CN1598982A - Inner electrode size and ceramic capacitor made by the size - Google Patents

Inner electrode size and ceramic capacitor made by the size Download PDF

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Publication number
CN1598982A
CN1598982A CN 03146862 CN03146862A CN1598982A CN 1598982 A CN1598982 A CN 1598982A CN 03146862 CN03146862 CN 03146862 CN 03146862 A CN03146862 A CN 03146862A CN 1598982 A CN1598982 A CN 1598982A
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China
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well
ceramic
characterized
electrode
described
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CN 03146862
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Chinese (zh)
Inventor
孟淑媛
黄耀浩
江志坚
梁世雄
何健华
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广东风华高新科技集团有限公司
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Priority to CN 03146862 priority Critical patent/CN1598982A/en
Publication of CN1598982A publication Critical patent/CN1598982A/en

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Abstract

The invention relates to the inner electrode stuff used in the slabbing multilayer ceramic capacitor and the ceramic capacitor made of the stuff. The abovementioned stuff includes the nickel metal powder, ceramic additive and organic carrier and their amount of weight is as follows: between 35% and 55% of nickel metal powder, between 2% and 20% of ceramic additive and between 35% and 65% of the organic carrier. The ceramic capacitor made of the stuff can solve the problems of craze of the ceramic body and production cost. The stuff in sintered in the protective atmosphere. The stuff doen't melt at the temperature of no more than 1450deg.C, makes no effect to the ceramics, reduces the production cost efficiently and produces the miniaturized products with excellent electrical property, high reliability and large capacity.

Description

Electrode size and the ceramic capacitor that makes with this slurry

Technical field

The present invention relates to a kind of electrode size, particularly relate to base metal nickel as interior electrode, preparation chip multilayer ceramic capacitor used slurry.

The invention still further relates to a kind of chip multilayer ceramic capacitor, particularly relate to the chip multilayer ceramic capacitor that the above-mentioned slurry of a kind of usefulness is made into interior electrode.

Background technology

Along with IT, 3C (communication, complete electronic set, computer) skill upgrading and the development of industry such as, the direction that multi-layer ceramic chip capacitor is required more and more to trend towards miniaturization, high capacity, high reliability and low production cost develops, and existing capacitor electrode size is formed and comprised noble metal powder, ceramic additive and organic carrier.Evenly disperse and make through equipment such as three-high mills again after each component blending in the slurry.

Chip multilayer ceramic capacitor production process be: porcelain powder baking material, porcelain slurry batching, preparation ceramic size, casting film-forming, the moulding of silk screen superimposition printing, drying, lamination, cutting, binder removal, burn till, chamfering, end-blocking, burning end, plating, testing, sorting, packing, warehouse-in, wherein the noble metal electrode size is that double exposure mode by silk screen printing forms, again by 1000-1200 ℃ burn altogether be formed with in the ceramic body of electrode.Altogether in the burning process, the fusing point of the conductive powder body of electrode must can not be lower than ceramic sintering temperature in forming at this.The phenomenon that flies silver or fusing will be produced if the fusing point of conductive powder body is lower than the sintering temperature conductive powder body of pottery, bad phenomenon such as ceramic body cracking, layering can be caused.In addition, along with reducing of ceramic layer thickness, the thickness of inner electrode layer also must reduce, therefore, the granularity of used conductive powder body must further reduce in the electrode slurry, yet, when the granularity of conductive powder body further reduces, because electrode was contracted under the lower temperature and takes place in the conductive powder body sintering caused during firing, and more was easy to generate the phenomenon that flies silver or fusing, and therefore the problems such as cracking, layering of ceramic body may take place.In addition, the material of existing capacitor electrode size is very expensive, and production cost is higher.

A kind of electrocondution slurry for preparing electrode in the ceramic capacitor is disclosed in the Chinese patent application 01122368.5, this electrocondution slurry contains conductive powder, organic carrier, compd A and the compd B of nickel, wherein, compd A is the organic complex salt of metal salts of organic acids, oxide powder, metal that is selected from calcium and/or magnesium and/or at least a material in the alkoxide, and compd B is titaniferous and/or zirconium, have the compound of hydrolyzable reactive group; The advantage of this electrocondution slurry is to improve the heat-resisting cataclysm and the moisture resistance load of laminated ceramic electronic unit.

A kind of electrocondution slurry for preparing electrode in the ceramic capacitor is also disclosed in the Chinese patent application 01122370.7, electrocondution slurry in this electrocondution slurry and 01122368.5 is basic identical, also be conductive powder, organic carrier, compd A and the compd B that contains nickel, wherein, compd A is the organic complex salt of metal salts of organic acids, oxide powder, metal that is selected from calcium and/or magnesium and/or at least a material in the alkoxide, but the compd B difference that it is used is for containing compound aluminium and/or silicon, that have hydrolyzable reactive group; Its conductive paste also is for heat-resisting cataclysm that improves the laminated ceramic electronic unit and moisture resistance load.

But the defective of above-mentioned two pieces of patent applications is that compd A and compd B all are the material of comparison costliness, especially compd B; This can limit this class electrocondution slurry widely in industrial extensive use.

Summary of the invention

At above electrocondution slurry when the sintering and cracking problem and the production cost problem of making ceramic body in the process of capacitor, the invention provides a kind of electrode size that adopts base metal nickel powder powder, this slurry neither can exert an influence to pottery, can effectively reduce production cost of products again.

Another object of the present invention provides a kind of chip multilayer ceramic capacitor, and the interior electrode of this capacitor adopts above-mentioned electrocondution slurry to make, and its electrical property excellence, reliability height, miniaturization and capacity are big.

Base metal nickel electrode size of the present invention comprises nickel powder, ceramic additive, organic carrier, is by weight percentage: nickel powder 35-55%, ceramic additive 2-20%, organic carrier 35%-65%.Wherein, so-called ceramic additive is meant a class material identical or close with ceramic layer Substance Properties in the multilayer ceramic capacitor, as metal oxide and synthetic thereof.The existence of ceramic additive in the electrode size can improve the adhesion of inner electrode layer and ceramic layer, prevents that lamination from appearring in multilayer ceramic capacitor.But its content in electrode size is very important, if content is too low, its improvement effect for inner electrode layer and ceramic layer adhesion is too low so, if content is too high, just may destroy the electric conductivity of inner electrode layer itself, forms discontinuous inner electrode layer.Thereby among the present invention, the weight percentage of ceramic additive generally is controlled between the 2-20%.

For the present invention, preferred ceramic additive is TiO 2, CaCO 3, BaO, SiO 2, Bi 2O 3, Cr 2O 3, ZrO 2, BaTi 0.8Zr 0.2O 3, BaTiO 3, CrZrO 3, CaZrO 3In one or more, also can be wherein several synthetics, more preferably BaTi 0.8Zr 0.2O 3, BaTiO 3And CaZrO 3In one or more.

In the electrode size of the present invention, the particle diameter of most metal nickel powder is controlled at more than the 0.05 μ m, below the 2 μ m; If the particle diameter of metal nickel powder is too small, delamination then takes place easily, because during roasting, the particle diameter of nickel powder powder is more little, the easy more sintering that causes powder under lower temperature, thereby the contraction of electrode in causing; If the particle diameter of metal nickel powder is excessive, then is unfavorable for lowering the layer thickness of interior electrode, thereby is unfavorable for the miniaturization of multilayer ceramic capacitor.

Organic carrier comprises resin and organic solvent.In general, resin accounts for the 1%-30% of whole organic carrier weight, preferred 3%-18%.Adding one of resin purpose is to make electrode size have suitable rheological property and thixotropic property, with the technological requirement in the production process that satisfies chip capacitor, simultaneously also can prevent or reduce the raising of electrode size, improve its processability in operation of rolling medium viscosity; Another purpose that adds resin be improve between the metal nickel powder and and ceramic masses between bonding force, thereby improve bonding force between inner electrode layer and the ceramic layer.Suitable resin can be a cellulose ether, for example methylcellulose (MC), ethyl cellulose (EC), hydroxypropyl cellulose (HPC) (comprising Hydroxypropylcelliloxe and low-substituted hydroxypropyl cellulose), carboxymethyl cellulose (CMC), carboxylic propyl methocel (HPMC), HEMC, hydroxypropyl methylcellulose etc. also can be the modifiers of these cellulose ethers.

Used organic solvent can be an esters solvent in the electrode size of the present invention, as ethyl acetate, butyl acetate, ethylene glycol ether acetate, 2-Butoxyethyl acetate, diethylene glycol monobutyl ether acetate etc., it can also be alcohols solvent, as hexanol, terpinol etc., also can be aromatic hydrocarbon solvent etc., can also be the mixture of above-mentioned solvent certainly.

On the other hand, the present invention also provides a kind of chip multilayer ceramic capacitor, this ceramic capacitor comprises ceramic layer, inner electrode layer and termination electrode, wherein said inner electrode layer is to be made with above-mentioned slurry, generally between 0.6-2 μ m, the number of plies of inner electrode layer was generally the 80-1000 layer to thickness in the whole ceramic capacitor after it burnt.Main component in the ceramic layer then can be BaTiO 3Termination electrode can use copper or copper alloy.

The present invention is owing to adopt the base metal nickel electrode size, its sintering range is wide and sintering temperature is high, can avoid in the burning process ceramic body being exerted an influence altogether, can produce electrical property excellence, high reliability, miniaturization, jumbo product with ceramic body.In addition, existing noble metal electrode size price is than high, production is brought to a certain degree restriction, and the base metal nickel electrode size also is very favourable to energy savings, can effectively reduce the production cost of chip capacitor.Adopt behind the multiple-layer sheet ceramic capacitor sintering that the base metal nickel electrode size makes and to electroplate the back outward appearance good, and etc. performance all satisfy instructions for use.Below be respectively the performance comparison that the chip capacitor that adopts noble metal electrode size and base metal nickel electrode size to make carries out, see Table 1.

Table 1 Project name The chip capacitor that existing noble metal electrode size is made The chip capacitor that the base metal nickel electrode size is made Technological temperature 900-1430℃ 1000-1450℃ Outward appearance behind the sintering Well Well Conventional electrical property Well Excellent Reliability test Well Excellent The product number of plies ≤ 100 layers ≤ 1000 layers

Embodiment

Base metal nickel electrode size that relates among the present invention and chip multilayer ceramic capacitor compared with prior art, production process is identical.Difference mainly is that nickel inner electrode slurry need be at protective atmosphere (for example nitrogen) sintering down in producing the chip capacitor process, can be under≤1450 ℃ of high temperature sintering conditions and ceramic body BaTiO 3Burn other technological requirement unanimity altogether.Be that the base metal nickel electrode size adopts silk screen printing double exposure mode, terminal electrode paste adopts the dip coating mode to finish and gets final product.

The percentage by weight that the present invention presses nickel powder, ceramic additive, resin (being ethyl cellulose), organic solvent in the table 2 herein mixes, and fully grinds with three-roll grinder, makes electrode size.

Table 2 Sequence number Prescription (%) Nickel powder Ceramic additive Resin Organic solvent ??BaTi 0.8Zr 0.2O 3 ??BaTiO 3 ????CaZrO 3 Ethyl cellulose Terpinol 2-Butoxyethyl acetate ????1 ??35 ??20 ??/ ??/ ??5 ??40 ??/ ????2 ??40 ??16 ??/ ??/ ??5 ??39 ??/ ????3 ??45 ??13 ??/ ??/ ??5 ??37 ??/ ????4 ??50 ??9 ??/ ??/ ??5 ??36 ??/ ????5 ??55 ??5 ??/ ??/ ??5 ??35 ??/ ????6 ??35 ??16 ??/ ??/ ??4 ??45 ??/ ????7 ??40 ??13 ??/ ??/ ??4 ??43 ??/ ????8 ??45 ??10 ??/ ??/ ??5 ??40 ??/ ????9 ??50 ??7 ??/ ??/ ??5 ??38 ??/ ????10 ??55 ??4 ??/ ??/ ??5 ??36 ??/ ????11 ??35 ??11 ??/ ??/ ??3 ??51 ??/ ????12 ??40 ??9 ??/ ??/ ??3 ??48 ??/ ????13 ??45 ??7 ??/ ??/ ??5 ??43 ??/ ????14 ??50 ??5 ??/ ??/ ??5 ??40 ??/ ????15 ??55 ??3 ??/ ??/ ??5 ??37 ??/ ????16 ??35 ??9 ??/ ??/ ??2 ??54 ??/ ????17 ??40 ??7.5 ??/ ??/ ??3 ??49.5 ??/ ????18 ??45 ??5 ??/ ??/ ??4 ??46 ??/ ????19 ??50 ??3.5 ??/ ??/ ??4 ??42.5 ??/ ????20 ??55 ??2 ??/ ??/ ??5 ??38 ??/ ????21 ??35 ??4 ??/ ??/ ??1 ??60 ??/ ????22 ??40 ??3 ??/ ??/ ??2 ??55 ??/ ????23 ??45 ??2 ??/ ??/ ??3 ??50 ??/ ????*24 ??50 ??1 ??/ ??/ ??4 ??45 ??/ ????*25 ??55 ??0 ??/ ??/ ??5 ??40 ??/ ????26 ??35 ??/ ??20 ??/ ??5 ??40 ??/ ????27 ??40 ??/ ??16 ??/ ??5 ??39 ??/ ????28 ??45 ??/ ??13 ??/ ??5 ??37 ??/ ????29 ??50 ??/ ??9 ??/ ??5 ??36 ??/ ????30 ??55 ??/ ??5 ??/ ??5 ??35 ??/ ????31 ??35 ??/ ??16 ??/ ??4 ??45 ??/ ????32 ??40 ??/ ??13 ??/ ??4 ??43 ??/ ????33 ??45 ??/ ??10 ??/ ??5 ??40 ??/ ????34 ??50 ??/ ??7 ??/ ??5 ??38 ??/ ????35 ??55 ??/ ??4 ??/ ??5 ??36 ??/ ????36 ??35 ??/ ??11 ??/ ??3 ??/ ??51

????37 ??40 ??/ ??9 ??/ ??3 ??/ ??48 ????38 ??45 ??/ ??7 ??/ ??5 ??/ ??43 ????39 ??50 ??/ ??5 ??/ ??5 ??/ ??40 ????40 ??55 ??/ ??3 ??/ ??5 ??/ ??37 ????41 ??35 ??/ ??9 ??/ ??2 ??/ ??54 ????42 ??40 ??/ ??7.5 ??/ ??3 ??/ ??49.5 ????43 ??45 ??/ ??5 ??/ ??4 ??/ ??46 ????44 ??50 ??/ ??3.5 ??/ ??4 ??/ ??42.5 ????45 ??55 ??/ ??2 ??/ ??5 ??/ ??38 ????46 ??35 ??/ ??4 ??/ ??1 ??/ ??60 ????47 ??40 ??/ ??3 ??/ ??2 ??/ ??55 ????48 ??45 ??/ ??2 ??/ ??3 ??/ ??50 ????49 ??50 ??/ ??1 ??/ ??4 ??/ ??45 ????50 ??55 ??/ ??0 ??/ ??5 ??/ ??40 ????51 ??35 ??/ ??/ ??20 ??5 ??/ ??40 ????52 ??40 ??/ ??/ ??16 ??5 ??/ ??39 ????53 ??45 ??/ ??/ ??13 ??5 ??/ ??37 ????54 ??50 ??/ ??/ ??9 ??5 ??/ ??36 ????55 ??55 ??/ ??/ ??5 ??5 ??/ ????56 ??35 ??/ ??/ ??16 ??4 ??45 ????57 ??40 ??/ ??/ ??13 ??4 ??43 ????58 ??45 ??/ ??/ ??10 ??5 ??40 ????59 ??50 ??/ ??/ ??7 ??5 ??38 ????60 ??55 ??/ ??/ ??4 ??5 ??36 ????61 ??35 ??/ ??/ ??11 ??3 ??51 ????62 ??40 ??/ ??/ ??9 ??3 ??48 ????63 ??45 ??/ ??/ ??7 ??5 ??43 ????64 ??50 ??/ ??/ ??5 ??5 ??40 ????65 ??55 ??/ ??/ ??3 ??5 ??37 ????66 ??35 ??/ ??/ ??9 ??2 ??54 ????67 ??40 ??/ ??/ ??7.5 ??3 ??49.5 ????68 ??45 ??/ ??/ ??5 ??4 ??46 ????69 ??50 ??/ ??/ ??3.5 ??4 ??42.5 ????70 ??55 ??/ ??/ ??2 ??5 ??38 ????71 ??35 ??/ ??/ ??4 ??1 ??60 ????72 ??40 ??/ ??/ ??3 ??2 ??55 ????73 ??45 ??/ ??/ ??2 ??3 ??50 ????74 ??50 ??/ ??/ ??1 ??4 ??45 ????75 ??55 ??/ ??/ ??0 ??5 ??40

Annotate: the sample of using (*) label is outside the scope of the invention.

Make slurry by above-mentioned prescription, making capacitor by existing chip multilayer ceramic capacitor manufacture craft again, and check its performance, seeing Table 3.

Table 3 Production code member The sintering outward appearance Conventional electrical property Reliability test Product hierarchy ????1 Generally Difference Difference Difference ????2 Better Relatively poor Difference Difference ????3 Better Well Generally Medium ????4 Better Well Better Very ????5 Better Well Better Very ????6 Generally Generally Difference Difference ????7 Well Well Well Excellent ????8 Well Well Well Excellent ????9 Well Well Well Excellent ????10 Well Well Better Very ????11 Generally Generally Generally Generally ????12 Well Well Well Excellent ????13 Well Well Well Excellent ????14 Well Well Well Excellent ????15 Better Well Better Very ????16 Better Generally Generally Medium ????17 Well Well Well Excellent ????18 Well Well Well Excellent ????19 Well Well Better Very ????20 Well Well Difference Difference ????21 Generally Generally Difference Difference ????22 Well Better Better Very ????23 Well Well Better Good ????*24 Generally Well Difference Difference ????*25 Relatively poor Well Difference Difference ????26 Generally Difference Difference Difference ????27 Better Relatively poor Difference Difference ????28 Better Well Generally Medium ????29 Better Well Better Very ????30 Better Well Better Very ????31 Generally Generally Difference Difference ????32 Well Well Well Excellent ????33 Well Well Well Excellent ????34 Well Well Well Excellent ????35 Well Well Better Very ????36 Generally Generally Generally Generally

????37 Well Well Well Excellent ????38 Well Well Well Excellent ????39 Well Well Well Excellent ????40 Better Well Better Very ????41 Better Generally Generally Medium ????42 Well Well Well Excellent ????4?3 Well Well Well Excellent ????44 Well Well Better Very ????45 Well Well Difference Difference ????46 Generally Generally Difference Difference ????47 Well Better Better Very ????48 Well Well Better Good ????*49 Generally Well Difference Difference ????*50 Relatively poor Well Difference Difference ????51 Generally Difference Difference Difference ????52 Better Relatively poor Difference Difference ????53 Better Generally Generally Generally ????54 Better Generally Better Medium ????55 Better Well Better Very ????56 Generally Difference Difference Difference ????57 Well Generally Generally Generally ????58 Well Generally Generally Generally ????59 Well Well Better Very ????60 Well Well Well Excellent ????61 Generally Generally Generally Generally ????62 Well Generally Generally Generally ????63 Well Better Better Medium ????64 Well Well Well Excellent ????65 Better Well Well Excellent ????66 Better Generally Generally Medium ????67 Well Well Well Excellent ????68 Well Well Well Excellent ????69 Well Well Well Excellent ????70 Well Well Well Excellent ????71 Generally Generally Generally Generally ????72 Well Better Well Very ????73 Well Well Well Excellent ????74 Well Well Well Excellent ????75 Better Well Well Very

Claims (10)

1, a kind ofly prepares the electrode size that electrode is used in the ceramic capacitor, it comprises metal nickel powder, ceramic additive and organic carrier, it is characterized in that: by weight percentage, the content of metal nickel powder is 35-55%, the content of ceramic additive is 2-20%, and the content of organic carrier is 35%-65%.
2, electrode size as claimed in claim 1 is characterized in that: described ceramic additive is TiO 2, CaCO 3, BaO, SiO 2, Bi 2O 3, Cr 2O 3, ZrO 2, BaTi 0.8Zr 0.2O 3, BaTiO 3, CrZrO 3, CaZrO 3In a kind of material or the mixture of several materials or the synthetic of several materials wherein.
3, electrode size as claimed in claim 1 or 2 is characterized in that: described ceramic additive is BaTi 0.8Zr 0.2O 3, BaTiO 3And CaZrO 3In one or more materials.
4, electrode size as claimed in claim 1 is characterized in that: the particle diameter of described metal nickel powder is between 0.05-2 μ m.
5, electrode size as claimed in claim 1 is characterized in that: described organic carrier comprises resin and organic solvent.
6, electrode size as claimed in claim 5 is characterized in that: described organic solvent is esters solvent, alcohols solvent and/or aromatic hydrocarbon solvent.
7, as claim 5 or 6 described electrode sizes, it is characterized in that: described resin is the cellulose ethers material.
8, a kind of chip multilayer ceramic capacitor comprises ceramic layer, inner electrode layer and termination electrode, it is characterized in that: described inner electrode layer one of adopts among the claim 1-7 described inner electrode layer slurry to make.
9, capacitor as claimed in claim 8 is characterized in that: thickness is 0.6-2 μ m after the burning of described inner electrode layer, and the number of plies is the 80-1000 layer.
10, capacitor as claimed in claim 8 is characterized in that: the main component of described ceramic layer is BaTiO 3
CN 03146862 2003-09-18 2003-09-18 Inner electrode size and ceramic capacitor made by the size CN1598982A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101206957B (en) * 2007-12-07 2010-04-21 宁波晶鑫电子材料有限公司 Preparation of low temperature drying wafer capacitance electrode silver paste
CN101206958B (en) * 2007-12-07 2010-04-21 宁波晶鑫电子材料有限公司 Preparation of hyperthermia drying wafer capacitance electrode silver paste
CN102222564A (en) * 2011-03-31 2011-10-19 亿曼丰科技(深圳)有限公司 Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate
CN104174841A (en) * 2014-08-18 2014-12-03 东莞市戍普电子科技有限公司 Production method of nickel paste for ultrahigh-capacitance MLCC (multilayer ceramic capacitor), nickel paste and MLCC
CN104335305A (en) * 2012-06-21 2015-02-04 京瓷株式会社 Multilayer ceramic capacitor
CN104576043A (en) * 2014-11-07 2015-04-29 广东风华高新科技股份有限公司 Inner electrode paste
CN105518805A (en) * 2013-09-17 2016-04-20 株式会社村田制作所 Electroconductive paste and ceramic electronic component
CN105977022A (en) * 2016-06-20 2016-09-28 大连海外华昇电子科技有限公司 Nanoscale nickel metal electrode slurry used for multilayer ceramic capacitors

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101206957B (en) * 2007-12-07 2010-04-21 宁波晶鑫电子材料有限公司 Preparation of low temperature drying wafer capacitance electrode silver paste
CN101206958B (en) * 2007-12-07 2010-04-21 宁波晶鑫电子材料有限公司 Preparation of hyperthermia drying wafer capacitance electrode silver paste
CN102222564A (en) * 2011-03-31 2011-10-19 亿曼丰科技(深圳)有限公司 Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate
CN102222564B (en) * 2011-03-31 2012-11-28 亿曼丰科技(深圳)有限公司 Multiplayer ceramic chip capacitor (MLCC) based on internal equilibrium electrode paste and ceramic membrane shrinkage rate
CN104335305A (en) * 2012-06-21 2015-02-04 京瓷株式会社 Multilayer ceramic capacitor
CN104335305B (en) * 2012-06-21 2017-05-31 京瓷株式会社 Laminated ceramic capacitor
CN105518805A (en) * 2013-09-17 2016-04-20 株式会社村田制作所 Electroconductive paste and ceramic electronic component
CN105518805B (en) * 2013-09-17 2018-01-12 株式会社村田制作所 Conductive paste and ceramic electronic components
CN104174841A (en) * 2014-08-18 2014-12-03 东莞市戍普电子科技有限公司 Production method of nickel paste for ultrahigh-capacitance MLCC (multilayer ceramic capacitor), nickel paste and MLCC
CN104174841B (en) * 2014-08-18 2016-08-24 东莞市戍普电子科技有限公司 Superelevation holds manufacture method and nickel slurry, the MLCC that MLCC starches with nickel
CN104576043A (en) * 2014-11-07 2015-04-29 广东风华高新科技股份有限公司 Inner electrode paste
CN104576043B (en) * 2014-11-07 2018-03-06 广东风华高新科技股份有限公司 Electrode size
CN105977022A (en) * 2016-06-20 2016-09-28 大连海外华昇电子科技有限公司 Nanoscale nickel metal electrode slurry used for multilayer ceramic capacitors

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