and the material structure manufacturing process performance of various MLCC and environment for use have nothing in common with each other, and also each is different for failure mechanism; Same failure mode has multiple failure mechanism, and same failure mechanism can produce multiple failure mode again.
Theoretical research at present shows that about the MLCC inefficacy mechanism layering of ceramic membrane is the main cause that MLCC lost efficacy.And cause that layering comprises the reason of technology and two aspects of material, in the inefficacy mechanism of material type again number in binder removal and sintering process the entoplasm shrinkage greater than due to the ceramic membrane shrinkage.Existing technological invention such as early stage CN85108402A, CN87105776 and in the recent period CN95106291.3 etc. all lay particular emphasis on to be stacked into and work hard on the distribution ratio at technology and the multilayer material that burns altogether, seldom notice ceramic material layering and electrode and porcelain body cracking mechanism that different shrinkages that entoplasm and potsherd burn altogether cause, and select that in technology aspect this and material new breakthrough is arranged.
Summary of the invention
The present invention provides a kind of function admirable MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage of long service life simultaneously in order to solve defective and the deficiency that above-mentioned prior art exists.
Technical scheme of the present invention: based on the MLCC capacitor of counter electrode entoplasm and ceramic membrane shrinkage, comprise interior electrode, replace stacked dielectric layer and be coated on outer termination electrode with interior electrode, described termination electrode comprises the termination electrode bottom that is connected with interior electrode, termination electrode outermost layer that is connected with external circuit and the termination electrode barrier layer that is in both centres, electrode is the nickel powder of 25-68% and the ethyl cellulose that mass percent is respectively 5-10% by mass percent in described, the turpentine oil of 10-15%, the acetate of 5-12% and the resistance of the 5%--15% electrode size that agent evenly mixes that contracts makes by the silk-screen sintering, wherein sintering temperature is the 1000-1200 degree, and the particle size range of nickel powder is 20-70nm.
Preferably, described electrode size is that resistance that 57% nickel powder and mass percent are respectively 8% ethyl cellulose, 13% turpentine oil, 11% acetate and 11% agent of contracting evenly mixes by mass percent.
Preferably, the particle diameter of nickel powder is 47nm in the described electrode size.
Preferably, the described resistance agent of contracting is that main component is the ceramic powder of barium titanate.
Preferably, adding mass percent in the described electrode size is 10% ceramic powder.
Preferably, described sintering temperature is 1150 degree.
Preferably, described dielectric layer is a ceramic substrate, and its main component is a barium titanate.
Preferably, described termination electrode bottom is the copper metal electrode.
Preferably, described termination electrode outermost layer is the tin weld layer.
Preferably, described termination electrode barrier layer is a nickel coating.
The present invention on binder removal that MLCC makes and sintering link from the shrinkage of reduction electrode slurry aspect two of batching and the technologies to adapt to the shrinkage of potsherd, thereby the failure rate of containment or reduction MLCC, in the premium properties that keeps the MLCC product, finally reach the long-lived performance that improves the MLCC product.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the shrinkage comparison diagram of interior electrode and dielectric layer in the sintering process of the present invention.
1. dielectric layers among the figure, 2. interior electrode, 3. termination electrode outermost layer, 4. termination electrode barrier layer, 5. termination electrode bottom.
Embodiment
The present invention is further detailed explanation below in conjunction with drawings and Examples, but be not limiting the scope of the invention.
Embodiment 1
As shown in Figure 1, MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage, comprise interior electrode 2, replace stacked dielectric layer 1 and be coated on outer termination electrode that termination electrode comprises the termination electrode bottom 5 that is connected with interior electrode 2, the termination electrode outermost layer 3 that is connected with external circuit and is in both middle termination electrode barrier layers 4 with interior electrode 2.
Interior electrode 2 is for being that to add main component in the nickel powder of 47nm and the electrode size that organic solvent ethyl cellulose, turpentine oil and acetate evenly mix be that the ceramic powder of barium titanate makes by the silk-screen sintering by particle diameter, wherein the mass percent of a component is nickel powder 57%, ethyl cellulose 8%, turpentine oil 13%, acetate 12%, ceramic powder 10%, and sintering temperature is 1150 degree;
Dielectric layer 1 is Y7R502 type barium titanate ceramic, barium phthalate base X7R502 type, and its major parameter is: room temperature dielectric constant can reach about 5000, room temperature dielectric loss＜1%, resistivity is 1013 Ω cm, disruptive field intensity 5kV/mm, temperature coefficient of capacitance≤± 10%;
Termination electrode outermost layer 3 is the tin weld layer that links to each other with external circuit;
Termination electrode bottom 5 is used for drawing the copper metal electrode of condenser capacity for linking to each other with interior electrode;
Termination electrode barrier layer 4 has been the nickel coating of thermal barrier properties effect.
Embodiment 2
As shown in Figure 1, MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage, comprise interior electrode 2, replace stacked dielectric layer 1 and be coated on outer termination electrode that termination electrode comprises the termination electrode bottom 5 that is connected with interior electrode 2, the termination electrode outermost layer 3 that is connected with external circuit and is in both middle termination electrode barrier layers 4 with interior electrode 2.
Interior electrode 2 is for being that to add main component in the nickel powder of 47nm and the electrode size that organic solvent ethyl cellulose, turpentine oil and acetate evenly mix be that the ceramic powder of barium titanate makes by the silk-screen sintering by particle diameter, wherein the mass percent of a component is nickel powder 55%, ethyl cellulose 9%, turpentine oil 11%, acetate 10%, ceramic powder 10%, and sintering temperature is 1150 degree;
Dielectric layer 1 is Y7R502 type barium titanate ceramic, barium phthalate base X7R502 type, and its major parameter is: room temperature dielectric constant can reach about 5000, room temperature dielectric loss＜1%, resistivity is 1013 Ω cm, disruptive field intensity 5kV/mm, temperature coefficient of capacitance≤± 10%;
Termination electrode outermost layer 3 is the tin weld layer that links to each other with external circuit;
Termination electrode bottom 5 is used for drawing the copper metal electrode of condenser capacity for linking to each other with interior electrode;
Termination electrode barrier layer 4 has been the nickel coating of thermal barrier properties effect.
As shown in Figure 2, because ceramic dielectric and silk-screen electrode are to burn till under same temperature, both shrinkages are different, if the improper meeting of control has a strong impact on the performance of capacitor.Compare with ceramic dielectric films, it is very fast that electrode burns till contraction speed.This can cause electrode film to lose continuity, consequently causes capacitance to descend and the equivalent series resistance increase.Because the difference in this contraction forms certain internal stress in capacitor, make ceramic dielectric layer produce lamination more in addition.So adding suitable additives in electrode slurry, to come the control electrode contraction speed be considerable.Result of the test (as shown in Figure 2) shows, when the addition (mass percent) of ceramic powder greater than 10% the time, the shrinkage of nickel electrode electricity slurry obviously slows down, obviously reduce 1000-1200 ℃ of shrinkage mismatch phenomenon with ceramic dielectric, when addition (mass percent) to 20% the time, nickel slurry silk-screen slurry has identical shrinkage with ceramic dielectric.
MLCC capacitor performance value of the present invention such as following table:
Claims (10)
1. based on the MLCC capacitor of counter electrode entoplasm and ceramic membrane shrinkage, comprise interior electrode, replace stacked dielectric layer and be coated on outer termination electrode with interior electrode, described termination electrode comprises the termination electrode bottom that is connected with interior electrode, termination electrode outermost layer that is connected with external circuit and the termination electrode barrier layer that is in both centres, it is characterized in that: electrode is the nickel powder of 25-68% and the ethyl cellulose that mass percent is respectively 5-10% by mass percent in described, the turpentine oil of 10-15%, the acetate of 5-12% and the resistance of the 5%--15% electrode size that agent evenly mixes that contracts makes by the silk-screen sintering, wherein sintering temperature is 1000-1200 degree, and the particle size range of nickel powder is 20-70nm.
2. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: described electrode size is that resistance that 57% nickel powder and mass percent are respectively 8% ethyl cellulose, 13% turpentine oil, 11% acetate and 11% agent of contracting evenly mixes by mass percent.
3. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: the particle diameter of nickel powder is 47nm in the described electrode size.
4. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: the described resistance agent of contracting is that main component is the ceramic powder of barium titanate.
5. according to claim 1 or 3 described MLCC capacitors based on counter electrode entoplasm and ceramic membrane shrinkage, it is characterized in that: the interpolation mass percent is 10% ceramic powder in the described electrode size.
6. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: described sintering temperature is 1150 degree.
7. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: described dielectric layer is a ceramic substrate, and its main component is a barium titanate.
8. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: described termination electrode bottom is the copper metal electrode.
9. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: described termination electrode outermost layer is the tin weld layer.
10. the MLCC capacitor based on counter electrode entoplasm and ceramic membrane shrinkage according to claim 1 is characterized in that: described termination electrode barrier layer is a nickel coating.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110081136 CN102222564B (en) | 2011-03-31 | 2011-03-31 | Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate |
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| CN 201110081136 CN102222564B (en) | 2011-03-31 | 2011-03-31 | Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104823252A (en) * | 2012-12-18 | 2015-08-05 | 株式会社村田制作所 | Multilayer ceramic electronic component |
| CN106927822A (en) * | 2017-03-14 | 2017-07-07 | 南京航空航天大学 | A kind of preparation method of multi-layer ceramics internal interface |
| CN108364786A (en) * | 2017-01-25 | 2018-08-03 | 禾伸堂企业股份有限公司 | Multilayer ceramic capacitor and method for manufacturing same |
| CN116190102A (en) * | 2022-12-13 | 2023-05-30 | 成都宏科电子科技有限公司 | Low-loss microwave broadband capacitor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1598982A (en) * | 2003-09-18 | 2005-03-23 | 广东风华高新科技集团有限公司 | Inner electrode size and ceramic capacitor made by the size |
| CN101354962A (en) * | 2007-07-26 | 2009-01-28 | 太阳诱电株式会社 | Laminated ceramic capacitor and manufacturing method thereof |
-
2011
- 2011-03-31 CN CN 201110081136 patent/CN102222564B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1598982A (en) * | 2003-09-18 | 2005-03-23 | 广东风华高新科技集团有限公司 | Inner electrode size and ceramic capacitor made by the size |
| CN101354962A (en) * | 2007-07-26 | 2009-01-28 | 太阳诱电株式会社 | Laminated ceramic capacitor and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104823252A (en) * | 2012-12-18 | 2015-08-05 | 株式会社村田制作所 | Multilayer ceramic electronic component |
| CN104823252B (en) * | 2012-12-18 | 2018-04-06 | 株式会社村田制作所 | Monolithic ceramic electronic component |
| CN108364786A (en) * | 2017-01-25 | 2018-08-03 | 禾伸堂企业股份有限公司 | Multilayer ceramic capacitor and method for manufacturing same |
| CN106927822A (en) * | 2017-03-14 | 2017-07-07 | 南京航空航天大学 | A kind of preparation method of multi-layer ceramics internal interface |
| CN116190102A (en) * | 2022-12-13 | 2023-05-30 | 成都宏科电子科技有限公司 | Low-loss microwave broadband capacitor |
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| Publication number | Publication date |
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| CN102222564B (en) | 2012-11-28 |
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